54ACT16823_06

更新时间:2024-09-18 06:50:14
品牌:TI
描述:18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS

54ACT16823_06 概述

18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS 18位总线接口触发器具有三态输出

54ACT16823_06 数据手册

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54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A – APRIL 1991 – REVISED APRIL 1996  
54ACT16823 . . . WD PACKAGE  
74ACT16823 . . . DL PACKAGE  
(TOP VIEW)  
Members of the Texas Instruments  
Widebus Family  
Inputs Are TTL-Voltage Compatible  
Provide Extra Data Width Necessary for  
Wider Address/Data Paths or Buses With  
Parity  
1
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
1CLR  
1OE  
1Q1  
GND  
1Q2  
1Q3  
1CLK  
1CLKEN  
1D1  
GND  
1D2  
2
3
Flow-Through Architecture Optimizes PCB  
Layout  
4
5
Distributed V  
Minimizes High-Speed Switching Noise  
and GND Pin Configuration  
6
1D3  
CC  
7
V
V
CC  
CC  
8
1Q4  
1Q5  
1Q6  
GND  
1Q7  
1Q8  
1Q9  
2Q1  
2Q2  
2Q3  
GND  
2Q4  
2Q5  
2Q6  
1D4  
1D5  
1D6  
GND  
1D7  
1D8  
1D9  
2D1  
2D2  
2D3  
GND  
2D4  
2D5  
2D6  
EPIC (Enhanced-Performance Implanted  
CMOS) 1-µm Process  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Package Options Include Plastic 300-mil  
Shrink Small-Outline (DL) Packages Using  
25-mil Center-to-Center Pin Spacings and  
380-mil Fine-Pitch Ceramic Flat (WD)  
Packages Using 25-mil Center-to-Center  
Pin Spacings  
description  
These 18-bit flip-flops feature 3-state outputs  
designed specifically for driving highly-capacitive  
or relatively low-impedance loads. They are  
particularly suitable for implementing wider buffer  
registers, I/O ports, parity bus interfacing, and  
working registers.  
V
V
CC  
CC  
2Q7  
2Q8  
GND  
2Q9  
2OE  
2CLR  
2D7  
2D8  
GND  
2D9  
2CLKEN  
2CLK  
The ’ACT16823 can be used as two 9-bit flip-flops  
or one 18-bit flip-flop. With the clock-enable  
(CLKEN) input low, the D-type flip-flops enter data  
on the low-to-high transitions of the clock. Taking  
CLKEN high disables the clock buffer, thus  
latching the outputs. Taking the clear (CLR) input  
low causes the Q outputs to go low independently  
of the clock.  
A buffered output-enable (OE) input can be used to place the outputs in either a normal logic state (high or low  
logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus  
lines significantly.  
OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered  
while the outputs are in the high-impedance state.  
The 74ACT16823 is packaged in theTI shrink small-outline package, which provides twice the I/O pin count and  
functionality of standard small-outline packages in the same printed-circuit-board area.  
The 54ACT16823 is characterized for operation over the full military temperature range of 55°C to 125°C. The  
74ACT16823 is characterized for operation from –40°C to 85°C  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC and Widebus are trademarks of Texas Instruments Incorporated.  
Copyright 1996, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A APRIL 1991 REVISED APRIL 1996  
FUNCTION TABLE  
(each 9-bit stage)  
INPUTS  
OUTPUT  
Q
OE  
L
CLR CLKEN CLK  
D
X
H
L
L
H
H
H
H
X
X
L
X
L
H
L
L
L
L
L
L
L
X
X
X
X
X
Q
Q
0
0
L
H
X
H
Z
logic symbol  
2
1
EN1  
R2  
1OE  
1CLR  
1CLKEN  
1CLK  
55  
G3  
56  
27  
28  
30  
29  
3C4  
EN5  
R6  
2OE  
2CLR  
2CLKEN  
2CLK  
G7  
7C8  
54  
52  
51  
49  
48  
47  
45  
44  
43  
42  
41  
40  
38  
37  
36  
34  
33  
31  
3
1D1  
1D2  
1D3  
1D4  
1D5  
1D6  
1D7  
1D8  
1D9  
2D1  
2D2  
2D3  
2D4  
2D5  
2D6  
2D7  
2D8  
2D9  
4D  
1Q1  
1Q2  
1Q3  
1Q4  
1Q5  
1Q6  
1Q7  
1Q8  
1Q9  
2Q1  
2Q2  
2Q3  
2Q4  
2Q5  
2Q6  
2Q7  
2Q8  
2Q9  
1, 2  
5
6
8
9
10  
12  
13  
14  
15  
16  
17  
19  
20  
21  
23  
24  
25  
8D  
5, 6  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A APRIL 1991 REVISED APRIL 1996  
logic diagram (positive logic)  
2
1OE  
1
1CLR  
R
55  
1CLKEN  
CE  
56  
3
1CLK  
C1  
1D  
1Q1  
54  
1D1  
One of Nine Channels  
To Eight Other Channels  
27  
2OE  
28  
2CLR  
R
30  
2CLKEN  
CE  
29  
15  
2CLK  
C1  
1D  
2Q1  
42  
2D1  
One of Nine Channels  
To Eight Other Channels  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A APRIL 1991 REVISED APRIL 1996  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
+ 0.5 V  
I
CC  
CC  
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
IK  
I
I
CC  
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
Continuous current through V  
Maximum package power dissipation at T = 55°C (in still air) (see Note 2): DL package . . . . . . . . . . . 1.4 W  
Storage temperature range, T  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±450 mA  
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The maximum package power dissipation is calculated using a junction temperature of 150 C and a board trace length of 750 mils.  
recommended operating conditions (see Note 2)  
54ACT16823  
MIN NOM  
74ACT16823  
MIN NOM  
UNIT  
MAX  
MAX  
V
V
V
V
V
Supply voltage  
4.5  
2
5
5.5  
4.5  
2
5
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
0.8  
V
0
0
V
V
0
0
V
V
V
I
CC  
CC  
Output voltage  
V
O
CC  
CC  
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
24  
24  
24  
24  
mA  
mA  
ns/V  
°C  
OH  
OL  
I
t/v  
0
10  
0
10  
T
55  
125  
40  
85  
A
NOTE 3: Unused inputs must be held high or low to prevent them from floating.  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A APRIL 1991 REVISED APRIL 1996  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
54ACT16823  
74ACT16823  
PARAMETER  
TEST CONDITIONS  
V
UNIT  
CC  
MIN  
4.4  
TYP  
MAX  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
I
= 50 µA  
OH  
5.4  
5.4  
5.4  
V
3.94  
4.94  
3.8  
3.8  
V
OH  
OL  
I
I
I
= 24 mA  
OH  
OH  
OL  
4.8  
4.8  
= 75 mA  
= 50 µA  
3.85  
3.85  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
0.36  
0.36  
0.44  
0.44  
1.65  
±1  
0.44  
0.44  
1.65  
±1  
V
I
I
= 24 mA  
OL  
= 75 mA  
OL  
I
I
I
V = V  
or GND  
±0.1  
±0.5  
8
µA  
µA  
µA  
I
I
CC  
V
= V  
or GND  
±5  
±5  
OZ  
CC  
O
CC  
V = V  
or GND,  
I
O
= 0  
80  
80  
I
CC  
One input at 3.4 V,  
Other inputs at V  
5.5 V  
0.9  
1
1
mA  
I  
CC  
or GND  
CC  
or GND  
C
C
V = V  
5 V  
5 V  
3
pF  
pF  
i
I
CC  
= V or GND  
CC  
V
12  
o
O
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.  
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V  
.
CC  
timing requirements over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
= 25°C  
54ACT16823  
74ACT16823  
A
UNIT  
MHz  
ns  
MIN  
0
MAX  
MIN  
0
MAX  
MIN  
0
MAX  
f
t
Clock frequency  
Pulse duration  
90  
90  
90  
clock  
CLR low  
3.3  
5.5  
0.5  
7
3.3  
5.5  
0.5  
7
3.3  
5.5  
0.5  
7
w
CLK high or low  
CLR inactive  
Data  
t
Setup time before CLK↑  
Hold time after CLK↑  
ns  
ns  
su  
h
CLKEN low  
Data  
3.5  
0.5  
2.5  
3.5  
0.5  
2.5  
3.5  
0.5  
2.5  
t
CLKEN high or low  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A APRIL 1991 REVISED APRIL 1996  
switching characteristics over recommended operating free-air temperature range,  
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
CC  
T = 25°C  
A
54ACT16823  
74ACT16823  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
90  
TYP  
MAX  
MIN  
90  
MAX  
MIN  
90  
MAX  
f
t
t
t
t
t
t
t
max  
PLH  
PHL  
PHL  
PZH  
PZL  
PHZ  
PLZ  
4.2  
4.8  
3.4  
2.4  
3.3  
5.5  
4.6  
7.5  
8.3  
7.3  
5.9  
7.1  
7.6  
6.7  
10.6  
11.5  
11.2  
9.5  
4.2  
4.8  
3.4  
2.4  
3.3  
5.5  
4.6  
12.1  
12.9  
12.5  
10.7  
12.8  
10.3  
9.4  
4.2  
4.8  
3.4  
2.4  
3.3  
5.5  
4.6  
12.1  
12.9  
12.5  
10.7  
12.8  
10.3  
9.4  
CLK  
CLR  
OE  
Q
Q
Q
ns  
ns  
11.3  
9.7  
Q
ns  
OE  
8.8  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 1 MHz  
L
TYP  
42  
UNIT  
Outputs enabled  
Outputs disabled  
C
Power dissipation capacitance per flip-flop  
C
pF  
pd  
24  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
54ACT16823, 74ACT16823  
18-BIT BUS-INTERFACE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS160A APRIL 1991 REVISED APRIL 1996  
PARAMETER MEASUREMENT INFORMATION  
2 × V  
CC  
Open  
GND  
TEST  
S1  
S1  
t
/t  
Open  
PLH PHL  
/t  
500 Ω  
From Output  
Under Test  
t
2 × V  
CC  
GND  
PLZ PZL  
t
/t  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
LOAD CIRCUIT  
3 V  
0 V  
Timing Input  
Data Input  
1.5 V  
t
w
t
h
t
3 V  
su  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
VOLTAGE WAVEFORMS  
Output  
Control  
(low-level  
enabling)  
3 V  
0 V  
3 V  
0 V  
1.5 V  
Input  
1.5 V  
1.5 V  
1.5 V  
t
PZL  
t
t
PHL  
PLH  
t
PLZ  
Output  
Waveform 1  
V
OH  
V
CC  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
50% V  
CC  
V
CC  
20% V  
S1 at 2 × V  
(see Note B)  
CC  
CC  
CC  
V
V
OL  
OL  
t
PHZ  
t
PLH  
t
t
PHL  
PZH  
Output  
Waveform 2  
S1 at GND  
V
OH  
OH  
0 V  
Out-of-Phase  
Output  
80% V  
50% V  
50% V  
CC  
CC  
CC  
V
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
NOTES: A.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t = 3 ns, t = 3 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2006  
PACKAGING INFORMATION  
Orderable Device  
74ACT16823DL  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP  
DL  
56  
56  
56  
56  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74ACT16823DLG4  
74ACT16823DLR  
74ACT16823DLRG4  
SSOP  
SSOP  
SSOP  
DL  
DL  
DL  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
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dataconverter.ti.com  
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www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
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Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
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Security  
www.ti.com/opticalnetwork  
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