74ACT11373DBRE4 [TI]
ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, GREEN, PLASTIC, SSOP-24;
| 型号： | 74ACT11373DBRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, GREEN, PLASTIC, SSOP-24 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总20页 (文件大小：916K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74ACT11373
OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SCAS015B – JUNE 1987 – REVISED APRIL 1996
DB, DW, OR NT PACKAGE
(TOP VIEW)
Eight Latches in a Single Package
3-State Bus Driving True Outputs
Full Parallel Access for Loading
Buffered Input and Output-Enable Pins
Inputs Are TTL-Voltage Compatible
1Q
2Q
OE
1D
2D
3D
4D
V
1
24
23
22
21
20
19
18
17
16
15
14
13
2
3Q
3
4Q
4
Flow-Through Architecture Optimizes
PCB Layout
GND
GND
GND
GND
5Q
5
6
CC
Center-Pin V
Minimize High-Speed Switching Noise
and GND Configurations
CC
7
V
CC
8
5D
6D
7D
8D
LE
EPIC (Enhanced-Performance Implanted
CMOS) 1- m Process
9
10
11
12
6Q
500-mA Typical Latch-Up Immunity at
125°C
7Q
8Q
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, and Standard
Plastic 300-mil DIPs (NT)
description
This 8-bit latch features 3-state outputs designed specifically for driving highly-capacitive or relatively
low-impedance loads. It is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus
drivers, and working registers.
The eight latches of the 74ACT11373 are transparent D-type latches. While the latch-enable (LE) input is high,
the Q outputs follow the data (D) inputs. When the enable is taken low, the Q outputs are latched at the levels
that were set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impendance third state and increased drive provide the capability to drive
the bus lines in a bus-organized system without need for interface or pullup components.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are off.
The 74ACT11373 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each latch)
INPUTS
OUTPUT
Q
LE
H
H
L
OE
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11373
OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SCAS015B – JUNE 1987 – REVISED APRIL 1996
†
logic symbol
24
OE
EN
C1
13
LE
23
1D
1
2
1D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
22
2D
21
3
3D
20
4
4D
17
9
5D
16
10
11
12
6D
15
7D
14
8D
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
24
13
OE
LE
C1
1D
1
2
23
22
21
20
17
16
15
14
1Q
1D
2D
3D
4D
5D
6D
7D
8D
C1
1D
2Q
3Q
4Q
5Q
6Q
7Q
8Q
C1
1D
3
C1
1D
4
C1
1D
9
C1
1D
10
11
12
C1
1D
C1
1D
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11373
OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SCAS015B – JUNE 1987 – REVISED APRIL 1996
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
A
DW package . . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . . 1.3 W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150 C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
MIN
4.5
2
MAX
UNIT
V
V
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
V
0.8
V
0
0
V
V
V
I
CC
Output voltage
V
O
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
–24
24
mA
mA
ns/V
°C
OH
OL
t/ v
0
10
T
–40
85
A
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11373
OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SCAS015B – JUNE 1987 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
4.4
TYP
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5 V
4.4
5.4
I
I
= –50 A
OH
5.4
3.94
4.94
3.8
V
V
OH
OL
= –24 mA
= –75 mA
OH
4.8
3.85
I
I
OH
0.1
0.1
0.1
0.1
0.44
0.44
1.65
±5
= 50
A
OL
0.36
0.36
V
V
I
I
= 24 mA
= 75 mA
OL
OL
I
I
I
V
= V or GND
CC
±0.5
±0.1
8
A
A
OZ
O
V = V
or GND
or GND,
±1
I
I
CC
CC
V = V
I = 0
O
80
A
CC
I
I
One input at 3.4 V,
V = V or GND
Other inputs at GND or V
CC
0.9
1
mA
pF
pF
CC
C
C
4
i
I
CC
= V or GND
CC
V
5 V
10
o
O
†
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V
.
CC
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
T
= 25°C
A
MIN
MAX
UNIT
MIN
5
MAX
t
w
t
su
t
h
Pulse duration, LE high
Setup time, data before LE↓
Hold time, data LE↓
5
3.5
3.5
ns
ns
ns
3.5
3.5
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
7.5
6.5
8.5
8.5
7
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
MAX
10.3
9.3
t
t
t
t
t
t
t
t
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
11.8
10
PLH
PHL
PLH
PHL
PZH
PZL
PHZ
PLZ
D
Q
11.3
10.9
10.7
10.9
12.1
9.5
13
LE
Any Q
Any Q
Any Q
ns
12.2
12.5
12
ns
OE
OE
7.5
10
12.2
10.1
ns
7.5
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11373
OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SCAS015B – JUNE 1987 – REVISED APRIL 1996
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
TYP
65
UNIT
Outputs enabled
Outputs disabled
C
Power dissipation capacitance per latch
C
= 50 pF,
L
f = 1 MHz
pF
pd
54
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
GND
S1
500 Ω
From Output
Under Test
TEST
S1
t
t
/t
Open
PLH PHL
/t
C
= 50 pF
t
2 × V
L
PLZ PZL
CC
500 Ω
(see Note A)
/t
GND
PHZ PZH
LOAD CIRCUIT
3 V
Timing Input
Data Input
1.5 V
0 V
3 V
0 V
t
w
t
h
t
3 V
su
Input
1.5 V
1.5 V
1.5 V
1.5 V
0 V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3 V
0 V
3 V
0 V
Input
1.5 V
1.5 V
1.5 V
1.5 V
t
PZL
t
t
PHL
PLH
t
PLZ
Output
Waveform 1
V
OH
V
CC
In-Phase
Output
50% V
50% V
CC
50% V
50% V
CC
V
CC
20% V
S1 at 2 × V
(see Note B)
CC
CC
CC
V
V
OL
OL
t
PHZ
t
PLH
t
t
PHL
PZH
Output
Waveform 2
S1 at GND
V
OH
OH
Out-of-Phase
Output
80% V
50% V
50% V
CC
CC
CC
0 V
V
OL
(see Note B)
VOLTAGE WAVEFORMS
includes probe and jig capacitance.
VOLTAGE WAVEFORMS
NOTES: A.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SSOP
SSOP
Drawing
74ACT11373DBLE
74ACT11373DBR
OBSOLETE
ACTIVE
DB
24
24
TBD
Call TI
Call TI
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11373DBRE4
74ACT11373DBRG4
74ACT11373DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DB
DB
24
24
24
24
24
24
24
24
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
NT
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11373DWE4
74ACT11373DWG4
74ACT11373DWR
74ACT11373DWRE4
74ACT11373DWRG4
74ACT11373NT
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11373NTE4
NT
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74ACT11373DBR
74ACT11373DWR
SSOP
SOIC
DB
24
24
2000
2000
330.0
330.0
16.4
24.4
8.2
8.8
2.5
2.7
12.0
12.0
16.0
24.0
Q1
Q1
DW
10.75 15.7
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74ACT11373DBR
74ACT11373DWR
SSOP
SOIC
DB
24
24
2000
2000
346.0
346.0
346.0
346.0
33.0
41.0
DW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SSOP
SSOP
Drawing
74ACT11373DBLE
74ACT11373DBR
OBSOLETE
ACTIVE
DB
24
24
TBD
Call TI
Call TI
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11373DBRE4
74ACT11373DBRG4
74ACT11373DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DB
DB
24
24
24
24
24
24
24
24
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
NT
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11373DWE4
74ACT11373DWG4
74ACT11373DWR
74ACT11373DWRE4
74ACT11373DWRG4
74ACT11373NT
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11373NTE4
NT
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74ACT11373DBR
74ACT11373DWR
SSOP
SOIC
DB
24
24
2000
2000
330.0
330.0
16.4
24.4
8.2
8.8
2.5
2.7
12.0
12.0
16.0
24.0
Q1
Q1
DW
10.75 15.7
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74ACT11373DBR
74ACT11373DWR
SSOP
SOIC
DB
24
24
2000
2000
367.0
367.0
367.0
367.0
38.0
45.0
DW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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相关型号：
74ACT11373NSR
IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, GREEN, PLASTIC, SOP-24, Bus Driver/Transceiver
TI
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