74F174SJ [TI]

F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.300 INCH, EIAJ, SOIC-16;
74F174SJ
型号: 74F174SJ
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, 0.300 INCH, EIAJ, SOIC-16

光电二极管 输出元件 逻辑集成电路 触发器
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54F174  
54F174 Hex D Flip-Flop with Master Reset  
Literature Number: SNOS162A  
November 1994  
54F/74F174 Hex D Flip-Flop with Master Reset  
General Description  
Features  
Y
Edge-triggered D-type inputs  
The ’F174 is a high-speed hex D flip-flop. The device is  
used primarily as a 6-bit edge-triggered storage register.  
The information on the D inputs is transferred to storage  
during the LOW-to-HIGH clock transition. The device has a  
Master Reset to simultaneously clear all flip-flops.  
Y
Buffered positive edge-triggered clock  
Y
Asynchronous common reset  
Y
Guaranteed 4000V minimum ESD protection  
Package  
Commercial  
74F174PC  
Military  
Package Description  
Number  
N16E  
J16A  
16-Lead (0.300 Wide) Molded Dual-In
×
54F174DM (Note 2)  
16-Lead Ceramic Dual-In-Li
74F174SC (Note 1)  
74F174SJ (Note 1)  
M16A  
M16D  
W16A  
E20A  
16-Lead (0.150 Wide) Moldd all OutlineC  
×
16-Lead (0.300 Wide) Molded Smautline, EIAJ  
×
54F174FM (Note 2)  
54F174LM (Note 2)  
16-Lead Cerpack  
20-LCeramic Chip Crier, Type C  
e
Note 1: Devices also available in 13 reel. Use Suffix  
SCX and SJX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
DMQB, QB and
Logic Symbols  
Cction Diagrams  
Pin Assignm
DIP, SOIC and
Pin Assignment  
for LCC  
89–3  
TL/F/9489–1  
TL/F/9489–2  
TL/F/9489–5  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9489  
RRD-B30M75/Printed in U. S. A.  
Unit Loading/Fan Out  
54F/74F  
Pin Names  
Description  
U.L.  
Input I /I  
IH IL  
Output I /I  
HIGH/LOW  
OH OL  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
D D  
0
Data Inputs  
1.0/1.0  
1.0/1.0  
1.0/1.0  
50/33.3  
5
CP  
Clock Pulse Input (Active Rising Edge)  
Master Reset Input (Active LOW)  
Outputs  
MR  
b
Q Q  
0
1 mA/20 mA  
5
Functional Description  
Truth Table  
The ’F174 consists of six edge-triggered D flip-flops with  
individual D inputs and Q outputs. The Clock (CP) and Mas-  
ter Reset (MR) are common to all flip-flops. Each D input’s  
state is transferred to the corresponding flip-flop’s output  
following the LOW-to-HIGH Clock (CP) transition. A LOW  
input to the Master Reset (MR) will force all outputs LOW  
independent of Clock or Data inputs. The ’F174 is useful for  
applications where the true output only is required and the  
Clock and Master Reset are common to all storage ele-  
ments.  
Inputs  
Outputs  
MR  
CP  
D
Q
n
n
L
H
H
X
X
L
L
L
H
L
H
e
e
e
H
L
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
X
e
L
LOW-to-HIGH Clock Transition  
Logic Diagram  
TL/F/9489–4  
Please note that this diagram is provided only for thnding of logic operans and should not be used to estimate propagation delays.  
2
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Recommended Operating  
Conditions  
Free Air Ambient Temperature  
Military  
Commercial  
b
a
55 C to 125 C  
§
0 C to 70 C  
§
§
b
b
a
65 C to 150 C  
Storage Temperature  
§
§
§
§
§
a
§
a
55 C to 125 C  
Ambient Temperature under Bias  
§
Supply Voltage  
Military  
Commercial  
b
b
a
a a  
4.5V to 5.5V  
a a  
4.5V to 5.5V  
Junction Temperature under Bias  
Plastic  
55 C to 175 C  
§
§
a
55 C to 150 C  
V
Pin Potential to  
CC  
Ground Pin  
b
a
0.5V to 7.0V  
b
a
0.5V to 7.0V  
Input Voltage (Note 2)  
Input Current (Note 2)  
Voltage Applied to Output  
b
a
30 mA to 5.0 mA  
e
in HIGH State (with V  
Standard Output  
0V)  
CC  
b
0.5V to 5.5V  
0.5V to V  
CC  
b
a
TRI-STATE Output  
É
Current Applied to Output  
in LOW State (Max)  
twice the rated I (mA)  
OL  
ESD Last Passing Voltage (Min)  
4000V  
Note 1: Absolute maximum ratings are values beyond which the device may  
be damaged or have its useful life impaired. Functional operation under  
these conditions is not implied.  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
DC Electrical Characteristics  
54F/74F  
Symbol  
Parameter  
U
V
CC  
Conditions  
Min  
Typ  
V
V
V
V
Input HIGH Voltage  
2.0  
V
V
V
Recognized as a HIGH Signal  
Recognized as a LOW Signal  
IH  
Input LOW Voltage  
0.8  
IL  
e b  
18 mA  
Input Clamp Diode Voltage  
Min  
Min  
I
IN  
CD  
OH  
e b  
e b  
e b  
Output HIGH  
Voltage  
54F 10% V  
2.5  
2.5  
I
I
I
1 mA  
1 mA  
1 mA  
CC  
OH  
OH  
OH  
74F 10% V  
74F 5% V  
V
CC  
CC  
e
e
V
Output LOW  
Voltage  
54F 10% V  
74F 10% V  
0.5  
I
I
20 mA  
20 mA  
OL  
CC  
OL  
V
Min  
Max  
Max  
Max  
0.0  
0.5  
CC  
OL  
e
I
I
I
Input HIGH  
Current  
54F  
74
20.0  
5.0  
V
V
V
2.7V  
IH  
IN  
mA  
mA  
mA  
V
e
Input HIGH Current  
Breakdown Test  
5
100  
7.0  
7.0V  
BVI  
IN  
e
V
CC  
Outp
54F  
74F  
250  
50  
CEX  
OUT  
Le
e
All Other Pins Grounded  
V
ID  
I
T
I
ID  
1.9 mA  
F  
4F  
4.75  
e
IOD  
I
Ou
Circui
V
150 mV  
OD  
3.75  
mA  
0.0  
All Other Pins Grounded  
b
e
0.5V  
I
I
I
Input LOW Current  
0.6  
mA  
mA  
Max  
Max  
V
IL  
IN  
b
b
e
0V  
OUT  
Output Short-Circuit Current  
Power Supply Current  
60  
150  
V
OS  
CCH  
e
e
CP  
L
MR  
30  
30  
45  
45  
mA  
mA  
Max  
Max  
e
HIGH  
D
n
e
I
Power Supply Current  
V
LOW  
CCL  
O
3
AC Electrical Characteristics  
74F  
54F  
74F  
e a  
T
25 C  
§
5.0V  
A
e
50 pF  
e
50 pF  
T
, V  
CC  
e
Mil  
T
, V  
A CC  
Com  
A
e a  
Symbol  
Parameter  
V
Units  
CC  
e
C
C
L
L
e
C
50 pF  
L
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
f
Maximum Clock Frequency  
Propagation Delay  
80  
70  
80  
MHz  
ns  
max  
t
t
3.5  
4.0  
5.5  
7.0  
8.0  
3.0  
4.0  
10.0  
12.0  
3.5  
4.0  
9.0  
PLH  
CP to Q  
10.0  
11.0  
PHL  
n
t
Propagation Delay  
MR to Q  
PHL  
5.0  
10.0  
14.0  
5.0  
16.0  
5.0  
15.0  
ns  
n
AC Operating Requirements  
74F  
54F  
74F  
e a  
e a  
T
25 C  
§
5.0V  
A
e
e
Symbol  
Parameter  
T
, V  
CC  
Mil  
Max  
T
, V  
A CC  
M
Units  
A
V
CC  
Min  
Max  
Min  
M
t (H)  
s
Setup Time, HIGH or LOW  
4.8  
4.0  
5.0  
5.0  
4.8  
4.0  
t (L)  
s
D to CP  
n
ns  
t (H)  
h
Hold Time, HIGH or LOW  
D to CP  
n
0
0
2.0  
2.0  
t (L)  
h
t
t
(H)  
(L)  
CP Pulse Width  
HIGH or LOW  
4.0  
6.0  
5.0  
7.5  
4.0  
6.0  
w
ns  
ns  
w
t
t
(L)  
MR Pulse Width, LOW  
5.0  
5.0  
6.5  
5.0  
5.0  
w
Recovery Time, MR to CP  
rec  
4
Ordering Information  
The device number is used to form part of a simplified purchasing code where the package type and temperature range are  
defined as follows:  
74F 174  
S
C
X
Temperature Range Family  
Special Variations  
e
e
e
74F  
54F  
Commercial  
Military  
QB  
Military grade device with  
environmental and burn-in  
processing  
Device Type  
e
X
Devices shipped in 13 reel  
×
Package Code  
Temperature Range  
e
e
e
e
e
e
P
D
F
L
S
SS  
Plastic DIP  
Ceramic DIP  
Flatpak  
Leadless Chip Carrier (LCC)  
Small Outline SOIC JEDEC  
Small Outline SOIC EIAJ  
e
e
a
C
M
Commercial (0 C to 70 C)  
§
§
b a  
Military ( 55 C to 125 C)  
§
§
Physical Dimensions inches (millimeters)  
20-Terminal Ceramic Leadless Chip Carrier (L)  
NS Package Number E20A  
5
Physical Dimensions inches (millimeters) (Continued)  
16-Lead Ceramic Dual-In-Line Package (D)  
NS Package Number J16A  
16-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)  
×
NS Package Number M16A  
6
Physical Dimensions inches (millimeters) (Continued)  
16-Lead (0.300 Wide) Molded Small One PacIAJ (SJ
×
NS Package Number MD  
16-Lead (0.300 Wide) Molded Dual-In-Line Package (P)  
×
NS Package Number N16E  
7
Physical Dimensions inches (millimeters) (Continued)  
16 Lead Ceramic FlatpaF)  
NS Package Number W16
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