74CBT16213DGGRE4 [TI]
24-BIT FET BUS-EXCHANGE SWITCH;
| 型号： | 74CBT16213DGGRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 24-BIT FET BUS-EXCHANGE SWITCH 光电二极管 逻辑集成电路 |
| 文件： | 总11页 (文件大小：320K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74CBT16213
24-BIT FET BUS-EXCHANGE SWITCH
SCDS026I – MAY 1995 – REVISED NOVEMBER 2001
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments
Widebus Family
5-Ω Switch Connection Between Two Ports
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
S0
1A1
1A2
2A1
2A2
3A1
3A2
GND
4A1
4A2
5A1
5A2
6A1
6A2
7A1
7A2
S1
S2
TTL-Compatible Input Levels
2
3
1B1
1B2
2B1
2B2
3B1
GND
3B2
4B1
4B2
5B1
5B2
6B1
6B2
7B1
7B2
8B1
GND
8B2
9B1
9B2
10B1
10B2
11B1
11B2
12B1
12B2
description
4
5
The SN74CBT16213 provides 24 bits of
high-speed TTL-compatible bus switching or
exchanging. The low on-state resistance of the
switch allows connections to be made with
minimal propagation delay.
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
The device operates as a 24-bit bus switch or a
12-bit bus exchanger that provides data
exchanging between the four signal ports via the
data-select (S0–S2) terminals.
V
CC
8A1
GND
8A2
9A1
9A2
10A1
10A2
11A1
11A2
12A1
12A2
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube
SN74CBT16213DL
SN74CBT16213DLR
SSOP – DL
CBT16213
CBT16213
–40°C to 85°C
Tape and reel
TSSOP – DGG Tape and reel
SN74CBT16213DGGR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16213
24-BIT FET BUS-EXCHANGE SWITCH
SCDS026I – MAY 1995 – REVISED NOVEMBER 2001
FUNCTION TABLE
INPUTS/OUTPUTS
INPUTS
FUNCTION
S2
L
S1
L
S0
L
A1
Z
A2
Z
Disconnect
A1 port = B1 port
L
L
H
L
B1
B2
Z
Z
L
H
H
L
Z
A1 port = B2 port
L
H
L
B1
B2
A2 port = B1 port
H
H
Z
A2 port = B2 port
L
H
A2 and B2 A1 and B2
A1 port = A2 port = B2 port
A1 port = B1 port
A2 port = B2 port
H
H
H
H
L
B1
B2
B2
B1
A1 port = B2 port
A2 port = B1 port
H
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16213
24-BIT FET BUS-EXCHANGE SWITCH
SCDS026I – MAY 1995 – REVISED NOVEMBER 2001
logic diagram (positive logic)
2
54
1B1
1A1
3
53
1B2
1A2
27
30
12A1
12B1
28
29
12B2
12A2
1
S0
56
S1
55
S2
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16213
24-BIT FET BUS-EXCHANGE SWITCH
SCDS026I – MAY 1995 – REVISED NOVEMBER 2001
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
IK
I
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
JA
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
4
MAX
UNIT
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level control input voltage
Low-level control input voltage
Operating free-air temperature
2
V
0.8
85
V
T
A
–40
°C
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
‡
PARAMETER
TEST CONDITIONS
I = –18 mA
MIN TYP
MAX
–1.2
10
UNIT
V
V
V
V
V
V
= 4.5 V,
= 0,
V
IK
CC
CC
CC
CC
CC
I
V = 5.5 V
I
I
I
µA
= 5.5 V,
= 5.5 V,
= 5.5 V,
V = 5.5 V or GND
I
±1
I
I
O
= 0,
V = V
I
or GND
3
µA
mA
pF
CC
CC
§
∆I
CC
Control inputs
One input at 3.4 V,
Other inputs at V
or GND
2.5
CC
C
Control inputs V = 3 V or 0
I
4.5
8.5
8
i
B port
C
V
O
= 3 V or 0,
S0, S1, and S2 = GND
pF
io(OFF)
A port
V
= 4 V,
CC
V = 2.4 V,
I
I = 15 mA
I
14
20
TYP at V
= 4 V
CC
A to B or
B to A
I = 64 mA
5
5
8
7
7
I
V = 0
I
V
= 4.5 V
I = 30 mA
I
CC
CC
V = 2.4 V,
I
I = 15 mA
I
15
¶
Ω
r
on
V
= 4 V,
V = 2.4 V,
I
I = 15 mA
I
22
30
TYP at V
= 4 V
CC
I = 64 mA
10
10
16
14
14
22
A1 to A2
I
V = 0
I
V
CC
= 4.5 V
I = 30 mA
I
V = 2.4 V,
I
I = 15 mA
I
‡
§
¶
All typical values are at V
= 5 V (unless otherwise noted), T = 25°C.
A
CC
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V
or GND.
CC
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16213
24-BIT FET BUS-EXCHANGE SWITCH
SCDS026I – MAY 1995 – REVISED NOVEMBER 2001
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
V
= 5 V
CC
± 0.5 V
V
= 4 V
FROM
(INPUT)
TO
(OUTPUT)
CC
PARAMETER
UNIT
MIN
MAX
MIN
MAX
0.25
0.5
A or B
A1
S
B or A
A2
0.35
0.5
†
t
pd
ns
t
t
t
t
A or B
A or B
12.4
12.4
3.2
2.3
4
11.1
11.9
ns
ns
ns
ns
en
dis
en
dis
S
S0
S0
A2 and B2
A2 and B2
11.5
12.8
10.9
12
5.7
†
Thepropagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
PARAMETER MEASUREMENT INFORMATION
7 V
TEST
S1
S1
Open
GND
500 Ω
t
Open
7 V
From Output
Under Test
pd
/t
t
PLZ PZL
t
/t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
t
t
PLZ
PZL
Output
Waveform 1
S1 at 7 V
3.5 V
3 V
0 V
1.5 V
Input
1.5 V
1.5 V
V
+ 0.3 V
OL
V
(see Note B)
OL
OH
t
t
PHZ
PZH
t
t
PHL
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
V
OH
V
– 0.3 V
OH
1.5 V
Output
1.5 V
1.5 V
0 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
are the same as t
are the same as t
.
dis
en
.
pd
PLZ
PZL
PLH
PHZ
PZH
PHL
.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
74CBT16213DGGRE4
74CBT16213DGGRG4
SN74CBT16213DGGR
SN74CBT16213DL
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
56
56
56
56
56
56
56
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT16213DLG4
SN74CBT16213DLR
SN74CBT16213DLRG4
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74CBT16213DGGR TSSOP
SN74CBT16213DLR SSOP
DGG
DL
56
56
2000
1000
330.0
330.0
24.4
32.4
8.6
15.6
1.8
3.1
12.0
16.0
24.0
32.0
Q1
Q1
11.35
18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74CBT16213DGGR
SN74CBT16213DLR
TSSOP
SSOP
DGG
DL
56
56
2000
1000
346.0
346.0
346.0
346.0
41.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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