ADS5277IPFP [TI]
8-Channel, 10-Bit, 65MSPS Analog-to-Digital Converter with Serial LVDS Interface; 8通道， 10位， 65MSPS模拟数字转换器，串行LVDS接口
| 型号： | ADS5277IPFP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 8-Channel, 10-Bit, 65MSPS Analog-to-Digital Converter with Serial LVDS Interface |
| 文件： | 总32页 (文件大小：1488K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
8-Channel, 10-Bit, 65MSPS Analog-to-Digital Converter
with Serial LVDS Interface
An integrated phase lock loop (PLL) multiplies the
incoming ADC sampling clock by a factor of 12. This
1
FEATURES
23
•
Maximum Sample Rate: 65MSPS
high-frequency clock is used in the data serialization
and transmission process. The word output of each
internal ADC is serialized and transmitted either MSB
or LSB first. The word consists of 12 bits, of which
the 2 LSBs are zeroes and the remaining 10 bits
correspond to the output from the ADC. This
formatting is done in order to keep the interface
compatible with the 12-bit parts of the family. In
addition to the eight data outputs, a bit clock and a
word clock are also transmitted. The bit clock is at 6x
the speed of the sampling clock, whereas the word
clock is at the same speed of the sampling clock.
•
10-Bit Resolution
•
•
No Missing Codes
Total Power Dissipation:
Internal Reference: 911mW
External Reference: 845mW
•
•
•
•
•
•
•
•
•
•
CMOS Technology
Simultaneous Sample-and-Hold
61.7dBFS SNR at 5MHz IF
3.3V Digital/Analog Supply
Serialized LVDS Outputs
The ADS5277 provides internal references, or can
optionally be driven with external references. Best
performance is achieved through the internal
reference mode.
Integrated Frame and Bit Patterns
Option to Double LVDS Clock Output Currents
Four Current Modes for LVDS
Pin- and Format-Compatible Family
TQFP-80 PowerPAD™ Package
The ADS5277 is available in a PowerPAD TQFP-80
package and is specified over a –40°C to +85°C
operating range.
APPLICATIONS
LCLKP
6x ADCLK
LCLKN
•
•
•
Portable Ultrasound Systems
Tape Drives
Test Equipment
12x ADCLK
PLL
ADCLKP
ADCLKN
1x ADCLK
ADCLK
IN1P
IN1N
OUT1P
OUT1N
10−Bit
ADC
Serializer
Serializer
Serializer
Serializer
Serializer
Serializer
Serializer
S/H
S/H
S/H
S/H
S/H
S/H
S/H
S/H
DESCRIPTION
IN2P
IN2N
OUT2P
OUT2N
10−Bit
ADC
The ADS5277 is
a
high-performance, CMOS,
IN3P
IN3N
OUT3P
OUT3N
10−Bit
ADC
65MSPS, 8-channel analog-to-digital converter
(ADC). Internal references are provided, simplifying
system design requirements. Low power consumption
allows for the highest of system integration densities.
Serial LVDS (low-voltage differential signaling)
outputs reduce the number of interface lines and
package size.
IN4P
IN4N
OUT4P
OUT4N
10−Bit
ADC
IN5P
IN5N
OUT5P
OUT5N
10−Bit
ADC
IN6P
IN6N
OUT6P
OUT6N
10−Bit
ADC
IN7P
IN7N
OUT7P
OUT7N
10−Bit
ADC
RELATED PRODUCTS
RESOLUTION SAMPLE RATE
IN8P
IN8N
OUT8P
OUT8N
10−Bit
ADC
Serializer
Control
MODEL
ADS5270
ADS5271
ADS5272
ADS5273
(BITS)
(MSPS)
CHANNELS
12
40
8
8
8
8
Registers
Reference
INT/EXT
12
50
12
65
12
70
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2009, Texas Instruments Incorporated
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
SPECIFIED
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT PACKAGE-LEAD(2)
ADS5277 HTQFP-80
ADS5277IPFP
Tray, 96
PFP
–40°C to +85°C
ADS5277IPFP
ADS5277IPFPT Tape and Reel, 250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Thermal pad size: 4.69mm × 4.69mm (min), 6.20mm × 6.20mm (max).
ABSOLUTE MAXIMUM RATINGS(1)
Analog Supply Voltage Range, AVDD
Output Driver Supply Voltage Range, LVDD
Voltage Between AVSS and LVSS
Voltage Between AVDD and LVDD
Voltage Applied to External REF Pins
All LVDS Data and Clock Outputs
Analog Input Pins(2)
–0.3V to +3.8V
–0.3V to +3.8V
–0.3V to +0.3V
–0.3V to +0.3V
–0.3V to +2.4V
–0.3V to +2.4V
–0.3V to min. [3.3V, (AVDD + 0.3V)]
–0.3V to min. [3.9V, (AVDD + 0.3V)](3)
–0.3V to min. [3.9V, (LVDD + 0.3V)](3)
–40°C to +85°C
Digital Input Pins, Set 1 (pins 69, 76-78)
Digital Input Pins, Set 2 (pins 16, 45)
Operating Free-Air Temperature Range, TA
Lead Temperature, 1.6mm (1/16" from case for 10s)
Junction Temperature
+260°C
+105°C
Storage Temperature Range
–65°C to +150°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) The dc voltage applied on the input pins should not go below –0.3V. Also, the dc voltage should be limited to the lower of either 3.3V or
(AVDD + 0.3V). If the input can go higher than +3.3V, then a resistor greater than or equal to 25Ω should be added in series with each
of the input pins. Also, the duty cycle of the overshoot beyond +3.3V should be limited. The overshoot duty cycle can be defined either
as a percentage of the time of overshoot over a clock period, or over the entire device lifetime. For a peak voltage between +3.3V and
+3.5V, a duty cycle up to 10% is acceptable. For a peak voltage between +3.5V and +3.7V, the overshoot duty cycle should not exceed
1%. Any overshoot beyond +3.7V should be restricted to less than 0.1% duty cycle, and never exceed +3.9V.
(3) It is recommended that a series resistor of 1kΩ or greater be used if the digital input pins are tied to AVDD or LVDD.
2
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
RECOMMENDED OPERATING CONDITIONS
ADS5277
PARAMETER
MIN
TYP
MAX
UNITS
SUPPLIES AND REFERENCES
Analog Supply Voltage, AVDD
Output Driver Supply Voltage, LVDD
REFT — External Reference Mode
REFB — External Reference Mode
REFCM = (REFT + REFB)/2 – External Reference Mode(1)
Reference = (REFT – REFB) – External Reference Mode
Analog Input Common-Mode Range(1)
CLOCK INPUT AND OUTPUTS
ADCLK Input Sample Rate (low-voltage TTL)
ADCLK Duty Cycle
3.0
3.0
3.3
3.3
3.6
3.6
V
V
V
V
V
V
V
1.825
0.9
1.95
2.0
0.95
1.075
VCM ± 50mV
1.0
0.75
1.1
VCM ± 50mV
20
45
65
55
MSPS
%
Low-Level Voltage Clock Input
High-Level Voltage Clock Input
ADCLKP and ADCLKN Outputs (LVDS)
LCLKP and LCLKN Outputs (LVDS)(2)
Operating Free-Air Temperature, TA
Thermal Characteristics:
0.6
V
2.2
20
V
65
MHz
MHz
°C
120
–40
390
+85
θJA
19.4
4.2
°C/W
°C/W
θJC
(1) These voltages need to be set to 1.45V ± 50mV if they are derived independent of VCM
.
(2) 6 × ADCLK.
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
ELECTRICAL CHARACTERISTICS
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per
channel, unless otherwise noted. All values are applicable after the device has been reset.
ADS5277
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
No Missing Codes
Tested
±0.08
±0.09
DNL Differential Nonlinearity
INL Integral Nonlinearity
fIN = 5MHz
fIN = 5MHz
–0.5
–1.0
+0.5
+1.0
LSB
LSB
Offset Error(1)
–0.75
+0.75
%FS
ppm/°C
%FS
dB
Offset Temperature Coefficient
Fixed Attenuation in Channel(2)
Fixed Attenuation Matching Across Channels
Gain Error/ Reference Error(3)
Gain Error Temperature Coefficient
POWER REQUIREMENTS(4)
Internal Reference
±6
1.5
0.01
±1.0
±20
0.2
VREFT – VREFB
–2.5
+2.5
%FS
ppm/°C
Power Dissipation
Analog Only (AVDD)
Output Driver (LVDD)
718
193
911
782
218
mW
mW
mW
Total Power Dissipation
External Reference
1000
Power Dissipation
Analog Only (AVDD)
Output Driver (LVDD)
652
193
845
92
mW
mW
mW
mW
Total Power Dissipation
Total Power-Down
Clock Running
149
REFERENCE VOLTAGES
VREFT Reference Top (internal)
VREFB Reference Bottom (internal)
VCM Common-Mode Voltage
VCM Output Current(5)
1.9
0.9
1.4
1.95
0.95
2.0
1.0
1.5
V
V
1.45
V
50mV Change in Voltage
±2.0
mA
V
VREFT Reference Top (external)
VREFB Reference Bottom (external)
External Reference Common-Mode
External Reference Input Current(6)
1.825
0.9
1.95
2.0
0.95
1.075
V
VCM ± 50mV
1.0
V
mA
(1) Offset error is the deviation of the average code from mid-code with –1dBFS sinusoid from mid-code (512). Offset error is expressed in
terms of % of full-scale.
(2) Fixed attenuation in the channel arises due to a fixed attenuation in the sample-and-hold amplifier. When the differential voltage at the
analog input pins are changed from –VREF to +VREF, the swing of the output code is expected to deviate from the full-scale code
(1024LSB) by the extent of this fixed attenuation. NOTE: VREF is defined as (REFT – REFB).
(3) The reference voltages are trimmed at production so that (VREFT – VREFB) is within ± 25mV of the ideal value of 1V. This specification
does not include fixed attenuation.
(4) Supply current can be calculated from dividing the power dissipation by the supply voltage of 3.3V.
(5) VCM provides the common-mode current for the inputs of all eight channels when the inputs are ac-coupled. The VCM output current
specified is the additional drive of the VCM buffer if loaded externally.
(6) Average current drawn from the reference pins in the external reference mode.
4
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
ELECTRICAL CHARACTERISTICS (continued)
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per
channel, unless otherwise noted. All values are applicable after the device has been reset.
ADS5277
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
ANALOG INPUT
Differential Input Capacitance
4.0
VCM ± 50
2.03
pF
mV
Analog Input Common-Mode Range
Differential Full-Scale Input Voltage Range
Internal Reference
External Reference
VPP
2.03 × (VREFT – VREFB)
3.0
VPP
Voltage Overload Recovery Time(7)
Input Bandwidth
CLK Cycles
–3dBFS, 25Ω Series
300
MHz
Resistances
DIGITAL INPUTS
VIH High Level Input Voltage
VIL Low Level Input Voltage
CIN Input Capacitance
DIGITAL DATA OUTPUTS
Data Format
2.2
0.6
3
V
V
pF
Straight Offset Binary
Data Bit Rate
240
780
Mbps
MHz
SERIAL INTERFACE
SCLK Serial Clock Input Frequency
20
(7) A differential ON/OFF pulse is applied to the ADC input. The differential amplitude of the pulse in its ON (high) state is twice the
full-scale range of the ADC, while the differential amplitude of the pulse in its OFF (low) state is zero. The overload recovery time of the
ADC is measured as the time required by the ADC output code to settle within 1% of full-scale, as measured from its mid-code value
when the pulse is switched from ON (high) to OFF (low).
REFERENCE SELECTION
MODE
INT/EXT
DESCRIPTION
Internal Reference; FSR = 2.03VPP
1
Default with internal pull-up.
Internal reference is powered down. The common-mode voltage
of the external reference should be within 50mV of VCM. VCM is
derived from the internal bandgap voltage.
External Reference; FSR = 2.03 × (VREFT – VREFB)
0
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
AC CHARACTERISTICS
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = +25°C, clock frequency = maximum specified, 50% clock duty
cycle, AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer at 3.5mA per
channel, unless otherwise noted.
ADS5277
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DYNAMIC CHARACTERISTICS
fIN = 1MHz
fIN = 5MHz
fIN = 10MHz
fIN = 20MHz
fIN = 1MHz
fIN = 5MHz
fIN = 10MHz
fIN = 20MHz
fIN = 1MHz
fIN = 5MHz
fIN = 10MHz
fIN = 20MHz
fIN = 1MHz
fIN = 5MHz
fIN = 10MHz
fIN = 20MHz
fIN = 1MHz
fIN = 5MHz
fIN = 10MHz
fIN = 20MHz
fIN = 5MHz
84
85
dBc
dBc
75
SFDR Spurious-Free Dynamic Range
HD2 2nd-Order Harmonic Distortion
HD3 3rd-Order Harmonic Distortion
SNR Signal-to-Noise Ratio
84
dBc
81
dBc
97
dBc
82
75
95
dBc
90
dBc
84
dBc
90
dBc
88
dBc
88
dBc
85
dBc
61.7
61.7
61.7
61.6
61.7
61.7
61.7
61.6
10
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
Bits
60.5
60.4
9.7
SINAD Signal-to-Noise and Distortion
ENOB Effective Number of Bits
Crosstalk
5MHz Full-Scale Signal Applied to 7 Channels;
Measurement Taken on the Channel with No Input Signal
–89
93
dBc
f1 = 9.5MHz at –7dBFS
f2 = 10.2MHz at –7dBFS
Two-Tone, Third-Order
IMD3
dBFS
Intermodulation Distortion
6
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
LVDS DIGITAL DATA AND CLOCK OUTPUTS
Test conditions at IO = 3.5mA, RLOAD = 100Ω, CLOAD = 6pF, and 50% duty cycle. IO refers to the current setting for the LVDS buffer. RLOAD is
the differential load resistance between the differential LVDS pair. CLOAD is the effective single-ended load capacitance between each of the
LVDS pins and ground. CLOAD includes the receiver input parasitics as well as the routing parasitics. Measurements are done with a 1-inch
transmission line of 100Ω characteristic impedance between the device and the load. All LVDS specifications are characterized, but not
parametrically tested at production. LCLKOUT refers to (LCLKP – LCLKN); ADCLKOUT refers to (ADCLKP – ADCLKN); DATA OUT refers to
(OUTP – OUTN); and ADCLK refers to the input sampling clock.
PARAMETER
DC SPECIFICATIONS(1)
CONDITIONS
MIN
TYP
MAX
UNITS
VOH Output Voltage High, OUTP or OUTN
VOL Output Voltage Low, OUTP or OUTN
RLOAD = 100Ω ± 1%; See LVDS Timing Diagram, Page 8
RLOAD = 100Ω ± 1%
1265
940
275
1.1
1365
1040
325
1.2
13
1465
1140
375
mV
mV
mV
V
|VOD
|
Output Differential Voltage
RLOAD = 100Ω ± 1%
VOS Output Offset Voltage(2)
RO Output Impedance, Differential
RO Output Impedance, Differential
CO Output Capacitance(3)
RLOAD = 100Ω ± 1%; See LVDS Timing Diagram, Page 8
Normal Operation
1.3
kΩ
kΩ
pF
Power-Down
20
4
|ΔVOD
|
Change in |VOD| Between 0 and 1
RLOAD = 100Ω ± 1%
RLOAD = 100Ω ± 1%
10
25
40
12
mV
mV
mA
mA
ΔVOS Change Between 0 and 1
ISOUT Output Short-Circuit Current
ISOUTNP Output Current
Drivers Shorted to Ground
Drivers Shorted Together
DRIVER AC SPECIFICATIONS
ADCLKOUT Clock Duty Cycle(4)
LCLKOUT Duty Cycle(4)
45
40
50
50
55
60
%
%
Data Setup Time(5)(6)
Data Hold Time(6)(7)
LVDS Outputs Rise/Fall Time(8)
0.4
0.25
ns
ns
ps
ps
ps
ps
ns
ns
ns
IO = 2.5mA
IO = 3.5mA
IO = 4.5mA
IO = 6.0mA
400
300
230
180
0.64
0.64
0
180
500
LCLKOUT Rising Edge to ADCLKOUT Rising Edge(9)
ADCLKOUT Rising Edge to LCLKOUT Falling Edge(9)
ADCLKOUT Rising Edge to DATA OUT Transition(9)
0.37
0.37
–0.3
0.9
0.9
+0.3
(1) The dc specifications refer to the condition where the LVDS outputs are not switching, but are permanently at a valid logic level 0 or 1.
(2) VOS refers to the common-mode of OUTP and OUTN.
(3) Output capacitance inside the device, from either OUTP or OUTN to ground.
(4) Measured between zero crossings.
(5) DATA OUT (OUTP – OUTN) crossing zero to LCLKOUT(LCLKP – LCLKN) crossing zero.
(6) Data setup and hold time accounts for data-dependent skews, channel-to-channel mismatches, as well as effects of clock jitter within
the device.
(7) LCLKOUT crossing zero to DATA OUT crossing zero.
(8) Measured from –100mV to +100mV on the differential output for rise time, and +100mV to –100mV for fall time.
(9) Measured between zero crossings.
SWITCHING CHARACTERISTICS
TMIN = –40°C and TMAX = +85°C. Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless
otherwise noted.
PARAMETER
MIN
TYP
MAX
UNITS
SWITCHING SPECIFICATIONS
tSAMPLE
15.4
2
50
ns
ns
tD(A) Aperture Delay(1)
Aperture Jitter (uncertainty)
tD(pipeline) Latency
tPROP Propagation Delay(2)
4
6.5
1
ps rms
cycles
ns
6.5
4.8
3
6.5
(1) Rising edge of ADCLK (input clock close to the ADC) to actual instant when data is sampled within the ADC.
(2) Falling edge of ADCLK to zero-crossing of rising edge of ADCLKOUT (ADCLKP – ADCLKN).
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
LVDS TIMING DIAGRAM (Per ADC Channel)
Sample n
Sample n + 6
Input
1
tSAMPLE
ADCLK
tS
2
LCLKP
6X ADCLK
LCLKN
OUTP
D8 D9
SERIAL DATA
OUTN
0
0
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9
0
0
D0 D1 D2 D3 D4 D5 D6 D7
Sample n data
0
0
ADCLKP
1X ADCLK
ADCLKN
tD(A)
tPROP
6.5 Clock Cycles
NOTE: Serial data bit format shown in LSB first mode.
RECOMMENDED POWER-UP SEQUENCING AND RESET TIMING
AVDD (3V to 3.6V)
t1
AVDD
LVDD (3V to 3.6V)
t2
LVDD
Device Ready
For ADC Operation
t3
t4
t7
t5
t6
RESET
CS
Device Ready
For Serial Register Write
Device Ready
Start of Clock
For ADC Operation
ADCLK
t8
NOTE: 10 s < t1 < 50ms; 10 s < t2 < 50ms; 10ms < t3 < 10ms; t4 > 10ms; t5 > 100ns; t6 > 100ns; t7 > 10ms; and t8 > 100 s.
µ
µ
−
µ
8
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
POWER-DOWN TIMING
µ
1 s
µ
500 s
PD
Device Fully
Powers Down
Device Fully
Powers Up
µ
NOTE: The shown power−up time is based on 1 F bypass capacitors on the reference pins.
Apply a reset to the ADS5277 after power−up. See the Theory of Operation section for details.
SERIAL INTERFACE TIMING
Outputs change on
next rising clock edge
after CS goes high.
ADCLK
CS
Start Sequence
t6
t1
t7
Data latched on
each rising edge of SCLK.
t2
SCLK
t3
D7
(MSB)
SDATA
D6
D5
D4
D3
D2
D1
D0
t4
t5
NOTE: Data is shifted in MSB first.
PARAMETER
DESCRIPTION
Serial CLK Period
MIN
50
20
20
5
TYP
MAX
UNIT
ns
t1
t2
t3
t4
t5
t6
t7
Serial CLK High Time
Serial CLK Low Time
ns
ns
Minimum Data Setup Time
Minimum Data Hold Time
CS Fall to SCLK Rise
ns
5
ns
8
ns
SCLK Rise to CS Rise
8
ns
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
SERIAL INTERFACE REGISTERS
ADDRESS
DATA
DESCRIPTION
REMARKS
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
LVDS BUFFERS (Register 0)
Normal ADC Output
All Data Outputs
0
0
1
1
0
1
0
1
(default after reset)
Deskew Pattern
Sync Pattern
See Test Patterns
Custom Pattern
0
0
1
1
0
1
0
1
Output Current in LVDS = 3.5mA
Output Current in LVDS = 2.5mA
Output Current in LVDS = 4.5mA
Output Current in LVDS = 6.0mA
CLOCK CURRENT (Register 1)
Default LVDS Clock Output Current
2X LVDS Clock Output Current(1)
LSB/MSB MODE (Register 1)
LSB First Mode
(default after reset)
0
0
0
0
0
0
0
0
1
1
1
0
0
0
X
X
X
X
0
1
IOUT = 3.5mA (default)
IOUT = 7.0mA
0
0
0
1
X
X
X
X
(default after reset)
MSB First Mode
POWER-DOWN ADC CHANNELS
(Register 2)
X
X
X
X
X
X
X
X
Example: 1010 Powers Down
Channels 4 and 2 and
Keeps Channels 1 and 3 Active
Power-Down Channels 1 to 4; D3 is
for Channel 4 and D0 for Channel 1
0
0
1
1
POWER-DOWN ADC CHANNELS
(Register 3)
Power-Down Channels 5 to 8; D3 is
for Channel 8 and D0 for Channel 5
CUSTOM PATTERN (Registers 4–6)
D3
X
D2
X
D1
X
D0
X
Bits for Custom Pattern
See Test Patterns
0
0
0
1
1
1
0
0
1
0
1
0
X
X
X
X
X
X
X
X
(1) Output current drive for the two clock LVDS buffers (LCLKP and LCLKN and ADCLKP and ADCLKN) is double the output current setting
programmed in register 0. The current drive of the data buffers remains the same as the setting in register 0.
TEST PATTERNS
Serial Output(1)
ADC Output(2)
Deskew Pattern
Sync Pattern
LSB
MSB
D9
0
1
0
0
D0
1
D1
0
D2
1
D3
0
D4
1
D5
0
D6
1
D7
0
D8
1
0
0
0
0
0
0
0
1
1
1
1
1
1
Custom Pattern(3)
D0(4)
D1(4)
D2(4)
D3(4)
D0(5)
D1(5)
D2(5)
D3(5)
D0(6)
D1(6)
D2(6)
D3(6)
(1) The serial output stream comes out LSB first by default.
(2) D9...D0 represent the ten output bits from the ADC.
(3) D0(4) represents the content of bit D0 of register 4, D3(6) represents the content of bit D3 of register 6, etc.
10
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
PIN CONFIGURATION
Top View
HTQFP
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
60
59
1
2
AVDD
IN8N
AVDD
IN1P
58 IN8P
57
IN1N
3
4
AVSS
AVSS
IN2P
56 IN7N
55 IN7P
5
IN2N
6
54
7
AVDD
AVDD
AVSS
IN3P
53 AVSS
8
52
51
50
9
IN6N
IN6P
10
11
IN3N
ADS5277
AVSS
AVSS
49 IN5N
48
IN4P 12
13
IN5P
IN4N
47 AVDD
46 LVSS
AVDD 14
LVSS 15
45
16
RESET
PD
44 LVSS
LVSS 17
43
42
41
18
19
20
LVSS
LVSS
LCLKP
LCLKN
ADCLKN
ADCLKP
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
PIN DESCRIPTIONS
NAME
ADCLK
ADCLKN
ADCLKP
AVDD
AVSS
CS
PIN #
I/O DESCRIPTION
71
I
O
O
I
Data Converter Clock Input
42
Negative LVDS ADC Clock Output
41
Positive LVDS ADC Clock Output
1, 7, 14, 47, 54, 60, 63, 70, 75
Analog Power Supply
4, 8, 11, 50, 53, 57, 61, 62, 68, 72-74, 79, 80
I
Analog Ground
76
I
Chip Select; 0 = Select, 1 = No Select
Channel 1 Differential Analog Input Low
Channel 1 Differential Analog Input High
Channel 2 Differential Analog Input Low
Channel 2 Differential Analog Input High
Channel 3 Differential Analog Input Low
Channel 3 Differential Analog Input High
Channel 4 Differential Analog Input Low
Channel 4 Differential Analog Input High
Channel 5 Differential Analog Input Low
Channel 5 Differential Analog Input High
Channel 6 Differential Analog Input Low
Channel 6 Differential Analog Input High
Channel 7 Differential Analog Input Low
Channel 7 Differential Analog Input High
Channel 8 Differential Analog Input Low
Channel 8 Differential Analog Input High
Internal/External Reference Select; 0 = External, 1 = Internal. Weak pull-up to supply.
IN1N
3
I
IN1P
2
I
IN2N
6
I
IN2P
5
I
IN3N
10
I
IN3P
9
I
IN4N
13
I
IN4P
12
I
IN5N
49
I
IN5P
48
I
IN6N
52
I
IN6P
51
I
IN7N
56
I
IN7P
55
I
IN8N
59
I
IN8P
58
I
INT/EXT
ISET
69
I
64
I/O Bias Current Setting Resistor of 56.2kΩ to Ground
LCLKN
LCLKP
LVDD
LVSS
OUT1N
OUT1P
OUT2N
OUT2P
OUT3N
OUT3P
OUT4N
OUT4P
OUT5N
OUT5P
OUT6N
OUT6P
OUT7N
OUT7P
OUT8N
OUT8P
PD
20
O
O
I
Negative LVDS Clock
19
Positive LVDS Clock
25, 35
LVDS Power Supply
15, 17, 18, 26, 36, 43, 44, 46
I
LVDS Ground
22
21
24
23
28
27
30
29
32
31
34
33
38
37
40
39
16
66
67
45
78
77
65
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
Channel 1 Negative LVDS Data Output
Channel 1 Positive LVDS Data Output
Channel 2 Negative LVDS Data Output
Channel 2 Positive LVDS Data Output
Channel 3 Negative LVDS Data Output
Channel 3 Positive LVDS Data Output
Channel 4 Negative LVDS Data Output
Channel 4 Positive LVDS Data Output
Channel 5 Negative LVDS Data Output
Channel 5 Positive LVDS Data Output
Channel 6 Negative LVDS Data Output
Channel 6 Positive LVDS Data Output
Channel 7 Negative LVDS Data Output
Channel 7 Positive LVDS Data Output
Channel 8 Negative LVDS Data Output
Channel 8 Positive LVDS Data Output
Power-Down; 0 = Normal, 1 = Power-Down. Weak pull-down to ground.
REFB
REFT
RESET
SCLK
SDATA
VCM
I/O Reference Bottom Voltage (2Ω resistor in series with a capacitor ≥ 0.1F to ground)
I/O Reference Top Voltage (2Ω resistor in series with a capacitor ≥ 0.1F to ground)
I
I
Reset to Default; 0 = Reset, 1 = Normal. Weak pull-down to ground.
Serial Data Clock
I
Serial Data input
O
Common-Mode Output Voltage
12
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
DEFINITION OF SPECIFICATIONS
Analog Bandwidth
Minimum Conversion Rate
The analog input frequency at which the spectral
power of the fundamental frequency (as determined
by FFT analysis) is reduced by 3dB.
This is the minimum sampling rate where the ADC
still works.
Signal-to-Noise and Distortion (SINAD)
Aperture Delay
SINAD is the ratio of the power of the fundamental
(PS) to the power of all the other spectral components
including noise (PN) and distortion (PD), but not
including dc.
The delay in time between the rising edge of the input
sampling clock and the actual time at which the
sampling occurs.
PS
SINAD + 10Log
10 PN ) PD
Aperture Uncertainty (Jitter)
The sample-to-sample variation in aperture delay.
SINAD is either given in units of dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference, or dBFS (dB to full-scale) when the
power of the fundamental is extrapolated to the
full-scale range of the converter.
Clock Duty Cycle
Pulse width high is the minimum amount of time that
the ADCLK pulse should be left in logic ‘1’ state to
achieve rated performance. Pulse width low is the
minimum time that the ADCLK pulse should be left in
a low state (logic ‘0’). At a given clock rate, these
specifications define an acceptable clock duty cycle.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the power of the fundamental (PS)
to the noise floor power (PN), excluding the power at
dc and the first eight harmonics.
PS
SNR + 10Log
10 PN
Differential Nonlinearity (DNL)
An ideal ADC exhibits code transitions that are
exactly 1 LSB apart. DNL is the deviation of any
single LSB transition at the digital output from an
ideal 1 LSB step at the analog input. If a device
claims to have no missing codes, it means that all
possible codes (for a 10-bit converter, 1024 codes)
are present over the full operating range.
SNR is either given in units of dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference, or dBFS (dB to full-scale) when the
power of the fundamental is extrapolated to the
full-scale range of the converter.
Effective Number of Bits (ENOB)
Spurious-Free Dynamic Range
The ENOB is a measure of converter performance as
compared to the theoretical limit based on
quantization noise.
The ratio of the power of the fundamental to the
highest other spectral component (either spur or
harmonic). SFDR is typically given in units of dBc (dB
to carrier).
SINAD * 1.76
ENOB +
6.02
Two-Tone, Third-Order Intermodulation
Distortion
Integral Nonlinearity (INL)
INL is the deviation of the transfer function from a
reference line measured in fractions of 1 LSB using a
best straight line or best fit determined by a least
square curve fit. INL is independent from effects of
offset, gain or quantization errors.
Two-tone IMD3 is the ratio of power of the
fundamental (at frequencies f1 and f2) to the power of
the worst spectral component of third-order
intermodulation distortion at either frequency 2f1 – f2
or 2f2 – f1. IMD3 is either given in units of dBc (dB to
carrier) when the absolute power of the fundamental
is used as the reference, or dBFS (dB to full-scale)
when the power of the fundamental is extrapolated to
the full-scale range of the converter.
Maximum Conversion Rate
The encode rate at which parametric testing is
performed. This is the maximum sampling rate where
certified operation is given.
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS
TMIN = –40C and TMAX = +85C. Typical values are at TA = +25C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, LVDS buffer current at 3.5mA per channel,
16kFFT, and 8 averages, unless otherwise noted.
SPECTRAL PERFORMANCE
SPECTRAL PERFORMANCE
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
−
fIN = 1MHz, 1dBFS
SNR = 61.8dBFS
SINAD = 61.7dBFS
SFDR = 84dBc
−
fIN = 5MHz, 1dBFS
SNR = 61.7dBFS
SINAD = 61.7dBFS
SFDR = 85dBc
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
16 Averages
16 Averages
−
−
−
−
100
110
100
110
0
0
0
0
5
10
15
20
25
30 32.5
5
10
15
20
25
30 32.5
Input Frequency (MHz)
Input Frequency (MHz)
Figure 1.
Figure 2.
SPECTRAL PERFORMANCE
SPECTRAL PERFORMANCE
0
0
−
−
fIN = 10MHz, 1dBFS
SNR = 61.8dBFS
SINAD = 61.7dBFS
SFDR = 84dBc
fIN = 20MHz, 1dBFS
SNR = 61.6dBFS
SINAD = 61.6dBFS
SFDR = 81dBc
−
−
−
−
−
−
−
−
−
−
10
20
30
40
50
60
70
80
90
10
20
30
40
50
60
70
80
90
−
−
−
−
−
−
−
−
16 Averages
16 Averages
−
−
−
−
100
110
100
110
0
5
10
15
20
25
30 32.5
5
10
15
20
25
30 32.5
Input Frequency (MHz)
Input Frequency (MHz)
Figure 3.
Figure 4.
TWO-TONE INTERMODULATION DISTORTION
DIFFERENTIAL NONLINEARITY
0.15
0.10
0.05
0
0
f1 = 9.5MHz
f2 = 10.2MHz
fIN = 5MHz
−
−
−
−
−
−
−
−
−
10
20
30
40
50
60
70
80
90
2−ToneIMD = 93dBFS
16 k−Point Data
16 Averages
−
−
−
0.05
0.10
0.15
−
−
100
110
0
256
512
Code
768
1024
5
10
15
20
25
30 32.5
Input Frequency (MHz)
Figure 5.
Figure 6.
14
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
TYPICAL CHARACTERISTICS (continued)
TMIN = –40C and TMAX = +85C. Typical values are at TA = +25C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, LVDS buffer current at 3.5mA per channel,
16kFFT, and 8 averages, unless otherwise noted.
INTEGRAL NONLINEARITY
SNR vs INPUT FREQUENCY
External Reference
0.15
0.10
0.05
0
64
63
62
61
60
59
58
57
56
fIN = 5MHz
REFT = 1.95V
REFB = 0.95V
−
0.05
0.10
0.15
−
−
0
128
256
384
512
640
768
896 1024
0
0
0
10
10
10
20
30
40
50
60
70
Code
Input Frequency (MHz)
Figure 7.
SINAD vs INPUT FREQUENCY
Figure 8.
SFDR vs INPUT FREQUENCY
64
63
62
61
60
59
58
57
56
95
90
85
80
75
70
65
60
External Reference
REFT = 1.95V
External Reference
REFT = 1.95V
REFB = 0.95V
REFB = 0.95V
0
10
20
30
40
50
60
70
20
30
40
50
60
70
Input Frequency (MHz)
Input Frequency (MHz)
Figure 9.
Figure 10.
SNR vs INPUT FREQUENCY
Internal Reference
SINAD vs INPUT FREQUENCY
66
64
62
60
58
56
54
66
64
62
60
58
56
54
Internal Reference
0
10
20
30
40
50
60
70
20
30
40
50
60
70
Input Frequency (MHz)
Input Frequency (MHz)
Figure 11.
Figure 12.
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS (continued)
TMIN = –40C and TMAX = +85C. Typical values are at TA = +25C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, LVDS buffer current at 3.5mA per channel,
16kFFT, and 8 averages, unless otherwise noted.
SFDR vs INPUT FREQUENCY
SWEPT POWER — SNR
95
90
85
80
75
70
65
60
70
60
50
40
30
20
10
0
Internal Reference
dB FS
dBc
fIN = 10MHz
−
50
−
50
−
50
−
−
−
−
10
40
30
20
0
0
0
0
10
20
30
40
50
60
70
Input Frequency (MHz)
Input Amplitude (dBFS)
Figure 13.
Figure 14.
SWEPT POWER — SFDR
SWEPT POWER — SINAD
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
dBFS
dB FS
dBc
dBc
fIN = 10MHz
fIN = 10MHz
−
−
−
−
10
40
30
20
−
−
−
−
−
10
50
40
30
20
0
Input Amplitude (dBFS)
Input Amplitude (dBFS)
Figure 15.
Figure 16.
SWEPT POWER — SNR
SWEPT POWER — SINAD
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
dBFS
dBFS
dBc
dBc
fIN = 5MHz
fIN = 5MHz
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
5
60
45
40
35
30
25
20
15
10
5
0
45
40
35
30
25
20
15
10
Input Amplitude (dBFS)
Input Amplitude (dBFS)
Figure 17.
Figure 18.
16
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
TYPICAL CHARACTERISTICS (continued)
TMIN = –40C and TMAX = +85C. Typical values are at TA = +25C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, LVDS buffer current at 3.5mA per channel,
16kFFT, and 8 averages, unless otherwise noted.
SWEPT POWER — SFDR
SNR vs DUTY CYCLE
90
80
70
60
50
40
30
20
10
0
65
64
63
62
61
60
59
58
fIN = 5MHz
dBFS
dBc
fIN = 5MHz
−
−
−
−
−
−
−
−
−
−
5
50
45
40
35
30
25
20
15
10
0
35
35
20
40
45
50
55
60
65
Input Amplitude (dBFS)
Duty Cycle (%)
Figure 20.
Figure 19.
SINAD vs DUTY CYCLE
SFDR vs DUTY CYCLE
95
90
85
80
75
70
65
65
64
63
62
61
60
59
58
fIN = 5MHz
fIN = 5MHz
35
40
45
50
55
60
65
40
45
50
55
60
65
Duty Cycle (%)
Duty Cycle (%)
Figure 21.
Figure 22.
SNR vs SAMPLE RATE
SINAD vs SAMPLE RATE
66
64
62
60
58
56
54
66
64
62
60
58
56
54
fIN = 5MHz
fIN = 5MHz
20
25
30
35
40
45
50
55
60
65
25
30
35
40
45
50
55
60
65
Sample Rate (MSPS)
Sample Rate (MSPS)
Figure 23.
Figure 24.
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS (continued)
TMIN = –40C and TMAX = +85C. Typical values are at TA = +25C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, LVDS buffer current at 3.5mA per channel,
16kFFT, and 8 averages, unless otherwise noted.
SFDR vs SAMPLE RATE
SNR vs SAMPLE RATE
88
86
84
82
80
78
76
64
63
62
61
60
59
58
fIN = 5MHz
fIN = 10MHz
20
25
30
35
40
45
50
55
60
65
20
20
10
25
30
35
40
45
50
55
60
65
65
70
Sample Rate (MSPS)
Sample Rate (MSPS)
Figure 25.
Figure 26.
SINAD vs SAMPLE RATE
SFDR vs SAMPLE RATE
90
86
82
78
74
70
64
63
62
61
60
59
58
fIN = 10MHz
fIN = 10MHz
25
30
35
40
45
50
55
60
20
25
30
35
40
45
50
55
60
65
Sample Rate (MSPS)
Sample Rate (MSPS)
Figure 27.
Figure 28.
CURRENT vs SAMPLE RATE
TOTAL POWER vs SAMPLE RATE
300
250
200
150
100
50
950
900
850
800
750
700
650
600
IAVDD
ILVDD
0
20
30
40
50
60
0
10
20
40
40
50
60
70
Sample Rate (MSPS)
Sample Rate (MSPS)
Figure 29.
Figure 30.
18
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
TYPICAL CHARACTERISTICS (continued)
TMIN = –40C and TMAX = +85C. Typical values are at TA = +25C, sampling rate = 65MSPS, 50% clock duty cycle,
AVDD = 3.3V, LVDD = 3.3V, –1dBFS, ISET = 56.2kΩ, internal voltage reference, LVDS buffer current at 3.5mA per channel,
16kFFT, and 8 averages, unless otherwise noted.
TOTAL POWER vs TEMPERATURE
SNR vs TEMPERATURE
975
950
925
900
875
850
825
65
64
63
62
61
60
59
58
−
−
−
−
15
40
15
+10
+35
+60
+85
40
+10
+35
+60
+85
_
_
Temperature ( C)
Temperature ( C)
Figure 31.
Figure 32.
SINAD vs TEMPERATURE
65
64
63
62
61
60
59
58
−
−
15
40
+10
+35
+60
+85
_
Temperature ( C)
Figure 33.
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
THEORY OF OPERATION
transmit data externally has multiple advantages,
such as a reduced number of output pins (saving
routing space on the board), reduced power
consumption, and reduced effects of digital noise
coupling to the analog circuit inside the ADS5277.
OVERVIEW
The ADS5277 is an 8-channel, high-speed, CMOS
ADC.
It
consists
of
a
high-performance
sample-and-hold circuit at the input, followed by a
10-bit ADC. The 10 bits given out by each channel
are serialized and sent out on a single pair of pins in
LVDS format. All eight channels of the ADS5277
operate from a single clock referred to as ADCLK.
The sampling clocks for each of the eight channels
are generated from the input clock using a carefully
matched clock buffer tree. The 12x clock required for
the serializer is generated internally from ADCLK
using a phase lock loop (PLL). A 6x and a 1x clock
are also output in LVDS format along with the data to
enable easy data capture. The ADS5277 operates
from internally-generated reference voltages that are
trimmed to improve the accuracy of the device. This
feature eliminates the need for external routing of
reference lines and also improves gain matching
across devices. The nominal values of REFT and
REFB are 1.95V and 0.95V, respectively. These
The ADS5277 operates from two sets of supplies and
grounds. The analog supply/ground set is denoted as
AVDD/AVSS, while the digital set is denoted by
LVDD/LVSS.
DRIVING THE ANALOG INPUTS
The analog input biasing is shown in Figure 34. The
inputs are biased internally using two 600Ω resistors
to enable ac-coupling. A resistor greater than 20Ω is
recommended in series with each input pin.
A 4pF sampling capacitor is used to sample the
inputs. The choice of the external ac coupling
capacitor is dictated by the attenuation at the lowest
desired input frequency of operation. The attenuation
resulting from using a 10nF ac coupling capacitor is
0.04%.
values imply that
a
differential input of –1V
corresponds to the zero code of the ADC, and a
differential input of +1V corresponds to the full-scale
code (1024LSB). VCM (common-mode voltage of
REFT and REFB) is also made available externally
through a pin, and is nominally 1.45V.
ADS5277
IN+
Ω
Ω
600
Input
Circuitry
The ADC employs a pipelined converter architecture
consisting of a combination of multi-bit and single-bit
internal stages. Each stage feeds its data into the
digital error correction logic, ensuring excellent
differential linearity and no missing codes at the
10-bit level. The pipeline architecture results in a data
latency of 6.5 clock cycles.
600
−
IN
Internal
Voltage
Reference
VCM
CM Buffer
The output of the ADC goes to a serializer that
operates from a 12x clock generated by the PLL. The
10 data plus two padded bits from each channel are
serialized and sent LSB first. In addition to serializing
the data, the serializer also generates a 1x clock and
a 6x clock. These clocks are generated in the same
way the serialized data is generated, so these clocks
maintain perfect synchronization with the data. The
data and clock outputs of the serializer are buffered
externally using LVDS buffers. Using LVDS buffers to
NOTE: Dashed area denotes one of eight channels.
Figure 34. Analog Input Bias Circuitry
If the input is dc-coupled, then the output
common-mode voltage of the circuit driving the
ADS5277 should match the VCM (which is provided as
an output pin) to within 50mV. It is recommended that
the output common-mode of the driving circuit be
derived from VCM provided by the device.
20
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
Figure 35 shows a detailed RLC model of the
sample-and-hold circuit. The circuit operates in two
phases. In the sample phase, the input is sampled on
two capacitors that are nominally 4pF. The sampling
circuit consists of a low-pass RC filter at the input to
filter out noise components that might be differentially
coupled on the input pins. The next phase is the hold
phase wherein the voltage sampled on the capacitors
is transferred (using the amplifier) to a subsequent
pipeline ADC stage.
over-voltage pulse input of twice the amplitude of a
full-scale pulse is expected to be within three clock
cycles when the input switches from overload to zero
signal. All of the amplifiers in the SHA and ADC are
specially designed for excellent recovery from an
overload signal.
In most applications, the ADC inputs are driven with
differential sinusoidal inputs. While the pulse-type
signal remains at peak overload conditions
throughout its HIGH state, the sinusoid signal only
attains peak overload intermittently, at its minima and
maxima. This condition is much less severe for the
ADC input and the recovery of the ADC output (to 1%
of full-scale around the expected code). This typically
happens within the second clock when the input is
driven with a sinusoid of amplitude equal to twice that
of the ADC differential full-scale range.
INPUT OVER-VOLTAGE RECOVERY
The differential full-scale range supported by the
ADS5277 is nominally 2.03V. The ADS5277 is
specially designed to handle an over-voltage
condition where the differential peak-to-peak voltage
can exceed up to twice the ADC full-scale range. If
the input common-mode is not considerably off from
VCM during overload (less than 300mV around the
nominal value of 1.45V), recovery from an
IN
OUT
5nH
to 9nH
INP
1.5pF to
2.5pF
3.2pF
to 4.8pF
Ω
Ω
Ω
to 25
Ω
60
Ω
to 120
15
15
Ω
to 25
Ω
1
IN
OUT
IN
OUT
Ω
500
Ω
to 720
OUT
OUTP
OUTN
1.5pF
to 1.9pF
IN
Ω
500
Ω
to 720
Ω
Ω
15 to 35
3.2pF
to 4.8pF
Ω
Ω
Ω
60
Ω
to 120
15
15
Ω
to 25
Ω
to 25
IN
OUT
IN
OUT
5nH
to 9nH
INN
1.5pF to
2.5pF
Switches that are ON
in SAMPLE phase.
Ω
1
Switches that are ON
in HOLD phase.
IN
OUT
Figure 35. Overall Structure of the Sample-and-Hold Circuit
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
21
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
REFERENCE CIRCUIT DESIGN
The device also supports the use of external
reference voltages. This mode involves forcing REFT
and REFB externally and the internal reference buffer
is tri-stated. Since the switching current for the eight
ADCs come from the externally-forced references, it
is possible for the performance to be slightly less than
when the internal references are used. It should be
noted that in this mode, VCM and ISET continue to be
generated from the internal bandgap voltage, as in
the internal reference mode. It is therefore important
to ensure that the common-mode voltage of the
externally-forced reference voltages matches to
within 50mV of VCM. The state of the reference
voltages during various combinations of PD and
INT/EXT is shown in Table 1.
The digital beam-forming algorithm relies on gain
matching across all receiver channels. A typical
system would have about 12 octal ADCs on the
board. In such a case, it is critical to ensure that the
gain is matched, essentially requiring the reference
voltages seen by all the ADCs to be the same.
Matching references within the eight channels of a
chip is done by using a single internal reference
voltage buffer. Trimming the reference voltages on
each chip during production ensures the reference
voltages are well-matched across different chips.
All bias currents required for the internal operation of
the device are set using an external resistor to
ground at pin ISET. Using a 56.2kΩ resistor on ISET
generates an internal reference current of 20A. This
current is mirrored internally to generate the bias
current for the internal blocks. Using a larger external
resistor at ISET reduces the reference bias current,
and thereby scales down the device operating power.
However, it is recommended that the external resistor
be within 10% of the specified value of 56.2kΩ so
that the internal bias margins for the various blocks
are proper.
Table 1. State of Reference Voltages for Various
Combinations of PD and INT/EXT
PD
INT/EXT
REFT
REFB
VCM
0
0
1
1
0
1
0
1
Tri-State
Tri-State
1.45V
1.95V
0.95V
1.45V
Tri-State
Tri-State
Tri-State(1) Tri-State(1)
Tri-State
Tri-State
(1) Weak pull-down (approximately 5kΩ) to ground.
Buffering the internal bandgap voltage also generates
a voltage called VCM, which is set to the midlevel of
REFT and REFB, and is accessible on a pin. It is
meant as a reference voltage to derive the input
common-mode in case the input is directly coupled. It
can also be used to derive the reference
common-mode voltage in the external reference
mode.
CLOCKING
The eight channels on the chip operate from a single
ADCLK input. To ensure that the aperture delay and
jitter are same for all the channels, a clock tree
network is used to generate individual sampling
clocks to each channel. The clock paths for all the
channels are matched from the source point all the
way to the sample-and-hold amplifier. This ensures
that the performance and timing for all the channels
are identical. The use of the clock tree for matching
introduces an aperture delay, which is defined as the
delay between the rising edge of ADCLK and the
actual instant of sampling. The aperture delays for all
the channels are matched to the best possible extent.
However, a mismatch of ±20ps (±3σ) could exist
between the aperture instants of the eight ADCs
within the same chip. However, the aperture delays of
ADCs across two different chips can be several
hundred picoseconds apart. Another critical
specification is the aperture jitter that is defined as
the uncertainty of the sampling instant. The gates in
the clock path are designed to provide an rms jitter of
approximately 1ps.
When using the internal reference mode, a 2Ω
resistor should be added between the reference pins
(REFT and REFB) and the decoupling capacitor, as
shown in Figure 36. If the device is used in the
external reference mode, this 2Ω resistor is not
required.
ADS5277
ISET
REFT
REFB
Ω
56.2k
Ω
2
Ω
2
µ
µ
µ
µ
0.1 F
0.1
F
2.2
F
2.2
F
Ideally the input ADCLK should have a 50% duty
cycle. However, while routing ADCLK to different
components on board, the duty cycle of the ADCLK
reaching the ADS5277 could deviate from 50%. A
smaller (or larger) duty cycle reduces the time
available for sample or hold phases of each circuit,
and is therefore not optimal. For this reason, the
internal PLL is used to generate an internal clock that
Figure 36. Internal Reference
22
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
has 50% duty cycle. The input sampling instant,
however, is determined by the rising edge of the
external clock and is not affected by the jitter in the
PLL. In addition to generating a 50% duty cycle clock
for the ADC, the PLL also generates a 12x clock that
is used by the serializer to convert the parallel data
from the ADC to a serial stream of bits.
The LVDS buffer receives data from a serializer that
takes the output data from each channel and
serializes it into a single data stream. For a clock
frequency of 65MHz, the data rate output by the
serializer is 780Mbps. The data comes out LSB first,
with a register programmability that allows it to revert
to MSB first. The serializer also transmits a 1x clock
and
a
6x clock. The 6x clock (denoted as
The use of the PLL automatically dictates the
minimum sample rate to be about 20MSPS. The PLL
also requires the input clock to be free-running. If the
input clock is momentarily stopped (for a duration
less than 300ns), then the PLL would require
approximately 10µs to lock back to the input clock
frequency.
LCLKP/LCLKN) is meant to synchronize the capture of
the LVDS data. Deskew mode can be enabled as
well, using a register setting. This mode gives out a
data stream of alternate 0s and 1s and can be used
determine the relative delay between the 6x clock
and the output data for optimum capture. A 1x clock
is also generated by the serializer and transmitted
through the LVDS buffer. The 1x clock (referred to as
ADCLKP/ADCLKN) is used to determine the start of
the 12-bit data frame. Sync mode (enabled through a
register setting) gives out a data of six 0s followed by
six 1s. Using this mode, the 1x clock can be used to
determine the start of the data frame. In addition to
the deskew mode pattern and the sync mode pattern,
a custom pattern can be defined by the user and
output from the LVDS buffer. The LVDS buffers are
tri-stated in the power-down mode. The LVDS outputs
are weakly forced to 1.2V through 10kΩ resistors
(from each output pin to 1.2V).
LVDS BUFFERS
The LVDS buffer has two current sources, as shown
in Figure 37. OUTP and OUTN are loaded externally
by a resistive load that is ideally about 100Ω.
Depending on whether the data is 0 or 1, the currents
are directed in one direction or the other through the
resistor. While the lower-side current source is a
constant current source, the higher-side current
source is controlled through a feedback loop to
maintain a constant output common-mode level. The
LVDS buffer has four current settings.
The single-ended output impedance of the LVDS
drivers is very high because they are current-source
driven. If there are excessive reflections from the
receiver, it might be necessary to place a 100Ω
termination resistor across the outputs of the LVDS
drivers to minimize the effect of reflections. In such a
situation, the output current of the LVDS drivers can
be increased to regain the output swing.
NOISE COUPLING ISSUES
High-speed mixed signals are sensitive to various
types of noise coupling. One of the main sources of
noise is the switching noise from the serializer and
the output buffers. Maximum care is taken to isolate
these noise sources from the sensitive analog blocks.
As a starting point, the analog and digital domains of
the chip are clearly demarcated. AVDD and AVSS
are used to denote the supplies for the analog
sections, while LVDD and LVSS are used to denote
the digital supplies. Care is taken to ensure that there
is minimal interaction between the supply sets within
the device. The extent of noise coupled and
transmitted from the digital to the analog sections
depends on the following:
External
Termination
Resistor
High
Low
1. The effective inductance of each of the
supply/ground sets.
OUTP
OUTN
2. The isolation between the digital and analog
supply/ground sets.
Low
High
Smaller effective inductance of the supply/ground
pins leads to better noise suppression. For this
reason, multiple pins are used to drive each
supply/ground. It is also critical to ensure that the
impedances of the supply and ground lines onboard
are kept to the minimum possible values. Use of
ground planes in the board as well as large
decoupling capacitors between the supply and
ground lines are necessary to get the best possible
SNR from the device.
Figure 37. LVDS Buffer
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
23
Product Folder Link(s): ADS5277
ADS5277
SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009............................................................................................................................................ www.ti.com
It is recommended that the isolation be maintained
onboard by using separate supplies to drive AVDD
and LVDD, as well as separate ground planes for
AVSS and LVSS.
RESET
After the supplies have stabilized, it is required to
give the device an active RESET pulse. This results
in all internal registers resetting to their default value
of 0 (inactive). Without a reset, it is possible that
some registers may be in their non-default state on
power-up. This may cause the device to malfunction.
When a reset is active, the device outputs ‘0’ code on
all channels. However, the LVDS output clocks are
unaffected by reset.
The use of LVDS buffers reduces the injected noise
considerably, compared to CMOS buffers. Also, the
low output swing, as well as the differential nature of
the LVDS buffer, results in low-noise coupling.
POWER-DOWN MODE
The ADS5277 has a power-down pin, referred to as
PD. Pulling PD high causes the device to enter the
power-down mode. In this mode, the reference and
clock circuitry as well as all the channels are powered
down and device power consumption drops to less
than 100mW. In power-down mode, the internal
buffers driving REFT and REFB are tri-stated and their
outputs are forced to a voltage roughly equal to half
of the voltage on AVDD. Speed of recovery from
power-down mode depends on the value of the
external capacitance on the REFT and REFB pins. For
capacitances on REFT and REFB less than 1µF, the
reference voltages settle to within 1% of their steady
state values in less than 500µs. Individual channels
can also be selectively powered down by
programming registers.
LAYOUT OF PCB WITH PowerPAD
THERMALLY-ENHANCED PACKAGES
The ADS5277 is housed in an 80-lead PowerPAD
thermally-enhanced package. To make optimum use
of the thermal efficiencies designed into the
PowerPAD package, the printed circuit board (PCB)
must be designed with this technology in mind.
Please refer to PowerPAD brief SLMA004,
PowerPAD Made Easy (available for download at
www.ti.com),
considerations
which
required
addresses
when
the
integrating
specific
a
PowerPAD package into a PCB design. For more
detailed information, including thermal modeling and
repair procedures, please see technical brief
SLMA002, PowerPAD Thermally-Enhanced Package
(www.ti.com).
The ADS5277 also has an internal circuit that
monitors the state of stopped clocks. If ADCLK is
stopped for longer than 300ns (or if it runs at a speed
less than 3MHz), this monitoring circuit generates a
Interfacing High-Speed LVDS Outputs (SBOA104),
an application report discussing the design of a
simple deserializer that can deserialize LVDS outputs
up to 840Mbps, can also be found on the TI web site
(www.ti.com).
logic signal that puts the device in
power-down state. As result, the power
consumption of the device is reduced when ADCLK is
stopped. The recovery from such partial
a partial
a
a
CONNECTING HIGH-SPEED,
MULTI-CHANNEL ADCs TO XILINX FPGAs
power-down takes approximately 100µs; this is
described in Table 2.
A separate application note (XAPP774) describing
how to connect TI's high-speed, multi-channel ADCs
with serial LVDS outputs to Xilinx FPGAs can be
downloaded directly from the Xilinx web site
(http://www.xilinx.com).
Table 2. Time Constraints Associated with Device Recovery from Power-Down and Clock Stoppage
DESCRIPTION
TYP
500µs
10µs
REMARKS
Recovery from power-down mode (PD = 1 to PD = 0).
Recovery from momentary clock stoppage ( < 300ns).
Recovery from extended clock stoppage ( > 300ns).
Capacitors on REFT and REFB less than 1µF.
100µs
24
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS5277
ADS5277
www.ti.com............................................................................................................................................ SBAS333D–FEBRUARY 2005–REVISED JANUARY 2009
Changes from Revision C (September 2005) to Revision D .......................................................................................... Page
•
Updated Absolute Maximum Ratings table: added entries for Digital Input Pins, Set 1 and Set 2 and added footnote 3.... 2
Changes from Revision B (August 2005) to Revision C ................................................................................................ Page
•
•
•
•
•
Changed unit value of Lead Temperature row in Absolute Maximum table.......................................................................... 2
Changed footnotes of Electrical Characteristics table. .......................................................................................................... 5
Changed Figure 4. ............................................................................................................................................................... 14
Deleted Supply from title of Figure 29. ................................................................................................................................ 18
Added (±3σ) to seventh sentence of first paragraph of Clocking section in Theory of Operation....................................... 22
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
25
Product Folder Link(s): ADS5277
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
ADS5277IPFP
ADS5277IPFPG4
ADS5277IPFPT
ADS5277IPFPTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
HTQFP
HTQFP
HTQFP
HTQFP
PFP
PFP
PFP
PFP
80
80
80
80
96
96
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
250
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ADS5277IPFPT
HTQFP
PFP
80
250
330.0
24.4
15.0
15.0
1.5
20.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTQFP PFP 80
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 45.0
ADS5277IPFPT
250
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
ADS5277IPFPG4
Eight-Channel, 10-Bit, 65-MSPS Analog-to-Digital Converter (ADC) 80-HTQFP -40 to 85
TI
©2020 ICPDF网 联系我们和版权申明