5962-01-314-6464 [TI]

IC,LOGIC GATE,QUAD 2-INPUT OR,S-TTL,DIP,14PIN,CERAMIC;
5962-01-314-6464
型号: 5962-01-314-6464
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

IC,LOGIC GATE,QUAD 2-INPUT OR,S-TTL,DIP,14PIN,CERAMIC

输入元件
文件: 总18页 (文件大小:724K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
5962-9557401QCA  
5962-9557401QDA  
5962-9557401QDA  
JM38510/30501B2A  
JM38510/30501B2A  
JM38510/30501BCA  
JM38510/30501BCA  
JM38510/30501BDA  
JM38510/30501BDA  
JM38510/30501SCA  
JM38510/30501SCA  
JM38510/30501SDA  
JM38510/30501SDA  
SN5432J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
W
W
FK  
FK  
J
14  
14  
14  
20  
20  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
25  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
CFP  
A42  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
W
W
J
CFP  
A42  
CDIP  
CDIP  
CFP  
A42 SNPB  
A42 SNPB  
A42  
J
W
W
J
CFP  
A42  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
PDIP  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
SN5432J  
J
SN54LS32J  
J
SN54LS32J  
J
SN54S32J  
J
SN54S32J  
J
SN7432N  
N
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN7432N  
ACTIVE  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN7432N3  
SN7432N3  
SN7432NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN7432NE4  
SN74LS32D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SSOP  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
N
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS32D  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS32DBR  
SN74LS32DBR  
SN74LS32DBRE4  
SN74LS32DBRE4  
SN74LS32DE4  
SN74LS32DE4  
SN74LS32DG4  
DB  
DB  
DB  
DB  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
SN74LS32DG4  
SN74LS32DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS32DR  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS32DRE4  
SN74LS32DRE4  
SN74LS32DRG4  
SN74LS32DRG4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS32J  
SN74LS32J  
SN74LS32N  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
PDIP  
J
J
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS32N  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS32N3  
SN74LS32N3  
SN74LS32NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS32NE4  
SN74LS32NSR  
SN74LS32NSR  
SN74LS32NSRG4  
SN74LS32NSRG4  
SN74S32D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
NS  
NS  
NS  
NS  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S32D  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S32DE4  
SN74S32DE4  
SN74S32DR  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S32DR  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S32DRE4  
SN74S32DRE4  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
Orderable Device  
SN74S32N  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S32N  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S32N3  
SN74S32N3  
SN74S32NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S32NE4  
SN74S32NSR  
SN74S32NSR  
SN74S32NSRE4  
SN74S32NSRE4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
NS  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ5432J  
SNJ5432J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CFP  
J
J
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
SNJ5432W  
W
W
FK  
FK  
J
SNJ5432W  
CFP  
A42  
SNJ54LS32FK  
SNJ54LS32FK  
SNJ54LS32J  
SNJ54LS32J  
SNJ54LS32W  
SNJ54LS32W  
SNJ54S32FK  
SNJ54S32FK  
SNJ54S32J  
SNJ54S32J  
SNJ54S32W  
SNJ54S32W  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
W
W
FK  
FK  
J
CFP  
A42  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
W
W
CFP  
A42  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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FAIRCHILD

5962-01-314-9702

IC IC,VOLT REFERENCE,PIN-PROGRAMMABLE,2.5V/5V/7.5V/10V,BIPOLAR,LLCC,20PIN,CERAMIC, Voltage Reference
ADI

5962-01-314-9714

IC,LINE RECEIVER,QUAD,ALS-TTL,DIFFERENTIAL,DIP,16PIN,PLASTIC
TI

5962-01-316-4291

IC,LINE DRIVER,2 DRIVER,BIPOLAR,DIP,8PIN,CERAMIC
TI

5962-01-316-4435

IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,DIP,14PIN,PLASTIC
RENESAS

5962-01-316-8581

MEMORY REFRESH TIMER
RENESAS

5962-01-317-6622

Standard SRAM, 16KX1, 55ns, CMOS, CDFP20
IDT

5962-01-318-3385

AND-OR-Invert Gate, TTL, CDFP14,
FAIRCHILD

5962-01-318-3767

IC,ANALOG MUX,SINGLE,4-CHANNEL,HC-CMOS,DIP,16PIN,CERAMIC
RENESAS

5962-01-318-8115

IC,ANALOG MUX,SINGLE,4-CHANNEL,CMOS,DIP,16PIN,CERAMIC
RENESAS

5962-01-318-9021

IC,SRAM,32KX8,CMOS,DIP,28PIN,PLASTIC
RENESAS