AD3421QRWETQ1 [TI]
汽车类、四通道、12 位、25MSPS 模数转换器 (ADC) | RWE | 56 | -40 to 125;型号: | AD3421QRWETQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 汽车类、四通道、12 位、25MSPS 模数转换器 (ADC) | RWE | 56 | -40 to 125 转换器 模数转换器 |
文件: | 总64页 (文件大小:3115K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
ADC3421-Q1 车用、四通道、12 位、25MSPS 模数转换器
1 特性
3 说明
1
•
符合面向汽车 标准
ADC3421-Q1 是一款汽车级、高线性度、超低功耗、
四通道、12 位、25MSPS 模数转换器 (ADC)。该器件
专门用于支持具有宽动态范围需求且要求苛刻的高输入
频率信号。输入时钟分频器使得系统时钟架构设计更加
灵活,SYSREF 输入可实现系统完全同步。ADC3421-
Q1 支持串行低压差分信令 (LVDS),从而减少接口线
路的数量,实现高系统集成密度。串行 LVDS 接口为
双线制,通过两个 LVDS 对串行输出每个 ADC 数据。
内部锁相环 (PLL) 会将传入的 ADC 采样时钟加倍,以
获得串行输出各通道的 12 位输出数据时所使用的位时
钟。除了串行数据流之外,数据帧和位时钟也作为
LVDS 输出进行传送。
–
温度等级 1:–40°C 至 125°C TA
•
•
•
•
•
四通道
12 位分辨率
单电源:1.8V
串行 LVDS 接口
支持 1 分频、2 分频和 4 分频的灵活输入时钟缓冲
器
•
•
fIN = 10MHz 时,SNR = 71.1dBFS,
SFDR = 90dBc
超低功耗:
–
25MSPS 时为每通道 44mW
•
•
•
通道隔离:105dB
内部抖动和斩波
支持多芯片同步
器件信息(1)
器件型号
封装
封装尺寸(标称值)
ADC3421-Q1
VQFNP (56)
8.00mm x 8.00mm
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。
2 应用
•
•
•
•
•
固态激光雷达
电机控制反馈
无损检测
雷达和智能天线阵列
军需品指导
10MHz IF 时的频谱
(SFDR = 90dBc,SNR = 71.2dBFS,
SINAD = 71.1dBFS,THD = 89dBc)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D802
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SBAS958
ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
www.ti.com.cn
目录
8.2 Functional Block Diagram ....................................... 18
8.3 Feature Description................................................. 19
8.4 Device Functional Modes........................................ 23
8.5 Programming........................................................... 26
8.6 Register Maps......................................................... 31
Applications and Implementation ...................... 53
9.1 Application Information............................................ 53
9.2 Typical Applications ................................................ 54
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics: General............................ 6
6.6 Electrical Characteristics: AC Performance.............. 7
6.7 Digital Characteristics ............................................... 9
6.8 Timing Requirements: General ................................. 9
6.9 Timing Requirements: LVDS Output....................... 10
6.10 Typical Characteristics.......................................... 11
Parameter Measurement Information ................ 16
7.1 Timing Diagrams..................................................... 16
Detailed Description ............................................ 18
8.1 Overview ................................................................. 18
9
10 Power Supply Recommendations ..................... 56
11 Layout................................................................... 57
11.1 Layout Guidelines ................................................. 57
11.2 Layout Example .................................................... 57
12 器件和文档支持 ..................................................... 58
12.1 接收文档更新通知 ................................................. 58
12.2 支持资源................................................................ 58
12.3 商标....................................................................... 58
12.4 静电放电警告......................................................... 58
12.5 Glossary................................................................ 58
13 机械、封装和可订购信息....................................... 58
7
8
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
日期
修订版本
说明
2019 年 12 月
*
初始发行版。
2
Copyright © 2019, Texas Instruments Incorporated
ADC3421-Q1
www.ti.com.cn
ZHCSKL4 –DECEMBER 2019
5 Pin Configuration and Functions
RWE Package
VQFNP-56
Top View
DA1P
DA1M
DA0P
DA0M
DVDD
AVDD
AVDD
INAM
INAP
1
42
41
40
39
38
37
36
35
34
33
32
31
30
29
DD0M
DD0P
DD1M
DD1P
DVDD
PDN
2
3
4
5
6
7
AVDD
INDM
INDP
Thermal Pad
8
9
AVDD
AVDD
INBP
10
11
12
13
14
AVDD
AVDD
INCP
INBM
AVDD
INCM
AVDD
Not to scale
Copyright © 2019, Texas Instruments Incorporated
3
ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
www.ti.com.cn
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
6, 7, 10, 11, 14,
15, 20, 23, 28, 29,
32, 33, 36
AVDD
I
Analog 1.8-V power supply
CLKM
CLKP
DA0M
DA0P
DA1M
DA1P
DB0M
DB0P
DB1M
DB1P
DC0M
DC0P
DC1M
DC1P
DD0M
DD0P
DD1M
DD1P
DCLKM
DCLKP
DVDD
FCLKM
FCLKP
INAM
INAP
21
I
Negative differential clock input for the ADC
Positive differential clock input for the ADC
Negative serial LVDS output for wire-0 of channel A
Positive serial LVDS output for wire-0 of channel A
Negative serial LVDS output for wire-1 of channel A
Positive serial LVDS output for wire-1 of channel A
Negative serial LVDS output for wire-0 of channel B
Positive serial LVDS output for wire-0 of channel B
Negative serial LVDS output for wire-1 of channel B
Positive serial LVDS output for wire-1 of channel B
Negative serial LVDS output for wire-0 of channel C
Positive serial LVDS output for wire-0 of channel C
Negative serial LVDS output for wire-1 of channel C
Positive serial LVDS output for wire-1 of channel C
Negative serial LVDS output for wire-0 of channel D
Positive serial LVDS output for wire-0 of channel D
Negative serial LVDS output for wire-1 of channel D
Positive serial LVDS output for wire-1 of channel D
Negative bit clock output
22
I
4
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
3
2
1
56
55
54
53
46
45
44
43
42
41
40
39
51
50
Positive bit clock output
5, 38, 47, 52
Digital 1.8-V power supply
49
48
8
O
O
I
Negative frame clock output
Positive frame clock output
Negative differential analog input for channel A
Positive differential analog input for channel A
Negative differential analog input for channel B
Positive differential analog input for channel B
Negative differential analog input for channel C
Positive differential analog input for channel C
Negative differential analog input for channel D
Positive differential analog input for channel D
9
I
INBM
INBP
13
12
30
31
35
34
I
I
INCM
INCP
I
I
INDM
INDP
I
I
Power-down control. This pin can be configured using the SPI. This pin has an internal
150-kΩ pulldown resistor.
PDN
37
I
RESET
SCLK
24
16
17
19
I
I
Hardware reset; active high. This pin has an internal 150-kΩ pulldown resistor.
Serial interface clock input. This pin has an internal 150-kΩ pulldown resistor.
Serial interface data input. This pin has an internal 150-kΩ pulldown resistor.
Serial interface data output
SDATA
SDOUT
I
O
Serial interface enable; active low.
This pin has an internal 150-kΩ pullup resistor to AVDD.
SEN
18
I
SYSREFM
SYSREFP
VCM
26
25
27
—
I
I
Negative external SYSREF input
Positive external SYSREF input
Common-mode voltage for analog inputs
Connect thermal pad to ground.
O
—
Thermal Pad
4
Copyright © 2019, Texas Instruments Incorporated
ADC3421-Q1
www.ti.com.cn
ZHCSKL4 –DECEMBER 2019
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
Analog supply voltage range, AVDD
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
2.1
Digital supply voltage range, DVDD
2.1
V
INAP, INBP, INCP, INDP, INAM, INBM, INCM, INDM
min (1.9, AVDD + 0.3)
CLKP, CLKM
AVDD + 0.3
AVDD + 0.3
3.9
Voltage applied to
input pins
V
SYSREFP, SYSREFM
SCLK, SEN, SDATA, RESET, PDN
Operating junction, TJ
Storage, Tstg
150
Temperature
ºC
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-011
CDM ESD Classification Level C5
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions(1)
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supplies
AVDD
Analog supply voltage range
Digital supply voltage range
1.7
1.7
1.8
1.8
1.9
1.9
V
V
DVDD
Analog Input
For input frequencies < 450 MHz
For input frequencies < 600 MHz
2
1
VID
Differential input voltage
VPP
V
VIC
Input common-mode voltage
Input clock frequency
VCM ± 0.025
Clock Input
Sampling clock frequency
Sine wave, ac-coupled
LPECL, ac-coupled
15(2)
25
MSPS
VPP
0.2
1.5
1.6
Input clock amplitude (differential)
LVDS, ac-coupled
0.7
Input clock duty cycle
35%
50%
0.95
65%
Input clock common-mode voltage
V
Digital Outputs
Maximum external load capacitance
CLOAD
3.3
pF
from each output pin to GND
RLOAD
Temperature
TJ Operating Junction Temperature
Single-ended load resistance
100
Ω
–40
125
°C
(1) After power-up, use only the RESET pin to reset the device for the first time; see the Register Initialization section for details.
(2) See 表 1 for details.
Copyright © 2019, Texas Instruments Incorporated
5
ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
www.ti.com.cn
6.4 Thermal Information
ADC3421-Q1
THERMAL METRIC(1)
RWE (VQFNP)
UNIT
56 PINS
20.3
8.8
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
5.6
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.1
ψJB
5.6
RθJC(bot)
0.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
6.5 Electrical Characteristics: General
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 125°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MSPS
Bits
ADC clock frequency
25
Resolution
12
1.8-V analog supply current
1.8-V digital supply current
Total power dissipation
Global power-down dissipation
Standby power-down dissipation
54
45
71
71
mA
mA
177
5
240
17
mW
mW
mW
34
75
Analog Input
Differential input full-scale
Input resistance
2.0
6.6
3.7
0.95
10
VPP
kΩ
ri
Differential at dc
Differential at dc
ci
Input capacitance
pF
VOC(VCM)
VCM common-mode voltage output
VCM output current capability
Input common-mode current
V
mA
Per analog input pin
1.5
µA/MSPS
50-Ω differential source driving 50-Ω termination
across INP and INM
Analog input bandwidth (3 dB)
540
MHz
DC accuracy
EO
Offset error
–25
–2
25
2
mV
αEO
Temperature coefficient of offset error
± 0.024
mV/°C
Gain error as a result of internal
reference inaccuracy alone
EG(REF)
%FS
EG(CHAN)
Gain error of channel alone
–2
%FS
α(EGCHAN)
Temperature coefficient of EG(CHAN)
±0.008
Δ%FS/Ch
Channel-to-channel Isolation
Near channel
fIN = 10 MHz
105
105
95
Far channel
Near channel
fIN = 100 MHz
Far channel
105
94
Near channel
fIN = 200 MHz
Crosstalk(1)
dB
Far channel
105
92
Near channel
fIN = 230 MHz
Far channel
105
85
Near channel
fIN = 300 MHz
Far channel
105
(1) Crosstalk is measured with a –1-dBFS input signal on the aggressor channel and no input on the victim channel.
6
Copyright © 2019, Texas Instruments Incorporated
ADC3421-Q1
www.ti.com.cn
ZHCSKL4 –DECEMBER 2019
6.6 Electrical Characteristics: AC Performance
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 125°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input,
unless otherwise noted.
DITHER ON
MIN
DITHER OFF
MIN MAX
PARAMETER
TEST CONDITIONS
UNIT
TYP
70.9
70.7
70.4
70.3
69.7
68.9
70.2
70.1
69.8
69.6
69.2
68.3
–141.5
MAX
TYP
71.1
70.9
70.6
70.5
69.9
69.1
70.5
70.3
70.0
69.8
69.3
68.5
–141.7
–141.5
–141.2
–141.1
–140.5
–139.7
71.1
70.9
70
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
68.9
Signal-to-noise ratio
(from 1-MHz offset)
dBFS
SNR
Signal-to-noise ratio
(full Nyquist band)
dBFS
dBFS/Hz
dBFS
Bits
–141.3 –139.5
–141.0
–140.9
–140.3
–139.5
71
Noise spectral density
(averaged across Nyquist zone)
NSD(1)
67.9
70.8
69.5
70.5
69.6
68.7
11.5
11.4
11.4
11.4
11.3
11.1
93
Signal-to-noise and distortion
ratio
SINAD(1)
ENOB(1)
SFDR
70.7
69.8
68.7
11.5
11.4
11.4
11.4
11.3
11.1
90
11
Effective number of bits
84
91
85
93
88
Spurious-free dynamic range
dBc
85
82
86
85
82
82
(1) Reported from a 1-MHz offset.
Copyright © 2019, Texas Instruments Incorporated
7
ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
www.ti.com.cn
Electrical Characteristics: AC Performance (continued)
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 125°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input,
unless otherwise noted.
DITHER ON
MIN
DITHER OFF
MIN MAX
PARAMETER
TEST CONDITIONS
UNIT
TYP
93
100
93
94
86
86
96
91
93
85
89
82
99
98
96
95
92
97
90
90
89
84
84
80
MAX
TYP
92
94
92
93
85
82
90
85
88
82
89
82
92
91
92
93
90
91
86
83
85
80
83
79
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
83
82
86
78
Second-order harmonic
distortion
HD2
dBc
HD3
Non
Third-order harmonic distortion
dBc
dBc
Spurious-free dynamic range
HD2, HD3 (excluding HD2, HD3)
THD
Total harmonic distortion
dBc
fIN1 = 45 MHz,
fIN2 = 50 MHz
–98
–91
–98
–91
Two-tone, third-order
intermodulation distortion
IMD3
dBFS
fIN1 = 185 MHz,
fIN2 = 190 MHz
8
Copyright © 2019, Texas Instruments Incorporated
ADC3421-Q1
www.ti.com.cn
ZHCSKL4 –DECEMBER 2019
6.7 Digital Characteristics
The dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic
level 0 or 1. AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Digital Inputs (RESET, SCLK, SDATA, SEN, PDN)
All digital inputs support 1.8-V and
3.3-V CMOS logic levels
VIH
VIL
High-level input voltage
Low-level input voltage
1.3
V
V
All digital inputs support 1.8-V and
3.3-V CMOS logic levels
0.4
RESET, SDATA, SCLK,
PDN
SEN(1)
VHIGH = 1.8 V
VHIGH = 1.8 V
VLOW = 0 V
10
0
µA
µA
µA
µA
High-level input
current
IIH
RESET, SDATA, SCLK,
PDN
0
Low-level input
current
IIL
SEN
VLOW = 0 V
10
DigitaL Inputs (SYSREFP, SYSREFM)
VIH
VIL
High-level input voltage
1.3
0.5
0.9
V
V
V
Low-level input voltage
Common-mode voltage for SYSREF
Digital Outputs (CMOS Interface, SDOUT)
VOH
VOL
High-level output voltage
Low-level output voltage
DVDD – 0.1
DVDD
0
V
V
0.1
Digital Outputs (LVDS Interface)
VODH
VODL
VOCM
High-level output differential voltage
With an external 100-Ω termination
With an external 100-Ω termination
280
350
–350
1.05
460
mV
mV
V
Low-level output differential voltage
Output common-mode voltage
–460
–280
(1) SEN has an internal 150-kΩ pullup resistor to AVDD. SPI pins (SEN, SCLK, SDATA) can be driven by 1.8 V or 3.3 V CMOS buffers.
6.8 Timing Requirements: General
Typical values are at TA = 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. Minimum
and maximum values are across the full temperature range: TMIN = –40°C to TMAX = 125°C.
MIN
TYP
1.44
±70
±150
130
35
MAX
UNIT
ns
tA
Aperture delay
1.24
1.64
Aperture delay matching between two channels of the same device
Aperture delay variation between two devices at same temperature and supply voltage
Aperture jitter
ps
ps
tJ
fS rms
µs
Time to valid data after exiting standby power-down mode
200
450
Wake-up time:
ADC latency(1)
Time to valid data after exiting global power-down mode
(in this mode, both channels power down)
85
9
µs
Clock
cycles
2-wire mode (default)
1-wire mode
:
Clock
cycles
8
tSU_SYSREF
Setup time for SYSREF referenced to input clock rising edge
Hold time for SYSREF referenced to input clock rising edge
1000
100
ps
ps
SYSREF reference time:
tH_SYSREF
(1) Overall latency = ADC latency + tPDI
.
Copyright © 2019, Texas Instruments Incorporated
9
ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
www.ti.com.cn
6.9 Timing Requirements: LVDS Output(1)(2)
Typical values are at TA = 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, 6x Serialization (2-Wire Mode),
CLOAD = 3.3 pF(3), and RLOAD = 100 Ω(4), unless otherwise noted.. Minimum and maximum values are across the full
temperature range: TMIN = –40°C to TMAX = 125°C.
MIN
1.3
TYP
1.48
3.06
1.57
3.12
MAX
UNIT
1-wire mode
2-wire mode
1-wire mode
2-wire mode
Data setup time: data valid to zero-crossing of differential
output clock (CLKOUTP – CLKOUTM)(5)(6)
tSU
ns
2.61
1.32
2.75
Data hold time: zero-crossing of differential output clock
(CLKOUTP – CLKOUTM) to data becoming invalid(5)(6)
tHO
ns
Clock propagation delay: input clock falling edge cross-over to 1-wire mode
frame clock rising edge cross-over
(15 MSPS < sampling frequency < 25 MSPS)
0.1 × tS + tDELAY
0.61 × tS + tDELAY
ns
ns
ns
tPDI
2-wire mode
tDELAY
Delay time
3
4.5
5.9
LVDS bit clock duty cycle: duty cycle of differential clock
(CLKOUTP – CLKOUTM)
49%
tFALL
tRISE
,
Data fall time, data rise time: rise time measured from –100 mV to 100 mV,
15 MSPS ≤ Sampling frequency ≤ 25 MSPS
0.11
0.11
ns
ns
tCLKRISE
tCLKFALL
,
Output clock rise time, output clock fall time: rise time measured from
–100 mV to 100 mV, 15 MSPS ≤ Sampling frequency ≤ 25 MSPS
(1) Measurements are done with a transmission line of a 100-Ω characteristic impedance between the device and load. Setup and hold time
specifications take into account the effect of jitter on the output data and clock.
(2) Timing parameters are ensured by design and characterization and are not tested in production.
(3) CLOAD is the effective external single-ended load capacitance between each output pin and ground.
(4) RLOAD is the differential load resistance between the LVDS output pair.
(5) Data valid refers to a logic high of 100 mV and a logic low of –100 mV.
(6) Write relevant register settings as mentioned in 表 22.
10
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ADC3421-Q1
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ZHCSKL4 –DECEMBER 2019
6.10 Typical Characteristics
typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted).
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D801
D802
SFDR = 95 dBc, SNR = 71 dBFS, SINAD = 71 dBFS,
THD = 94 dBc, HD2 = 106 dBc, HD3 = 95 dBc
SFDR = 90 dBc, SNR = 71.2 dBFS, SINAD = 71.1 dBFS,
THD = 89 dBc, HD2 = 90 dBc, HD3 = 106 dBc
图 1. FFT for 10-MHz Input Signal (Dither On)
图 2. FFT for 10-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D803
D804
SFDR = 92 dBc, SNR = 70.5 dBFS, SINAD = 70.3 dBFS,
THD = 91 dBc, HD2 = 105 dBc, HD3 = 92 dBc
SFDR = 91 dBc, SNR = 70.7 dBFS, SINAD = 70.6 dBFS,
THD = 88 dBc, HD2 = 91 dBc, HD3 = 101 dBc
图 3. FFT for 70-MHz Input Signal (Dither On)
图 4. FFT for 70-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D805
D806
SFDR = 87 dBc, SNR = 69.8 dBFS, SINAD = 69.7 dBFS,
THD = 85 dBc, HD2 = 90 dBc, HD3 = 87 dBc
SFDR = 85 dBc, SNR = 70 dBFS, SINAD = 69.8 dBFS,
THD = 86 dBc, HD2 = 85 dBc, HD3 = 92 dBc
图 5. FFT for 170-MHz Input Signal (Dither On)
图 6. FFT for 170-MHz Input Signal (Dither Off)
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Typical Characteristics (接下页)
typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted).
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D807
D808
SFDR = 77 dBc, SNR = 68.2 dBFS, SINAD = 67.7 dBFS,
THD = 75 dBc, HD2 = 77 dBc, HD3 = 83 dBc
SFDR = 75 dBc, SNR = 68.4 dBFS, SINAD = 67.5 dBFS,
THD = 74 dBc, HD2 = 75 dBc, HD3 = 80 dBc
图 7. FFT for 270-MHz Input Signal (Dither On)
图 8. FFT for 270-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D809
D810
SFDR = 67 dBc, SNR = 66.4 dBFS, SINAD = 66.4 dBFS,
THD = 93 dBc, HD2 = 67 dBc, HD3 = 88 dBc
SFDR = 66 dBc, SNR = 66.5 dBFS, SINAD = 66.5 dBFS,
THD = 87 dBc, HD2 = 66 dBc, HD3 = 93 dBc
图 9. FFT for 450-MHz Input Signal (Dither On)
图 10. FFT for 450-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D811
D812
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 90,
each tone at = –7 dBFS
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 105,
each tone at = –36 dBFS
图 11. FFT for Two-Tone Input Signal
图 12. FFT for Two-Tone Input Signal
(–7 dBFS at 46 MHz and 50 MHz)
(–36 dBFS at 46 MHz and 50 MHz)
12
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ZHCSKL4 –DECEMBER 2019
Typical Characteristics (接下页)
typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted).
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D813
D814
fIN1 = 184.5 MHz, fIN2 = 189.5 MHz, IMD3 = 91,
each tone at = –7 dBFS
fIN1 = 184.5 MHz, fIN2 = 189.5 MHz, IMD3 = 98 dBFS,
each tone at –36 dBFS
图 13. FFT for Two-Tone Input Signal
图 14. FFT for Two-Tone Input Signal
(–7 dBFS at 185 MHz and 190 MHz)
(–36 dBFS at 185 MHz and 190 MHz)
-85
-85
-90
-90
-95
-95
-100
-105
-110
-100
-105
-35
-31
-27
Each Tone Amplitude (dBFS)
-23
-19
-15
-11
-7
-35
-31
-27
Each Tone Amplitude (dBFS)
-23
-19
-15
-11
-7
D815
D816
图 15. Intermodulation Distortion vs Input Amplitude
图 16. Intermodulation Distortion vs Input Amplitude
(46 MHz and 50 MHz)
(185 MHz and 190 MHz)
72
100
Dither_EN
Dither_DIS
Dither_EN
Dither_DIS
95
90
85
80
75
70
65
60
71
70
69
68
67
66
0
50
100
150
Frequency (MHz)
200
250
300
350
400
0
50
100
150
Frequency (MHz)
200
250
300
350
400
D80117
D818
图 17. Signal-to-Noise Ratio vs Input Frequency
图 18. Spurious-Free Dynamic Range vs
Input Frequency
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Typical Characteristics (接下页)
typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted).
73
72
71
70
69
68
250
200
150
100
50
72.5
280
240
200
160
120
80
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
72
71.5
71
70.5
70
69.5
69
40
0
0
-70
-60
-50
-40 -30
Amplitude (dBFS)
-20
-10
0
-70
-60
-50
-40 -30
Amplitude (dBFS)
-20
-10
0
D819
D820
图 19. Performance vs Input Amplitude (30 MHz)
图 20. Performance vs Input Amplitude (170 MHz)
78
76
74
72
70
68
105
SNR
SFDR
76
88
SNR
SFDR
100
95
74
72
70
68
66
86
84
82
80
78
90
85
80
0.85
0.9
0.95
1
Input Common-Mode Voltage (V)
1.05
1.1
0.85
0.9
0.95
1
Input Common-Mode Voltage (V)
1.05
1.1
D821
D822
图 21. Performance vs Input Common-Mode Voltage
图 22. Performance vs Input Common-Mode Voltage (170
MHz)
(30 MHz)
105
72
AVDD=1.7 V
AVDD=1.75 V
AVDD=1.8 V
AVDD=1.85 V
AVDD=1.9 V
AVDD=1.7 V
AVDD=1.75 V
AVDD=1.8 V
AVDD=1.85 V
AVDD=1.9 V
101
97
93
89
85
71.6
71.2
70.8
70.4
70
-40
-20
0
20
40 60
Temperature (°C)
80
100 120 140
-40
-20
0
20
40 60
Temperature (°C)
80
100 120 140
D900
D901
图 23. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature (30 MHz)
图 24. Signal-to-Noise Ratio vs
AVDD Supply and Temperature (30 MHz)
14
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ZHCSKL4 –DECEMBER 2019
Typical Characteristics (接下页)
typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted).
99
97
95
93
91
89
87
71.1
71.05
71
DVDD=1.7 V
DVDD=1.75 V
DVDD=1.8 V
DVDD=1.85 V
DVDD=1.9 V
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
70.95
70.9
70.85
70.8
70.75
70.7
70.65
70.6
-40
-20
0
20
40 60
Temperature (°C)
80
100 120 140
-40
-20
0
20
40 60
Temperature (°C)
80
100 120 140
D902
D904
图 25. Spurious-Free Dynamic Range vs
图 26. Signal-to-Noise Ratio vs
DVDD Supply and Temperature (30 MHz)
DVDD Supply and Temperature (30 MHz)
75
74
73
72
71
70
69
68
67
100
96
92
88
84
80
76
72
68
76
100
SNR
SFDR
SNR
SFDR
73
70
67
64
61
58
90
80
70
60
50
40
0.2 0.4 0.6 0.8
1
Differential Clock Amplitude (Vpp)
1.2 1.4 1.6 1.8
2
2.2
0.2 0.4 0.6 0.8
1
Differential Clock Amplitude (Vpp)
1.2 1.4 1.6 1.8
2
2.2
D827
D828
图 27. Performance vs Clock Amplitude (40 MHz)
图 28. Performance vs Clock Amplitude (150 MHz)
70.6
70.4
70.2
70
90
71.5
71.3
71.1
70.9
70.7
70.5
100
SNR
SFDR
SNR
SFDR
88
98
96
94
92
90
86
84
82
80
78
69.8
69.6
69.4
30
35
40
45
Input Clock Duty Cycle (%)
50
55
60
65
70
30
35
40
45
Input Clock Duty Cycle (%)
50
55
60
65
70
D829
D830
图 29. Performance vs Clock Duty Cycle (30 MHz)
图 30. Performance vs Clock Duty Cycle (150 MHz)
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Typical Characteristics (接下页)
typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted).
0.15
0.15
0.1
0.1
0.05
0
0.05
0
-0.05
-0.1
-0.15
-0.05
-0.1
-0.15
0
512 1024 1536 2048 2560 3072 3584 4096
Output Code (LSB)
0
512 1024 1536 2048 2560 3072 3584 4096
Output Code (LSB)
D001
D1002
图 31. Integral Nonlinearity for a 20-MHz Input
图 32. Differential Nonlinearity for a 20-MHz Input
7 Parameter Measurement Information
7.1 Timing Diagrams
DAn_P
DBn_P
Logic 0
VODL = -350 mV(1)
Logic 1
VODH = +350 mV(1)
DAn_M
DBn_M
VOCM
GND
(1) With an external 100-Ω termination.
图 33. Serial LVDS Output Voltage Levels
16
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ZHCSKL4 –DECEMBER 2019
Timing Diagrams (接下页)
CLKIN
FCLK
DCLK
Dx0P
1-Wire (12x Serialization)
D
9
D D
10 11
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D D
10 11
D
0
Dx0M
DCLK
Dx0P
Dx0M
D
5
D
0
D
1
D
2
D
3
D
4
D
5
D
0
2-Wire (6x Serialization)
Dx1P
Dx1M
D
11
D
6
D
7
D
8
D
9
D
10
D
11
D
6
SAMPLE N-1
SAMPLE N
SAMPLE N+1
图 34. Output Timing Diagram
DCLK
t HO
Dx0P
Dx0M
t SU
图 35. Setup and Hold Time
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8 Detailed Description
8.1 Overview
The ADC3421-Q1 is an automotive-grade, high-linearity, ultra-low power, quad-channel, 12-bit, 25-MSPS analog-
to-digital converter (ADC). The device is designed specifically to support demanding, high input frequency signals
with large dynamic range requirements. An input clock divider gives more flexibility for system clock architecture
design, and the SYSREF input enables complete system synchronization. The ADC3421-Q1 supports a serial
low-voltage differential signaling (LVDS) interface in order to reduce the number of interface lines, thus allowing
for high system integration density. The serial LVDS interface is two-wire, where each ADC data are serialized
and output over two LVDS pairs. An internal phase-locked loop (PLL) multiplies the incoming ADC sampling
clock to derive the bit clock that is used to serialize the 12-bit output data from each channel. In addition to the
serial data streams, the frame and bit clocks are also transmitted as LVDS outputs.
8.2 Functional Block Diagram
DA0P
DA0M
INAP
INAM
12-Bit
ADC
Digital Encoder
and Serializer
DA1P
DA1M
DB0P
DB0M
Digital Encoder
and Serializer
INBP
INBM
12-Bit
ADC
DB1P
DB1M
Bit Clock
CLKP
CLKM
Divide
by 1,2,4
DCLKP
DCLKM
PLL
Frame Clock
FCLKP
FCLKM
SYSREFP
SYSREFM
DC0P
DC0M
INCP
INCM
12-Bit
ADC
Digital Encoder
and Serializer
DC1P
DC1M
DD0P
DD0M
INDP
INDM
12-Bit
ADC
Digital Encoder
and Serializer
DD1P
DD1M
Common
Mode
Configuration
Registers
VCM
18
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ADC3421-Q1
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ZHCSKL4 –DECEMBER 2019
8.3 Feature Description
8.3.1 Analog Inputs
The ADC3421-Q1 analog signal inputs are designed to be driven differentially. Each input pin (INP, INM) must
swing symmetrically between (VCM + 0.5 V) and (VCM – 0.5 V), resulting in a 2-VPP (default) differential input
swing. The input sampling circuit has a 3-dB bandwidth that extends up to 540 MHz (50-Ω source driving 50-Ω
termination between INP and INM).
8.3.2 Clock Input
The device clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with
little or no difference in performance between them. The common-mode voltage of the clock inputs is set to
0.95 V using internal 5-kΩ resistors. The self-bias clock inputs of the ADC3421-Q1 can be driven by the
transformer-coupled, sine-wave clock source or by the ac-coupled, LVPECL and LVDS clock sources, as shown
in 图 36, 图 37, and 图 38. See 图 39 for details regarding the internal clock buffer.
0.1 …F
0.1 …F
ZO
CLKP
CLKP
Differential
Sine-Wave
Clock Input
Typical LVDS
Clock Input
RT
TI Device
100 Ω
0.1 …F
TI Device
0.1 …F
ZO
CLKM
CLKM
NOTE: RT = termination resistor, if necessary.
图 36. Differential Sine-Wave Clock Driving Circuit
图 37. LVDS Clock Driving Circuit
0 …F
ZO
CLKP
150 Ω
Typical LVPECL
Clock Input
100 Ω
TI Device
CLKM
0 …F
ZO
150 Ω
图 38. LVPECL Clock Driving Circuit
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ZHCSKL4 –DECEMBER 2019
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Clock Buffer
LPKG
2 nH
20 Ω
CLKP
CBOND
1 pF
5 kΩ
CEQ
CEQ
RESR
100 Ω
0.95 V
CEQ
LPKG
2 nH
5 kΩ
20 Ω
CLKM
CBOND
1 pF
RESR
100 Ω
NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer.
图 39. Internal Clock Buffer
A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1-μF
capacitor, as shown in 图 40. However, for best performance the clock inputs must be driven differentially,
thereby reducing susceptibility to common-mode noise. For high input frequency sampling, TI recommends using
a clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter.
There is no change in performance with a non-50% duty cycle clock input.
0.1 …F
CMOS
Clock Input
CLKP
TI Device
0.1 …F
CLKM
图 40. Single-Ended Clock Driving Circuit
8.3.2.1 SNR and Clock Jitter
The signal-to-noise ratio of the ADC is limited by three different factors, as shown in 公式 1. Quantization noise
(typically 74 dB for a 12-bit ADC) and thermal noise limit SNR at low input frequencies, and the clock jitter sets
SNR for higher input frequencies.
2
2
2
SNRQuantization_Noise
SNRThermal_Noise
SNRJitter
20
≈
’
÷
÷
◊
≈
’
÷
÷
◊
≈
’
÷
-
-
-
∆
∆
20
20
∆
SNRADC[dBc] = -20 ∂log 10
+ 10
+ 10
∆
«
∆
«
∆
«
÷
◊
(1)
(2)
The SNR limitation resulting from sample clock jitter can be calculated with 公式 2.
SNRJitter [dBc] = -20 ∂log 2p∂ f ∂ t
in Jitter
20
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ZHCSKL4 –DECEMBER 2019
The total clock jitter (TJitter) has two components: the internal aperture jitter (130 fs for the device) which is set by
the noise of the clock input buffer and the external clock. TJitter can be calculated with 公式 3.
2
2
tJitter
=
t
+ t
Aperture _ ADC
Jitter,Ext.Clock _Input
(3)
External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass
filters at the clock input; a faster clock slew rate improves the ADC aperture jitter. The devices have a typical
thermal noise of 70.6 dBFS and internal aperture jitter of 130 fs. The SNR, depending on the amount of external
jitter for different input frequencies, is shown in 图 41.
71.0
70.5
70.0
69.5
69.0
68.5
Ext Clock Jitter
35 fs
50 fs
68.0
67.5
67.0
66.5
66.0
65.5
65.0
100 fs
150 fs
200 fs
10
100
Input Frequency (MHz)
1000
D00316
图 41. SNR vs Frequency for Different Clock Jitter
8.3.3 Digital Output Interface
The devices offer two different output format options, thus making interfacing to a field-programmable gate array
(FPGA) or an application-specific integrated circuit (ASIC) easy. Each option can be easily programmed using
the serial interface, as shown in 表 1. The output interface options are:
•
•
One-wire, 1x frame clock, 12x serialization with the DDR bit clock and
Two-wire, 1x frame clock, 6x serialization with the DDR bit clock.
表 1. Interface Rates
RECOMMENDED SAMPLING
FREQUENCY (MSPS)
BIT CLOCK
FREQUENCY
(MHz)
FRAME CLOCK
FREQUENCY
(MHz)
SERIAL DATA
RATE PER
WIRE (Mbps)
INTERFACE
OPTIONS
SERIALIZATION
MINIMUM
MAXIMUM
15
90
150
60
15
25
20
180
300
120
One-wire
12x
6x
25
Two-wire
(Default after
Reset)
20(1)
25
75
25
150
(1) Use the LOW SPEED ENABLE register bits for low speed operation; see .
8.3.3.1 One-Wire Interface: 12x Serialization
In this interface option, the device outputs the data of each ADC serially on a single LVDS pair (one-wire). The
data are available at the rising and falling edges of the bit clock (DDR bit clock). The ADC outputs a new word at
the rising edge of every frame clock, starting with the LSB. The data rate is 12x sample frequency (12x
serialization).
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8.3.3.2 Two-Wire Interface: 6x Serialization
In two-wire interface ,the output data rate is 6x sample frequency because six data bits are output every clock
cycle on each differential pair. Each ADC sample is sent over the two wires with the six MSBs on Dx1P, Dx1M
and the six LSBs on Dx0P, Dx0M, as shown in 图 42.
CLKIN
FCLK
DCLK
1-Wire (12x Serialization)
Dx0P
Dx0M
D
9
D D
10 11
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D D
10 11
D
0
DCLK
Dx0P
Dx0M
D
5
D
0
D
1
D
2
D
3
D
4
D
5
D
0
2-Wire (6x Serialization)
Dx1P
Dx1M
D
11
D
6
D
7
D
8
D
9
D
10
D
11
D
6
SAMPLE N-1
SAMPLE N
SAMPLE N+1
图 42. Output Timing Diagram
22
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8.4 Device Functional Modes
8.4.1 Input Clock Divider
The devices are equipped with an optional internal divider on the clock input. The clock divider allows operation
with a faster input clock (divide by 2 and divide by 4 options programmable using SPI), thus simplifying the
system clock distribution design.
8.4.2 Chopper Functionality
The devices are equipped with an internal chopper front-end. Enabling the chopper function swaps the ADC
noise spectrum by shifting the 1/f noise from dc to fS / 2. 图 43 shows the noise spectrum with the chopper off
and 图 44 shows the noise spectrum with the chopper on. This function is especially useful in applications
requiring good ac performance at low input frequencies or in dc-coupled applications. The chopper can be
enabled via SPI register writes and is recommended for input frequencies below 30 MHz. The chopper function
creates a spur at fS / 2 that must be filtered out digitally.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D905
D906
SNR = 71.1 dBFS, SINAD = 71.1 dBFS
SFDR = 97 dBc ,THD = 95 dBc
SNR = 71 dBFS, SINAD = 71 dBFS
SFDR = 96 dBc, THD = 97 dBc
图 43. Chopper Off
图 44. Chopper On
8.4.3 Power-Down Control
The power-down functions of the ADC3421-Q1 can be controlled either through the parallel control pin (PDN) or
through an SPI register setting (see register 15h). The PDN pin can also be configured via SPI to a global power-
down or standby functionality, as shown in 表 2.
表 2. Power-Down Modes
FUNCTION
Global power-down
Standby
POWER CONSUMPTION (mW)
WAKE-UP TIME (µs)
5
85
35
34
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8.4.4 Internal Dither Algorithm
The ADC3421-Q1 uses an internal dither algorithm to achieve high SFDR and a clean spectrum. However, the
dither algorithm marginally degrades SNR, creating a trade-off between SNR and SFDR. If desired, the dither
algorithm can be turned off by using the DIS DITH CHx registers bits. 图 45 and 图 46 show the effect of using
dither algorithms.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D801
D802
SFDR = 95 dBc, SNR = 71 dBFS, SINAD = 71 dBFS,
THD = 94 dBc, HD2 = 106 dBc, HD3 = 95 dBc
SFDR = 90 dBc, SNR = 71.2 dBFS, SINAD = 71.1 dBFS,
THD = 89 dBc, HD2 = 90 dBc, HD3 = 106 dBc
图 45. FFT for 10-MHz Input Signal
图 46. FFT for 10-MHz Input Signal
(Chopper On, Dither On)
(Chopper On, Dither Off)
8.4.5 Summary of Performance Mode Registers
表 3 lists the location, value, and functions of performance mode registers in the device.
表 3. Performance Modes
MODE
REGISTER SETTINGS
DESCRIPTION
Special modes
Registers 139 (bit 3), 239 (bit 3), 439 (bit 3), and 539 (bit 3)
Always write 1 for best performance
Registers 1 (bits 7:0), 134 (bits 5 and 3), 234 (bits 5 and 3),
434 (bits 5 and 3), and 534 (bits 5 and 3)
Disable dither
Disable dither to improve SNR
Disable chopper Registers 122 (bit 1), 222 (bit 1), 422 (bit 1), and 522 (bit 1)
Disable chopper (shifts 1/f noise floor at dc)
Registers 11Dh (bit 1), 21Dh (bit 1), 31Dh (bit 7 and bit 1), 41Dh
High IF modes
(bit 1), 51Dh (bit 1), 308h (bits 7-6), 608h (bits 7-6) and 61Dh
(bit 7 and bit 1)
Improves HD3 by a couple of dB for IF > 100 MHz
8.4.6 Device Diagnostic Modes
The device offers various diagnostic modes to check proper device operation at system level. These modes can
be enabled using the SPI. Outputs of these modes are stored in diagnostic read-only registers.
8.4.6.1 Internal Reference and Clock Status Check
Device is equipped with a mode to verify presence of a valid input clock, as well as status of on-chip ADC
reference. When a valid clock input clock is absent at input clock pins (CLKP,CLKM) of ADC, device sets register
bit CLK STATUS to ‘1’. Similarly, if internal reference block is malfunctioning for a channel, device sets register
bits REF STATUS CHx to ‘1’. To read the status of internal reference from these pins:
1. First enable reference status check by setting register bit EN REF STATUS CHECK to ‘1’.
2. Read back register bits REF STATUS CHx on SDATA pin for desired channel (x = A, B, C or D).
24
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8.4.6.2 DC Input check
In this mode, an internally generated DC voltage can be forced by device to its analog inputs. Before forcing
internal DC voltage, analog inputs must float. To enable forcing internal DC voltage, register bit EN DC FORCE
must be set HIGH. Forced voltage is programmable by register bits DC FORCE[2:0], applied to all four channels
together. In terms of output code, typical value of programmed DC voltage is given by equation mentioned below:
Output code= 368 × DC FORCE[2:0] + 745.
Output code is available on LVDS data outputs.
8.4.6.3 Mean and Variance Measurement
Mean and variance values of the ADC output can be analyzed using the on-chip statistical module available for
individual channel for a programmable length of samples. These values are stored in register bits MEAN[11:0]
and VAR[11:0] in 2s complement format. Equation for computing mean and variance values respectively are
given below:
0
5(J)
/A=J = T = Í
0
•
•
J=1
0
: ;
|5 J F T|
8=NE=J?A = Í
0
J=1
Where S(n) is nth sample, N is total number of samples used for computation, programmed by register bits
SAMPLES FOR STATS[1:0].
Follow steps mentioned below to read the mean and variance:
1. Enable Statistical Module by setting bit EN STATS to ‘1’.
2. Select desired channel through bits STATS CH SEL[1:0].
3. Program number of samples, N, using register bits SAMPLES FOR STATS[1:0].
4. Wait for at least 4N samples for module to compute and update the results.
5. Disable Statistical Module by resetting EN STATS bit to ‘0’.
6. Read back mean and variance values from register bits MEAN[11:0] and VAR[11:0]. These values are in 2s
complement format.
8.4.6.4 Temperature Sensor
The device is equipped with a temperature sensor to measure internal junction temperature.
The temperature sensor output is a 9-bit digital data available in 2s complement format directly representing
temperature in degree Celsius units. Temperature data is internally updated every 1024×TCLK× 16 seconds
where TCLK period of sampling clock in seconds. Follow the steps mentioned below to read temperature sensor’s
output:
1. Enable temperature sensor by setting bits EN TEMP SENSE and EN TEMP SENSE CONV to ‘1’.
2. Wait for at least 1024 × TCLK× 16 seconds for temperature sensor to update the data.
3. Disable temperature sensor by resetting the bit EN TEMP SENSE to ‘0’.
4. Load temperature sensor's data to register bits TEMPDATA[8:0] by setting register bit EN TEMP DATA
READOUT to '1'.
5. Readout 9-bit temperature data from register bits TEMPDATA[8:0] located in register addresses 10h and
11h.
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8.5 Programming
The ADC3421-Q1 can be configured using a serial programming interface, as described in this section.
8.5.1 Serial Interface
The device has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial
interface enable), SCLK (serial interface clock), SDATA (serial interface data), and SDOUT (serial interface data
output) pins. Serially shifting bits into the device is enabled when SEN is low. Serial data SDATA are latched at
every SCLK rising edge when SEN is active (low). The serial data are loaded into the register at every 24th
SCLK rising edge when SEN is low. When the word length exceeds a multiple of 24 bits, the excess bits are
ignored. Data can be loaded in multiples of 24-bit words within a single active SEN pulse. The interface can
function with SCLK frequencies from 20 MHz down to very low speeds (of a few hertz) and also with a non-50%
SCLK duty cycle.
26
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Programming (接下页)
8.5.1.1 Register Initialization
After power-up, the internal registers must be initialized to their default values through a hardware reset by
applying a high pulse on the RESET pin (of durations greater than 10 ns), as shown in 图 47. Notice that when
hardware reset is applied for "first time after powering up the device", the SEN pin must be in low logic state.
However, this requirement is applicable only for first hardware reset after power-up. Any subsequent hardware
reset does not require SEN to be in low logic state and works independent to it. If required, the serial interface
registers can be cleared during operation either:
1. Through a hardware reset, or
2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h)
high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low.
In this case, the RESET pin is kept low.
8.5.1.1.1 Serial Register Write
The device internal register can be programmed with these steps:
1. Drive the SEN pin low,
2. Set the R/W bit to 0 (bit A15 of the 16-bit address),
3. Set bit A14 in the address field to 1,
4. Initiate a serial interface cycle by specifying the address of the register (A13 to A0) whose content must be
written, and
5. Write the 8-bit data that are latched in on the SCLK rising edge.
图 47 and 表 4 show the timing requirements for the serial register write operation.
AVDD, DVDD
Register Address [13:0]
Register Data [7:0]
SDATA
R/W
= 0
1
A13 A12 A11
A1
A0
D7
D6
D5
D4
D3
D2
D1
tDH
D0
tSCLK
tDSU
SCLK
SEN
tSLOADH
tSLOADS
RESET
First Hardware Reset after power-up needs SEN to be in low logic state
图 47. Serial Register Write Timing Diagram
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Programming (接下页)
表 4. Serial Interface Timing(1)
MIN
TYP
MAX
UNIT
MHz
ns
fSCLK
tSLOADS
tSLOADH
tDSU
SCLK frequency (equal to 1 / tSCLK
)
> dc
25
20
SEN to SCLK setup time
SCLK to SEN hold time
SDIO setup time
25
ns
25
ns
tDH
SDIO hold time
25
ns
(1) Typical values are at 25°C, full temperature range is from TMIN = –40°C to TMAX = 125°C, and AVDD = DVDD = 1.8 V, unless otherwise
noted.
28
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8.5.1.1.2 Serial Register Readout
The device includes a mode where the contents of the internal registers can be read back using the SDOUT pin.
This readback mode may be useful as a diagnostic check to verify the serial interface communication between
the external controller and the ADC. The procedure to read the contents of the serial registers is as follows:
1. Drive the SEN pin low.
2. Set the R/W bit (A15) to 1. This setting disables any further writes to the registers.
3. Set bit A14 in the address field to 1.
4. Initiate a serial interface cycle specifying the address of the register (A13 to A0) whose content must be read.
5. The device outputs the contents (D7 to D0) of the selected register on the SDOUT pin.
6. The external controller can latch the contents at the SCLK rising edge.
7. To enable register writes, reset the R/W register bit to 0.
When READOUT is disabled, the SDOUT pin is in a high-impedance mode. If serial readout is not used, the
SDOUT pin must float. 图 48 shows a timing diagram of the serial register read operation. Data appear on the
SDOUT pin at the SCLK falling edge with an approximate delay (tSD_DELAY) of 20 ns, as shown in 图 49.
Register Address [13:0]
Register Data: Don‘t Care
D5 D4 D3 D2
SDATA
R/W
= 1
A13 A12 A11
A1
A0
D7
D7
D6
D6
D1
D1
D0
D0
1
Register Read Data [7:0]
SDOUT
SCLK
D5
D4
D3
D2
SEN
图 48. Serial Register Read Timing Diagram
SCLK
tSD_DELAY
SDOUT
图 49. SDOUT Timing Diagram
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8.5.2 Register Initialization
After power-up, the internal registers must be initialized to their default values through a hardware reset by
applying a high pulse on the RESET pin, as shown in 图 50 and 表 5.
Power
Supplies
t1
RESET
t2
t3
Start of
SPI cyles
SEN
SEN has to be
LOW when first
Hardware Reset
is being applied.
图 50. Initialization of Serial Registers after Power-Up
表 5. Power-Up Timing
MIN
TYP
MAX
UNIT
ms
ns
t1
t2
t3
Power-on delay from power-up to active high RESET pulse
Reset pulse duration: active high RESET pulse duration
Register write delay from RESET disable to SEN active
1
10
100
ns
If required, the serial interface registers can be cleared during operation either:
1. Through hardware reset, or
2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h)
high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low.
In this case, the RESET pin is kept low.
30
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8.6 Register Maps
表 6. Register Map Summary
REGISTER
REGISTER DATA
ADDRESS,
A[13:0] (Hex)
7
6
5
4
3
2
1
0
Register 01h
Register 02h
Register 03h
Register 04h
Register 05h
DIS DITH CHA
DIS DITH CHB
DIS DITH CHC
DIS DITH CHD
STATS CH SEL[1:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
ODD EVEN
FLIP WIRE
1W-2W
TEST
PATTERN EN
Register 06h
Register 07h
Register 09h
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RESET
0
OVR ON LSB
ALIGN TEST
PATTERN
DATA
FORMAT
Register 0Ah
Register 0Bh
Register 0Eh
Register 0Fh
CHA TEST PATTERN
CHB TEST PATTERN
CHD TEST PATTERN
CHC TEST PATTERN 0
CUSTOM PATTERN[11:4]
0
CUSTOM PATTERN[3:0]
0
0
0
REF STATUS
CHB OR
TEMPDATA [2] TEMPDATA [1] TEMPDATA [0]
REF STATUS
CHD OR
REF STATUS
CHA OR
REF STATUS
CHC OR
TEMPDATA [3]
Register 10h
Register 11h
Register 13h
CLK STATUS
TEMPDATA[6:4]
0
0
0
TEMPDATA [8:7]
0
0
0
0
0
0
EN REF
STATUS
CHECK
EN DC FORCE
EN STATS
LOW SPEED ENABLE
EN TEMP
DATA
READOUT
EN TEMP
SENS CONV
EN TEMP
SENSE
Register 14h
Register 15h
0
0
0
0
0
CONFIG PDN
PIN
CHA PDN
CHB PDN
CHC PDN
CHD PDN
STANDBY
GLOBAL PDN
0
0
Register 16h
Register 17h
Register 18h
Register 19h
Register 25h
Register 27h
Register 4Bh
MEAN[5:0]
0
0
0
0
0
MEAN[11:6]
VAR[5:0]
0
0
0
VAR[11:6]
LVDS SWING
CLK DIV
0
0
0
0
0
0
0
0
0
0
0
0
0
SAMPLES FOR STATS[1:0]
HIGH IF
0
Register 11Dh
Register 122h
0
0
0
0
0
0
0
0
MODE0
DIS CHOP
CHA
0
0
0
Register 134h
Register 139h
0
0
0
0
DIS DITH CHA
0
0
0
DIS DITH CHA
SP1 CHA
0
0
0
0
0
0
HIGH IF
MODE1
Register 21Dh
Register 222h
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DIS CHOP
CHD
Register 234h
Register 239h
Register 308h
0
0
0
0
DIS DITH CHD
0
0
0
DIS DITH CHD
0
0
0
0
0
0
0
0
0
0
0
SP1 CHD
0
HIGH IF MODE <5:4>
HIGH IF
MODE4
HIGH IF
MODE4
Register 31Dh
Register 41Dh
0
0
0
0
0
0
0
0
0
0
0
0
HIGH IF
MODE2
0
DIS CHOP
CHB
Register 422h
Register 434h
0
0
0
0
0
0
0
0
0
0
0
0
DIS DITH CHB
DIS DITH CHB
0
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Register Maps (接下页)
表 6. Register Map Summary (接下页)
REGISTER
REGISTER DATA
ADDRESS,
A[13:0] (Hex)
7
6
0
0
5
0
0
4
0
0
3
SP1 CHB
0
2
0
0
1
0
0
0
Register 439h
Register 51Dh
0
0
0
HIGH IF
MODE3
DIS CHOP
CHC
Register 522h
0
0
0
0
0
0
0
Register 534h
Register 539h
Register 608h
0
0
0
0
DIS DITH CHC
0
0
0
DIS DITH CHC
0
0
0
0
0
0
0
0
0
0
0
SP1 CHC
0
HIGH IF MODE <7:6>
HIGH IF
MODE5
HIGH IF
MODE5
Register 61Dh
0
0
0
0
0
0
0
Register 70Ah
Register 71Ah
0
0
0
0
0
0
0
0
0
0
PDN SYSREF
0
DC FORCE[2:0]
32
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8.6.1 Serial Register Description
8.6.1.1 Register 01h (address = 01h)
图 51. Register 01h
7
6
5
4
3
2
1
0
DIS DITH CHA
R/W-0h
DIS DITH CHB
R/W-0h
DIS DITH CHC
R/W-0h
DIS DITH CHD
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 7. Register 01h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
DIS DITH CHA
R/W
0h
These bits enable or disable the on-chip dither. Control this bit
along with bits 5 and 3 of register 134h.
00 = Default
11 = Dither is disabled for channel A. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
5-4
3-2
1-0
DIS DITH CHB
DIS DITH CHC
DIS DITH CHD
R/W
R/W
R/W
0h
0h
0h
These bits enable or disable the on-chip dither. Control this bit
along with bits 5 and 3 of register 434h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
These bits enable or disable the on-chip dither. Control this bit
along with bits 5 and 3 of register 534h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
These bits enable or disable the on-chip dither. Control this bit
along with bits 5 and 3 of register 234h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
8.6.1.2 Register 02h (address = 02h)
图 52. Register 02h
7
6
5
0
4
0
3
0
2
0
1
0
0
0
STATS CH SEL[1:0]
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 8. Register 02h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
STATS CH SEL[1:0]
R/W
0h
These bits select desired channel for statistical data computation
00 = Channel A,
01 = Channel B,
10 = Channel C,
11 = Channel D
5-0
0
W
0h
Must write 0.
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8.6.1.3 Register 03h (address = 03h)
图 53. Register 03h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
ODD EVEN
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 9. Register 03h Field Descriptions
Bit
7-6
0
Field
Type
W
Reset
0h
Description
0
Must write 0.
ODD EVEN
R/W
0h
This bit selects the bit sequence on the output wires (in 2-wire
mode only).
0 = Bits 0, 1, 2, and so forth appear on wire-0; bits 7, 8, 9, and
so forth appear on wire-1.
1 = Bits 0, 2, 4, and so forth appear on wire-0; bits 1, 3, 5, and
so forth appear on wire-1.
34
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ZHCSKL4 –DECEMBER 2019
8.6.1.4 Register 04h (address = 04h)
图 54. Register 04h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
FLIP WIRE
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 10. Register 04h Field Descriptions
Bit
7-1
0
Field
Type
W
Reset
0h
Description
0
Must write 0.
FLIP WIRE
R/W
0h
This bit flips the data on the output wires. Valid only in two wire
configuration.
0 = Default
1 = Data on output wires is flipped. Pin D0x becomes D1x, and
vice versa.
8.6.1.5 Register 05h (address = 05h)
图 55. Register 05h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1W-2W
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 11. Register 05h Field Descriptions
Bit
7-1
0
Field
0
Type
W
Reset
0h
Description
Must write 0.
1W-2W
R/W
0h
This bit transmits output data on either one or two wires.
0 = Output data are transmitted on two wires (Dx0P, Dx0M and
Dx1P, Dx1M)
1 = Output data are transmitted on one wire (Dx0P, Dx0M).
8.6.1.6 Register 06h (address = 06h)
图 56. Register 06h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
TEST PATTERN EN
R/W-0h
RESET
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 12. Register 06h Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
TEST PATTERN EN
R/W
0h
This bit enables test pattern selection for the digital outputs.
0 = Normal output
1 = Test pattern output enabled
0
RESET
R/W
0h
This bit applies a software reset.
This bit resets all internal registers to the default values and self-
clears to 0.
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8.6.1.7 Register 07h (address = 07h)
图 57. Register 07h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
OVR ON LSB
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 13. Register 07h Field Descriptions
Bit
7-1
0
Field
Type
W
Reset
0h
Description
0
Must write 0.
OVR ON LSB
R/W
0h
This bit provides OVR information on the LSB bits.
0 = Output data bit 0 functions as the LSB of the 12-bit data
1 = Output data bit 0 carries the overrange (OVR) information
8.6.1.8 Register 09h (address = 09h)
图 58. Register 09h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
ALIGN TEST PATTERN
R/W-0h
DATA FORMAT
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 14. Register 09h Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
ALIGN TEST PATTERN
R/W
0h
This bit aligns the test patterns across the outputs of both
channels.
0 = Test patterns of both channels are free running
1 = Test patterns of both channels are aligned
0
DATA FORMAT
R/W
0h
This bit selects th digital output data format.
0 = Twos complement
1 = Offset binary
36
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ADC3421-Q1
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ZHCSKL4 –DECEMBER 2019
8.6.1.9 Register 0Ah (address = 0Ah)
图 59. Register 0Ah
7
6
5
4
3
2
1
0
CHA TEST PATTERN
R/W-0h
CHB TEST PATTERN
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 15. Register 0Ah Field Descriptions
Bit
Field
Type
Reset
Description
7-4
CHA TEST PATTERN
R/W
0h
These bits control the test pattern for channel A after the TEST
PATTERN EN bit is set.
0000 = Normal operation
0001 = All 0's
0010 = All 1's
0011 = Toggle pattern: data alternate between 101010101010
and 010101010101
0100 = Digital ramp: data increment by 1 LSB every clock cycle
from code 0 to 4095
0101 = Custom pattern: output data are the same as
programmed by the CUSTOM PATTERN register bits
0110 = Deskew pattern: data are AAAh
1000 = PRBS pattern: data are a sequence of pseudo random
numbers
1001 = 8-point sine-wave: data are a repetitive sequence of the
following eight numbers that form a sine-wave: 0, 599, 2048,
3496, 4095, 3496, 2048, and 599
Others = Do not use
3-0
CHB TEST PATTERN
R/W
0h
These bits control the test pattern for channel B after the TEST
PATTERN EN bit is set.
0000 = Normal operation
0001 = All 0's
0010 = All 1's
0011 = Toggle pattern: data alternate between 101010101010
and 010101010101
0100 = Digital ramp: data increment by 1 LSB every clock cycle
from code 0 to 4095
0101 = Custom pattern: output data are the same as
programmed by the CUSTOM PATTERN register bits
0110 = Deskew pattern: data are AAAh
1000 = PRBS pattern: data are a sequence of pseudo random
numbers
1001 = 8-point sine-wave: data are a repetitive sequence of the
following eight numbers that form a sine-wave: 0, 599, 2048,
3496, 4095, 3496, 2048, and 599
Others = Do not use
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ZHCSKL4 –DECEMBER 2019
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8.6.1.10 Register 0Bh (address = 0Bh)
图 60. Register 0Bh
7
6
5
4
3
2
1
0
CHC TEST PATTERN
R/W-0h
CHD TEST PATTERN
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 16. Register 0Bh Field Descriptions
Bit
Field
Type
Reset
Description
7-4
CHC TEST PATTERN
R/W
0h
These bits control the test pattern for channel C after the TEST
PATTERN EN bit is set.
0000 = Normal operation
0001 = All 0's
0010 = All 1's
0011 = Toggle pattern: data alternate between 101010101010
and 010101010101.
0100 = Digital ramp: data increment by 1 LSB every clock cycle
from code 0 to 4095.
0110 = Custom pattern: output data are the same as
programmed by the CUSTOM PATTERN register bits.
1000 = Deskew pattern: data are AAAh.
1010 = PRBS pattern: data are a sequence of pseudo random
numbers.
1011 = 8-point sine wave: data are a repetitive sequence of the
following eight numbers that form a sine-wave: 0, 599, 2048,
3496, 4095, 3496, 2048, 599.
Others = Do not use
3-0
CHD TEST PATTERN
R/W
0h
These bits control the test pattern for channel D after the TEST
PATTERN EN bit is set.
0000 = Normal operation
0001 = All 0's
0010 = All 1's
0011 = Toggle pattern: data alternate between 101010101010
and 010101010101.
0100 = Digital ramp: data increment by 1 LSB every clock cycle
from code 0 to 4095.
0110 = Custom pattern: output data are the same as
programmed by the CUSTOM PATTERN register bits.
1000 = Deskew pattern: data are AAAh.
1010 = PRBS pattern: data are a sequence of pseudo random
numbers.
1011 = 8-point sine wave: data are a repetitive sequence of the
following eight numbers that form a sine-wave: 0, 599, 2048,
3496, 4095, 3496, 2048, 599.
Others = Do not use
8.6.1.11 Register 0Eh (address = 0Eh)
图 61. Register 0Eh
7
6
5
4
3
2
1
0
CUSTOM PATTERN[11:4]
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 17. Register 0Eh Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CUSTOM PATTERN[11:4]
R/W
0h
These bits set the 12-bit custom pattern (bits 11-4) for all
channels.
38
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ADC3421-Q1
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ZHCSKL4 –DECEMBER 2019
8.6.1.12 Register 0Fh (address = 0Fh)
图 62. Register 0Fh
7
6
5
4
3
0
2
0
1
0
0
CUSTOM PATTERN[3:0]
R/W-0h
0
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 18. Register 0Fh Field Descriptions
Bit
Field
Type
Reset
Description
7-4
CUSTOM PATTERN[3:0]
R/W
0h
These bits set the 12-bit custom pattern (bits 3-0) for all
channels.
3-0
0
W
0h
Must write 0.
8.6.1.13 Register 10h (address = 10h)
图 63. Register 10h
7
6
5
4
3
2
1
0
REF STATUS
CHB OR
REF STATUS
CHD OR
REF STATUS
CHA OR
CLK STATUS
TEMPDATA [6:4]
REF STATUS
CHC OR
TEMPDATA [2] TEMPDATA [1] TEMPDATA [0]
TEMPDATA [3]
Read Only Read Only Read Only
Read Only
Read Only
Read Only
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 19. Register 10h Field Descriptions
Bit
Field
Type
Reset
Description
7-5, 0
REF STATUS CHB, REF STATUS
CHD, REF STATUS CHA, REF
STATUS CHC
Read
Only
0h
When internal reference diagnostic is enabled by setting EN
REF STATUS CHECK bit to ‘1’, these bits carry status of
internal reference for corresponding channel.
See Internal Reference and Clock Status Check for details.
Note that these bits are multiplexed with temperature sensor’s
data and carry TEMPDATA[3:0] if temperature sensor’s is
enabled.
4
CLK STATUS
Read
Only
0h
0h
This bit indicates presence of input clock. By default, device sets
this bit 0. If input clock is absent, this bit becomes '1'
7-5, 3-1, 0 TEMPDATA [6:0]
Read
Only
When temperature sensor’s data is being read, these bits carry
seven MSBs of temperature sensor’s 9-bit data. Remaining two
LSBs are available on address 11h bit 5:4.
See Temperature Sensor for details of operation.
8.6.1.14 Register 11h (address = 11h)
图 64. Register 11h
7
0
6
0
5
4
3
0
2
0
1
0
0
0
TEMPDATA [8:7]
Read Only
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 20. Register 11h Field Descriptions
Bit
7-6
5-4
Field
Type
Reset
0h
Description
0
W
Must write 0.
TEMPDATA [8:7]
Read
Only
0h
These bits represent digital equivalent of temperature in 2s
complement format.
3-0
0
W
0h
Must write 0.
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ZHCSKL4 –DECEMBER 2019
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8.6.1.15 Register 13h (address = 13h)
图 65. Register 13h
7
0
6
5
4
3
0
2
0
1
0
EN REF
STATUS
CHECK
LOW SPEED ENABLE
EN DC FORCE
R/W-0h
EN STATS
R/W-0h
W-0h
R/W-0h
W-0h
W-0h
R/W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 21. Register 13h Field Descriptions
Bit
7
Field
Type
W
Reset
0h
Description
0
Must write 0.
6
EN REF STATUS CHECK
R/W
0h
This Bit Enables reference diagnostic check. Must be set to '1'
before reading reference status from REF STATUS CHECK CHx
bits.
5
4
EN DC FORCE
EN STATS
R/W
R/W
0h
0h
This Bit Enables internal DC voltage force diagnostic check
together for all channels. Must be set to '1' before forcing
internal DC voltage through DC FORCE[2:0] bits.
This bit enables inter Statistics Module for mean and variance
computation. After this bit is set to '1', statistical module for
desired channel can be selected by using bits STATS CH
SEL[1:0]
3-2
1-0
0
W
0h
0h
Must write 0.
LOW SPEED ENABLE
R/W
Enables low speed operation in 1-wire and 2-wire mode.
Depending upon sampling frequency, write this bit as per 表 22
表 22. LOW SPEED ENABLE Register Settings across fS
fS, MSPS
REGISTER BIT LOW SPEED ENABLE
1- Wire Mode 2-Wire Mode
10 11
10 Not supported
MIN
20
MAX
25
15
20
8.6.1.16 Register 14h (address = 14h)
图 66. Register 14h
7
0
6
5
4
0
3
0
2
1
0
0
0
EN TEMP
SENS CONV
EN TEMP
SENSE
EN TEMP
DATA
READOUT
W-0h
R/W-0h
R/W-0h
W-0h
W-0h
R/W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 23. Register 14h Field Descriptions
Bit
7
Field
Type
W
Reset
0h
Description
0
Must write 0.
6
EN TEMP SENS CONV
R/W
0h
This bit enables the temperature-to-digital conversion process of
temperature sensor. This bit can be set to '1' after temperature
sensor is enabled by setting EN TEMP SENSE bit to '1'.
5
4-3
2
EN TEMP SENSE
R/W
W
0h
0h
0h
This bit enables temperature sensor present inside device
Must write 0.
0
EN TEMP DATA READOUT
R/W
This bit places the 9-bit digital equivalent of temperature on
register bits TEMPDATA[8:0].
1-0
0
W
0h
Must write 0.
40
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ZHCSKL4 –DECEMBER 2019
8.6.1.17 Register 15h (address = 15h)
图 67. Register 15h
7
6
5
4
3
2
1
0
CONFIG PDN
PIN
CHA PDN
W-0h
CHB PDN
R/W-0h
CHC PDN
R/W-0h
CHD PDN
W-0h
STANDBY
R/W-0h
GLOBAL PDN
R/W-0h
0
W-0h
R/W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 24. Register 15h Field Descriptions
Bit
Field
Type
Reset
Description
7
CHA PDN
W
0h
0 = Normal operation
1 = Power-down channel A
6
5
4
3
CHB PDN
CHC PDN
CHD PDN
STANDBY
R/W
R/W
W
0h
0h
0h
0h
0 = Normal operation
1 = Power-down channel B
0 = Normal operation
1 = Power-down channel C
0 = Normal operation
1 = Power-down channel D
R/W
The ADCs of both channels enter standby.
0 = Normal operation
1 = Standby
2
GLOBAL PDN
R/W
0h
0 = Normal operation
1 = Global power-down
1
0
0
W
0h
0h
Must write 0.
CONFIG PDN PIN
R/W
This bit configures the PDN pin as either a global power-down or
standby pin.
0 = Logic high voltage on the PDN pin sends the device into
global power-down
1 = Logic high voltage on the PDN pin sends the device into
standby
8.6.1.18 Register 16h (address = 16h)
图 68. Register 16h
7
6
5
4
3
2
1
0
0
0
MEAN[5:0]
Read Only
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 25. Register 16h Field Descriptions
Bit
Field
Type
Reset
Description
7-2
MEAN[5:0]
Read
Only
0h
These bits represent mean value in 2s complement format
computed over programmed number of samples by statistical
module.
1-0
0
W
0h
Must write 0.
8.6.1.19 Register 17h (address = 17h)
图 69. Register 17h
7
0
6
0
5
4
3
2
1
0
MEAN[11:6]
Read Only
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
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表 26. Register 17h Field Descriptions
Bit
7-6
5-0
Field
Type
Reset
0h
Description
0
W
Must write 0.
MEAN[11:6]
Read
Only
0h
These bits represent mean value in 2s complement format
computed over programmed number of samples by statistical
module.
8.6.1.20 Register 18h (address = 18h)
图 70. Register 18h
7
6
5
4
3
2
1
0
0
0
VAR[5:0]
Read Only
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 27. Register 18h Field Descriptions
Bit
Field
Type
Reset
Description
7-2
VAR[5:0]
Read
Only
0h
These bits represent variance value in 2s complement format
computed over programmed number of samples by statistical
module
1-0
0
W
0h
Must write 0.
8.6.1.21 Register 19h (address = 19h)
图 71. Register 19h
7
0
6
0
5
4
3
2
1
0
VAR[11:6]
Read Only
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 28. Register 19h Field Descriptions
Bit
7-6
5-0
Field
Type
Reset
0h
Description
0
W
Must write 0.
VAR[11:6]
Read
Only
0h
These bits represent variance value in 2s complement format
computed over programmed number of samples by statistical
module
8.6.1.22 Register 25h (address = 25h)
图 72. Register 25h
7
6
5
4
3
2
1
0
LVDS SWING
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 29. Register 25h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LVDS SWING
R/W
0h
These bits control the swing of the LVDS outputs (including the
data output, bit clock, and frame clock).
42
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ADC3421-Q1
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ZHCSKL4 –DECEMBER 2019
8.6.1.23 Register 27h (address = 27h)
图 73. Register 27h
7
6
5
0
4
0
3
0
2
0
1
0
0
CLK DIV
R/W-0h
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 30. Register 27h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
CLK DIV
R/W
0h
These bits select the internal clock divider for the input sampling
clock.
00 = Divide-by-1
01 = Divide-by-1
10 = Divide-by-2
11 = Divide-by-4
5-0
0
W
0h
Must write 0.
8.6.1.24 Register 4Bh (address = 4Bh)
图 74. Register 4Bh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
SAMPLES FOR STATS[1:0]
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 31. Register 4Bh Field Descriptions
Bit
7-2
1-0
Field
Type
W
Reset
0h
Description
0
Must write 0.
SAMPLES FOR STATS[1:0]
R/W
0h
These bits program number of samples to be used by statistical
module for computation of mean and variance.
00=256,
01=1024,
10=4096,
11=16384
8.6.1.25 Register 11Dh (address = 11Dh)
图 75. Register 11Dh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF MODE0
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 32. Register 11Dh Field Descriptions
Bit
7-2
1
Field
Type
Reset
Description
0
W
0h
Must write 0.
HIGH IF MODE0
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
0
0
W
0h
Must write 0.
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8.6.1.26 Register 122h (address = 122h)
图 76. Register 122h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
DIS CHOP CHA
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 33. Register 122h Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS CHOP CHA
R/W
0h
This bit disables the chopper.
Set this bit to shift the 1/f noise floor at dc.
0 = 1/f noise floor is centered at fS / 2 (default)
1 = Chopper mechanism is disabled; 1/f noise floor is centered
at dc
0
0
W
0h
Must write 0.
44
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ZHCSKL4 –DECEMBER 2019
8.6.1.27 Register 134h (address = 134h)
图 77. Register 134h
7
0
6
0
5
4
0
3
2
0
1
0
0
DIS DITH CHA
R/W-0h
DIS DITH CHA
R/W-0h
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 34. Register 134h Field Descriptions
Bit
7-6
5
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS DITH CHA
R/W
0h
Set this bit along with bits 7 and 6 of register 01h.
00 = Default
11 = Dither is disabled for channel A. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
4
3
0
W
0h
0h
Must write 0.
DIS DITH CHA
R/W
Set this bit along with bits 7 and 6 of register 01h.
00 = Default
11 = Dither is disabled for channel A. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
2-0
0
W
0h
Must write 0.
8.6.1.28 Register 139h (address = 139h)
图 78. Register 139h
7
0
6
0
5
0
4
0
3
2
0
1
0
0
0
SP1 CHA
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 35. Register 139h Field Descriptions
Bit
7-4
3
Field
0
Type
W
Reset
0h
Description
Must write 0.
SP1 CHA
R/W
0h
This bit sets the special mode for best performance on channel
A.
Always write 1 after reset.
2-0
0
W
0h
Must write 0.
8.6.1.29 Register 21Dh (address = 21Dh)
图 79. Register 21Dh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF MODE1
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 36. Register 21Dh Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
HIGH IF MODE1
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
0
0
W
0h
Must write 0.
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8.6.1.30 Register 222h (address = 222h)
图 80. Register 222h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
DIS CHOP CHD
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 37. Register 222h Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS CHOP CHD
R/W
0h
This bit disables the chopper.
Set this bit to shift the 1/f noise floor at dc.
0 = 1/f noise floor is centered at fS / 2 (default)
1 = Chopper mechanism is disabled; 1/f noise floor is centered
at dc
0
0
W
0h
Must write 0.
8.6.1.31 Register 234h (address = 234h)
图 81. Register 234h
7
0
6
0
5
4
0
3
2
0
1
0
0
0
DIS DITH CHD
R/W-0h
DIS DITH CHD
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 38. Register 234h Field Descriptions
Bit
7-6
5
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS DITH CHD
R/W
0h
Set this bit with bits 1 and 0 of register 01h.
00 = Default
11 = Dither is disabled for channel D. In this mode, SNR
typically improves by 0.2 dB at 70 MHz.
4
3
0
W
0h
0h
Must write 0.
DIS DITH CHD
R/W
Set this bit with bits 1 and 0 of register 01h.
00 = Default
11 = Dither is disabled for channel D. In this mode, SNR
typically improves by 0.2 dB at 70 MHz.
2-0
0
W
0h
Must write 0.
46
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ZHCSKL4 –DECEMBER 2019
8.6.1.32 Register 239h (address = 239h)
图 82. Register 239h
7
0
6
0
5
0
4
0
3
2
0
1
0
0
SP1 CHD
R/W-0h
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 39. Register 239h Field Descriptions
Bit
7-4
3
Field
0
Type
W
Reset
0h
Description
Must write 0.
SP1 CHD
R/W
0h
This bit sets the special mode for best performance on channel
D.
Always write 1 after reset.
2-0
0
W
0h
Must write 0.
8.6.1.33 Register 308h (address = 308h)
图 83. Register 308h
7
6
5
0
4
0
3
0
2
0
1
0
0
0
HIGH IF MODE<5:4>
W-0h W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 40. Register 308h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
HIGH IF MODE<5:4>
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
5-0
0
W
0h
Must write 0.
8.6.1.34 Register 31Dh (address = 31Dh)
图 84. Register 31Dh
7
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF
MODE4
HIGH IF
MODE4
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 41. Register 31Dh Field Descriptions
Bit
Field
Type
Reset
Description
7
HIGH IF MODE4
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
6-2
1
0
W
0h
0h
Must write 0.
HIGH IF MODE4
R/W
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
0
0
W
0h
Must write 0.
8.6.1.35 Register 41Dh (address = 41Dh)
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图 85. Register 41Dh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF MODE2
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 42. Register 41Dh Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
HIGH IF MODE2
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
0
0
W
0h
Must write 0.
48
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ZHCSKL4 –DECEMBER 2019
8.6.1.36 Register 422h (address = 422h)
图 86. Register 422h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
DIS CHOP CHB
R/W-0h
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 43. Register 422h Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS CHOP CHB
R/W
0h
This bit disables the chopper.
Set this bit to shift the 1/f noise floor at dc.
0 = 1/f noise floor is centered at fS / 2 (default)
1 = Chopper mechanism is disabled; 1/f noise floor is centered
at dc
0
0
W
0h
Must write 0.
8.6.1.37 Register 434h (address = 434h)
图 87. Register 434h
7
0
6
0
5
4
0
3
2
0
1
0
0
0
DIS DITH CHB
R/W-0h
DIS DITH CHB
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 44. Register 434h Field Descriptions
Bit
7-6
5
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS DITH CHB
R/W
0h
Set this bit with bits 5 and 4 of register 01h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
4
3
0
W
0h
0h
Must write 0.
DIS DITH CHB
R/W
Set this bit with bits 5 and 4 of register 01h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.2 dB at 70 MHz.
2-0
0
W
0h
Must write 0.
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8.6.1.38 Register 439h (address = 439h)
图 88. Register 439h
7
0
6
0
5
0
4
0
3
2
0
1
0
0
0
SP1 CHB
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 45. Register 439h Field Descriptions
Bit
7-4
3
Field
0
Type
W
Reset
0h
Description
Must write 0.
SP1 CHB
R/W
0h
This bit sets the special mode for best performance on channel
B.
Always write 1 after reset.
2-0
0
W
0h
Must write 0.
8.6.1.39 Register 51Dh (address = 51Dh)
图 89. Register 51Dh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF MODE3
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 46. Register 51Dh Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
HIGH IF MODE3
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
0
0
W
0h
Must write 0.
8.6.1.40 Register 522h (address = 522h)
图 90. Register 522h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
DIS CHOP CHC
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 47. Register 522h Field Descriptions
Bit
7-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS CHOP CHC
R/W
0h
This bit disables the chopper.
Set this bit to shift the 1/f noise floor at dc.
0 = 1/f noise floor is centered at fS / 2 (default)
1 = Chopper mechanism is disabled; 1/f noise floor is centered
at dc
0
0
W
0h
Must write 0.
50
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ZHCSKL4 –DECEMBER 2019
8.6.1.41 Register 534h (address = 534h)
图 91. Register 534h
7
0
6
0
5
4
0
3
2
0
1
0
0
DIS DITH CHC
R/W-0h
DIS DITH CHC
R/W-0h
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 48. Register 534h Field Descriptions
Bit
7-6
5
Field
Type
W
Reset
0h
Description
0
Must write 0.
DIS DITH CHC
R/W
0h
Set this bit with bits 3 and 2 of register 01h.
00 = Default
11 = Dither is disabled for channel C. In this mode, SNR
typically improves by 0.2 dB at 70 MHz.
4
3
0
W
0h
0h
Must write 0.
DIS DITH CHC
R/W
Set this bit with bits 3 and 2 of register 01h.
00 = Default
11 = Dither is disabled for channel C. In this mode, SNR
typically improves by 0.2 dB at 70 MHz.
2-0
0
W
0h
Must write 0.
8.6.1.42 Register 539h (address = 539h)
图 92. Register 539h
7
0
6
0
5
0
4
0
3
2
0
1
0
0
0
SP1 CHC
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 49. Register 539h Field Descriptions
Bit
7-4
3
Field
0
Type
W
Reset
0h
Description
Must write 0.
SP1 CHC
R/W
0h
This bit sets the special mode for best performance on channel
C.
Always write 1 after reset.
2-0
0
W
0h
Must write 0.
8.6.1.43 Register 608h (address = 608h)
图 93. Register 608h
7
6
5
0
4
0
3
0
2
0
1
0
0
0
HIGH IF MODE<7:6>
W-0h W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 50. Register 608h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
HIGH IF MODE<7:6>
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
5-0
0
W
0h
Must write 0.
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8.6.1.44 Register 61Dh (address = 61Dh)
图 94. Register 61Dh
7
6
0
5
0
4
0
3
0
2
0
1
0
HIGH IF
MODE5
HIGH IF
MODE5
PDN SYSREF
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 51. Register 61Dh Field Descriptions
Bit
Field
Type
Reset
Description
7
HIGH IF MODE5
R/W
0h
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
6-2
1
0
W
0h
0h
Must write 0.
HIGH IF MODE5
R/W
Set all register bits belonging to HIGH IF MODE as logic HIGH
to improve HD3 by a couple of dB for IF > 100 MHz.
0
0
W
0h
Must write 0.
8.6.1.45 Register 70Ah (address = 70Ah)
图 95. Register 70Ah
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
PDN SYSREF
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 52. Register 70Ah Field Descriptions
Bit
7-1
0
Field
Type
W
Reset
0h
Description
0
Must write 0.
PDN SYSREF
R/W
0h
If the SYSREF pins are not used in the system, the SYSREF
buffer must be powered down by setting this bit.
0 = Normal operation
1 = Powers down the SYSREF buffer
8.6.1.46 Register 71Ah (address = 71Ah)
图 96. Register 71Ah
7
0
6
0
5
0
4
0
3
2
1
0
0
DC FORCE[2:0]
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 53. Register 71Ah Field Descriptions
Bit
7-4
3-1
Field
Type
W
Reset
0h
Description
0
Must write 0.
DC FORCE[2:0]
R/W
0h
These Bits force internal DC voltage to ADC's analog inputs
together for all channels. Minimum DC voltage corresponds to
output code 745 and max DC voltage to output code 3332
typically following the equation:
Output Code = 368 × DC FORCE[2:0] + 745
0
0
W
0h
Must write 0.
52
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ZHCSKL4 –DECEMBER 2019
9 Applications and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Typical applications involving transformer-coupled circuits are discussed in this section. Transformers (such as
ADT1-1WT or WBC1-1) can be used up to 250 MHz to achieve good phase and amplitude balances at ADC
inputs. When designing the dc driving circuits, the ADC input impedance must be considered. 图 97 and 图 98
show the impedance (Zin = Rin || Cin) across the ADC input pins.
10
6
5
4
3
2
1
1
0.1
0.01
0
100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
0
100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
D024
D00215
图 97. Differential Input Resistance, RIN
图 98. Differential Input Capacitance, CIN
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9.2 Typical Applications
9.2.1 Driving Circuit Design: Low Input Frequencies
0.1 µF
0.1 µF
INP
50 ꢀ
0.1 µF
50 Ω
22 pF
50 Ω
25 Ω
25 Ω
TI Device
50 ꢀ
1:1
1:1
INM
0.1 µF
VCM
图 99. Driving Circuit for Low Input Frequencies
9.2.1.1 Design Requirements
For optimum performance, the analog inputs must be driven differentially. An optional 5-Ω to 15-Ω resistor in
series with each input pin can be kept to damp out ringing caused by package parasitic. The drive circuit may
have to be designed to minimize the impact of kick-back noise generated by sampling switches opening and
closing inside the ADC, as well as ensuring low insertion loss over the desired frequency range and matched
impedance to the source.
9.2.1.2 Detailed Design Procedure
A typical application involving using two back-to-back coupled transformers is illustrated in 图 99. The circuit is
optimized for low input frequencies. An external R-C-R filter using 50-Ω resistors and a 22-pF capacitor is used
with the series inductor (39 nH), this combination helps absorb the sampling glitches.
9.2.1.3 Application Curve
图 100 shows the performance obtained by using the circuit shown in 图 99.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D801
SFDR = 95 dBc, SNR = 71 dBFS, SINAD = 71 dBFS,
THD = 94 dBc, HD2 = 106 dBc, HD3 = 95 dBc
图 100. Performance FFT at 10 MHz (Low Input Frequency)
54
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Typical Applications (接下页)
9.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
0.1 µF
10 ꢀ
0.1 µF
INP
15 Ω
25 Ω
0.1 pF
TI Device
10 pF
56 nH
25 Ω
15 Ω
1:1
1:1
INM
10 ꢀ
0.1 µF
VCM
图 101. Driving Circuit for Mid-Range Input Frequencies (100 MHz < fIN < 230 MHz)
9.2.2.1 Design Requirements
See the Design Requirements section for further details.
9.2.2.2 Detailed Design Procedure
When input frequencies are between 100 MHz to 230 MHz, an R-LC-R circuit can be used to optimize
performance, as shown in 图 101.
9.2.2.3 Application Curve
图 102 shows the performance obtained by using the circuit shown in 图 101.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D805
SFDR = 87 dBc, SNR = 69.8 dBFS, SINAD = 69.7 dBFS,
THD = 85 dBc, HD2 = 90 dBc, HD3 = 87 dBc
图 102. Performance FFT at 170 MHz (Mid Input Frequency)
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Typical Applications (接下页)
9.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
0.1 µF
0.1 µF
10 Ω
INP
0.1 µF
25 ꢀ
25 ꢀ
TI Device
10 Ω
INM
1:1
1:1
0.1 µF
VCM
图 103. Driving Circuit for High Input Frequencies (fIN > 230 MHz)
9.2.3.1 Design Requirements
See the Design Requirements section for further details.
9.2.3.2 Detailed Design Procedure
For high input frequencies (> 230 MHz), using the R-C-R or R-LC-R circuit does not show significant
improvement in performance. However, a series resistance of 10 Ω can be used as shown in 图 103.
9.2.3.3 Application Curve
图 104 shows the performance obtained by using the circuit shown in 图 103.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
2.5
5 7.5
Frequency (MHz)
10
12.5
D809
SFDR = 67 dBc, SNR = 66.4 dBFS, SINAD = 66.4 dBFS,
THD = 93 dBc, HD2 = 67 dBc, HD3 = 88 dBc
图 104. Performance FFT at 450 MHz (High Input Frequency)
10 Power Supply Recommendations
The device requires a 1.8-V nominal supply for AVDD and DVDD. There are no specific sequence power-supply
requirements during device power-up. AVDD and DVDD can power up in any order.
56
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ZHCSKL4 –DECEMBER 2019
11 Layout
11.1 Layout Guidelines
The ADC3421-Q1 EVM layout can be used as a reference layout to obtain the best performance. A layout
diagram of the EVM top layer is provided in 图 105. Some important points to remember during laying out the
board are:
1. Analog inputs are located on opposite sides of the device pin out to ensure minimum crosstalk on the
package level. To minimize crosstalk onboard, the analog inputs must exit the pin out in opposite directions,
as shown in the reference layout of 图 105 as much as possible.
2. In the device pin out, the sampling clock is located on a side perpendicular to the analog inputs in order to
minimize coupling between them. This configuration is also maintained on the reference layout of 图 105 as
much as possible.
3. Keep digital outputs away from the analog inputs. When these digital outputs exit the pin out, the digital
output traces must not be kept parallel to the analog input traces because this configuration can result in
coupling from digital outputs to analog inputs and degrade performance. All digital output traces to the
receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)]
must be matched in length to avoid skew among outputs.
4. At each power-supply pin (AVDD and DVDD), keep a 0.1-µF decoupling capacitor close to the device. A
separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF
capacitors can be kept close to the supply source.
11.2 Layout Example
Sampling
Clock
Routing
Analog
Input
Routing
ADC34xx
Digital
Output
Routing
图 105. Typical Layout of the ADC3421-Q1 Board
版权 © 2019, Texas Instruments Incorporated
57
ADC3421-Q1
ZHCSKL4 –DECEMBER 2019
www.ti.com.cn
12 器件和文档支持
12.1 接收文档更新通知
要接收文档更新通知,请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产品
信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.2 支持资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
58
版权 © 2019, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AD3421QRWERQ1
AD3421QRWETQ1
ACTIVE
ACTIVE
VQFNP
VQFNP
RWE
RWE
56
56
2000 RoHS & Green
250 RoHS & Green
NIPDAUAG
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
AZ3421Q
AZ3421Q
Samples
Samples
NIPDAUAG
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2022
OTHER QUALIFIED VERSIONS OF ADC3421-Q1 :
Catalog : ADC3421
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AD3421QRWERQ1
VQFNP
RWE
56
2000
330.0
16.4
8.3
8.3
2.25
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
VQFNP RWE 56
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
AD3421QRWERQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RWE 56
8 x 8, 0.5 mm pitch
VQFNP - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224587/A
www.ti.com
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相关型号:
AD346JD
IC SAMPLE AND HOLD AMPLIFIER, 1.6 us ACQUISITION TIME, CDIP14, BOTTOM BRAZED, CERAMIC, DIP-14, Sample and Hold Circuit
ADI
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