S2083 [TE]

Surface Mount Instructions for QFN / DFN Packages; 表面贴装说明QFN / DFN封装
S2083
型号: S2083
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Surface Mount Instructions for QFN / DFN Packages
表面贴装说明QFN / DFN封装

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Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Introduction  
Via Design  
To improve the thermal/RF performance of the  
package, we recommend providing thermal vias on  
the PCB. These vias provide a heat transfer and  
RF ground path from the top surface of the PCB to  
the inner layers and the bottom surface. We  
recommend a via diameter of 0.3 mm in a 1.0 mm  
pitch array for standard square packages. This is  
shown in Figure 1-1, in which the vias are 1.0 mm  
away from their diagonal neighbors. Other non-  
standard designs may require a slightly different via  
diameter and pitch as shown in Figures 1-2, 1-3,  
and 2-4.  
The layout of the surface mount board plays a  
critical role in product design and must be done  
properly to achieve the intended performance of an  
integrated circuit. An accurate PCB pad and solder  
stencil design provides  
a proper connection  
interface between the IC package and the board.  
With the correct pad geometry, the package will  
self-align when subjected to a solder reflow  
process and will also allow for just enough excess  
surface area for adequate solder filleting. The  
solder mask should be applied over bare copper  
(SMOBC) to avoid solder reflow under the solder  
mask.  
These considerations apply in general for most of  
M/A-COM Tech’s surface mount packaged IC’s.  
This application note provides specific guidelines  
for mounting quad flat no-leads packages (QFN per  
JEDEC MO-220), and dual flat no-leads packages  
(DFN per JEDEC MO-229).  
Figure 1-1 PCB Land Design  
PCB Pad Design  
The first consideration in mounting the QFN / DFN  
to a board is the layout of metalized pads. The US-  
based trade association, IPC, has developed land  
pad design standards contained in the document  
IPC-SM-782 entitled Surface Mount Design and  
Land Pattern Standards.  
Figures 1-1 through 1-3 shows the PCB geometry  
developed for M/A-COM’s QFN / DFN packages  
based on the general guidelines contained within  
IPC-SM-782. The center area or the thermal pad,  
acts as an RF ground pad and thermal path to  
conduct heat away from the package. Normally,  
the size of the thermal pad should match the size  
of the exposed pad on the bottom of the package.  
However, a smaller thermal pad is sometimes  
recommended to prevent solder bridging to the  
lead pads. Table 1 shows some suggested PCB  
pad dimensions for QFN / DFN packages used by  
M/A-COM Tech. The solderable length of the lead  
pad is controlled by the solder mask opening (Lm)  
as indicated in Table 2, in combination with pad  
length (L) as indicated in Table 1.  
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383  
China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 1-2 PCB Land Designs  
2 x 2 mm PDFN - 8LD  
1 x 1 mm X1-DFN - 6LD  
1.2 x 1.5 mm PDFN - 6LD  
2 x 2 mm STQFN - 12LD  
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 1-3 PCB Land Designs - cont.  
1.5 x 1.2 mm PDFN - 6LD  
2 x 2.5 mm STQFN - 14LD  
4 x 6 mm PQFN - 32LD  
5 x 5 mm PQFN - 20LD (Power Amp)  
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Table 1. Recommended PCB Land Pattern Dimensions  
Package Description  
PCB Land Pattern Dimensions (mm)  
Max #  
of Vias  
Package  
Type  
Size  
(mm)  
No. of  
Leads  
Lead Pitch  
(mm)  
Tp  
X
L
X1-DFN  
PDFN  
PDFN  
PDFN  
STQFN  
STQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
1 x 1  
6
0.35  
0.50  
0.40  
0.50  
0.40  
0.40  
0.50  
0.50  
0.50  
0.65  
0.50  
0.50  
0.50  
0.65  
0.65  
0.50  
0.65  
Fig. 1-2  
Fig. 1-2  
Fig. 1-3  
Fig. 1-2  
0.82  
0.18  
0.25  
0.23  
0.28  
0.23  
0.23  
0.28  
0.28  
0.28  
0.37  
0.28  
0.28  
0.28  
0.37  
0.37  
0.28  
0.40  
0.20  
0.40  
0.315  
0.40  
0.34  
0.34  
0.65  
0.50  
0.45  
0.65  
0.65  
0.50  
0.50  
0.65  
0.65  
0.65  
0.50  
1
1.2 x 1.5  
6
1
1.5 x 1.2  
6
2
2 x 2  
8
3
2 x 2  
12  
14  
12  
16  
16  
16  
20  
24  
32  
20  
20  
28  
28  
4
2 x 2.5  
Fig.1-3  
1.2  
6
3 x 3  
2
3 x 3 (1.45 mm Exp. Pad)  
1.5  
2
3 x 3 (1.7 mm Exp. Pad)  
1.6  
2
4 x 4  
4 x 4  
2.2  
5
2.2  
5
4 x 4  
2.55  
5
4 x 6 (V1)  
5 x 5 (std)  
5 x 5 (Power Amp.)  
5 x 5  
Fig. 1-3  
3.2  
5
9
Fig.1-3  
9
3.2  
3.2  
6 x 6  
4.5  
18  
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Solder Mask Considerations  
To avoid any solder bridging between the thermal  
pad and lead pads, we recommend making the  
thermal pad an SMD pad so that the solder mask  
defines the thermal land. The mask opening (Tm)  
should be 100 microns smaller than the  
recommended thermal land size, which would be  
2.1 mm for the 4 mm PQFN package. See Table 2  
for additional recommended thermal land solder  
mask opening dimensions.  
The solder mask, a permanent part of most PCB’s  
applied after etching the metal pads, helps protect  
the spaces between the metal pads from solder  
paste and unintended adhesion of solder. All  
metalized pad areas on a printed circuit board can  
be classified as either solder mask defined (SMD)  
or non-solder mask defined (NSMD), depending on  
the size of the opening in the solder mask relative  
to the size of the metal pad.  
To prevent solder wicking inside the via during  
reflow, we recommend solder mask pads over all  
thermal via areas. The solder mask diameter  
should be 100 microns larger than the via diameter.  
Based on our experience with suppliers, we have  
found fewer voids under the die paddle using  
solder mask printing on the top surface of the PCB,  
as compared with solder mask printing on the  
bottom. Filled vias also work well as an alternative  
to solder mask to further enhance thermal  
conduction for high power amplifier products (see  
figure 1-3). These printed boards should also  
include 1 oz. copper plating in vias which are  
subsequently filled with a conductive via fill material  
and then over-plated. It is recommended that there  
be 2 oz. final copper thickness on the thermal pad  
for optimal heat transfer.  
An SMD metal pad has its periphery partly covered  
by the solder mask. An NSMD metal pad sits  
within a larger opening in the solder mask.  
The copper etching process used to define metal  
pads provides tighter control than the solder mask  
process, so M/A-COM recommends using NSMD  
pads whenever possible.  
The recommended  
solder mask opening for all lead pads should be  
140 microns larger than the pad size, which results  
in 70 microns clearance between the copper pad  
and solder mask. For example, the 4 x 4 mm 20-  
lead package has an indicated width of the PCB  
lead pad (X) of 0.28 mm (Table 1) and the width of  
the solder mask opening (Wm) would be 0.42 mm  
(Table 2). In the other direction, the length of the  
solder mask opening (Lm) should be 180 microns  
extended outward from the edge of the package  
and 70 microns inward from the PCB pads, which  
results in a total length of 900 microns (see  
Table 2).  
Figure 2-1 Solder Mask Designs  
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383  
China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 2-2 Solder Mask Designs  
1 x 1 mm X1-DFN - 6LD  
1.2 x 1.5 mm PDFN - 6LD  
1.5 x 1.2 mm PDFN - 6LD  
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 2-3 Solder Mask Designs - cont.  
2 x 2 mm PDFN - 8LD  
2 x 2 mm STQFN - 12LD  
2 x 2.5 mm STQFN - 14LD  
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 2-4 Solder Mask Design - cont.  
(not shown on right  
view for clarity)  
4 x 6 mm PQFN - 32LD  
Stencil Design  
A stencil is used for applying solder paste to the  
PCB. Although the PCB design suggested in  
Figures 1 through 2 will help eliminate some  
surface mounting difficulties, special considerations  
apply in stencil design and solder paste printing for  
both lead pad and thermal pads.  
The stencil opening for all lead pad areas should  
be the same as the pad size on the PCB (Tables 1  
& 2). As mentioned before, the function of the  
thermal pad is to allow for heat removal from the  
package as well as providing an effective RF  
ground. Therefore, a good stencil design becomes  
important for getting an optimal older paste  
distribution between the lead pads and the thermal  
pad. To minimize voids and defects, use smaller  
multiple stencil openings for the thermal pad  
instead of one big opening. Figures 3-1 through 3-  
3 shows the recommended stencil designs. The  
target coverage for solder paste area is to maintain  
50 to 80 percent of the overall thermal pad area.  
The selected web width is 0.2 mm running across  
the vias as shown in Figures 3-1 through 3-3.  
Surface mount processes vary from company to  
company, so we recommend careful development  
of your process for QFN / DFN packages. The  
following provides some guidelines for stencil  
design.  
We recommend a stencil thickness of 0.100 to  
0.125 mm for fine pitch packages (0.5 mm or  
smaller). This thickness can be increased to 0.15  
mm for coarser pitch parts. A laser-cut, stainless  
steel stencil with electro-polished trapezoidal walls  
is recommended.  
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383  
China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 3-1 Stencil Designs  
1 mm X1-DFN - 6LD  
1.5 x 1.2 mm PDFN - 6LD  
st  
1.2 x 1.5 mm PDFN - 6LD  
2 mm PDFN - 8LD  
2 mm STQFN - 12LD  
2 x 2.5 mm STQFN14LD  
9
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Figure 3-2 Stencil Designs - cont.  
3 mm PQFN  
5 mm PQFN  
4 mm PQFN  
6 mm PQFN  
Figure 3-3 Stencil Design  
4 x 6 mm PQFN  
10  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Table 2. Recommended Solder Mask & Stencil Dimensions  
Package  
Solder Mask Opening (mm)  
Stencil Opening (mm)  
type  
X1-DFN  
PDFN  
mm  
1 x 1  
leads  
6
Wm  
Fig. 2-2  
0.39  
Lm  
Tm  
Am  
1.30  
1.56  
1.86  
2.36  
2.36  
X
Lst  
0.35  
0.58  
0.495  
0.58  
0.52  
0.52  
0.83  
Tst  
Ast  
1.30  
1.56  
1.86  
2.36  
2.36  
Fig. 2-2 Fig. 2-2  
0.18  
0.25  
0.23  
0.28  
0.23  
0.23  
0.28  
Fig. 3-1  
Fig. 3-1  
Fig. 3-1  
Fig. 3-1  
0.62  
1.2 x 1.5  
1.5 x 1.2  
2 x 2  
6
0.65  
0.565  
0.65  
0.59  
0.59  
0.90  
Fig. 2-2  
Fig. 2-2  
Fig. 2-3  
0.72  
PDFN  
6
Fig. 2-2  
0.42  
PDFN  
8
STQFN  
STQFN  
PQFN  
2 x 2  
12  
14  
12  
Fig. 2-3  
Fig. 2-3  
0.42  
2 x 2.5  
3 x 3  
Fig. 2-3 Fig. 2-3  
Fig. 3-1 Fig. 3-1  
1.1  
1.4  
3.36  
3.36  
1.0  
1.3  
3.36  
3.36  
3 x 3  
PQFN  
PQFN  
16  
16  
0.42  
0.42  
0.75  
0.70  
0.28  
0.28  
0.68  
0.63  
(1.45 mm Exp. Pad)  
3 x 3  
(1.7 mm Exp. Pad)  
1.5  
3.36  
1.4  
3.36  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
PQFN  
4 x 4  
4 x 4  
16  
20  
24  
32  
20  
20  
28  
28  
0.51  
0.42  
0.42  
0.42  
0.51  
0.51  
0.42  
0.54  
0.90  
0.90  
0.75  
0.75  
0.90  
0.90  
0.90  
0.75  
2.1  
2.1  
4.36  
4.36  
0.37  
0.28  
0.28  
0.28  
0.37  
0.37  
0.28  
0.40  
0.83  
0.83  
0.68  
0.68  
0.83  
0.83  
0.83  
0.68  
2.0  
2.0  
2.3  
4.36  
4.36  
4.36  
4 x 4  
2.45  
Fig. 3-3  
3.1  
4.36  
4 x 6 (V1)  
5 x 5 (std)  
5 x 5 (Power Amp.)  
5 x 5  
Fig. 3-3  
5.36  
Fig. 3-3 Fig. 3-3  
3.0  
3.0  
3.0  
4.3  
5.36  
5.36  
5.36  
6.36  
3.1  
5.36  
3.1  
5.36  
6 x 6  
4.4  
6.36  
11  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Reflow Profile  
General Soldering Precautions  
The most common solder reflow method is  
accomplished in a belt furnace using convection  
heat transfer. Tables 3 thru 5 along with Figure 4  
The melting temperature of solder generally  
exceeds the recommended maximum operating  
temperature of the device. When the entire device  
is heated to a high temperature, failure to complete  
soldering within a short time could result in device  
failure. Therefore, always observe the following  
instructions to minimize the thermal stress to the  
devices.  
show  
a
typical convection reflow profile of  
temperature versus time. The profile reflects the  
three distinct heating stages, or zones (preheat,  
reflow, and cooling) recommended in automated  
reflow processes to ensure reliable, finished solder  
joints.  
The profile will vary among soldering  
systems and is intended as an example to use as a  
starting point. Other factors that can affect the  
profile include the density and types of components  
on the board, type of solder used and type of board  
or substrate material being used.  
Always preheat the device (failure to do so can  
cause excessive thermal shock and stress that  
can result in damage to the device).  
Limit the temperature in the reflow stage to peak  
temperature indicated in Tables 3 thru 5.  
After completing the soldering process, allow the  
devices to cool naturally for at least 3 minutes.  
Gradual cooling should be used, as the use of  
forced cooling will increase the temperature  
gradient and may result in latent failure due to  
mechanical stress.  
Thermocouples should be securely attached to the  
top surface of a representative component to  
insure the temperature exposure is met. Profile  
should be recorded by data acquisition for future  
reference.  
Avoid any mechanical stress or shock to the  
solder joints and devices during cooling.  
12  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Table 3. Reflow Conditions  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Preheat/Soak  
Temperature Min (Tsmin  
Temperature Max (Tsmax  
)
)
100°C  
150°C  
150°C  
200°C  
Time (ts) from (Tsmin to Tsmax  
)
60 - 120 seconds  
60 - 120 seconds  
Ramp-Up Rate  
(TL to Tp)  
3°C/second max.  
3°C/second max.  
Liquidous temperature (TL)  
Time (tL) maintained above TL  
183°C  
60 - 150 seconds  
217°C  
60 - 150 seconds  
For users Tp must not exceed the  
For users Tp must not exceed the  
Classification temperature in Table 4  
Classification temperature in Table 5  
Peak package body temperature (Tp)  
For suppliers Tp must not exceed the  
Classification temperature in Table 4  
For suppliers Tp must not exceed the  
Classification temperature in Table 5  
Time (tp)* within 5 °C of the specified  
Classification temperature (TC), see reflow  
profile  
20* seconds  
30* seconds  
Ramp-Down Rate  
(Tp to TL)  
6°C/second max.  
6 minutes max.  
6°C/second max.  
8 minutes max.  
Time 25°C to Peak Temperature  
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum  
Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If  
parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still  
meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures  
refer to JEP140 for recommended thermocouple use.  
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly  
profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 3  
For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user.  
For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.  
For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.  
Note 3: All components in the test load shall meet the classification profile requirements.  
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,  
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a  
higher peak classification temperature is desired.  
Table 4. SnPb Eutectic Process - Classification Temperature (TC)  
Package Thickness  
Volume mm3 <350  
Volume mm3 ≥350  
<2.5 mm  
235°C  
220°C  
≥2.5 mm  
220°C  
220°C  
13  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383  
China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
Application Note  
S2083  
Surface Mount Instructions for QFN / DFN Packages  
Rev. V10  
Table 5. Pb-Free Process - Classification Temperature (TC)  
Package Thickness  
Volume mm3 <350  
Volume mm3 350-2000  
Volume mm3 >2000  
<1.6 mm  
260°C  
260°C  
260°C  
1.6 mm-2.5 mm  
>2.5 mm  
260°C  
250°C  
250°C  
245°C  
245°C  
245°C  
Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the  
values specified in Tables 4 or 5. The use of a higher Tp does not change the classification temperature (Tc).  
Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.  
Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes  
reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.  
Note 4: Moisture sensitivity levels of components intended for use in a Pb-free assembly process shall be evaluated using the Pb-free classification  
temperatures and profiles defined in Tables 3 and 5, whether or not Pb-free.  
Note 5: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,  
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a  
higher peak classification temperature is desired  
Figure 4. Reflow Profile  
14  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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