74LVTH16541DGGRG4 [TI]
3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS; 3.3 -V ABT 16位缓冲器/驱动器，具有三态输出
| 型号： | 74LVTH16541DGGRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
| 文件： | 总13页 (文件大小：314K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
FEATURES
SN54LVTH16541 . . . WD PACKAGE
SN74LVTH16541 . . . DGG OR DL PACKAGE
(TOP VIEW)
•
Members of the Texas Instruments Widebus™
Family
•
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V Operation
and Low Static-Power Dissipation
1OE1
1Y1
1OE2
1A1
1
2
3
4
5
6
7
8
9
48
47
1Y2
GND
1Y3
46 1A2
•
Support Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
GND
1A3
1A4
45
44
43
42
3.3-V VCC
)
1Y4
•
•
•
•
•
•
•
•
Support Unregulated Battery Operation Down
to 2.7 V
V
CC
V
CC
1Y5
1Y6
GND 10
1Y7
1Y8
2Y1
41 1A5
40 1A6
39 GND
Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
1A7
1A8
2A1
11
12
13
38
37
36
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
2Y2 14
GND 15
2Y3 16
2Y4 17
35 2A2
34 GND
33 2A3
32 2A4
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
V
CC
V
CC
18
31
2Y5 19
2Y6 20
GND 21
2Y7 22
2Y8 23
2OE1 24
30 2A5
29 2A6
28 GND
27 2A7
26 2A8
25 2OE2
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
•
Package Options Include Plastic Shrink
Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package Using
25-mil Center-to-Center Spacings
DESCRIPTION/ORDERING INFORMATION
These 16-bit buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the
capability to provide a TTL interface to a 5-V system environment.
These devices are noninverting 16-bit buffers composed of two 8-bit sections with separate output-enable
signals. For either 8-bit buffer section, the two output-enable (1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must
be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit
buffer section are in the high-impedance state.
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1997–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The SN54LVTH16541 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74LVTH16541 is characterized for operation from –40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
74LVTH16541DLRG4
TOP-SIDE MARKING
Reel of 1000
SN74LVTH16541DLR
SSOP – DL
LVTH16541
SN74LVTH16541DL
–40°C to 85°C
Tube of 25
SN74LVTH16541DLG4
74LVTH16541DGGRE4
SN74LVTH16541DGGR
TSSOP – DGG
Reel of 2000
LVTH16541
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each 8-bit section)
INPUTS
OUTPUT
Y
OE1
L
OE2
L
A
L
L
H
Z
Z
L
L
H
X
X
H
X
X
H
2
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SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
LOGIC SYMBOL(1)
1
&
1OE1
1OE2
48
EN1
24
25
&
2OE1
2OE2
EN2
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
2
1
1
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1A8
2A1
2A2
2A3
2A4
2A5
2A6
2A7
2A8
1Y1
3
1Y2
5
1Y3
6
1Y4
8
1Y5
9
1Y6
11
1Y7
12
1Y8
13
1
2
2Y1
14
2Y2
16
2Y3
17
2Y4
19
2Y5
20
2Y6
22
2Y7
23
2Y8
(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
LOGIC DIAGRAM (POSITIVE LOGIC)
24
25
1
1OE1
1OE2
2OE1
2OE2
48
47
2
36
13
1A1
1Y1
2Y1
2A1
To Seven Other Channels
To Seven Other Channels
3
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SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX UNIT
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high state(2)
4.6
V
V
V
V
7
VO
VO
7
VCC + 0.5
96
SN54LVTH16541
IO
Current into any output in the low state
Current into any output in the high state(3)
mA
mA
SN74LVTH16541
SN54LVTH16541
SN74LVTH16541
VI < 0
128
48
IO
64
IIK
Input clamp current
Output clamp current
–50
mA
mA
IOK
VO < 0
–50
DGG package
DL package
89
θJA
Package thermal impedance(4)
Storage temperature range
°C/W
°C
94
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) This current flows only when the output is in the high state and VO > VCC
.
(4) The package thermal impedance is calculated in accordance with JESD 51.
Recommended Operating Conditions(1)
SN54LVTH16541
SN74LVTH16541
UNIT
MIN
2.7
2
MAX
MIN
2.7
2
MAX
VCC
VIH
VIL
Supply voltage
3.6
3.6
V
V
High-level input voltage
Low-level input voltage
Input voltage
0.8
5.5
–24
48
0.8
5.5
–32
64
V
VI
V
IOH
IOL
High-level output current
Low-level output current
Input transition rise or fall rate
mA
mA
ns/V
µs/V
°C
∆t/∆v
Outputs enabled
10
10
∆t/∆VCC Power-up ramp rate
TA Operating free-air temperature
200
–55
200
–40
125
85
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
SN54LVTH16541
MIN TYP(1)
SN74LVTH16541B
MIN TYP(1) MAX
–1.2
PARAMETER
VIK
TEST CONDITIONS
UNIT
MAX
VCC = 2.7 V,
II = –18 mA
–1.2
V
VCC = 2.7 V to 3.6 V, IOH = –100 µA
VCC – 0.2
VCC – 0.2
VCC = 2.7 V,
IOH = –8 mA
IOH = –24 mA
IOH = –32 mA
IOL = 100 µA
IOL = 24 mA
IOL = 16 mA
IOL = 32 mA
IOL = 48 mA
IOL = 64 mA
VI = 5.5 V
2.4
2
2.4
VOH
V
V
VCC = 3 V
2
0.2
0.5
0.2
0.5
0.4
0.5
VCC = 2.7 V
VCC = 3 V
0.4
VOL
0.5
0.55
0.55
10
VCC = 0 or 3.6 V,
VCC = 3.6 V,
10
Control
inputs
VI = VCC or GND
±1
±1
II
µA
VI = VCC
1
1
–5
Data
inputs
VCC = 3.6 V
VCC = 0,
VI = 0
–5
Ioff
VI or VO = 0 to 4.5 V
VI = 0.8 V
VI = 2 V
±100
µA
µA
75
75
VCC = 3 V
Data
–75
–75
II(hold)
inputs
500
–750
VCC = 3.6 V,(2)
VI = 0 to 3.6 V
IOZH
IOZL
VCC = 3.6 V,
VCC = 3.6 V,
VO = 3 V
5
5
µA
µA
VO = 0.5 V
–5
–5
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don't care
IOZPU
IOZPD
±100(3)
±100(3)
±100
±100
µA
µA
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,
OE = don't care
Outputs high
VCC = 3.6 V,
0.19
5
0.19
5
ICC
IO = 0,
Outputs low
mA
mA
VI = VCC or GND
Outputs disabled
0.19
0.19
VCC = 3 V to 3.6 V, One input at VCC – 0.6 V,
Other inputs at VCC or GND
(4)
∆ICC
0.2
0.2
CI
VI = 3 V or 0
VO = 3 V or 0
4
9
4
9
pF
pF
Co
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
5
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SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54LVTH16541
VCC = 3.3 V
SN74LVTH16541
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V
PARAMETER
VCC = 2.7 V
MIN
VCC = 2.7 V UNIT
± 0.3 V
MIN
1
MAX
3.7
3.7
4.8
4.8
6.2
5.7
MAX MIN TYP(1) MAX MIN MAX
tPLH
tPHL
4
4
1
1
2.4
2
3.5
3.5
4.6
4.6
5.9
5.4
0.5
0.5
3.8
3.8
5.5
5.2
6.2
5.5
0.5
0.5
A
Y
Y
Y
ns
ns
ns
ns
1
tPZH
1.1
1.1
2.1
1.9
5.7
5.4
6.5
6
1.2
1.2
2.2
2.2
2.7
2.8
4.1
3.8
OE
OE
tPZL
tPHZ
tPLZ
tsk(LH)
tsk(HL)
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
6
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SN54LVTH16541, SN74LVTH16541
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS691E–MAY 1997–REVISED NOVEMBER 2006
PARAMETER MEASUREMENT INFORMATION
6 V
Open
TEST
S1
S1
500 Ω
From Output
Under Test
t
pd
Open
6 V
GND
GND
t
t
/t
PLZ PZL
C = 50 pF
L
/t
PHZ PZH
500 Ω
(see Note A)
2.7 V
0 V
LOAD CIRCUIT
1.5 V
Timing Input
Data Input
t
w
t
t
h
su
2.7 V
0 V
2.7 V
0 V
1.5 V
1.5 V
Input
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
0 V
2.7 V
0 V
Output
Control
1.5 V
1.5 V
Input
1.5 V
1.5 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
S1 at 6 V
V
V
3 V
OH
1.5 V
Output
1.5 V
1.5 V
1.5 V
V
V
+ 0.3 V
OL
V
OL
OL
(see Note B)
t
t
t
PZH
PHZ
PHL
PLH
Output
Waveform 2
S1 at GND
V
V
V
OH
OH
− 0.3 V
OH
1.5 V
Output
1.5 V
≈ 0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
7
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
74LVTH16541DGGRE4
74LVTH16541DGGRG4
74LVTH16541DLRG4
SN74LVTH16541DGGR
SN74LVTH16541DL
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
SSOP
TSSOP
SSOP
SSOP
SSOP
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVTH16541DLG4
SN74LVTH16541DLR
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74LVTH16541DGGR TSSOP
SN74LVTH16541DLR SSOP
DGG
DL
48
48
2000
1000
330.0
330.0
24.4
32.4
8.6
15.8
16.2
1.8
3.1
12.0
16.0
24.0
32.0
Q1
Q1
11.35
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LVTH16541DGGR
SN74LVTH16541DLR
TSSOP
SSOP
DGG
DL
48
48
2000
1000
346.0
346.0
346.0
346.0
41.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
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