74F169PCQB [TI]

F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, PDIP16, 0.300 INCH, PLASTIC, DIP-16;
74F169PCQB
型号: 74F169PCQB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, PDIP16, 0.300 INCH, PLASTIC, DIP-16

光电二极管
文件: 总8页 (文件大小:141K)
中文:  中文翻译
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November 1994  
54F/74F169  
4-Stage Synchronous Bidirectional Counter  
General Description  
Features  
Y
Asynchronous counting and loading  
The ’F169 is a fully synchronous 4-stage up/down counter.  
The ’F169 is a modulo-16 binary counter. Features a preset  
capability for programmable operation, carry lookahead for  
easy cascading and a U/D input to control the direction of  
counting. All state changes, whether in counting or parallel  
loading, are initiated by the LOW-to-HIGH transition of the  
clock.  
Y
Built-in lookahead carry capability  
Y
Presettable for programmable operation  
Package  
Commercial  
74F169PC  
Military  
Package Description  
Number  
N16E  
16-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F169DM (Note 2)  
J16A  
16-Lead Ceramic Dual-In-Line  
74F169SC (Note 1)  
74F169SJ (Note 1)  
M16A  
M16D  
16-Lead (0.150 Wide) Molded Small Outline, JEDEC  
×
16-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
e
Note 1: Devices also available in 13 reel. Use suffix  
SCX and SJX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
DMQB.  
Logic Symbols  
IEEE/IEC  
’F169  
TL/F/9488–3  
TL/F/9488–9  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9488  
RRD-B30M75/Printed in U. S. A.  
Connection Diagrams  
Pin Assignment for  
DIP, SOIC and Flatpak  
Pin Assignment  
for LCC  
TL/F/9488–1  
TL/F/9488–2  
Unit Loading/Fan Out  
54F/74F  
Pin Names  
Description  
U.L.  
Input I /I  
IH IL  
HIGH/LOW Output I /I  
OH OL  
b
20 mA/ 0.6 mA  
CEP  
CET  
CP  
Count Enable Parallel Input (Active LOW)  
Count Enable Trickle Input (Active LOW)  
Clock Pulse Input (Active Rising Edge)  
Parallel Data Inputs  
1.0/1.0  
1.0/2.0  
1.0/1.0  
1.0/1.0  
1.0/1.0  
1.0/1.0  
50/33.3  
50/33.3  
b
20 mA/ 1.2 mA  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
P P  
0
3
PE  
Parallel Enable Input (Active LOW)  
Up-Down Count Control Input  
Flip-Flop Outputs  
U/D  
b
b
Q Q  
0
1 mA/20 mA  
1 mA/20 mA  
3
TC  
Terminal Count Output (Active LOW)  
Functional Description  
The ’F169 uses edge-triggered J-K type flip-flops and has  
no constraints on changing the control or data input signals  
in either state of the clock. The only requirement is that the  
various inputs attain the desired state at least a setup time  
before the rising edge of the clock and remain valid for the  
recommended hold time thereafter. The parallel load opera-  
tion takes precedence over other operations, as indicated in  
the Mode Select Table. When PE is LOW, the data on the  
P P inputs enters the flip-flops on the next rising edge of  
CET is LOW, when a counter reaches zero in the Count  
Down mode or reaches 15 for the ’F169 in the Count Up  
mode. The TC output state is not a function of the Count  
Enable Parallel (CEP) input level. Since the TC signal is de-  
rived by decoding the flip-flop states, there exists the possi-  
bility of decoding spikes on TC. For this reason the use of  
TC as a clock signal is not recommended (see logic equa-  
tions below).  
e
0
3
1) Count Enable  
CEP CET PE  
#
#
the clock. In order for counting to occur, both CEP and CET  
must be LOW and PE must be HIGH; the U/D input then  
determines the direction of counting. The Terminal Count  
(TC) output is normally HIGH and goes LOW, provided that  
e
2) Up: (’F169): TC  
Q
Q
Q
Q
Q
Q
#
3
(Down) CET  
#
(Up) CET  
#
#
#
#
#
#
#
0
1
2
e
3) Down: TC  
Q
Q
#
0
1
2
3
2
Logic Diagram  
’F169  
TL/F/9488–5  
Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
Mode Select Table  
Action on Rising  
PE  
CEP  
CET  
U/D  
Clock Edge  
e
e
e
H
L
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
L
H
H
H
H
X
L
X
L
X
H
L
Load (Pn x Q )  
n
Count Up (Increment)  
Count Down (Decrement)  
No Change (Hold)  
X
L
L
H
X
X
H
X
X
No Change (Hold)  
State Diagram  
’F169  
TL/F/9488–7  
3
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Recommended Operating  
Conditions  
Free Air Ambient Temperature  
Military  
Commercial  
b
a
55 C to 125 C  
§
0 C to 70 C  
§
§
b
b
a
65 C to 150 C  
Storage Temperature  
§
§
§
§
§
a
§
a
55 C to 125 C  
Ambient Temperature under Bias  
§
Supply Voltage  
Military  
Commercial  
b
b
a
a a  
4.5V to 5.5V  
a a  
4.5V to 5.5V  
Junction Temperature under Bias  
Plastic  
55 C to 175 C  
§
§
a
55 C to 150 C  
V
Pin Potential to  
CC  
Ground Pin  
b
a
0.5V to 7.0V  
b
a
0.5V to 7.0V  
Input Voltage (Note 2)  
Input Current (Note 2)  
Voltage Applied to Output  
b
a
30 mA to 5.0 mA  
e
in HIGH State (with V  
Standard Output  
0V)  
CC  
b
0.5V to 5.5V  
0.5V to V  
CC  
b
a
TRI-STATE Output  
É
Current Applied to Output  
in LOW State (Max)  
twice the rated I (mA)  
OL  
Note 1: Absolute maximum ratings are values beyond which the device may  
be damaged or have its useful life impaired. Functional operation under  
these conditions is not implied.  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
DC Electrical Characteristics  
54F/74F  
Symbol  
Parameter  
Units  
V
CC  
Conditions  
Min  
Typ  
Max  
V
V
V
V
Input HIGH Voltage  
2.0  
V
V
V
Recognized as a HIGH Signal  
Recognized as a LOW Signal  
IH  
Input LOW Voltage  
0.8  
IL  
b
e b  
18 mA  
Input Clamp Diode Voltage  
1.2  
Min  
Min  
I
IN  
CD  
OH  
e b  
e b  
e b  
Output HIGH  
Voltage  
54F 10% V  
2.5  
2.5  
2.7  
I
I
I
1 mA  
1 mA  
1 mA  
CC  
OH  
OH  
OH  
74F 10% V  
74F 5% V  
V
CC  
CC  
e
e
V
Output LOW  
Voltage  
54F 10% V  
74F 10% V  
0.5  
I
I
20 mA  
20 mA  
OL  
CC  
OL  
V
Min  
Max  
Max  
Max  
0.0  
0.5  
CC  
OL  
e
I
I
I
Input HIGH  
Current  
54F  
74F  
20.0  
5.0  
V
V
V
2.7V  
IH  
IN  
mA  
mA  
mA  
V
e
Input HIGH Current  
Breakdown Test  
54F  
74F  
100  
7.0  
7.0V  
BVI  
IN  
e
V
CC  
Output HIGH  
54F  
74F  
250  
50  
CEX  
OUT  
Leakage Current  
e
All Other Pins Grounded  
V
Input Leakage  
Test  
I
ID  
1.9 mA  
ID  
OD  
IL  
74F  
74F  
4.75  
e
All Other Pins Grounded  
I
I
Output Leakage  
Circuit Current  
V
150 mV  
IOD  
3.75  
mA  
mA  
0.0  
b
b
e
e
Input LOW Current  
0.6  
1.2  
V
V
0.5V (except CET)  
0.5V (CET)  
IN  
IN  
Max  
b
b
e
0V  
OUT  
I
I
Output Short-Circuit Current  
Power Supply Current  
60  
150  
mA  
mA  
Max  
Max  
V
V
OS  
e
35  
52  
LOW  
CCL  
O
4
’F169  
AC Electrical Characteristics  
74F  
54F  
74F  
e a  
T
25 C  
§
5.0V  
A
e
50 pF  
e
T
, V  
CC  
e
Mil  
T
, V  
Com  
e
50 pF  
A
A CC  
e a  
Symbol  
Parameter  
V
Units  
CC  
C
C
L
L
e
C
50 pF  
L
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
f
Maximum Count Frequency  
Propagation Delay  
90  
60  
70  
MHz  
ns  
max  
t
t
3.0  
4.0  
6.5  
9.0  
8.5  
3.0  
4.0  
12.0  
16.0  
3.0  
4.0  
9.5  
PLH  
CP to Q (PE HIGH or LOW)  
n
11.5  
13.0  
PHL  
t
t
Propagation Delay  
CP to TC  
5.5  
4.0  
12.0  
8.5  
15.5  
12.5  
5.5  
4.0  
20.0  
15.0  
5.5  
4.0  
17.5  
13.0  
PLH  
ns  
ns  
ns  
PHL  
t
t
Propagation Delay  
CET to TC  
2.5  
2.5  
4.5  
8.5  
6.5  
2.5  
2.5  
9.0  
2.5  
2.5  
7.0  
PLH  
11.0  
12.0  
12.0  
PHL  
t
t
Propagation Delay  
U/D to TC  
3.5  
4.0  
8.5  
8.0  
11.5  
12.0  
3.5  
4.0  
16.0  
14.0  
3.5  
4.0  
12.5  
13.0  
PLH  
PHL  
AC Operating Requirements  
74F  
54F  
74F  
e a  
T
25 C  
§
5.0V  
A
e
e
Symbol  
Parameter  
T
, V  
CC  
Mil  
Max  
T
, V  
A CC  
Com  
Max  
Units  
A
e a  
V
CC  
Min  
Max  
Min  
Min  
t (H)  
s
Setup Time, HIGH or LOW  
4.0  
4.0  
4.5  
4.5  
4.5  
4.5  
t (L)  
s
P to CP  
n
ns  
t (H)  
h
Hold Time, HIGH or LOW  
P to CP  
n
3.0  
3.0  
3.5  
3.5  
3.5  
3.5  
t (L)  
h
t (H)  
s
Setup Time, HIGH or LOW  
CEP or CET to CP  
7.0  
5.0  
8.0  
8.0  
8.0  
6.5  
t (L)  
s
ns  
t (H)  
h
Hold Time, HIGH or LOW  
CEP or CET to CP  
0
0
0
t (L)  
h
0.5  
1.0  
0.5  
t (H)  
s
Setup Time, HIGH or LOW  
PE to CP  
8.0  
8.0  
10.0  
10.0  
9.0  
9.0  
t (L)  
s
ns  
t (H)  
h
Hold Time, HIGH or LOW  
PE to CP  
1.0  
0
1.0  
0
1.0  
0
t (L)  
h
t (H)  
s
Setup Time, HIGH or LOW  
U/D to CP  
11.0  
7.0  
14.0  
12.0  
12.5  
8.5  
t (L)  
s
ns  
ns  
t (H)  
h
Hold Time, HIGH or LOW  
U/D to CP  
0
0
0
0
0
0
t (L)  
h
t
t
(H)  
(L)  
CP Pulse Width  
HIGH or LOW  
4.0  
7.0  
6.0  
9.0  
4.5  
8.0  
w
w
5
Ordering Information  
The device number is used to form part of a simplified purchasing code where the package type and temperature range are  
defined as follows:  
74F 169  
S
C
X
Temperature Range Family  
Special Variations  
e
e
e
e
74F  
54F  
Commercial  
Military  
X
QB  
Devices shipped in 13 reels  
×
Military grade device with  
environmental and burn-in  
processing shipped in tubes  
Device Type  
Package Code  
Temperature Range  
e
e
e
e
P
D
S
SJ  
Plastic DIP  
Ceramic DIP  
Small Outline Package SOIC JEDEC  
Small Outline SOIC EIAJ  
e
e
a
C
M
Commercial (0 C to 70 C)  
§
§
b a  
Military ( 55 C to 125 C)  
§
§
Physical Dimensions inches (millimeters)  
16-Lead Ceramic Dual-In-Line Package (D)  
NS Package Number J16A  
6
Physical Dimensions inches (millimeters) (Continued)  
16-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)  
×
NS Package Number M16A  
16-Lead (0.300 Wide) Molded Dual-In-Line Package (P)  
×
NS Package Number N16E  
7
Physical Dimensions inches (millimeters) (Continued)  
16-Lead (0.300 Wide) Molded Small Outline Package, EIAJ (SJ)  
×
NS Package Number M16D  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
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