S2083_技术文档

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Introduction

Via Design

To improve the thermal/RF performance of the

package, we recommend providing thermal vias on

the PCB. These vias provide a heat transfer and

RF ground path from the top surface of the PCB to

the inner layers and the bottom surface. We

recommend a via diameter of 0.3 mm in a 1.0 mm

pitch array for standard square packages. This is

shown in Figure 1-1, in which the vias are 1.0 mm

away from their diagonal neighbors. Other non-

standard designs may require a slightly different via

diameter and pitch as shown in Figures 1-2, 1-3,

and 2-4.

The layout of the surface mount board plays a

critical role in product design and must be done

properly to achieve the intended performance of an

integrated circuit. An accurate PCB pad and solder

stencil design provides

a proper connection

interface between the IC package and the board.

With the correct pad geometry, the package will

self-align when subjected to a solder reflow

process and will also allow for just enough excess

surface area for adequate solder filleting. The

solder mask should be applied over bare copper

(SMOBC) to avoid solder reflow under the solder

mask.

These considerations apply in general for most of

M/A-COM Tech’s surface mount packaged IC’s.

This application note provides specific guidelines

for mounting quad flat no-leads packages (QFN per

JEDEC MO-220), and dual flat no-leads packages

(DFN per JEDEC MO-229).

Figure 1-1 PCB Land Design

PCB Pad Design

The first consideration in mounting the QFN / DFN

to a board is the layout of metalized pads. The US-

based trade association, IPC, has developed land

pad design standards contained in the document

IPC-SM-782 entitled Surface Mount Design and

Land Pattern Standards.

Figures 1-1 through 1-3 shows the PCB geometry

developed for M/A-COM’s QFN / DFN packages

based on the general guidelines contained within

IPC-SM-782. The center area or the thermal pad,

acts as an RF ground pad and thermal path to

conduct heat away from the package. Normally,

the size of the thermal pad should match the size

of the exposed pad on the bottom of the package.

However, a smaller thermal pad is sometimes

recommended to prevent solder bridging to the

lead pads. Table 1 shows some suggested PCB

pad dimensions for QFN / DFN packages used by

M/A-COM Tech. The solderable length of the lead

pad is controlled by the solder mask opening (Lm)

as indicated in Table 2, in combination with pad

length (L) as indicated in Table 1.

1

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 1-2 PCB Land Designs

2 x 2 mm PDFN - 8LD

1 x 1 mm X1-DFN - 6LD

1.2 x 1.5 mm PDFN - 6LD

2 x 2 mm STQFN - 12LD

2

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 1-3 PCB Land Designs - cont.

1.5 x 1.2 mm PDFN - 6LD

2 x 2.5 mm STQFN - 14LD

4 x 6 mm PQFN - 32LD

5 x 5 mm PQFN - 20LD (Power Amp)

3

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Table 1. Recommended PCB Land Pattern Dimensions

Package Description

PCB Land Pattern Dimensions (mm)

Max #

of Vias

Package

Type

Size

(mm)

No. of

Leads

Lead Pitch

(mm)

Tp

X

L

X1-DFN

PDFN

STQFN

PQFN

1 x 1

6

0.35

0.50

0.40

0.50

0.40

0.50

0.65

0.50

0.65

0.50

0.65

Fig. 1-2

Fig. 1-3

Fig. 1-2

0.82

0.18

0.25

0.23

0.28

0.23

0.28

0.37

0.28

0.37

0.28

0.40

0.20

0.40

0.315

0.40

0.34

0.65

0.50

0.45

0.65

0.50

0.65

0.50

1

1.2 x 1.5

6

1

1.5 x 1.2

6

2

2 x 2

8

3

2 x 2

12

14

12

16

20

24

32

20

28

4

2 x 2.5

Fig.1-3

1.2

6

3 x 3

2

3 x 3 (1.45 mm Exp. Pad)

1.5

2

3 x 3 (1.7 mm Exp. Pad)

1.6

2

4 x 4

2.2

5

2.2

5

4 x 4

2.55

5

4 x 6 (V1)

5 x 5 (std)

5 x 5 (Power Amp.)

5 x 5

Fig. 1-3

3.2

5

9

Fig.1-3

9

3.2

6 x 6

4.5

18

4

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Solder Mask Considerations

To avoid any solder bridging between the thermal

pad and lead pads, we recommend making the

thermal pad an SMD pad so that the solder mask

defines the thermal land. The mask opening (Tm)

should be 100 microns smaller than the

recommended thermal land size, which would be

2.1 mm for the 4 mm PQFN package. See Table 2

for additional recommended thermal land solder

mask opening dimensions.

The solder mask, a permanent part of most PCB’s

applied after etching the metal pads, helps protect

the spaces between the metal pads from solder

paste and unintended adhesion of solder. All

metalized pad areas on a printed circuit board can

be classified as either solder mask defined (SMD)

or non-solder mask defined (NSMD), depending on

the size of the opening in the solder mask relative

to the size of the metal pad.

To prevent solder wicking inside the via during

reflow, we recommend solder mask pads over all

thermal via areas. The solder mask diameter

should be 100 microns larger than the via diameter.

Based on our experience with suppliers, we have

found fewer voids under the die paddle using

solder mask printing on the top surface of the PCB,

as compared with solder mask printing on the

bottom. Filled vias also work well as an alternative

to solder mask to further enhance thermal

conduction for high power amplifier products (see

figure 1-3). These printed boards should also

include 1 oz. copper plating in vias which are

subsequently filled with a conductive via fill material

and then over-plated. It is recommended that there

be 2 oz. final copper thickness on the thermal pad

for optimal heat transfer.

An SMD metal pad has its periphery partly covered

by the solder mask. An NSMD metal pad sits

within a larger opening in the solder mask.

The copper etching process used to define metal

pads provides tighter control than the solder mask

process, so M/A-COM recommends using NSMD

pads whenever possible.

The recommended

solder mask opening for all lead pads should be

140 microns larger than the pad size, which results

in 70 microns clearance between the copper pad

and solder mask. For example, the 4 x 4 mm 20-

lead package has an indicated width of the PCB

lead pad (X) of 0.28 mm (Table 1) and the width of

the solder mask opening (Wm) would be 0.42 mm

(Table 2). In the other direction, the length of the

solder mask opening (Lm) should be 180 microns

extended outward from the edge of the package

and 70 microns inward from the PCB pads, which

results in a total length of 900 microns (see

Table 2).

Figure 2-1 Solder Mask Designs

5

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 2-2 Solder Mask Designs

1 x 1 mm X1-DFN - 6LD

1.2 x 1.5 mm PDFN - 6LD

1.5 x 1.2 mm PDFN - 6LD

6

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 2-3 Solder Mask Designs - cont.

2 x 2 mm PDFN - 8LD

2 x 2 mm STQFN - 12LD

2 x 2.5 mm STQFN - 14LD

7

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 2-4 Solder Mask Design - cont.

(not shown on right

view for clarity)

4 x 6 mm PQFN - 32LD

Stencil Design

A stencil is used for applying solder paste to the

PCB. Although the PCB design suggested in

Figures 1 through 2 will help eliminate some

surface mounting difficulties, special considerations

apply in stencil design and solder paste printing for

both lead pad and thermal pads.

The stencil opening for all lead pad areas should

be the same as the pad size on the PCB (Tables 1

& 2). As mentioned before, the function of the

thermal pad is to allow for heat removal from the

package as well as providing an effective RF

ground. Therefore, a good stencil design becomes

important for getting an optimal older paste

distribution between the lead pads and the thermal

pad. To minimize voids and defects, use smaller

multiple stencil openings for the thermal pad

instead of one big opening. Figures 3-1 through 3-

3 shows the recommended stencil designs. The

target coverage for solder paste area is to maintain

50 to 80 percent of the overall thermal pad area.

The selected web width is 0.2 mm running across

the vias as shown in Figures 3-1 through 3-3.

Surface mount processes vary from company to

company, so we recommend careful development

of your process for QFN / DFN packages. The

following provides some guidelines for stencil

design.

We recommend a stencil thickness of 0.100 to

0.125 mm for fine pitch packages (0.5 mm or

smaller). This thickness can be increased to 0.15

mm for coarser pitch parts. A laser-cut, stainless

steel stencil with electro-polished trapezoidal walls

is recommended.

8

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 3-1 Stencil Designs

1 mm X1-DFN - 6LD

1.5 x 1.2 mm PDFN - 6LD

st

1.2 x 1.5 mm PDFN - 6LD

2 mm PDFN - 8LD

2 mm STQFN - 12LD

2 x 2.5 mm STQFN—14LD

9

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Figure 3-2 Stencil Designs - cont.

3 mm PQFN

5 mm PQFN

4 mm PQFN

6 mm PQFN

Figure 3-3 Stencil Design

4 x 6 mm PQFN

10

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Table 2. Recommended Solder Mask & Stencil Dimensions

Package

Solder Mask Opening (mm)

Stencil Opening (mm)

type

X1-DFN

PDFN

mm

1 x 1

leads

6

Wm

Fig. 2-2

0.39

Lm

Tm

Am

1.30

1.56

1.86

2.36

X

Lst

0.35

0.58

0.495

0.58

0.52

0.83

Tst

Ast

1.30

1.56

1.86

2.36

Fig. 2-2 Fig. 2-2

0.18

0.25

0.23

0.28

0.23

0.28

Fig. 3-1

0.62

1.2 x 1.5

1.5 x 1.2

2 x 2

6

0.65

0.565

0.65

0.59

0.90

Fig. 2-2

Fig. 2-3

0.72

PDFN

6

Fig. 2-2

0.42

PDFN

8

STQFN

PQFN

2 x 2

12

14

12

Fig. 2-3

0.42

2 x 2.5

3 x 3

Fig. 2-3 Fig. 2-3

Fig. 3-1 Fig. 3-1

1.1

1.4

3.36

1.0

1.3

3.36

3 x 3

PQFN

16

0.42

0.75

0.70

0.28

0.68

0.63

(1.45 mm Exp. Pad)

3 x 3

(1.7 mm Exp. Pad)

1.5

3.36

1.4

3.36

PQFN

4 x 4

16

20

24

32

20

28

0.51

0.42

0.51

0.42

0.54

0.90

0.75

0.90

0.75

2.1

4.36

0.37

0.28

0.37

0.28

0.40

0.83

0.68

0.83

0.68

2.0

2.3

4.36

4 x 4

2.45

Fig. 3-3

3.1

4.36

4 x 6 (V1)

5 x 5 (std)

5 x 5 (Power Amp.)

5 x 5

Fig. 3-3

5.36

Fig. 3-3 Fig. 3-3

3.0

4.3

5.36

6.36

3.1

5.36

3.1

5.36

6 x 6

4.4

6.36

11

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Reflow Profile

General Soldering Precautions

The most common solder reflow method is

accomplished in a belt furnace using convection

heat transfer. Tables 3 thru 5 along with Figure 4

The melting temperature of solder generally

exceeds the recommended maximum operating

temperature of the device. When the entire device

is heated to a high temperature, failure to complete

soldering within a short time could result in device

failure. Therefore, always observe the following

instructions to minimize the thermal stress to the

devices.

show

a

typical convection reflow profile of

temperature versus time. The profile reflects the

three distinct heating stages, or zones (preheat,

reflow, and cooling) recommended in automated

reflow processes to ensure reliable, finished solder

joints.

The profile will vary among soldering

systems and is intended as an example to use as a

starting point. Other factors that can affect the

profile include the density and types of components

on the board, type of solder used and type of board

or substrate material being used.



Always preheat the device (failure to do so can

cause excessive thermal shock and stress that

can result in damage to the device).

Limit the temperature in the reflow stage to peak

temperature indicated in Tables 3 thru 5.

After completing the soldering process, allow the

devices to cool naturally for at least 3 minutes.

Gradual cooling should be used, as the use of

forced cooling will increase the temperature

gradient and may result in latent failure due to

mechanical stress.



Thermocouples should be securely attached to the

top surface of a representative component to

insure the temperature exposure is met. Profile

should be recorded by data acquisition for future

reference.



Avoid any mechanical stress or shock to the

solder joints and devices during cooling.

12

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Table 3. Reflow Conditions

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat/Soak

Temperature Min (Ts_min

Temperature Max (Ts_max

)

100°C

150°C

200°C

Time (t_s) from (Ts_minto Ts_max

)

60 - 120 seconds

Ramp-Up Rate

(T_Lto Tp)

3°C/second max.

Liquidous temperature (T_L)

Time (t_L) maintained above T_L

183°C

60 - 150 seconds

217°C

60 - 150 seconds

For users Tp must not exceed the

Classification temperature in Table 4

Classification temperature in Table 5

Peak package body temperature (Tp)

For suppliers Tp must not exceed the

Classification temperature in Table 4

For suppliers Tp must not exceed the

Classification temperature in Table 5

Time (tp)* within 5 °C of the specified

Classification temperature (T_C), see reflow

profile

20* seconds

30* seconds

Ramp-Down Rate

(Tp to T_L)

6°C/second max.

6 minutes max.

6°C/second max.

8 minutes max.

Time 25°C to Peak Temperature

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum

Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If

parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still

meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures

refer to JEP140 for recommended thermocouple use.

Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly

profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 3

For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user.

For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.

For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.

Note 3: All components in the test load shall meet the classification profile requirements.

Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,

JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a

higher peak classification temperature is desired.

Table 4. SnPb Eutectic Process - Classification Temperature (T_C)

Package Thickness

Volume mm³<350

Volume mm³≥350

<2.5 mm

235°C

220°C

≥2.5 mm

220°C

13

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Application Note

S2083

Surface Mount Instructions for QFN / DFN Packages

Rev. V10

Table 5. Pb-Free Process - Classification Temperature (T_C)

Package Thickness

Volume mm³<350

Volume mm³350-2000

Volume mm³>2000

<1.6 mm

260°C

1.6 mm-2.5 mm

>2.5 mm

260°C

250°C

245°C

Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the

values specified in Tables 4 or 5. The use of a higher Tp does not change the classification temperature (Tc).

Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.

Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes

reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.

Note 4: Moisture sensitivity levels of components intended for use in a Pb-free assembly process shall be evaluated using the Pb-free classification

temperatures and profiles defined in Tables 3 and 5, whether or not Pb-free.

Note 5: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,

JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a

higher peak classification temperature is desired

Figure 4. Reflow Profile

14

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.


型号：	S2083
厂家：	TE CONNECTIVITY
描述：	Surface Mount Instructions for QFN / DFN Packages 表面贴装说明QFN / DFN封装
文件：	总14页 (文件大小：1366K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

S2083 [TE]

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