5962-8961101EA [TI]

Dual Output Driver; 双路输出驱动器
5962-8961101EA
型号: 5962-8961101EA
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Dual Output Driver
双路输出驱动器

驱动器 MOSFET驱动器 驱动程序和接口 接口集成电路 CD
文件: 总8页 (文件大小:212K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
application  
INFO  
UC1706  
UC2706  
UC3706  
available  
Dual Output Driver  
FEATURES  
DESCRIPTION  
Dual, 1.5A Totem Pole Outputs  
40nsec Rise and Fall into 1000pF  
Parallel or Push-Pull Operation  
Single-Ended to Push-Pull Conversion  
The UC1706 family of output drivers are made with a high-speed  
Schottky process to interface between low-level control functions and  
high-power switching devices - particularly power MOSFET's. These de-  
vices implement three generalized functions as outlined below.  
First: They accept a single-ended, low-current digital input of either polar-  
ity and process it to activate a pair of high-current, totem pole outputs  
which can source or sink up to 1.5A each.  
High-Speed, Power MOSFET  
Compatible  
Second: They provide an optional single-ended to push-pull conversion  
through the use of an internal flip-flop driven by double-pulse-  
suppression logic. With the flip-flop disabled, the outputs work in parallel  
for 3.0A capability.  
Low Cross-Conduction Current Spike  
Analog, Latched Shutdown  
Internal Deadband Inhibit Circuit  
Low Quiescent Current  
Third: Protection functions are also included for pulse-by-pulse current  
limiting, automatic deadband control, and thermal shutdown.  
These devices are available in a two-watt plastic “bat-wing” DIP for op-  
eration over a 0°C to 70°C temperature range and, with reduced power,  
in a hermetically sealed cerdip for -55°C to +125°C operation. Also avail-  
able in surface mount Q and L packages.  
5 to 40V Operation  
Thermal Shutdown Protection  
16-Pin Dual-In-Line Package  
20-Pin Surface Mount Package  
TRUTH TABLE  
OUT = INV and N.I.  
OUT = INV or N.I.  
INV  
N.I  
OUT  
H
L
H
L
H
H
L
L
H
L
L
L
BLOCK DIAGRAM  
SLUS200A - OCTOBER 1998 - REVISED APRIL 2001  
UC1706  
UC2706  
UC3706  
ABSOLUTE MAXIMUM RATINGS  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N--Pkg . . . . . . . . . . . . . . . J--Pkg  
Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V  
Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V  
Output Current (Each Output, Source or Sink)  
±
±
Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . . 500mA. . . . . . . . . . . . . . . 500mA  
±
±
Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A. . . . . . . . . . . . . . . . . 1.0A  
Capacitive Discharge Energy . . . . . . . . . . . . . . . 20µ.J. . . . . . . . . . . . . . . . . . 15µJ  
Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V . . . . . . . . . . . . . . . . . 5.5V  
Analog Stop Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . VI.N. . . . . . . . . . . . . . . . . . . VIN  
Power Dissipation at TA = 25°C (See Note) . . . . . . . 2W . . . . . . . . . . . . . . . . . . 1W  
Power Dissipation at T (Leads/Case) = 25°C . . . . . . 5W . . . . . . . . . . . . . . . . . . . 2  
(See Note)  
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . --55°C to +125°C  
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . --65°C to +150°C  
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . 300°C  
Note: All voltages are with respect to the four ground pins which must be connected  
together. All currents are positive into, negative out of the specified trerminal. Consult  
Packaging sections of the Databook for thermal limitations and considerations of package.  
CONNECTION DIAGRAMS  
DIL-16, SOIC-16 (TOP VIEW)  
J or N Package, DW Package  
PLCC-20, LCC-20 (TOP VIEW)  
Q, L Packages  
N/C  
B INHIBIT  
INV INPUT  
A INHIBIT  
B INHIBIT  
INV. INPUT  
N.I. INPUT  
GROUND  
GROUND  
A OUTPUT  
FLIP/FLOP  
VC  
16 A INHIBIT  
15 INHIBIT REF  
14 VIN  
1
2
3
4
5
6
7
8
INHIBIT REF  
3
2
1
20 19  
18  
N.I.INPUT  
GROUND  
N/C  
4
5
6
7
8
VIN  
17  
16  
15  
14  
GROUND  
N/C  
13 GROUND  
12 GROUND  
11 B OUTPUT  
10 STOP NON-INV.  
GROUND  
A OUTPUT  
GROUND  
B OUTPUT  
9
10 11 12 13  
FLIP/FLOP  
VC  
STOP INV.  
STOP NON-INV.  
N/C  
9
STOP INV.  
Note: All four ground pins must be connected to a common  
ground.  
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = 55°C to +125°C for  
the UC1706, 25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC = 20V. TA = TJ.  
PARAMETERS  
VIN Supply Current  
TEST CONDITIONS  
MIN  
TYP  
8
MAX UNITS  
VIN = 40V  
10  
5
mA  
mA  
mA  
V
VC Supply Current  
VC Leakage Current  
Digital Input Low Level  
Digital Input High Level  
Input Current  
VC = 40V, Outputs Low  
4
VIN = 0, VC = 30V, No Load  
.05  
0.1  
0.8  
2.2  
V
VI = 0  
0.6  
1.0  
mA  
mA  
Input Leakage  
VI = 5V  
.05  
0.1  
2
UC1706  
UC2706  
UC3706  
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = 55°C to +125°C for  
the UC1706, 25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC = 20V. TA = TJ.  
PARAMETERS  
Output High Sat., VC-VO  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
IO = -50mA  
2.0  
V
Output Low Sat., VO  
Inhibit Threshold  
IO = 50mA  
IO = 500mA  
VREF = 0.5V  
VREF = 3.5V  
VREF = 0  
0.4  
2.5  
V
V
0.4  
3.3  
0.6  
V
3.7  
V
Inhibit Input Current  
Analog Threshold  
10  
130  
130  
10  
155  
20  
160  
160  
20  
µA  
mV  
mV  
µA  
°C  
VCM = 0 to 15V, for the UC2706 and UC3706  
VCM = 0 to 15V, for the UC1706  
VCM = 0  
100  
80  
Input Bias Current  
Thermal Shutdown  
TYPICAL SWITCHING CHARACTERISTICS: VIN = VC = 20V, TA = 25°C. Delays measured to 10% output change.  
PARAMETERS  
From Inv. Input to Output:  
Rise Time Delay  
TEST CONDITIONS  
OUTPUT CL =  
UNITS  
open  
1.0  
130  
40  
2.2  
nF  
110  
20  
140  
60  
ns  
10% to 90% Rise  
ns  
Fall Time Delay  
80  
90  
110  
50  
ns  
90% to 10% Fall  
25  
30  
ns  
From N. I. Input to Output:  
Rise Time Delay  
120  
20  
130  
40  
140  
60  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10% to 90% Rise  
Fall Time Delay  
100  
25  
120  
30  
130  
50  
90% to 10% Fall  
VC Cross-Conduction Current Spike Duration Output Rise  
Output Fall  
25  
0
Inhibit Delay  
Inhibit Ref. = 1V, Inhibit Inv. = 0.5 to 1.5V  
Stop Non-Inv. = 0V, Stop Inv. = 0 to 0.5V  
250  
180  
Analog Shutdown Delay  
CIRCUIT DESCRIPTION  
Outputs  
Digital Inputs  
The totem-pole outputs have been designed to minimize With both an inverting and non-inverting input available,  
cross-conduction current spikes while maximizing fast, either active-high or active-low signals may be accepted.  
high-current rise and fall times. Current limiting can be These are true TTL compatible inputsthe threshold is  
done externally either at the outputs or at the common approximately 1.2V with no hysteresis; and external pull-  
VC pin. The output diodes included have slow recovery up resistors are not required.  
and should be shunted with high-speed external diodes  
when driving high-frequency inductive loads.  
Inhibit Circuit  
Although it may have other uses, this circuit is included to  
Flip/Flop  
eliminate the need for deadband control when driving  
relatively slow bipolar power transistors. A diode from  
each inhibit input to the opposite power switch collector  
will keep one output from turning-on until the other has  
turned-off. The threshold is determined by the voltage on  
pin 15 which can be set from 0.5 to 3.5V. When this cir-  
cuit is not used, ground pin 15 and leave 1 and 16 open.  
Grounding pin 7 activates the internal flip-flop to alter-  
nate the two outputs. With pin 7 open, the two outputs  
operate simultaneously and can be paralleled for higher  
current operation. Since the flip-flop is triggered by the  
digital input, an off-time of at last 200nsec must be pro-  
vided to allow the flip/flop to change states. Note that the  
circuit logic is configured such that the OFFstate is de-  
fined as the outputs low.  
3
UC1706  
UC2706  
UC3706  
CIRCUIT DESCRIPTION (cont.)  
use with a 7 to 40V supply; however, with some slight re-  
sponse time degradation, it can also be driven from 5V.  
When VIN is low, the entire circuit is disabled and no cur-  
rent is drawn from VC. When combined with a UC1840  
PWM, the Driver Bias switch can be used to supply VIN to  
the UC1706. VIN switching should be fast as if VC is  
high, undefined operation of the outputs may occur with  
VIN less than 5V.  
Analog Shutdown  
This circuit is included to get a latched shutdown as close  
to the outputs as possible, from a time standpoint. With  
an internal 130mV threshold, this comparator has a  
common-mode range from ground to (VIN 3V). When  
not used, both inputs should be grounded. The time re-  
quired for this circuit to latch is inversely proportional to  
the amount of overdrive but reaches a minimum of  
180nsec. As with the flip-flop, an input off-time of at least  
200nsec is required to reset the latch between pulses.  
Thermal Considerations  
Should the chip temperature reach approximately 155°C,  
a parallel, non--inverting input is activated driving both  
outputs to the low state.  
Supply Voltage  
With an internal 5V regulator, this circuit is optimized for  
APPLICATIONS  
D1, D2; UC3611 Schottky Diodes  
D1, D2; UC3611 Schottky Diodes  
Power MOSFET Drive Circuit  
Power MOSFET Drive Circuit Using Negative Bias Voltage and  
Level Shifting to Ground Referenced PWMs  
D1, D2: UC3611 Schottky Diodes  
Transformer Coupled MOSFET Drive Circuit  
Charge Pump Circuits  
4
UC1706  
UC2706  
UC3706  
APPLICATIONS (cont'd)  
D1, D2: UC3611 Schottky Diodes  
D1, D2: UC3611 Schottky Diodes  
Transformer Coupled Push-Pull MOSFET Drive Circuit  
Power Bipolar Drive Circuit  
UC3706 Converts Single Output PWMs to High Current Push-Pull Configuration  
UNITRODE CORPORATION  
7 CONTINENTAL BLVD. MERRIMACK, NH 03054  
TEL. (603) 424-2410 FAX (603) 424-3460  
5
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
5962-89611012A  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125 5962-  
89611012A  
5962-8961101EA  
UC1706J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CDIP  
LCCC  
SOIC  
J
J
16  
16  
16  
20  
16  
1
1
TBD  
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
Level-2-260C-1 YEAR  
-55 to 125 5962-8961101EA  
-55 to 125 UC1706J  
UC1706J883B  
UC1706L  
J
1
A42  
-55 to 125 UC1706J/883B  
-55 to 125 UC1706L  
FK  
DW  
1
POST-PLATE  
CU NIPDAU  
UC2706DW  
40  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
-40 to 85  
UC2706DW  
UC2706DW  
UC2706DWG4  
ACTIVE  
SOIC  
DW  
16  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
UC2706J  
UC2706N  
ACTIVE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
1
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
UC2706J  
UC2706N  
N
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
UC2706NG4  
UC3706DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
N
16  
16  
16  
16  
16  
25  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 85  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
UC2706N  
DW  
DW  
DW  
DW  
Green (RoHS  
& no Sb/Br)  
UC3706DW  
UC3706DW  
UC3706DW  
UC3706DW  
UC3706DWG4  
UC3706DWTR  
UC3706DWTRG4  
40  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
UC3706J  
UC3706N  
ACTIVE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
1
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
0 to 70  
0 to 70  
UC3706J  
UC3706N  
N
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
UC3706NG4  
ACTIVE  
PDIP  
N
16  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
N / A for Pkg Type  
0 to 70  
UC3706N  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF UC1706, UC2706, UC2706M, UC3706, UC3706M :  
Catalog: UC3706, UC2706, UC3706M, UC3706  
Military: UC2706M, UC1706, UC1706  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号:

5962-8961101EX

Dual MOSFET Driver
ETC
ETC
ETC
ETC
ETC
ETC

5962-8961401YX

UVPROM, 128KX8, 300ns, CMOS, CDIP32
WEDC
ETC
ETC
ETC
ETC
ETC