PACKAGEDPINDIODES [TE]
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型号: | PACKAGEDPINDIODES |
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描述: | Packaged PIN Diodes |
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Packaged PIN Diodes
V11
Features
Maximum Power Dissipation
♦ High Power
♦ Fast Speed
Cathode Heatsink Packages
♦ Voltage Ratings to 1500 Volts
♦ Wide Selection of Carrier Lifetimes
♦ Wide Selection of Capacitances
♦ Assortment of Packages Styles
♦ Available Screened for Military Applications
♦ RoHS Compliant
Pdiss = T (max oper.) - 25°C
Thermal Resistance
30,31,32,36,43,94,111,120,
150,255 258,296,1072,1079
Leaded Packages +25°C
P
diss = 250mW
144, 186, 276,1088
Surface Mount Package +25°C
Pdiss = 300mW
1056
Description and Applications
Co-Axial Packages
M/A-COM Tech’s broad line of packaged PIN diodes
encompass
a comprehensive range of electrical
characteristics and package outlines. This diverse un-
ion of semiconductor technology and chip packaging
gives considerable flexibility to the circuit designer. The
fast switching series of Packaged PIN Diodes utilize a
thin I-region, silicon oxide or glass passivated chip
which provides for low leakage current and low inser-
tion loss. With the use of in process control monitors to
regulate wafer fabrication parameters, these devices
will achieve consistent performance in control circuit
applications. The high voltage product line of Packaged
PIN Diodes employs M/A-COM Tech's CERMACHIP®
passivation process which provides for a hard glass
encapsulation that hermetically seals and protects the
active area of the chip. These packaged CERMACHIP®
PIN diodes are ideally suited for use in high power ap-
plications where high level RF voltages are present.
The diode chips are bonded into sealed ceramic pack-
ages that are designed for the most stringent electrical
and environmental conditions. An extensive choice of
package styles are available which may be used in a
wide variety of RF microwave circuits. The Packaged
PIN Diodes series are designed to have a high inherent
reliability and may be ordered screened to meet many
MIL-STD requirements.
31,32,94
36
30, 296
120,255
Leaded/Surface Mount Packages
Thru Hole
1088
276
1072,1079
186
1056
144
Threaded Packages
Absolute Maximum Ratings1
Parameter
Absolution Max.
150
111
43
258
Voltage
As Specified in Table
- 65°C to +175°C
- 65°C to +200°C
Operating Temperature
Storage Temperature
Unpackaged Die
Operating and Storage
(Case Style 1088)
- 65°C to +125°C
1. Operation beyond any one of the above conditions may
cause permanent damage to the device.
1
131,132.134 , 212
Specifications subject to change without prior notification.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Packaged PIN Diodes
V11
100V to 250V Fast Switching PIN Diodes Specifications (TAMB = +25°C)
( Unless otherwise
( Unless otherwise
specified )
Nominal Characteristics
specified )
Maximum
Minimum
Reverse
Voltage1
Maximum
Thermal
Maximum
Series Res.
Capacitance
Resistance
I-Region
Width
Microns
Part Number
Carrier
@ IR <10μA
CT @ -10V
f = 1MHz
pF
Lifetime4 TRR
5
RS @ 10mA
f = 500MHz
Ω
Volts
100
100
200
250
°C/W
60
nS
60
nS
µM
12
12
20
30
MA4P202-120
MA4P203-30
MA4P303-32
MA4P404-30
0.25
0.35
0.35
0.402
2.50
1.50
1.50
0.703
5
30
100
200
1000
20
30
60
20
100
Notes:
1. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA
2. At VR = -50V
3. Rs measured at IF = +50mA, f = 100MHz.
4. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
Package Options
Consult the “Package Availability Table” on page 7 for package style choices.
Chip
31,32, 94
30
111
120, 255
186
276
1088
1072
131,132
1056
Package Dimensions can be found on the M/A-COM Technology Solutions website
35V to 500V MELF General Purpose Switching Diodes Specifications (TAMB = +25°C)
(Unless otherwise
specified)
Maximum
Series Res.
Minimum
Reverse
CW Power
Dissipation
Rating
Nominal Characteristics
Maximum
Voltage2 Capacitance
Part Number1
Carrier
I-Region
Width
Typical IF
RS @10mA
f = 100MHz
Ω
CT @10V
f = 1MHz
pF
Lifetime3
When
RS = 75Ω
mA
IR <10μA
Volts
Watts
1.0
10
μS
0.3
1.0
1.5
3.0
2.0
6.0
3.0
mils
0.4
21
MA4PH235-1072T
MADP-000593-10720T
MA4PH236-1072T
MA4PH237-1079T
MA4PH238-1072T
MA4PH239-1079T
MADP-000234-10720T
35
1.2
1.5
0.5
1.5
0.5
0.8
1.54
0.50
—
150
600
200
200
200
500
0.55
—
—
3.0
1.0
2.0
1.0
2.0
5.0
2.0
3.0
4.0
14.0
2.0
0.6@50mA
6.0
—
0.30-0.60
1.20-2.40
—
25.0
0.25@100mA
Notes:
1. Only available in case styles indicated.
2. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse
leakage current, Ir, is measured to be <10μA.
3. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
4. Ct tested at 100V
2
Case Styles 1072, 1079
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Packaged PIN Diodes
V11
500V PIN Diodes Specifications (TAMB = +25°C)
Minimum
Reverse
Voltage1
Maximum
Series
Resistance
CW Power
Dissipation
Rating
Nominal Characteristics
Maximum
Capacitance
Part Number
Carrier
Lifetime2
μS
I-Region
Width
mils
CT @100V
f = 1 MHz
pF
RS @100mA
f = 100 MHz
Ω
IR <10μA
Volts
Watts
10
MA4P504-30
MADP000015-0000303
MA4P506-30
500
500
500
0.40
0.55
0.90
0.60
0.45
0.30
1.0
2.0
3.0
2
2
2
15
15
Notes:
1. The minimum specified VR (Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA.
2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
3. To order this part in a package style other than 30, use the prefix MA4P505 followed by a dash and the desired package style.
Package Options
Consult the “Package Availability Table” on page 7 for package style choices.
Thru Hole
144
30
31
111
131, 212
36
258
120,255
186
Package dimensions can be found on the M/A-COM Technology Solutions website.
500V MELF PIN Diode Specifications (TAMB = +25°C)
Maximum
Series
Resistance
Minimum
Reverse
Voltage1
CW Power
Dissipation
Rating
Nominal Characteristics
Maximum
Capacitance
Part Number
Carrier
I-Region
Width
RS @100mA
f = 100 MHz
Ω
Lifetime2
CT @100V
f = 1 MHz
pF
IR <10μA
Volts
mils
Watts
μS
MA4P504-1072T
MA4P505-1072T
MA4P506-1072T
500
500
500
0.5
0.65
1.0
0.60
0.45
0.30
10
1.0
2
15
15
2.0
3.0
2
2
Notes:
1072 Package
1. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse
leakage current, Ir, is measured to be <10μA.
2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
3
Specifications subject to change without prior notification.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Packaged PIN Diodes
V11
1000V CERMACHIP PIN Diodes Specification (TAMB = +25°C)
Maximum
Series
Resistance
Minimum
Reverse
Voltage1
CW Power
Dissipation
Rating
Maximum
Capacitance
Nominal Characteristics
Part Number
Carrier
Lifetime2
μS
I-Region
Width
Mils
Rs @100mA
f = 100MHz
Ω
CT @100V
f = 1MHz
pF
IR <10μA
Volts
Watts
MA4P604-30
MA4P606-30
MA4P607-43
1000
1000
1000
0.50
0.80
2.00
1.00
0.70
0.40
15
3.0
4.0
5.0
4
4
4
20
25
Notes:
1. The maximum specified VR (reverse voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be
<10μA
2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
Package Options
Consult the “Package Availability Table” on page 7 for package style choices.
111
36
131, 212
43
255
258
30, 296
Package dimensions can be found on the M/A-COM Technology Solutions website.
1500V CERMACHIP PIN Diode Specifications (TAMB = +25°C)
Minimum
Reverse
Voltage1
Maximum
Thermal
Resistance
Nominal Characteristics
Maximum
Capacitance
Maximum Series
Resistance
Part Number
Carrier
I-Region
Width
Lifetime2
Ct @100V
f = 1MHz
pF
Rs @200mA
f = 100MHz
Ω
IR <10μA
Volts
μS
mils
°C/W
MA4P709-150
1500
3.30
0.25
2
10.0
7
Notes:
1. The minimum specified VR (reverse voltage) is sourced and the resultant reverse
leakage current, Ir, is measured to be <10μA
2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
4
150
Specifications subject to change without prior notification.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Packaged PIN Diodes
V11
Forward Current vs. Series Resistance
Forward Current vs. Series Resistance
MA4P202, MA4P203, MA4P303 and MA4P404
100MHz
MA4P504, MA4P505 and MA4P506
100MHz
Forward Current (IF)
Forward Current (IF)
Forward Current vs. Series Resistance
Forward Current vs. Series Resistance
MA4P604, MA4P606 and MA4P607
100MHz
MA4P709
100MHz
Forward Current (IF)
Forward Current (IF)
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Packaged PIN Diodes
V11
Recommended Screening
Per MIL-STD 750
Recommended Groups B & C Testing
Per MIL-STD 750
Recommended methods and conditions
for equivalent TX and TXV level screening.
Recommended methods and conditions for
Groups B, C and equivalent TX and TXV
level screening.
Inspection
Method
Condition
Inspection
Method
Condition
Storage
Temperature
Internal Visual
and / or X-Ray
1031
See Maximum Ratings
2072, 2076
See Note
Operating
Temperature
High Temp.
Storage
48 hours min. @ max.
storage temp.
——
1051
2016
2056
See Maximum Ratings
1032
Temperature
Cycling
5 cycles
- 65°C to +150°C
Thermal Shock
1051
2006
1071
10 Cycles
20,000 g's, Y1
H
Constant
Acceleration
Shock
500g’s
15g’s
Vibration
Fine Leak
Constant
Acceleration
Gross Leak
1071
C or E
2006
1021
20,000g’s
10 Days
Electrical
Burn-In
——
See Note
See Note
Humidity
1038
Notes:
1. Conditions and details of test depend on specific model number. Information available upon request.
2. Case styles 1056 and 1088 are not military, MIL-STD-750, rated packages.
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Packaged PIN Diodes
V11
Maximum Soldering Temperature
For hand soldering operation:
Case Style: 120, 144, 150*,186, 255, 258*, 276, 1088, 1072, 1079 ♦ 265°C maximum for 5 seconds
Case Style: 30*, 31, 32, 36*, 43*, 94, 111* , 296* ♦ 225°C maximum for 5 seconds.
*Note:
Package styles that are threaded or have pronged ends rely on a pressure connection and do not require solder
attachment but can be soldered if desired.
For solder reflow profiles:
Refer to application note M-538 on the M/A-COM website using the following link:
http://www.macomtech.com/Application%20Notes/pdf/M538.pdf
Ordering Information
The Packaged PIN Diode specifications shown in the tables on pages 2, 3, & 4 are for the standard style package. The
standard package style is indicated by the number following the dash after the base part number. Note that the
specification tables lists the total diode capacitance for the standard case style. The total capacitance for the base part
in an alternative package will differ and is computed by adding the junction capacitance of the chip and the parasitic
capacitance of the alternative package as defined in the Package Parasitic Capacitance table below. To compute the
chip junction capacitance, subtract the total capacitance shown in the specifications tables on pages 2, 3, & 4 from the
appropriate standard style package capacitance below The various base part numbers are only available in the case
styles shown in the Package Availability Table below. To order, indicate the base part number followed by a dash and
the desired package style.
For example: The MA4P506-258 is the MA4P506 chip in the 258 style package.
Package Availability Table
Package Parasitic Capacitance
Base Part Number
Available ODS Package Styles
Package Style
30
Cap. (pF)
0.18
MA4P202
MA4P203
MA4P303
MA4P404
MA4P504
120, 134, 276, 1056
30, 32, 94, 111, 134, 1056
32, 36, 94, 120, 186, 255, 1088
30, 31, 36, 111, 132, 258,1072T*
30, 120, 132, 144, 186, 255,1072T*
36, 131, 255, 1072T*
30, 31, 36, 131, 255, 258, 1072T*
30, 43, 131, 255, 258
30, 36, 131, 258
31
32
36
43
94
111
120
131
132
134
144
186
212
255
258
276
0.18
0.30
0.18
0.75
0.15
0.27
0.13
MA4P505
MA4P506
MA4P604
MA4P606
MA4P607
N/A (chip)
N/A (chip)
N/A (chip)
0.42
0.15
N/A (chip)
0.30
43, 212, 296
150
MA4P709
MADP000015-000030
MA4PH235
MA4PH236
MA4PH237
MA4PH238
30
1072T*
1072T*
1079T*
1072T*
0.18
0.13
0.35
0.20
0.16
0.13
0.12
MA4PH239
1079T*
296
10720T* (1072 package style)
MADP-000234
1056
1072
1079
1088
*Note: “T” after the package style number indicates tape and reel.
Tape and reel information can be found on the M/A-COM website at http://www.macomtech.com/Application%20Notes/pdf/M513.pdf
Package dimensions can be found on the M/A-COM website at http://www.macomtech.com/static/content.aspx?page=outlinedrawings
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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