ADCS7477AIMFE/NOPB [TI]
采用 SOT-23 和 LLP 封装的 1MSPS、10 位模数转换器 | DBV | 6 | -40 to 85;
| 型号： | ADCS7477AIMFE/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 SOT-23 和 LLP 封装的 1MSPS、10 位模数转换器 | DBV | 6 | -40 to 85 光电二极管 转换器 模数转换器 |
| 文件： | 总29页 (文件大小：1419K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ADCS7476, ADCS7477, ADCS7478
www.ti.com
SNAS192F –APRIL 2003–REVISED MARCH 2013
ADCS7476
ADCS7477
ADCS7478 1MSPS, 12-/10-/8-Bit A/D Converters in SOT-23 & WSON
Check for Samples: ADCS7476, ADCS7477, ADCS7478
1
FEATURES
DESCRIPTION
2
•
•
•
•
•
Variable Power Management
The ADCS7476, ADCS7477, and ADCS7478 are low
power, monolithic CMOS 12-, 10- and 8-bit analog-to-
digital converters that operate at 1 MSPS. The
ADCS7476/77/78 are drop-in replacements for
Analog Devices' AD7476/77/78. Each device is based
on a successive approximation register architecture
with internal track-and-hold. The serial interface is
compatible with several standards, such as SPI™,
QSPI™, MICROWIRE™, and many common DSP
serial interfaces.
Packaged in 6-Lead, SOT-23 and WSON
Power Supply used as Reference
Single +2.7V to +5.25V Supply Operation
SPI™/QSPI™/MICROWIRE™/DSP Compatible
APPLICATIONS
•
•
•
•
•
•
Automotive Navigation
FA/ATM Equipment
The ADCS7476/77/78 uses the supply voltage as a
reference, enabling the devices to operate with a full-
scale input range of 0 to VDD. The conversion rate is
determined from the serial clock (SCLK) speed.
These converters offer a shutdown mode, which can
be used to trade throughput for power consumption.
The ADCS7476/77/78 is operated with a single
supply that can range from +2.7V to +5.25V. Normal
power consumption during continuous conversion,
using a +3V or +5V supply, is 2 mW or 10 mW
respectively. The power down feature, which is
enabled by a chip select (CS) pin, reduces the power
consumption to under 5 µW using a +5V supply. All
three converters are available in a 6-lead, SOT-23
package and in a 6-lead WSON, both of which
provide an extremely small footprint for applications
Portable Systems
Medical Instruments
Mobile Communications
Instrumentation and Control Systems
KEY SPECIFICATIONS
•
•
•
•
•
Resolution with no Missing Codes 12/10/8 bits
Conversion Rate 1 MSPS
DNL +0.5, -0.3 LSB (typ)
INL ± 0.4 LSB (typ)
Power Consumption
–
–
3V Supply 2 mW (typ)
5V Supply 10 mW (typ)
where space is
a critical consideration. These
products are designed for operation over the
automotive/extended industrial temperature range of
−40°C to +125°C.
Connection Diagram
Figure 1. 6-Lead SOT-23 or WSON
See DBV or NGF Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2013, Texas Instruments Incorporated
ADCS7476, ADCS7477, ADCS7478
SNAS192F –APRIL 2003–REVISED MARCH 2013
www.ti.com
PIN DESCRIPTIONS
Pin No.
ANALOG I/O
3
Symbol
Description
VIN
Analog input. This signal can range from 0V to VDD.
DIGITAL I/O
Digital clock input. The range of frequencies for this input is 10 kHz to 20 MHz, with ensured
performance at 20 MHz. This clock directly controls the conversion and readout processes.
4
SCLK
5
SDATA
CS
Digital data output. The output words are clocked out of this pin by the SCLK pin.
Chip select. A conversion process begins on the falling edge of CS.
6
POWER SUPPLY
Positive supply pin. These pins should be connected to a quiet +2.7V to +5.25V source and bypassed
to GND with 0.1 µF and 1 µF monolithic capacitors located within 1 cm of the power pin. The
ADCS7476/77/78 uses this power supply as a reference, so it should be thoroughly bypassed.
1
2
VDD
GND
The ground return for the supply.
Block Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage VDD
−0.3V to +6.5V
−0.3V to VDD +0.3V
-0.3V to 6.5V
Voltage on Any Analog Pin to GND
Voltage on Any Digital Pin to GND
(3)
Input Current at Any Pin
±10 mA
ESD Susceptibility
Human Body Model
Machine Model
3500V
200V
Soldering Temperature, Infrared,
10 seconds
215°C
+150°C
Junction Temperature
Storage Temperature
−65°C to +150°C
(1) Absolute maximum ratings are limiting values, to be applied individually, and beyond which the serviceability of the circuit may be
impaired. Functional operability under any of these conditions is not implied. Exposure to maximum ratings for extended periods may
affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Except power supply pins.
2
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SNAS192F –APRIL 2003–REVISED MARCH 2013
Operating Ratings
Operating Temperature Range
VDD Supply Voltage
TMIN = −40°C ≤ TA ≤ TMAX = +125°C
+2.7V to +5.25V
(1)
Digital Input Pins Voltage Range
+2.7V to +5.25V
(1) Independent of supply voltage.
Package Thermal Resistance
Package
θJA
6-Lead SOT-23
265°C / W
78°C / W
6-Lead WSON
ADCS7476/ADCS7477/ADCS7478 Specifications(1)
ADCS7476 Converter Electrical Characteristics
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
Parameter
Conditions
Typical
Limits
Units
STATIC CONVERTER CHARACTERISTICS
VDD = 2.7V to 3.6V,
−40°C ≤ TA ≤ 125°C
Resolution with No Missing Codes
12
±1
Bits
VDD = 2.7V to 3.6V,
−40°C ≤ TA ≤ 85°C
±0.4
LSB (max)
INL
Integral Non-Linearity
VDD = 2.7V to 3.6V,
TA = 125°C
+1
-1.1
LSB (max)
LSB (min)
VDD = 2.7V to 3.6V,
−40°C ≤ TA ≤ 85°C
+0.5
-0.3
+1
-0.9
LSB (max)
LSB (min)
DNL
Differential Non-Linearity
VDD = 2.7V to 3.6V,
TA = 125°C
±1
LSB (max)
LSB (max)
LSB (max)
VDD = 2.7V to 3.6V,
−40°C ≤ TA ≤ 125°C
VOFF
GE
Offset Error
Gain Error
±0.1
±0.2
±1.2
±1.2
VDD = 2.7V to 3.6V,
−40°C ≤ TA ≤ 125°C
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
Signal-to-Noise Plus Distortion Ratio
fIN = 100 kHz, −40°C ≤ TA ≤ 125°C
fIN = 100 kHz, −40°C ≤ TA ≤ 85°C
fIN = 100 kHz, TA = 125°C
fIN = 100 kHz
72
70
dB (min)
dB (min)
dB (min)
dB
72.5
70.8
70.6
SNR
Signal-to-Noise Ratio
THD
Total Harmonic Distortion
-80
82
SFDR
Spurious-Free Dynamic Range
fIN = 100 kHz
dB
Intermodulation Distortion, Second Order
Terms
fa = 103.5 kHz, fb = 113.5 kHz
fa = 103.5 kHz, fb = 113.5 kHz
-78
-78
dB
dB
IMD
Intermodulation Distortion, Third Order
Terms
+5V Supply
+3V Supply
11
8
MHz
MHz
FPBW
-3 dB Full Power Bandwidth
POWER SUPPLY CHARACTERISTICS
VDD Supply Voltage
2.7
V (min)
V (max)
−40°C ≤ TA ≤ 125°C
5.25
(1) Data sheet min/max specification limits are ensured by design, test, or statistical analysis.
Copyright © 2003–2013, Texas Instruments Incorporated
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SNAS192F –APRIL 2003–REVISED MARCH 2013
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ADCS7476/ADCS7477/ADCS7478 Specifications(1)
ADCS7476 Converter Electrical Characteristics (continued)
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
Parameter
Conditions
Typical
Limits
Units
VDD = +4.75V to +5.25V,
SCLK On or Off
2
mA
Normal Mode (Static)
VDD = +2.7V to +3.6V,
SCLK On or Off
1
mA
VDD = +4.75V to +5.25V,
fSAMPLE = 1 MSPS
2.0
0.6
3.5
1.6
mA (max)
mA (max)
IDD
Normal Mode (Operational)
Shutdown Mode
VDD = +2.7V to +3.6V,
fSAMPLE = 1 MSPS
VDD = +5V, SCLK Off
0.5
60
10
2
µA
µA
VDD = +5V, SCLK On
VDD = +5V, fSAMPLE = 1 MSPS
VDD = +3V, fSAMPLE = 1 MSPS
VDD = +5V, SCLK Off
17.5
4.8
mW (max)
mW (max)
µW
Power Consumption, Normal Mode
(Operational)
PD
2.5
1.5
Power Consumption, Shutdown Mode
VDD = +3V, SCLK Off
µW
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
0 to VDD
30
V
µA (max)
pF
IDCL
CINA
DC Leakage Current
Analog Input Capacitance
±1
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
2.4
0.8
0.4
±1
4
V (min)
V (max)
V (max)
µA (max)
pF (max)
VDD = +5V
VIL
Input Low Voltage
VDD = +3V
IIN
Input Current
VIN = 0V or VDD
±10 nA
2
CIND
Digital Input Capacitance
DIGITAL OUTPUT CHARACTERISTICS
ISOURCE = 200 µA,
VDD = +2.7V to +5.25V
VOH
Output High Voltage
VDD −0.2
V (min)
VOL
IOL
Output Low Voltage
ISINK = 200 µA
0.4
±10
4
V (max)
µA (max)
pF (max)
TRI-STATE Leakage Current
TRI-STATE Output Capacitance
Output Coding
COUT
2
Straight (Natural) Binary
AC ELECTRICAL CHARACTERISTICS
fSCLK
Clock Frequency
−40°C ≤ TA ≤ 125°C
20
MHz (max)
40
60
% (min)
% (max)
DC
SCLK Duty Cycle
tTH
Track/Hold Acquisition Time
Throughput Rate
Aperture Delay
400
1
ns (max)
fRATE
tAD
See USING THE ADCS7476/77/78
MSPS (max)
3
ns
ps
tAJ
Aperture Jitter
30
ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7477 Converter Electrical
Characteristics
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
Parameter
Conditions
Typical
Limits
Units
STATIC CONVERTER CHARACTERISTICS
(1) Data sheet min/max specification limits are ensured by design, test, or statistical analysis.
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4
Copyright © 2003–2013, Texas Instruments Incorporated
ADCS7476, ADCS7477, ADCS7478
www.ti.com
SNAS192F –APRIL 2003–REVISED MARCH 2013
ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7477 Converter Electrical
Characteristics (continued)
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
Parameter
Resolution with No Missing Codes
Integral Non-Linearity
Conditions
Typical
Limits
10
Units
Bits
INL
±0.2
±0.7
LSB (max)
+0.3
-0.2
LSB (max)
LSB (min)
DNL
Differential Non-Linearity
±0.7
VOFF
GE
Offset Error
Gain Error
±0.1
±0.2
±0.7
±1
LSB (max)
LSB (max)
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
SNR
Signal-to-Noise Plus Distortion Ratio
Signal-to-Noise Ratio
fIN = 100 kHz
fIN = 100 kHz
fIN = 100 kHz
fIN = 100 kHz
61.7
62
61
dBFS (min)
dB
THD
Total Harmonic Distortion
-77
78
-73
74
dB (max)
dB (min)
SFDR
Spurious-Free Dynamic Range
Intermodulation Distortion, Second Order
Terms
fa = 103.5 kHz, fb = 113.5 kHz
fa = 103.5 kHz, fb = 113.5 kHz
-78
-78
dB
dB
IMD
Intermodulation Distortion, Third Order
Terms
+5V Supply
+3V Supply
11
8
MHz
MHz
FPBW
-3 dB Full Power Bandwidth
POWER SUPPLY CHARACTERISTICS
2.7
5.25
V (min)
V (max)
VDD
Supply Voltage
VDD = +4.75V to +5.25V,
SCLK On or Off
2
mA
Normal Mode (Static)
VDD = +2.7V to +3.6V,
SCLK On or Off
1
mA
VDD = +4.75V to +5.25V,
fSAMPLE = 1 MSPS
2.0
0.6
3.5
1.6
mA (max)
mA (max)
IDD
Normal Mode (Operational)
Shutdown Mode
VDD = +2.7V to +3.6V,
fSAMPLE = 1 MSPS
VDD = +5V, SCLK Off
0.5
60
10
2
µA (max)
µA (max)
mW (max)
mW (max)
µW (max)
µW (max)
VDD = +5V, SCLK On
VDD = +5V, fSAMPLE = 1 MSPS
VDD = +3V, fSAMPLE = 1 MSPS
VDD = +5V, SCLK Off
17.5
4.8
Power Consumption, Normal Mode
(Operational)
PD
2.5
1.5
Power Consumption, Shutdown Mode
VDD = +3V, SCLK Off
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
0 to VDD
30
V
µA (max)
pF
IDCL
CINA
DC Leakage Current
Analog Input Capacitance
±1
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
2.4
0.8
0.4
±1
4
V (min)
V (max)
V (max)
µA (max)
pF (max)
VDD = +5V
VIL
Input Low Voltage
VDD = +3V
IIN
Input Current
VIN = 0V or VDD
±10 nA
2
CIND
Digital Input Capacitance
DIGITAL OUTPUT CHARACTERISTICS
ISOURCE = 200 µA,
VDD = +2.7V to +5.25V
VOH Output High Voltage
VDD −0.2
V (min)
Copyright © 2003–2013, Texas Instruments Incorporated
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Product Folder Links: ADCS7476 ADCS7477 ADCS7478
ADCS7476, ADCS7477, ADCS7478
SNAS192F –APRIL 2003–REVISED MARCH 2013
www.ti.com
ADCS7476/ADCS7477/ADCS7478 Specifications(1) ADCS7477 Converter Electrical
Characteristics (continued)
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
VOL
Parameter
Output Low Voltage
Conditions
Typical
Limits
0.4
Units
ISINK = 200 µA
V (max)
µA (max)
pF (max)
IOL
TRI-STATE Leakage Current
TRI-STATE Output Capacitance
Output Coding
±10
4
COUT
2
Straight (Natural) Binary
AC ELECTRICAL CHARACTERISTICS
fSCLK
Clock Frequency
20
MHz (max)
40
60
% (min)
% (max)
DC
SCLK Duty Cycle
tTH
Track/Hold Acquisition Time
Throughput Rate
Aperture Delay
400
1
ns (max)
fRATE
tAD
See USING THE ADCS7476/77/78
MSPS (max)
3
ns
ps
tAJ
Aperture Jitter
30
6
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Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: ADCS7476 ADCS7477 ADCS7478
ADCS7476, ADCS7477, ADCS7478
www.ti.com
SNAS192F –APRIL 2003–REVISED MARCH 2013
ADCS7476/ADCS7477/ADCS7478 Specifications(1)
ADCS7478 Converter Electrical Characteristics
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
Parameter
Conditions
Typical
Limits
Units
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
8
Bits
INL
Integral Non-Linearity
Differential Non-Linearity
Offset Error
±0.05
±0.07
±0.03
±0.08
±0.07
±0.3
±0.3
±0.3
±0.4
±0.3
LSB (max)
LSB (max)
LSB (max)
LSB (max)
LSB (max)
DNL
VOFF
GE
Gain Error
Total Unadjusted Error
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
SNR
Signal-to-Noise Plus Distortion Ratio
Signal-to-Noise Ratio
fIN = 100 kHz
fIN = 100 kHz
fIN = 100 kHz
fIN = 100 kHz
49.7
49.7
-77
49
dB (min)
dB
THD
Total Harmonic Distortion
-65
65
dB (max)
dB (min)
SFDR
Spurious-Free Dynamic Range
69
Intermodulation Distortion, Second Order
Terms
fa = 103.5 kHz, fb = 113.5 kHz
fa = 103.5 kHz, fb = 113.5 kHz
-68
-68
dB
dB
IMD
Intermodulation Distortion, Third Order
Terms
+5V Supply
+3V Supply
11
8
MHz
MHz
FPBW
-3 dB Full Power Bandwidth
POWER SUPPLY CHARACTERISTICS
2.7
5.25
V (min)
V (max)
VDD
Supply Voltage
VDD = +4.75V to +5.25V,
SCLK On or Off
2
mA
Normal Mode (Static)
VDD = +2.7V to +3.6V,
SCLK On or Off
1
mA
VDD = +4.75V to +5.25V,
fSAMPLE = 1 MSPS
2.0
0.6
3.5
1.6
mA (max)
mA (max)
IDD
Normal Mode (Operational)
Shutdown Mode
VDD = +2.7V to +3.6V,
fSAMPLE = 1 MSPS
VDD = +5V, SCLK Off
0.5
60
10
2
µA (max)
µA (max)
mW (max)
mW (max)
µW (max)
µW (max)
VDD = +5V, SCLK On
VDD = +5V, fSAMPLE = 1 MSPS
VDD = +3V, fSAMPLE = 1 MSPS
VDD = +5V, SCLK Off
17.5
4.8
Power Consumption, Normal Mode
(Operational)
PD
2.5
1.5
Power Consumption= Shutdown Mode
VDD = +3V, SCLK Off
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
0 to VDD
30
V
µA (max)
pF
IDCL
CINA
DC Leakage Current
Analog Input Capacitance
±1
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
2.4
0.8
0.4
±1
4
V (min)
V (max)
V (max)
µA (max)
pF(max)
VDD = +5V
VIL
Input Low Voltage
VDD = +3V
IIN
Digital Input Current
Input Capacitance
VIN = 0V or VDD
±10 nA
2
CIND
DIGITAL OUTPUT CHARACTERISTICS
(1) Data sheet min/max specification limits are ensured by design, test, or statistical analysis.
Copyright © 2003–2013, Texas Instruments Incorporated
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Product Folder Links: ADCS7476 ADCS7477 ADCS7478
ADCS7476, ADCS7477, ADCS7478
SNAS192F –APRIL 2003–REVISED MARCH 2013
www.ti.com
ADCS7476/ADCS7477/ADCS7478 Specifications(1)
ADCS7478 Converter Electrical Characteristics (continued)
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS unless otherwise noted.
Boldface limits apply for TA = −40°C to +85°C: all other limits TA = 25°C, unless otherwise noted.
Symbol
Parameter
Conditions
Typical
Limits
Units
ISOURCE = 200 µA,
VDD = +2.7V to +5.25V
ISINK = 200 µA
VOH
Output High Voltage
V
DD −0.2
V (min)
VOL
IOL
Output Low Voltage
0.4
±10
4
V (max)
µA (max)
pF (max)
TRI-STATE Leakage Current
TRI-STATE Output Capacitance
Output Coding
COUT
2
Straight (Natural) Binary
AC ELECTRICAL CHARACTERISTICS
fSCLK
Clock Frequency
20
MHz (max)
40
60
% (min)
% (max)
DC
SCLK Duty Cycle
tTH
Track/Hold Acquisition Time
Throughput Rate
Aperture Delay
400
1
ns (max)
fRATE
tAD
See Applications Information
MSPS (min)
3
ns
ps
tAJ
Aperture Jitter
30
Figure 2. Timing Test Circuit
Timing Test Circuit ADCS7476/ADCS7477/ADCS7478 Timing Specifications
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, Boldface limits apply for TA = −40°C to +85°C:
(1)
all other limits TA = 25°C, unless otherwise noted.
Symbol
tCONVERT
tQUIET
t1
Parameter
Conditions
Typical
Limits
Units
16 x tSCLK
(2)
50
10
10
ns (min)
ns (min)
ns (min)
Minimum CS Pulse Width
t2
CS to SCLK Setup Time
Delay from CS Until SDATA TRI-STATE
Disabled
t3
t4
20
ns (max)
(3)
VDD = +2.7 to +3.6
40
20
ns (max)
ns (max)
Data Access Time after SCLK Falling
Edge(4)
VDD = +4.75 to +5.25
0.4 x
tSCLK
t5
t6
SCLK Low Pulse Width
SCLK High Pulse Width
ns (min)
ns (min)
0.4 x
tSCLK
VDD = +2.7 to +3.6
7
5
ns (min)
ns (min)
t7
SCLK to Data Valid Hold Time
VDD = +4.75 to +5.25
(1) All input signals are specified as tr = tf = 5 ns (10% to 90% VDD) and timed from 1.6V.
(2) Minimum Quiet Time Required Between Bus Relinquish and Start of Next Conversion
(3) Measured with the load circuit shown above, and defined as the time taken by the output to cross 1.0V.
(4) Measured with the load circuit shown above, and defined as the time taken by the output to cross 1.0V or 2.0V.
8
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Timing Test Circuit ADCS7476/ADCS7477/ADCS7478 Timing Specifications (continued)
The following specifications apply for VDD = +2.7V to 5.25V, fSCLK = 20 MHz, Boldface limits apply for TA = −40°C to +85°C:
all other limits TA = 25°C, unless otherwise noted. (1)
Symbol
Parameter
Conditions
Typical
Limits
Units
25
6
ns (max)
ns (min)
ns (max)
ns (min)
VDD = +2.7 to +3.6
SCLK Falling Edge to SDATA High
Impedance
t8
(5)
25
5
VDD = +4.75 to +5.25
tPOWER-
UP
Power-Up Time from Full Power-Down
1
µs
(5) t8 is derived from the time taken by the outputs to change by 0.5V with the loading circuit shown above. The measured number is then
adjusted to remove the effects of charging or discharging the 25pF capacitor. This means t8 is the true bus relinquish time, independent
of the bus loading.
Specification Definitions
APERTURE DELAY is the variation in aperture delay from sample to sample. Aperture jitter manifests itself as
noise in the output.
APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample.
Aperture jitter manifests itself as noise in the output.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The
specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is
equivalent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF - 1.5 LSB
for ADCS7476 and ADCS7477, VREF - 1 LSB for ADCS7478), after adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last
code transition). The deviation of any given code from this straight line is measured from the center of that
code value.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the
power in the either the two second order or all four third order intermodulation products to the sum of the
power in both of the original frequencies. IMD is usually expressed in dBFS.
MISSING CODES are those output codes that will never appear at the ADC outputs. The ADCS7476/77/78 is
ensured not to have any missing codes.
OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND +
0.5 LSB for the ADCS7476 and ADCS7477, and GND + 1 LSB for the ADCS7478).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms
value of the sum of all other spectral components below one-half the sampling frequency, not including
harmonics or DC.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of
the input signal to the rms value of all of the other spectral components below half the clock frequency,
including harmonics but excluding DC.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the
input signal and the peak spurious signal, where a spurious signal is any signal present in the output
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spectrum that is not present at the input.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first five harmonic
levels at the output to the level of the fundamental at the output. THD is calculated as
where
•
•
f1 is the RMS power of the fundamental (output) frequency
f2 through f6 are the RMS power in the first 5 harmonic frequencies
(1)
TOTAL UNADJUSTED ERROR is the worst deviation found from the ideal transfer function. As such, it is a
comprehensive specification which includes full scale error, linearity error, and offset error.
Timing Diagrams
Figure 3. ADCS7476 Serial Interface Timing Diagram
Figure 4. ADCS7477 Serial Interface Timing Diagram
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Figure 5. ADCS7478 Serial Interface Timing Diagram
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Typical Performance Characteristics
TA = +25°C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated.
ADCS7476
ADCS7476 DNL
ADCS7476 INL
Figure 6.
Figure 7.
ADCS7476 THD
vs.
Source Impedance
ADCS7476 Spectral Response @ 100kHz Input
Figure 8.
Figure 9.
ADCS7476 THD
vs.
Input Frequency, 600 kSPS
ADCS7476 THD
vs.
Input Frequency, 1 MSPS
Figure 10.
Figure 11.
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Typical Performance Characteristics (continued)
TA = +25°C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated.
ADCS7476
ADCS7476 SINAD
vs.
Input Frequency, 600 kSPS
ADCS7476 SINAD
vs.
Input Frequency, 1 MSPS
Figure 12.
Figure 13.
ADCS7476 SNR
ADCS7476 SINAD
vs.
vs.
fSCLK
fSCLK
Figure 14.
Figure 15.
ADCS7477 DNL
ADCS7477 INL
Figure 16.
Figure 17.
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Typical Performance Characteristics (continued)
TA = +25°C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated.
ADCS7476
ADCS7477 SNR
vs.
ADCS7477 Spectral Response @ 100kHz Input
fSCLK
Figure 18.
Figure 19.
ADCS7477 SINAD
vs.
fSCLK
ADCS7478 DNL
Figure 20.
Figure 21.
ADCS7478 INL
ADCS7478 Spectral Response @ 100kHz Input
Figure 22.
Figure 23.
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Typical Performance Characteristics (continued)
TA = +25°C, VDD = 3V, fSAMPLE = 1 MSPS, fSCLK = 20 MHz, fIN = 100 kHz unless otherwise stated.
ADCS7476
ADCS7478 SNR
ADCS7478 SINAD
vs.
vs.
fSCLK
fSCLK
Figure 24.
Figure 25.
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APPLICATIONS INFORMATION
ADCS7476/77/78 OPERATION
The ADCS7476/77/78 are successive-approximation analog-to-digital converters designed around a charge-
redistribution digital-to-analog converter. Simplified schematics of the ADCS7476/77/78 in both track and hold
operation are shown in Figure 26 and Figure 27, respectively. In Figure 26 the device is in track mode: switch
SW1 connects the sampling capacitor to the input, and SW2 balances the comparator inputs. The device is in
this state until CS is brought low, at which point the device moves to hold mode.
Figure 27 shows the device in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining
the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the charge-
redistribution DAC to add or subtract fixed amounts of charge from the sampling capacitor until the comparator is
balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of
the analog input voltage. The device moves from hold mode to track mode on the 13th rising edge of SCLK.
CHARGE
REDISTRIBUTION
DAC
VIN
SAMPLING
CAPACITOR
SW1
+
CONTROL
LOGIC
SW2
-
GND
VDD/2
Figure 26. ADCS7476/77/78 in Track Mode
CHARGE
REDISTRIBUTION
DAC
VIN
SAMPLING
CAPACITOR
SW1
+
-
CONTROL
LOGIC
SW2
GND
VDD/2
Figure 27. ADCS7476/77/78 in Hold Mode
USING THE ADCS7476/77/78
Serial interface timing diagrams for the ADCS7476/77/78 are shown in Figure 3, Figure 4, and Figure 5. CS is
chip select, which initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the
conversion process and the timing of serial data. SDATA is the serial data out pin, where a conversion result is
found.
Basic operation of the ADCS7476/77/78 begins with CS going low, which initiates a conversion process and data
transfer. Subsequent rising and falling edges of SCLK will be labeled with reference to the falling edge of CS; for
example, "the third falling edge of SCLK" shall refer to the third falling edge of SCLK after CS goes low.
At the fall of CS, the SDATA pin comes out of TRI-STATE, and the converter moves from track mode to hold
mode. The input signal is sampled and held for conversion at the falling edge of CS. The converter moves from
hold mode to track mode on the 13th rising edge of SCLK (see Figure 3, Figure 4, or Figure 5). The SDATA pin
will be placed back into TRI-STATE after the 16th falling edge of SCLK, or at the rising edge of CS, whichever
occurs first. After a conversion is completed, the quiet time tQUIET must be satisfied before bringing CS low again
to begin another conversion.
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Sixteen SCLK cycles are required to read a complete sample from the ADCS7476/77/78. The sample bits
(including any leading or trailing zeroes) are clocked out on falling edges of SCLK, and are intended to be
clocked in by a receiver on subsequent falling edges of SCLK. The ADCS7476/77/78 will produce four leading
zeroes on SDATA, followed by twelve, ten, or eight data bits, most significant first. After the data bits, the
ADCS7477 will clock out two trailing zeros, and the ADCS7478 will clock out four trailing zeros. The ADCS7476
will not clock out any trailing zeros; the least significant data bit will be valid on the 16th falling edge of SCLK.
Depending upon the application, the first edge on SCLK after CS goes low may be either a falling edge or a
rising edge. If the first SCLK edge after CS goes low is a rising edge, all four leading zeroes will be valid on the
first four falling edges of SCLK. If instead the first SCLK edge after CS goes low is a falling edge, the first leading
zero may not be set up in time for a microprocessor or DSP to read it correctly. The remaining data bits are still
clocked out on the falling edges of SCLK.
ADCS7476/77/78 TRANSFER FUNCTION
The output format of the ADCS7476/77/78 is straight binary. Code transitions occur midway between successive
integer LSB values. The LSB widths for the ADCS7476 is VDD / 4096; for the ADCS7477 the LSB width is VDD
/
1024; for the ADCS7478, the LSB width is VDD / 256. The ideal transfer characteristic for the ADCS7476 and
ADCS7477 is shown in Figure 28, while the ideal transfer characteristic for the ADCS7478 is shown in Figure 29.
Figure 28. ADCS7476/77 Ideal Transfer Characteristic
Figure 29. ADCS7478 Ideal Transfer Characteristic
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TYPICAL APPLICATION CIRCUIT
A typical application of the ADCS7476/77/78 is shown in Figure 30. The combined analog and digital supplies
are provided in this example by the TI LP2950 low-dropout voltage regulator, available in a variety of fixed and
adjustable output voltages. The supply is bypassed with a capacitor network located close to the device. The
three-wire interface is also shown connected to a microprocessor or DSP.
Figure 30. Typical Application Circuit
ANALOG INPUTS
An equivalent circuit for the ADCS7476/77/78 input channel is shown in Figure 31. The diodes D1 and D2
provide ESD protection for the analog inputs. At no time should an analog input exceed VDD + 300 mV or GND -
300 mV, as these ESD diodes will begin conducting current into the substrate or supply line and affect ADC
operation.
The capacitor C1 in Figure 31 typically has a value of 4 pF, and is mainly due to pin capacitance. The resistor R1
represents the on resistance of the multiplexer and track / hold switch, and is typically 100 ohms. The capacitor
C2 is the ADCS7476/77/78 sampling capacitor, and is typically 26 pF.
The sampling nature of the analog input causes input current pulses that result in voltage spikes at the input. The
ADCS7476/77/78 will deliver best performance when driven by a low-impedance source to eliminate distortion
caused by the charging of the sampling capacitance. In applications where dynamic performance is critical, the
input might need to be driven with a low output-impedance amplifier. In addition, when using the
ADCS7476/77/78 to sample AC signals, a band-pass or low-pass filter will reduce harmonics and noise and thus
improve THD and SNR.
Figure 31. Equivalent Input Circuit
DIGITAL INPUTS AND OUTPUTS
The ADCS7476/77/78 digital inputs (SCLK and CS) are not limited by the same absolute maximum ratings as the
analog inputs. The digital input pins are instead limited to +6.5V with respect to GND, regardless of VDD, the
supply voltage. This allows the ADCS7476/77/78 to be interfaced with a wide range of logic levels, independent
of the supply voltage.
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Note that, even though the digital inputs are tolerant of up to +6.5V above GND, the digital outputs are only
capable of driving VDD out. In addition, the digital input pins are not prone to latch-up; SCLK and CS may be
asserted before VDD without any risk.
MODES OF OPERATION
The ADCS7476/77/78 has two possible modes of operation: NORMAL MODE, and SHUTDOWN MODE. The
ADCS7476/77/78 enters normal mode (and a conversion process is begun) when CS is pulled low. The device
will enter shutdown mode if CS is pulled high before the tenth falling edge of SCLK after CS is pulled low, or will
stay in normal mode if CS remains low. Once in shutdown mode, the device will stay there until CS is brought
low again. By varying the ratio of time spent in the normal and shutdown modes, a system may trade-off
throughput for power consumption.
NORMAL MODE
The best possible throughput is obtained by leaving the ADCS7476/77/78 in normal mode at all times, so there
are no power-up delays. To keep the device in normal mode continuously, CS must be kept low until after the
10th falling edge of SCLK after the start of a conversion (remember that a conversion is initiated by bringing CS
low).
If CS is brought high after the 10th falling edge, but before the 16th falling edge, the device will remain in normal
mode, but the current conversion will be aborted, and SDATA will return to TRI-STATE (truncating the output
word).
Sixteen SCLK cycles are required to read all of a conversion word from the device. After sixteen SCLK cycles
have elapsed, CS may be idled either high or low until the next conversion. If CS is idled low, it must be brought
high again before the start of the next conversion, which begins when CS is again brought low.
After sixteen SCLK cycles, SDATA returns to TRI-STATE. Another conversion may be started, after tQUIET has
elapsed, by bringing CS low again.
SHUTDOWN MODE
Shutdown mode is appropriate for applications that either do not sample continuously, or are willing to trade
throughput for power consumption. When the ADCS7476/77/78 is in shutdown mode, all of the analog circuitry is
turned off.
To enter shutdown mode, a conversion must be interrupted by bringing CS back high anytime between the
second and tenth falling edges of SCLK, as shown in Figure 32. Once CS has been brought high in this manner,
the device will enter shutdown mode; the current conversion will be aborted and SDATA will enter TRI-STATE. If
CS is brought high before the second falling edge of SCLK, the device will not change mode; this is to avoid
accidentally changing mode as a result of noise on the CS line.
Figure 32. Entering Shutdown Mode
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Figure 33. Entering Normal Mode
EXITING SHUTDOWN MODE
To exit shutdown mode, bring CS back low. Upon bringing CS low, the ADCS7476/77/78 will begin powering up.
Power up typically takes 1 µs. This microsecond of power-up delay results in the first conversion result being
unusable. The second conversion performed after power-up, however, is valid, as shown in Figure 33.
If CS is brought back high before the 10th falling edge of SCLK, the device will return to shutdown mode. This is
done to avoid accidentally entering normal mode as a result of noise on the CS line. To exit shutdown mode and
remain in normal mode, CS must be kept low until after the 10th falling edge of SCLK. The ADCS7476/77/78 will
be fully powered-up after 16 SCLK cycles.
POWER-UP TIMING
The ADCS7476/77/78 typically requires 1 µs to power up, either after first applying VDD, or after returning to
normal mode from shutdown mode. This corresponds to one "dummy" conversion for any SCLK frequency within
the specifications in this document. After this first dummy conversion, the ADCS7476/77/78 will perform
conversions properly. Note that the tQUIET time must still be included between the first dummy conversion and the
second valid conversion.
STARTUP MODE
When the VDD supply is first applied, the ADCS7476/77/78 may power up in either of the two modes: normal or
shutdown. As such, one dummy conversion should be performed after start-up, exactly as described in POWER-
UP TIMING. The part may then be placed into either normal mode or the shutdown mode, as described in
NORMAL MODE and SHUTDOWN MODE.
POWER CONSIDERATIONS
There are three concerns relating to the power supply of these products: the effects of Power Supply Noise upon
the conversion process, the Digital Output Effect Upon Noise upon the conversion process and Power
Management of the product.
Power Supply Noise
Since the reference voltage of the ADCS7476/77/78 is the reference voltage, any noise greater than 1/2 LSB in
amplitude will have some effect upon the converter noise performance. This effect is proportional to the input
voltage level. The power supply should receive all the considerations of a reference voltage as far as stability
and noise is concerned. Using the same supply voltage for these devices as is used for digital components will
lead to degraded noise performance.
Digital Output Effect Upon Noise
The charging of any output load capacitance requires current from the digital supply, VDD. The current pulses
required from the supply to charge the output capacitance will cause voltage variations at the ADC supply line. If
these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Similarly,
discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current
into the die substrate, causing "ground bounce" noise in the substrate that will degrade noise performance if that
current is large enough. The larger the output capacitance, the more current flows through the device power
supply line and die substrate and the greater is the noise coupled into the analog path.
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The first solution to keeping digital noise out of the power supply is to decouple the supply from any other
components or use a separate supply for the ADC. To keep noise out of the supply, keep the output load
capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100 Ω series resistor at
the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge
current of the output capacitance and improve noise performance. Since the series resistor and the load
capacitance form a low frequency pole, verify signal integrity once the series resistor has been added.
Power Management
When the ADCS7476/77/78 is operated continuously in normal mode, throughput up to 1 MSPS can be
achieved. The user may trade throughput for power consumption by simply performing fewer conversions per
unit time, and putting the ADCS7476/77/78 into shutdown mode between conversions. This method is not
advantageous beyond 350 kSPS throughput.
A plot of maximum power consumption versus throughput is shown in Figure 34. To calculate the power
consumption for a given throughput, remember that each time the part exits shutdown mode and enters normal
mode, one dummy conversion is required. Generally, the user will put the part into normal mode, execute one
dummy conversion followed by one valid conversion, and then put the part back into shutdown mode. When this
is done, the fraction of time spent in normal mode may be calculated by multiplying the throughput (in samples
per second) by 2 µs, the time taken to perform one dummy and one valid conversion. The power consumption
can then be found by multiplying the fraction of time spent in normal mode by the normal mode power
consumption figure. The power dissipated while the part is in shutdown mode is negligible.
For example, to calculate the power consumption at 300 kSPS with VDD = 5V, begin by calculating the fraction of
time spent in normal mode: 300,000 samples/second x 2 µs = 0.6, or 60%. The power consumption at 300 kSPS
is then 60% of 17.5 mW (the maximum power consumption at VDD = 5V) or 10.5 mW.
Figure 34. Maximum Power Consumption vs. Throughput
LAYOUT AND GROUNDING
Capacitive coupling between noisy digital circuitry and sensitive analog circuitry can lead to poor performance.
The solution is to keep the analog and digital circuitry separated from each other and the clock line as short as
possible.
Digital circuits create substantial supply and ground current transients. This digital noise could have significant
impact upon system noise performance. To avoid performance degradation of the ADCS7476/77/78 due to
supply noise, do not use the same supply for the ADCS7476/77/78 that is used for digital logic.
Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. However, to maximize
accuracy in high resolution systems, avoid crossing analog and digital lines altogether. It is important to keep
clock lines as short as possible and isolated from ALL other lines, including other digital lines. In addition, the
clock line should also be treated as a transmission line and be properly terminated.
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The analog input should be isolated from noisy signal lines to avoid coupling of spurious signals into the input.
Any external component (e.g., a filter capacitor) connected between the converter’s input pins and ground or to
the reference input pin and ground should be connected to a very clean point in the ground plane.
We recommend the use of a single, uniform ground plane and the use of split power planes. The power planes
should be located within the same board layer. All analog circuitry (input amplifiers, filters, reference
components, etc.) should be placed over the analog power plane. All digital circuitry and I/O lines should be
placed over the digital power plane. Furthermore, all components in the reference circuitry and the input signal
chain that are connected to ground should be connected together with short traces and enter the analog ground
plane at a single, quiet point.
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REVISION HISTORY
Changes from Revision E (March 2013) to Revision F
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 22
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ADCS7476AIMF
ACTIVE
SOT-23
SOT-23
DBV
6
6
1000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
X01A
ADCS7476AIMF/NOPB
ACTIVE
ACTIVE
DBV
DBV
1000
250
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
X01A
X01A
ADCS7476AIMFE/NOPB
SOT-23
6
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
ADCS7476AIMFX
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
X01A
X01A
ADCS7476AIMFX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
ADCS7477AIMF
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
X02A
X02A
ADCS7477AIMF/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
ADCS7477AIMFE/NOPB
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
X02A
ADCS7477AIMFX
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
X02A
X02A
ADCS7477AIMFX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
ADCS7478AIMF
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
X03A
X03A
ADCS7478AIMF/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
ADCS7478AIMFE/NOPB
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
X03A
ADCS7478AIMFX
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
X03A
X03A
ADCS7478AIMFX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ADCS7476AIMF
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
1000
1000
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
ADCS7476AIMF/NOPB SOT-23
ADCS7476AIMFE/NOPB SOT-23
ADCS7476AIMFX
ADCS7476AIMFX/NOPB SOT-23
ADCS7477AIMF SOT-23
SOT-23
3000
3000
1000
1000
250
ADCS7477AIMF/NOPB SOT-23
ADCS7477AIMFE/NOPB SOT-23
ADCS7477AIMFX
ADCS7477AIMFX/NOPB SOT-23
ADCS7478AIMF SOT-23
SOT-23
3000
3000
1000
1000
250
ADCS7478AIMF/NOPB SOT-23
ADCS7478AIMFE/NOPB SOT-23
ADCS7478AIMFX
SOT-23
3000
3000
ADCS7478AIMFX/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
ADCS7476AIMF
ADCS7476AIMF/NOPB
ADCS7476AIMFE/NOPB
ADCS7476AIMFX
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
1000
1000
250
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
3000
3000
1000
1000
250
ADCS7476AIMFX/NOPB
ADCS7477AIMF
ADCS7477AIMF/NOPB
ADCS7477AIMFE/NOPB
ADCS7477AIMFX
3000
3000
1000
1000
250
ADCS7477AIMFX/NOPB
ADCS7478AIMF
ADCS7478AIMF/NOPB
ADCS7478AIMFE/NOPB
ADCS7478AIMFX
3000
3000
ADCS7478AIMFX/NOPB
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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Copyright © 2013, Texas Instruments Incorporated
相关型号：
ADCS7478AIMF/NOPB
IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO6, SOT-23, 6 PIN, Analog to Digital Converter
NSC
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