SSRMP-240D10 [TE]

Solid State Relay;
SSRMP-240D10
型号: SSRMP-240D10
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Solid State Relay

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Potter & Brumfield  
Solid State Relay  
SSRMP Series  
“Mini Puck”  
Solid State Relay  
File E29244  
Users should thoroughly review the technical data before selecting a  
product part number. It is recommended that users also seek out the  
pertinent approvals files of the agencies/laboratories and review them to  
ensure the product meets the requirements for a given application.  
Features  
Engineering Data  
• Standard “mini puck” package.  
• LED indicator.  
Form: 1 Form A (SPST-NO).  
Duty: Continuous.  
• Triac outputs.  
Isolation: 4000V rms minimum, input - output.  
Temperature Range:  
• 10A, 16A & 25A rms versions.  
• DC input version.  
• 240 & 480 Vac Line voltage.  
• 4000V rms isolation.  
• Quick connect style terminals.  
• Panel mountable.  
Storage: –30°C to +100°C  
Operating Temperature: –30°C to + 80°C  
Case Material: Plastic, UL rated 94V-1.  
Case and Mounting: Refer to outline dimension.  
Termination: Refer to outline dimension.  
Approximate Weight: 0.65 oz. (18.3g).  
Ordering Information  
Typical Part Number  
SSRMP  
-240  
D
10  
R
1. Basic Series: SSRMP = “mini puck” triac output solid state reply  
2. Line Voltage: 240 = 24 - 280 VAC  
480 = 48 - 480 VAC  
3. Input Type & Voltage: D = 4 - 32 VDC constant current  
4. Maximum Switchin Rating: 10 = 10A rms, mounted to heatsink  
16 = 16A rms, mounted to heatsink  
25 = 25A rms, mounted to heatsink  
5. Options: Blank = Zero voltage turn-on  
R = Random volage turn-on  
Our authorized distributors are more likely to maintain the following items in stock for immediate delivery.  
SSRMP-240D10  
SSRMP-240D10R  
SSRMP-240D25  
SSRMP-240D25R  
SSRMP-480D10  
SSRMP-480D10R  
SSRMP-480D25  
SSRMP-480D25R  
Input Specifications  
Parameter  
Units  
VDC  
VDC  
VDC  
mA  
DC Input  
Control Voltage Range VIN  
4 - 32  
4
Must Operate Voltage VIN(OP) (Min.)  
Must release Voltage VIN(REL) (Min.)  
Input Current (Max.)  
1
1 - 20  
1
05-2020, Rev. 0520  
Datasheets and product specification  
according to IEC 61810-1 and to be used  
only together with the ‘Definitions’ section.  
Datasheets and product data is subject to the  
terms of the disclaimer and all chapters of  
the ‘Definitions’ section, available at  
http://relays.te.com/definitions  
Datasheets, product data, ‘Definitions’ sec-  
tion, application notes and all specifications  
are subject to change.  
www.te.com  
© 2015 Tyco Electronics Corporation,  
a TE Connectivity Ltd. company  
Potter & Brumfield  
Solid State Relay  
SSRMP Series (Continued)  
Output Specification (@ 25°C, unless otherwise specified)  
Parameter  
Nom. Line Voltage  
Conditions  
Units  
10A Models 16A Models 25A Models  
240  
480  
Vrms  
Vrms  
A
24-280  
48-480  
16  
Load Voltage Range VL  
Load Current Range IL*  
Resistive  
10  
25  
Single Cycle Surge Current  
A
100  
160  
208  
f=60Hz. VL  
=Nom  
Leakage Current (Off-State) (@rated voltage)  
mA  
5
240 & 480  
On-State Voltage Drop (@rated current)  
Static dv/dt (Off-State) (Min.)  
IL = Max.  
Vrms  
V/µs  
1.6  
400  
475  
240  
480  
Vrms  
600  
Repetitive Peak Off-State Voltage  
800  
144  
15  
2
2
I T Rating  
A Sec  
55  
259  
2
Zero Turn-On Voltage  
Vpk  
Thermal Resistance, Junction to case (R0J-C  
(Max.)  
)
°C/W  
2.4  
2.1  
240 & 480  
10 for Zero Voltage Turn-On  
Turn -On Time (Max.)  
0.1 for Random Voltage Turn-On  
f= 60/ 50 Hz.  
ms  
10 for Zero Voltage Turn-On  
Turn -Off Time (Max.)  
8.3/10 for Random Voltage Turn-On  
* See Derating curve  
Electrical Characteristics (Thermal Derating Curves)  
Heatsink Recommendations  
• We recommend that solid state relay modules be mounted to a heatsink sufficient to maintain the module’s base temperature at 85°C  
under worst case ambient temperature and load conditions.  
• The heatsink mounting surface should be a smooth (30-40 micro-inch finish), flat (30-40 micro-inch flatness across mating area), un-painted surface  
which is clean and free of oxidation.  
• An even coating of thermal compound (Dow Corning DC340 or equivalent) should be applied to both the heatsink and module mounting surfaces  
and spread to a uniform depth of .002” to eliminate all air pockets.  
Operating Diagrams  
Outline Dimensions  
2
05-2020, Rev. 0520  
Datasheets and product specification  
according to IEC 61810-1 and to be used  
only together with the ‘Definitions’ section.  
Datasheets and product data is subject to the  
terms of the disclaimer and all chapters of  
the ‘Definitions’ section, available at  
http://relays.te.com/definitions  
Datasheets, product data, ‘Definitions’ sec-  
tion, application notes and all specifications  
are subject to change.  
www.te.com  
© 2015 Tyco Electronics Corporation,  
a TE Connectivity Ltd. company  

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