A26LV31ESP [TI]

LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVER WITH ±15-kV IEC ESD PROTECTION; 具有± 15 kV的IEC ESD保护的低电压高速四路差动线路驱动器
A26LV31ESP
型号: A26LV31ESP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVER WITH ±15-kV IEC ESD PROTECTION
具有± 15 kV的IEC ESD保护的低电压高速四路差动线路驱动器

驱动器
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AM26LV31E-EP  
www.ti.com............................................................................................................................................................................................ SLLS947NOVEMBER 2008  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVER  
WITH ±15-kV IEC ESD PROTECTION  
1
FEATURES  
SUPPORTS DEFENSE, AEROSPACE,  
AND MEDICAL APPLICATIONS  
Meets or Exceeds Standards TIA/EIA-422-B  
and ITU Recommendation V.11  
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Available in Extended (–55°C/105°C)  
Temperature Range(1)  
Operates From a Single 3.3-V Power Supply  
ESD Protection for RS422 Bus Pins  
±15-kV Human-Body Model (HBM)  
±8-kV IEC61000-4-2, Contact Discharge  
±15-kV IEC61000-4-2, Air-Gap Discharge  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
Switching Rates up to 32 MHz  
Propagation Delay Time . . . 8 ns Typ  
Pulse Skew Time . . . 500 ps Typ  
D PACKAGE  
(TOP VIEW)  
High Output-Drive Current . . . ±30 mA  
Controlled Rise and Fall Times . . . 5 ns Typ  
1A  
1Y  
V
CC  
1
2
3
4
5
6
7
8
16  
Differential Output Voltage With 100-  
Load . . . 2.6 V Typ  
15 4A  
14 4Y  
13 4Z  
1Z  
G
Accepts 5-V Logic Inputs With 3.3-V Supply  
2Z  
12  
11  
10  
9
G
Ioff Supports Partial-Power-Down Mode  
Operation  
2Y  
3Z  
3Y  
3A  
2A  
Driver Output Short-Protection Circuit  
GND  
Glitch-Free Power-Up/Power-Down Protection  
(1) Additional temperature ranges are available – contact factory  
DESCRIPTION/ORDERING INFORMATION  
The AM26LV31E is a quadruple differential line driver with 3-state outputs. This driver has ±15-kV ESD  
(HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection.  
This device is designed to meet TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply  
voltage.  
The device is optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have high  
current capability for driving balanced lines, such as twisted-pair transmission lines, and provide a high  
impedance in the power-off condition.  
The AM26LV31ES is characterized for operation from –55°C to 105°C.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
AM26LV31ESDREP  
TOP-SIDE MARKING  
A26LV31ESP  
–55°C to 105°C  
SOIC – D  
Tape and reel  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
AM26LV31E-EP  
SLLS947NOVEMBER 2008............................................................................................................................................................................................ www.ti.com  
FUNCTION TABLE(1)  
ENABLES  
OUTPUTS  
INPUT  
A
G
H
H
X
X
L
G
X
X
L
Y
H
L
Z
L
H
L
H
L
H
L
H
L
L
H
Z
X
H
Z
(1) H = high level, L = low level, X = irrelevant,  
Z = high impedance (off)  
LOGIC DIAGRAM  
4
G
12  
G
2
1
1Y  
1A  
3
1Z  
6
7
2Y  
2A  
5
2Z  
10  
9
3Y  
3Z  
3A  
11  
14  
13  
15  
4Y  
4Z  
4A  
SCHEMATIC  
EQUIVALENT OF EACH INPUT (A, G, OR G)  
TYPICAL OF EACH DRIVER OUTPUT  
V
CC  
V
CC  
Input  
Output  
GND  
GND  
2
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Product Folder Link(s): AM26LV31E-EP  
AM26LV31E-EP  
www.ti.com............................................................................................................................................................................................ SLLS947NOVEMBER 2008  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX  
6
UNIT  
V
VCC  
VI  
Supply voltage range(2)  
Input voltage range  
6
V
VO  
IIK  
Output voltage range  
6
V
Input clamp current  
VI < 0  
–20  
–20  
±150  
±200  
150  
73  
mA  
mA  
mA  
mA  
°C  
IOK  
lO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
Operating virtual junction temperature  
Package thermal impedance(3)(4)  
Operating free-air temperature range  
Storage temperature range  
TJ  
θJA  
TA  
°C/W  
°C  
–55  
–65  
105  
150  
Tstg  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values except differential input voltage are with respect to the network GND.  
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient  
temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Copyright © 2008, Texas Instruments Incorporated  
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3
Product Folder Link(s): AM26LV31E-EP  
AM26LV31E-EP  
SLLS947NOVEMBER 2008............................................................................................................................................................................................ www.ti.com  
RECOMMENDED OPERATING CONDITIONS  
MIN  
3
NOM  
MAX  
3.6  
UNIT  
V
VCC  
VI  
Supply voltage  
3.3  
Input voltage  
0
5.5  
V
VIH  
VIL  
IOH  
IOL  
TA  
High-level input voltage  
Low-level input voltage  
High-level output current  
Low-level output current  
Operating free-air temperature  
2
V
0.8  
–30  
30  
V
mA  
mA  
°C  
–55  
105  
ELECTRICAL CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VIH = 2 V, VIL = 0.8 V, IOH = –20 mA  
VIH = 2 V, VIL = 0.8 V, IOL = 20 mA  
IO = 0 mA  
MIN  
TYP(1)  
3
MAX UNIT  
VOH  
High-level output voltage  
Low-level output voltage  
Differential output voltage  
Differential output voltage  
2.4  
V
VOL  
0.2  
0.4  
4
V
V
V
|VOD1  
|
|
2
2
|VOD2  
RL = 100 (see Figure 1)(2)  
2.6  
1.5  
Change in magnitude of  
differential output voltage  
Δ|VOD  
|
RL = 100 (see Figure 1)(2)  
RL = 100 (see Figure 1)(2)  
RL = 100 (see Figure 1)(2)  
±0.4  
2
V
V
V
VOC  
Common-mode output voltage  
Change in magnitude of  
common-mode output voltage  
Δ|VOC  
|
±0.4  
IO(OFF)  
IOZ  
Output current with power off  
High-impedance state output current  
Input current  
VCC = 0, VO = –0.25 V or 5.5 V  
VO = –0.25 V or 5.5 V, G = 0.8 V or G = 2 V  
VCC = 0 or 3.6 V, VI = 0 or 5.5 V  
VO = VCC or GND(3)  
±127  
±127  
±10  
µA  
µA  
µA  
mA  
µA  
pF  
II  
IOS  
ICC  
Cpd  
Short-circuit output current  
Supply current (total package)  
Power dissipation capacitance  
–30  
–150  
100  
VI = VCC or GND, No load, enable  
No load(4)  
160  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) Refer to TIA-EIA-422-B for exact conditions.  
(3) Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.  
(4) Cpd determines the no-load dynamic current consumption: IS = Cpd × VCC × f + ICC  
4
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): AM26LV31E-EP  
AM26LV31E-EP  
www.ti.com............................................................................................................................................................................................ SLLS947NOVEMBER 2008  
SWITCHING CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)  
PARAMETER  
Propagation delay time, high- to low-level output  
Propagation delay time, low- to high-level output  
Transition time (tr or tf)  
TEST CONDITIONS  
MIN  
4
TYP(1)  
8
MAX UNIT  
tPHL  
tPLH  
tt  
12  
12  
10  
20  
20  
20  
20  
3
ns  
ns  
See Figure 2  
3.5  
8
See Figure 2  
See Figure 3  
See Figure 4  
See Figure 3  
See Figure 4  
5
ns  
tPZH  
tPZL  
tPHZ  
tPLZ  
tsk(p)  
tsk(o)  
tsk(lim)  
f(max)  
Output-enable time to high level  
Output-enable time to low level  
Output-disable time from high level  
Output-disable time from low level  
Pulse skew  
10  
10  
10  
10  
0.5  
ns  
ns  
ns  
ns  
ns  
Skew limit (pin to pin)  
See Figure 2(2)(3)  
1.5  
3
ns  
Skew limit (device to device)  
Maximum operating frequency  
ns  
See Figure 2  
32  
MHz  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) Pulse skew is defined as the |tPLH – tPHL| of each channel of the same device.  
(3) Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices.  
ESD PROTECTION  
PARAMETER  
TEST CONDITIONS  
TYP  
±15  
±15  
±8  
UNIT  
HBM  
Driver output  
IEC61000-4-2, Air-Gap Discharge  
IEC61000-4-2, Contact Discharge  
kV  
Copyright © 2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): AM26LV31E-EP  
AM26LV31E-EP  
SLLS947NOVEMBER 2008............................................................................................................................................................................................ www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
R /2  
L
V
OD  
V
OC  
R /2  
L
Figure 1. Test Circuit, VOD and VOC  
C2 = 40 pF  
Y
R
L
= 100  
Input  
C1 = 40 pF  
C3 = 40 pF  
Z
See Note A  
V
CC  
Input  
50%  
50%  
A
0 V  
t
t
PHL  
PLH  
Z
Y
Output, V  
O
PROPAGATION DELAY TIMES  
V
V
OH  
90%  
90%  
10%  
10%  
OL  
Y
Z
t
t
r
f
Output, V  
O
t
t
f
r
V
V
OH  
90%  
90%  
10%  
10%  
OL  
RISE AND FALL TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B.  
t and t 2 ns.  
f
r
Figure 2. Test Circuit and Voltage Waveforms, tPHL and tPLH  
6
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Product Folder Link(s): AM26LV31E-EP  
AM26LV31E-EP  
www.ti.com............................................................................................................................................................................................ SLLS947NOVEMBER 2008  
PARAMETER MEASUREMENT INFORMATION (continued)  
S1  
Y
A
V
CC  
Z
Output  
R
L
= 110  
C
L
= 40 pF  
(see Note A)  
G
G
Generator  
(see Note B)  
50 Ω  
V
CC  
(see Note C)  
TEST CIRCUIT  
V
CC  
50%  
50%  
Input  
0 V  
t
PHZ  
t
PZH  
0.3 V  
V
OH  
Output  
50%  
VOLTAGE WAVEFORMS  
V
off  
0  
A. CL includes probe and jig capacitance.  
B. The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,  
tr = tf 2ns.  
C. To test the active-low enable G, ground G and apply an inverted waveform G.  
Figure 3. Test Circuit and Voltage Waveforms, tPZH and tPHZ  
Copyright © 2008, Texas Instruments Incorporated  
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7
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AM26LV31E-EP  
SLLS947NOVEMBER 2008............................................................................................................................................................................................ www.ti.com  
PARAMETER MEASUREMENT INFORMATION (continued)  
V
CC  
R
L
= 110  
S1  
Y
Z
A
V
CC  
Output  
C
L
= 40 pF  
(see Note A)  
G
G
Generator  
50 Ω  
(see Note B)  
V
CC  
(see Note C)  
TEST CIRCUIT  
V
CC  
Input  
50%  
50%  
0 V  
t
PLZ  
t
PZL  
V
off  
V  
CC  
50%  
Output  
V
OL  
0.3 V  
VOLTAGE WAVEFORMS  
A. CL includes probe and jig capacitance.  
B. The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,  
tr = tf 2ns.  
C. To test the active-low enable G, ground G and apply an inverted waveform G.  
Figure 4. Test Circuit and Voltage Waveforms, tPZL and tPLZ  
8
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Product Folder Link(s): AM26LV31E-EP  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Nov-2008  
PACKAGING INFORMATION  
Orderable Device  
AM26LV31ESDREP  
V62/09603-01XE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
16  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
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OTHER QUALIFIED VERSIONS OF AM26LV31E-EP :  
Catalog: AM26LV31E  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 1  
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