74CBT16245DGVRG4 [TI]
16-BIT FET BUS SWITCH;
| 型号： | 74CBT16245DGVRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-BIT FET BUS SWITCH 驱动 光电二极管 逻辑集成电路 |
| 文件： | 总9页 (文件大小：152K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74CBT16245
16-BIT FET BUS SWITCH
SCDS070C – JULY 1998 – REVISED OCTOBER 2000
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Member of Texas Instruments’ Widebus
Family
Standard ’16245-Type Pinout
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
1B1
1B2
GND
1B3
1B4
1OE
1A1
1A2
GND
1A3
1A4
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
2
3
4
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
5
6
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
7
V
V
CC
CC
8
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
9
– 1000-V Charged-Device Model (C101)
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
description
The SN74CBT16245 device provides 16 bits of
high-speed TTL-compatible bus switching in a
standard ’16245 device pinout. The low on-state
resistance of the switch allows connections to be
made with minimal propagation delay.
V
V
The device is organized as two 8-bit low-impedance
switches with separate output-enable (OE) inputs.
When OE is low, the switch is on, and data can
flow from the A port to the B port, or vice versa.
When OE is high, the switch is open, and the
high-impedance state exists between the two
ports.
CC
CC
2B5
2B6
GND
2B7
2B8
NC
2A5
2A6
GND
2A7
2A8
2OE
NC – No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube
SN74CBT16245DL
SSOP – DL
CBT16245
Tape and reel SN74CBT16245DLR
Tape and reel SN74CBT16245DGGR
Tape and reel SN74CBT16245DGVR
–40°C to 85°C
TSSOP – DGG
TVSOP – DGV
CBT16245
CY245
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each 8-bit bus switch)
INPUT
FUNCTION
OE
L
A port = B port
Disconnect
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16245
16-BIT FET BUS SWITCH
SCDS070C – JULY 1998 – REVISED OCTOBER 2000
logic diagram (positive logic)
47
2
1A1
1B1
1B8
37
48
12
1A8
1OE
36
13
23
2A1
2B1
2B8
26
25
2A8
2OE
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
IK I/O
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
4
MAX
UNIT
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level control input voltage
Low-level control input voltage
Operating free-air temperature
2
V
0.8
85
V
T
A
–40
°C
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16245
16-BIT FET BUS SWITCH
SCDS070C – JULY 1998 – REVISED OCTOBER 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
TEST CONDITIONS
I = –18 mA
MIN TYP
MAX
–1.2
10
UNIT
V
V
V
V
V
V
= 4.5 V,
= 0,
V
IK
CC
CC
CC
CC
CC
I
V = 5.5 V
I
I
I
µA
= 5.5 V,
= 5.5 V,
= 5.5 V,
V = 5.5 V or GND
I
±1
I
I
O
= 0,
V = V
I
or GND
3
µA
mA
pF
CC
CC
‡
∆I
CC
Control inputs
One input at 3.4 V,
Other inputs at V
or GND
2.5
CC
C
C
Control inputs V = 3 V or 0
3.5
4.5
i
I
V
O
= 3 V or 0,
OE = V
pF
io(OFF)
CC
V
= 4 V,
CC
V = 2.4 V,
I
I = 15 mA
I
14
20
TYP at V
= 4 V
CC
§
r
I = 64 mA
I
5
5
8
7
7
Ω
V = 0
I
V
CC
= 4.5 V
I = 30 mA
I
V = 2.4 V,
I
I = 15 mA
I
12
†
‡
§
All typical values are at V
= 5 V (unless otherwise noted), T = 25°C.
A
CC
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V
or GND.
CC
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
V
= 5 V
CC
± 0.5 V
V
= 4 V
FROM
(INPUT)
TO
(OUTPUT)
CC
PARAMETER
UNIT
MIN
MAX
MIN
MAX
0.25
5.6
¶
t
t
t
A or B
OE
B or A
A or B
A or B
0.35
6.1
ns
ns
ns
pd
1.2
3.9
en
7.5
7.7
OE
dis
¶
Thepropagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16245
16-BIT FET BUS SWITCH
SCDS070C – JULY 1998 – REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
TEST
S1
7 V
Open
S1
t
Open
7 V
pd
/t
500 Ω
From Output
Under Test
t
PLZ PZL
/t
GND
t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
t
t
PLZ
PZL
Output
Waveform 1
S1 at 7 V
3.5 V
3 V
0 V
1.5 V
Input
V
+ 0.3 V
1.5 V
1.5 V
OL
V
(see Note B)
OL
OH
t
t
PHZ
PZH
t
t
PHL
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
V
OH
V
OH
– 0.3 V
1.5 V
Output
1.5 V
1.5 V
0 V
V
OL
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
are the same as t
are the same as t
.
dis
en
.
pd
PLZ
PZL
PLH
PHZ
PZH
PHL
.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
74CBT16245DGGRE4
74CBT16245DGVRE4
SN74CBT16245DGGR
SN74CBT16245DGVR
SN74CBT16245DL
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
TSSOP
TVSOP
SSOP
SSOP
SSOP
SSOP
DGV
DGG
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT16245DLG4
SN74CBT16245DLR
SN74CBT16245DLRG4
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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