ZEN065V130A24LS [TE]
Polymer Protected Zener Diode; 聚合物保护齐纳二极管
| 型号： | ZEN065V130A24LS |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Polymer Protected Zener Diode |
| 文件： | 总8页 (文件大小：309K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PolyZen Devices
Polymer Protected Zener Diode
PolyZen devices are polymer enhanced precision Zener
diode micro-assemblies that help protect sensitive
electronics from damage caused by inductive voltage
spikes, voltage transients, use of incorrect power supplies
and reverse bias.
The PolyZen micro-assembly incorporates a stable
Zener diode for precise voltage clamping and
a
resistively non-linear, polymeric positive temperature
coefficient (PPTC) layer that responds to either diode
heating or overcurrent events by transitioning from a
low to high resistance state.
4
PolyZen devices help provide resettable protection
against damage caused by multi-watt fault events and
require only 0.7W power dissipation. In the event of
sustained high power conditions, the PPTC element of
the device “trips” to limit current and generate voltage
drop. This functionality helps protect both the Zener
and the follow-on electronics, effectively increasing the
diode’s power handling capacity.
Benefits
Features
• Helps shield downstream electronics from overvoltage
and reverse bias
• RoHS compliant
• Overvoltage transient suppression
• Hold currents up to 2.3A
• Trip events shut out overvoltage and reverse bias
sources
• Time delayed, overvoltage trip
• Time delayed, reverse bias trip
• Power handling on the order of 30 watts
• Integrated device construction
• Analog nature of trip events minimize upstream
inductive spikes
• Helps reduce design costs with single component
placement and minimal heat sinking requirements
Applications
• Portable media players
• Cellphone charger port and USB power
• Automotive peripheral input power
• DC power port protection
• Global positioning systems
• Hard disk drives 5V & 12V bus
• Solid State Drives (SSD) 5V bus
• Industrial handheld POS
27
Figure PZ1 Typical Application Block Diagram for PolyZen Devices
Power Supply
(External or internal)
Protected Electronics
GND
2
VIN
PolyZen
Device
1
+
VOUT
3
RLOAD
Regulated
Output
Protected downstream
electronics
Table PZ1 Electrical Characteristics for PolyZen Devices
(Performance ratings @ 25°C unless otherwise specified)
4
VZ(V)
VINT MAX
IFLT MAX
IHOLD
@ 20°C
(A)
Test
Test
IZt
(A)
RTyp
(Ω)
R1MAX
(Ω)
VINT MAX Current
IFLT MAX
(A)
Voltage
(V)
Part Number
Min.
5.45
Typ.
5.6
Max.
5.75
(V)
(A)
3A
3A
3A
3A
3A
5A
5A
5A
3A
3A
3A
3A
3A
ZEN056V130A24LS
ZEN065V130A24LS
ZEN098V130A24LS
ZEN132V130A24LS
ZEN164V130A24LS
ZEN056V230A16LS
ZEN065V230A16LS
ZEN132V230A16LS
ZEN056V075A48LS
ZEN132V075A48LM
ZEN056V115A24LS
ZEN056V130A24GS
ZEN059V130A24LS†
* Data is preliminary
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.3
1.3
0.12
0.12
0.12
0.12
0.12
0.04
0.04
0.04
0.28
0.28
0.15
0.12
0.12
0.16
0.16
0.16
0.16
0.16
0.06
0.06
0.06
0.45
0.45
0.18
0.18
0.16
24V
24V
24V
24V
24V
16V
16V
16V
48V
48V
24V
24V
24V
+10/-40
+6/-40
+24/-16V
+24/-16V
+24/-16V
+24/-16V
+24/-16V
+16/-12V
+16/-12V
+20/-12V
+48/-16V
+48/-16V
+24/-16V
+24/-16V
+24/-16V
6.35
6.5
6.65
NEW
9.60
9.8
10.00
13.60
16.60
5.75
1.3
+3.5/-40
+2/-40
13.20
16.10
5.45
13.4
16.4
5.6
1.3
1.3
+1.25/-40
+5/-40
2.3
6.35
6.5
6.65
2.3
+3.5/-40
+2/-40
13.20
5.45
13.4
5.6
13.60
5.75
2.3
0.75
0.75
1.15
1.30
1.30
+10/-40
+2/-40
13.20
5.45
13.4
5.6
13.60
5.75
NEW
NEW
+10/-40
+6/-40
5.45
5.6
5.75
Coming*
Soon
5.80
5.9
6.00
+6/-40
† Maximum Reverse Leakage Current = 650µA@5.0V meets USB suspend mode specification
Table PZ2 Definitions of Terms for PolyZen Devices
VZ
Zener clamping voltage measured at current IZt and 20°C.
Test current at which VZ is measured.
Polymer PTC
IZt
VIN
VOUT
IHOLD
Maximum steady state current IPTC that will not generate a trip event at the specified temperature.
Ratings assume IFLT = 0A.
Zener
Diode
RTyp
Typical resistance between VIN and VOUT pins when the device is at room temperature.
R1MAX
The maximum resistance between VIN and VOUT pins, at room temperature, one hour after first trip
or after reflow soldering.
GND
IFLT
Current flowing through the Zener diode.
IPTC
IOUT
IFLT MAX
Maximum RMS fault current the Zener diode component of the device can withstand and remain
VIN
resettable; testing is conducted at rated voltage with no load connected to VOUT
.
VOUT
VINT MAX
The voltage (VIN - VOUT “post trip”) at which typical qualification devices (98% devices, 95%
confidence) survived at least 100 trip cycles and 24 hours trip endurance when “tripped” at the
specified voltage and current (IPTC).
IFLT
GND
Trip Event
A condition where the PPTC transitions to a high resistance state, thereby limiting IPTC, and
significantly increasing the voltage drop between VIN and VOUT
.
28
RoHS Compliant, ELV Compliant
Figure PZ2-PZ9 Typical Performance Curves for PolyZen Devices
Figure PZ2
Figure PZ3
VOUT Peak vs IFLT RMS (IOUT = 0)
Time-to-Trip vs IFLT RMS (IOUT = 0)
22.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
10
A = ZEN056V1yyA24LS/GS
A = ZEN056V1yyA24LS/GS
E
B = ZEN065V130A24LS
C = ZEN098V130A24LS
D = ZEN132V130A24LS
E = ZEN164V130A24LS
B = ZEN065V130A24LS
C = ZEN098V130A24LS
D = ZEN132V130A24LS
E = ZEN164V130A24LS
D
1
C
E
B
A
0.1
D
B
6.0
A
C
4.0
2.0
0
0
0.01
0
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
IFLT RMS (A)
IFLT RMS (A)
Figure PZ4
Figure PZ5
VOUT Peak vs IFLT RMS (IOUT = 0)
Time-to-Trip vs IFLT RMS (IOUT = 0)
4
22.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
100
A = ZEN056V230A16LS
B = ZEN065V230A16LS
C = ZEN132V230A16LS
A = ZEN056V230A16LS
B = ZEN065V230A16LS
C = ZEN132V230A16LS
C
10
1
B
A
B
6.0
0.1
C
A
4.0
2.0
0.01
0
0
0
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
IFLT RMS (A)
IFLT RMS (A)
Figure PZ6
Figure PZ7
VOUT Peak vs IFLT RMS (IOUT = 0)
Time-to-Trip vs IFLT RMS (IOUT = 0)
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
100
10
A = ZENxxxV1yyA24LS/GS
B = ZENxxxV230A16LS
C = ZENxxxV075A48LS/M
A = ZENxxxV1yyA24LS/GS
B = ZENxxxV230A16LS
C = ZENxxxV075A48LS/M
1
0.1
0.01
B
A
B
A
C
C
-1.2
-50
0.001
-50
-40
-30
-20
-10
0
-40
-30
-20
-10
0
IFLT RMS (A)
IFLT RMS (A)
Figure PZ8
Figure PZ9
Temperature Effect on IHOLD (IFLT = 0)
Time-to-Trip vs IPTC RMS (IFLT = 0)
10
3.5
3.0
2.5
2.0
1.5
1.0
0.5
A = ZENxxxV130A24LS/GS
A = ZENxxxV1yyA24LS/GS
B = ZENxxxV230A16LS
C = ZENxxxV075A48LS/M
D = ZENxxxV115A24LS
B = ZENxxxV230A16LS
B
C = ZENxxxV075A48LS/M
1
0.1
A
D
0.01
C
B
A
C
0.001
0
0.0
-40
-20
0
20
40
60
80
100
5
10
15
20
25
30
35
40
45
AmbientTemperature (˚C)
I
RMS (A)
PTC
29
RoHS Compliant
Table PZ3 General Characteristics for PolyZen Devices
Operating temperature range
Storage temperature
ESD withstand
-40° to +85°C
-40° to +85°C
15kV
Human body model
Diode capacitance
Construction
4200pF
Typical @ 1MHz, 1V RMS
RoHS compliant
Figure PZ10-PZ22 Basic Operation Examples for PolyZen Devices
Figure PZ10
Hot-Plug Response
ZEN056V130A24LS vs a 22V/120W Universal Power Supply
350
300
250
200
150
100
50
35
C
A = VIN
Capacitive
Current Spike
B = VOUT
30
25
20
15
10
5
Supply Voltage
returns to normal
C = CURRENT (IFLT
D = POWER
)
Supply Voltage
dropped by current
Current Pulled to
GND via diode
4
A
D
PPTC switches to
high resistance
Output Voltage
remains clamped
A
B
B
D
V
OUT Peak
0.02
C
0
0
0
0.01
0.03
0.04
0.05
0.06
0.07
0.08
Time (Sec)
Figure PZ11
Figure PZ12
Typical Fault Response: ZEN056V115A24LS
20V, 3.5A Current Limited Source (IOUT=0)
Typical Fault Response: ZEN056V130A24LS
24V, 3.5A Current Limited Source (IOUT=0)
20
20
A
A
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
18
16
14
12
10
8
18
16
14
12
10
8
B
B
6
6
4
4
2
2
C
C
0
0
-0.02
0.02
0.06
0.10
0.14
0.18
-0.02
0.02
0.06
0.10
0.14
0.18
Time (s)
Time (s)
Figure PZ13
Figure PZ14
Typical Fault Response: ZEN065V130A24LS
24V, 5.0A Current Limited Source (IOUT=0)
Typical Fault Response: ZEN098V130A24LS
24V, 3.5A Current Limited Source (IOUT=0)
26
24
A
24
22
20
18
16
14
12
10
8
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
22
20
18
16
14
12
10
8
A
B
C
B
C
6
6
4
4
2
2
0
0
0.00
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.05
0.10
0.15
Time (s)
Time (s)
30
RoHS Compliant, ELV Compliant
Figure PZ16-PZ22 Basic Operation Examples for PolyZen Devices
Cont’d
Figure PZ15
Figure PZ16
Typical Fault Response: ZEN132V130A24LS
24V, 2.0A Current Limited Source (IOUT=0)
Typical Fault Response: ZEN164V130A24LS
24V, 1.0A Current Limited Source (IOUT=0)
30
30
A = VIN (V)
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
B = VOUT (V)
C = IFLT (A)
A
B
25
20
15
10
5
25
20
15
10
5
A
B
C
C
0
0
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.00
0.10
0.20
0.30
0.40
0.50
Time (s)
Time (s)
Figure PZ17
Figure PZ18
Typical Fault Response: ZEN056V230A16LS
16V, 5.0A Current Limited Source (IOUT=0)
Typical Fault Response: ZEN065V230A16LS
16V, 3.5A Current Limited Source (IOUT=0)
4
20
20
A = VIN (V)
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
A
B = VOUT (V)
C = IFLT (A)
A
15
10
5
15
10
5
B
C
B
C
0
0.00
0
0.00
0.10
0.20
0.30
0.10
0.20
0.30
Time (s)
Time (s)
Figure PZ19
Figure PZ20
Typical Fault Response: ZEN056V075A48LS
48V, 10.0A Current Limited Source (IOUT=0)
Typical Fault Response: ZEN132V230A16LS
20V, 2.0A Current Limited Source (IOUT=0)
50
22
A
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
A
20
18
16
14
12
10
8
40
30
20
10
0
B
6
4
B
2
C
C
0.03
0
0.00
0.01
0.02
0.04
0
0.05
0.10
0.15
0.20
0.25
0.30
Time (s)
Time (s)
Figure PZ21
Figure PZ22
Typical Fault Response: ZEN132V075A48LM
48V, 2.0A Current Limited Source (IOUT=0)
Typical Fault Response: ZEN056V130A24GS
24V, 1.0A Current Limited Source (IOUT=0)
24
50
A
A
A = VIN (V)
A = VIN (V)
B = VOUT (V)
C = IFLT (A)
22
20
18
16
14
12
10
8
45
40
35
30
25
20
15
10
5
B = VOUT (V)
C = IFLT (A)
B
C
B
C
6
4
2
0
0
0
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Time (s)
Time (s)
31
RoHS Compliant
Table PZ4 Packaging and Marking Information for PolyZen Devices
Part Number
Bag Quantity
Tape & Reel Quantity
Standard Package
15,000
ZENxxxVyyyAzzLS/M
ZENxxxVyyyAzzGS
-
-
3,000
4,000
20,000
Table PZ5 Dimensions for PolyZen Devices
ZENxxxVyyyAzzLS/M Devices
A
B
C
Min.
Max.
Min.
Max.
Min.
Max.
mm
inch
3.85
4.15
3.85
4.15
1.4
2.0
C
(0.152) (0.163)
(0.152) (0.163)
(0.055) (0.081)
A
B
4
ZENxxxVyyyAzzGS Devices
L
W
H
W
Min.
Max.
Min.
Max.
Min.
Max.
mm
inch
3.85
4.15
3.85
4.15
1.16
1.25
(0.152) (0.163)
(0.152) (0.163)
(0.046) (0.049)
L
H
Table PZ6 Pad Layout and Configuration Information for PolyZen Devices
Pin Number
Pin Name
VIN
Pin Function
1
2
3
VIN
= Protected input to Zener diode
GND
GND = Ground
VOUT
VOUT = Zener regulated voltage output
Pin Configuration
(Top View)
Pad Dimensions
0.94mm
(0.037”)
2
3
GND
0.33mm
(0.013”)
2.21mm
(0.087”)
V
1
IN
0.94mm
(0.037”)
V
OUT
0.56mm
(0.022”)
2.88mm
(0.1135”)
0.56mm
(0.022”)
32
RoHS Compliant, ELV Compliant
Solder Reflow and Rework Recommendation for PolyZen Devices
Classification Reflow Profiles
Profile Feature
Pb-Free Assembly
Average ramp up rate (TsMAX toTp)
Preheat
3°C/second max.
• Temperature min. (TsMIN
• Temperature max. (TsMAX
• Time (tsMIN to tsMAX
)
150°C
)
200°C
)
60-180 seconds
Time maintained above:
• Temperature (TL)
• Time (tL)
217°C
60-150 seconds
260°C
Peak/Classification temperature (Tp)
Time within 5°C of actual peak temperature
Time (tp)
20-40 seconds
6°C/second max.
8 minutes max.
Ramp down rate
Time 25°C to peak temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
4
Figure PZ23
tp
Critical Zone
TL toTp
Tp
Ramp up
TL
tL
TsMAX
TsMIN
ts
Ramp down
Preheat
25
t 25˚C to Peak
Time
Reflow Profile
Tape and Reel Specifications for PolyZen Devices (in Millimeters)
Figure PZ24 EIA Referenced Taped Component Dimensions for PolyZen Devices (in Millimeters)
Description
ZENxxxVyyyAzzLS/M Devices
ZENxxxVyyyAzzGS Devices
A0
B0
K0
4.35
4.35
2.30
4.35
4.35
1.80
8.00
ø1.5 + 0.1 / -0.0
4.00Note 1
ø1.50 Min
0.25 R
0.35 0.05
2.00 0.05Note 3
A
1.75 0.10
R 0.3 Max
5.50 0.05Note 3
B0
12.0 0.3
K0
A0
A
0.25
Notes:
1. 10 sprocket hole pitch cumulative tolerance 0.2
2. Camber in compliance with EIA 481
3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
33
RoHS Compliant
Figure PZ25 Reel Dimensions for PolyZen Devices (in Millimeters)
MatteFinishThese Area
Description
AMax
Dimension (mm)
Lock Feature (6 places)
330
102
8.4
NMin
W1
NMin
ø20.0 Min
W2
11.1
AMax
+0.25
330.0
102.0 Ref
–4.00
+0.5
–0.2
ø13.0
2.0 +/– 0.5
Detail A
See “Detail A”
W1 (measured at hub)
W2 (measured at hub)
Part Numbering System for PolyZen Devices
4
ZEN 056V 130A 24 LS/M & GS
Special Labeling
LS or M = Module Height of 2.0mm
GS = Module Height of 1.25mm
V
INT Max Rating (24 = 24V)
PPTC Hold Current Group (130 = 1.3A)
Zener Voltage Group (056 = 5.6V)
PolyZen Series
Part Marking System for PolyZen Devices
ZENxxxVyyyAzzLS/M Devices
ZENxxxVyyyAzzGS Devices
Zener Diode Voltage Rating
056 = 5.6V
Zener Diode Voltage Rating
056 = 5.6V
059 = 5.9V
065 = 6.5V
t056
1234567
098 = 9.8V
132 = 13.4V
Batch Number
164 = 16.4V
t056
12345
Batch Number
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and
test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the
information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations are those in the Tyco Electronics’ Standard Terms and
Conditions of Sale for this product, and in no case willTyco Electronics be liable for any incidental, indirect, or consequential damages arising from
the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition,Tyco Electronics reserves the right
to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer.
34
RoHS Compliant, ELV Compliant
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TE
ZEN132V260A16CE
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