ADS5510IPAP [TI]
11 位、125MSPS 模数转换器 (ADC) | PAP | 64 | -40 to 85;
| 型号： | ADS5510IPAP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 11 位、125MSPS 模数转换器 (ADC) | PAP | 64 | -40 to 85 PC 转换器 模数转换器 |
| 文件： | 总33页 (文件大小：1727K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SLAS499–JANUARY 2007
11-Bit, 125-MSPS
Analog-To-Digital Converter
FEATURES
•
Recommended Operational Amplifiers:
THS3201, THS3202, THS4503, THS4509,
THS9001, OPA695, OPA847
•
•
•
•
•
•
•
•
•
•
•
11-bit Resolution
125-MSPS Sample Rate
High SNR: 66.3 dBFS at 100 MHz fIN
High SFDR: 81 dBc at 100 MHz fIN
2.3-VPP Differential Input Voltage
Internal Voltage Reference
APPLICATIONS
•
Wireless Communication
–
–
Communication Receivers
Base Station Infrastructure
3.3-V Single-Supply Voltage
Analog Power Dissipation: 578 mW
Serial Programming Interface
TQFP-64 PowerPAD™ Package
Pin-Compatible With:
•
•
•
Test and Measurement Instrumentation
Single and Multichannel Digital Receivers
Communication Instrumentation
–
–
Radar
Infrared
•
•
Video and Imaging
Medical Equipment
–
–
–
–
–
–
ADS5500 (14-Bit, 125 MSPS)
ADS5541 (14-Bit, 105 MSPS)
ADS5542 (14-Bit, 80 MSPS)
ADS5520 (12-Bit, 125 MSPS)
ADS5521 (12-Bit, 105 MSPS)
ADS5522 (12-Bit, 80 MSPS)
DESCRIPTION
The ADS5510 is a high-performance, 11 bit, 125 MSPS analog-to-digital converter (ADC). To provide a
complete converter solution, it includes a high-bandwidth linear sample-and-hold stage (S&H) and internal
reference. Designed for applications demanding the highest speed and highest dynamic performance in little
space, the ADS5510 has excellent power consumption of 578 mW at 3.3-V single-supply voltage. This allows an
even higher system integration density. The provided internal reference simplifies system design requirements.
Parallel CMOS-compatible output ensures seamless interfacing with common logic.
The ADS5510 is available in 64-pin TQFP PowerPAD package over the industrial temperature range.
AV
DD
DRV
DD
CLK+
CLK−
Timing Circuitry
CLKOUT
11-Bit
D0
Digital
Error
Correction
V
IN+
.
.
.
Output
Control
Pipeline
ADC
Core
S&H
V
D10
IN−
OVR
DFS
Internal
Reference
Control Logic
CM
Serial Programming Register
ADS5510
A
SEN
SDATA SCLK
DR
GND
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ADS5510
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SLAS499–JANUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT PACKAGE-LEAD
HTQFP-64(2)
ADS5510
ADS5510IPAP
Tray, 160
PAP
–40°C to 85°C
ADS5510I
PowerPAD
ADS5510IPAPR
Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Thermal pad size: 3,5 mm x 3,5 mm (min), 4 mm x 4 mm (max). θJA = 21.47°C/W and θJC = 2.99°C/W, when used with 2 oz. copper
trace and pad soldered directly to a JEDEC standard, four-layer, 3 in x 3 in PCB.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
AVDD to AGND, DRVDD to DRGND
AGND to DRGND
–0.3 to 3.7
V
V
VSS
Supply Voltage
±0.1
–0.3 to minimum (AVDD + 0.3, 3.6)
–0.3 to DRVDD
–0.3 to DRVDD
–40 to 85
(2)(3)
Analog input to AGND
Logic input to DRGND
V
V
Digital data output to DRGND
Operating temperature range
Junction temperature
V
°C
°C
°C
TJ
105
Tstg
Storage temperature range
–65 to 150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) If the input signal can exceed 3.6 V, then a resistor greater than or equal to 25 Ω should be added in series with each of the analog
input pins to support input voltages up to 3.8 V. For input voltages above 3.8 V, the device can only handle transients and the duty cycle
of the overshoot should be limited to less than 5% for inputs up to 3.9 V.
(3) The overshoot duty cycle can be defined as the ratio of the total time of overshoot to the total intended device lifetime, expressed as a
percentage. The total time of overshoot is the integrated time of all overshoot occurrences over the lifetime of the device.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
Supplies
AVDD
Analog supply voltage
3
3
3.3
3.3
3.6
3.6
V
V
DRVDD
Output driver supply voltage
Analog input
Differential input range
2.3
VPP
V
VCM
Input common-mode voltage(1)
1.45
1.55
1.65
Digital Output
Maximum output load
10
pF
Clock Input
DLL ON
60
2
125
80
ADCLK input sample rate (sine wave) 1/tC
MSPS
VPP
DLL OFF
Clock amplitude, sine wave, differential
Clock duty cycle
1
3
50%
TA
Open free-air temperature range
–40
85
°C
(1) Input common-mode should be connected to CM.
2
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ELECTRICAL CHARACTERISTICS
Typical values given at TA = 25°C, min and max specified over the full recommended operating temperature range, AVDD
=
DRVDD = 3.3 V, sampling rate = 125 MSPS, 50% clock duty cycle, DLL On, 3-VPP differential clock, and –1 dBFS differential
input, unless otherwise noted
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Resolution
11
bits
Analog Inputs
Differential input range
2.3
6.6
4
VPP
kΩ
pF
Differential input impedance
Differential input capacitance
See Figure 24
See Figure 24
Analog input common-mode current
(per input)
300
750
4
µA
Analog input bandwidth
Source impedance = 50 Ω
MHz
Clock
cycles
Voltage overload recovery time
Internal Reference Voltages
V(REFM)
V(REFP)
Reference bottom voltage
Reference top voltage
Reference error
0.95
2.1
V
V
–4%
±0.9%
4%
1.55
±0.05
VCM
Common-mode voltage output
V
Dynamic DC Characteristics and Accuracy
No missing codes
Tested
±0.25
±0.8
DNL
INL
Differential nonlinearity error
Integral nonlinearity error
Offset error
fIN = 10 MHz
fIN = 10 MHz
-0.5
-1.5
-11
0.5
1.5
LSB
LSB
+2.5
+11
mV
Offset temperature coefficient
0.01
mV/°C
∆offset error/∆AVDD from AVDD = 3 V to
AVDD = 3.6 V
PSRR
DC power-supply rejection ratio
0.25
mV/V
(1)
Gain error
-2
±0.45
+2
%FS
Gain temperature coefficient
0.01
∆%/°C
Dynamic AC Characteristics
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 130 MHz
fIN = 170 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 130 MHz
fIN = 170 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 130 MHz
fIN = 170 MHz
62.5
66.7
66.5
66.3
66
SNR
SFDR
HD2
Signal-to-noise ratio
dBFS
dBc
65.5
84
73
73
81
Spurious-free dynamic range
82
78
72
91
87
Second-harmonic
84
dBc
79
74
(1) Gain error is specified by design and characterization; it is not tested in production.
3
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ELECTRICAL CHARACTERISTICS (continued)
Typical values given at TA = 25°C, min and max specified over the full recommended operating temperature range, AVDD
=
DRVDD = 3.3 V, sampling rate = 125 MSPS, 50% clock duty cycle, DLL On, 3-VPP differential clock, and –1 dBFS differential
input, unless otherwise noted
PARAMETER
CONDITIONS
MIN
TYP
84
MAX
UNIT
fIN = 10 MHz
fIN = 70 MHz
73
81
HD3
Third-harmonic
fIN = 100 MHz
fIN = 130 MHz
fIN = 170 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 130 MHz
fIN = 170 MHz
fIN = 10 MHz
82
dBc
78
72
62
66.5
66.3
66
SINAD
Signal-to-noise + distortion
dBFS
65.6
65
ENOB
IMD
Effective number of bits
10.0
10.8
Bits
dBFS
dB
f = 50.1 MHz, 46.1 MHz (-7 dBFS each
tone)
Two-tone intermodulation distortion
AC power supply rejection ratio
85
35
PSRR
Supply noise frequency ≤ 100 MHz
Power Supply
ICC
Total supply current
fIN = 10 MHz
fIN = 10 MHz
fIN = 10 MHz
Analog only
236
175
61
260
190
70
mA
mA
mA
I(AVDD)
I(DRVDD)
Analog supply current
Output buffer supply current
578
627
Power dissipation
Standby power
mW
mW
Output buffer power with 10-pF load on
digital output to ground
202
180
231
250
With Clocks running
4
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DIGITAL CHARACTERISTICS
Valid over full recommended operating temperature range, AVDD = DRVDD = 3.3 V, unless otherwise noted
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Digital Inputs
VIH
VIL
IIH
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
Input current for RESET
Input capacitance
2.4
V
0.8
10
V
µA
µA
µA
pF
IIL
-10
–20
4
Digital Outputs
VOL
VOH
Low-level output voltage
CLOAD = 10 pF
0.3
3
0.4
V
V
High-level output voltage
Output capacitance
CLOAD = 10 pF
2.4
3
pF
5
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TIMING CHARACTERISTICS(1)(2)
Typical values given at TA = 25°C, min and max specified over the full recommended operating temperature range, AVDD
DRVDD = 3.3 V, sampling rate = 125 MSPS, 50% clock duty cycle, 3-VPP differential clock, and CLOAD = 10 pF, unless
otherwise noted
=
PARAMETER
DESCRIPTION
MIN
TYP
MAX
UNIT
Switching Specification
tA
Aperture delay
Input CLK falling edge to data sampling point
Uncertainty in sampling instant
Data valid(3) to 50% of CLKOUT rising edge
1
300
2.7
2
ns
fs
Aperture jitter (uncertainty)
Data setup time
tSETUP
tHOLD
tSTART
tEND
2.3
1.7
ns
ns
50% of CLKOUT rising edge to data becoming
invalid(3)
Data hold time
Input clock to output data
Input clock rising edge to data valid start delay
Input clock rising edge to data valid end delay
2
2.6
ns
ns
(4)(5)
valid start
Input clock to output data
5.8
4.2
6.9
(4)(5)
valid end
tJIT
tr
Output clock jitter
Uncertainty in CLKOUT rising edge, peak-to-peak
Rise time of CLKOUT from 20% to 80% of DRVDD
Fall time of CLKOUT from 80% to 20% of DRVDD
150
1.7
1.5
4.8
210
1.9
1.7
5.5
psPP
ns
Output clock rise time
Output clock fall time
tf
ns
tPDI
Input clock to output clock
delay
Input clock rising edge, zero crossing, to output
clock rising edge 50%
ns
tr
tf
Data rise time
Data rise time measured from 20% to 80% of
DRVDD
3.6
2.8
4.6
3.7
ns
ns
Data fall time
Data fall time measured from 80% to 20% of
DRVDD
Output enable(OE) to data
output delay
Time required for outputs to have stable timings
with regard to input clock(6) after OE is activated
1000
1000
1000
Clock
cycles
Time to valid data after coming out of software
power down
Clock
cycles
Wakeup time
Latency
Time to valid data after stopping and restarting the
clock
Clock
cycles
Time for a sample to propagate to the ADC outputs
17.5
(1) Timing parameters are ensured by design and characterization, and not tested in production.
(2) See Table 5 through Table 8 in the Application Information section for timing information at additional sampling frequencies.
(3) Data valid refers to 2 V for LOGIC HIGH and 0.8 V for LOGIC LOW.
(4) See the Output Information section for details on using the input clock for data capture.
(5) These specifications apply when the CLKOUT polarity is set to rising edge (according to Table 2). Add 1/2 clock period for the valid
number for a falling edge CLKOUT polarity.
(6) Data outputs are available within a clock from assertion of OE; however, it takes 1000 clock cycles to ensure stable timing with respect
to input clock.
6
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N + 3
N + 4
N + 2
Sample
N
Analog
Input
N + 1
N + 17
N + 16
N + 14
N + 15
Signal
t
A
Input Clock
t
START
t
PDI
Output Clock
t
su
Data Out
(D0−D10)
N − 17
N − 16
N − 15
N − 14
N − 13
N − 3
N − 2
N − 1
N
Data Invalid
t
t
END
h
17.5 Clock Cycles
A. It is recommended that the loading at CLKOUT and all data lines are accurately matched to ensure that the above
timing matches closely with the specified values.
Figure 1. Timing Diagram
RESET TIMING CHARACTERISTICS
Typical values given at TA = 25°C, min and max specified over the full recommended operating temperature range, AVDD
=
DRVDD = 3.3 V, and 3-VPP differential clock, unless otherwise noted
PARAMETER
Switching Specification
DESCRIPTION
MIN
TYP
MAX
UNIT
t1
Power-on delay
Delay from power-on of AVDD and
DRVDD to RESET pulse active
10
ms
t2
t3
Reset pulse width
Pulse width of active RESET signal
2
2
µs
µs
Register write delay
Delay from RESET disable to SEN
active
Delay from power-up of AVDD and
DRVDD to output stable
Power-up time
40
ms
Power Supply
(AV , DRV
)
DD
DD
t . 10 ms
1
t . 2 ms
2
t . 2 ms
3
SEN Active
RESET (Pin 35)
Figure 2. Reset Timing Diagram
7
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SERIAL PROGRAMMING INTERFACE CHARACTERISTICS
The ADS5510 has a three-wire serial interface. The ADS5510 latches serial data SDATA on the falling edge of
serial clock SCLK when SEN is active.
•
•
•
•
•
•
Serial shift of bits is enabled when SEN is low. SCLK shifts serial data at the falling edge.
Minimum width of data stream for a valid loading is 16 clocks.
Data is loaded at every 16th SCLK falling edge while SEN is low.
In case the word length exceeds a multiple of 16 bits, the excess bits are ignored.
Data can be loaded in multiples of 16-bit words within a single active SEN pulse.
The first 4-bit nibble is the address of the register while the last 12 bits are the register contents.
A3
A2
A1
A0
D11
D10
D9
D0
SDATA
ADDRESS
DATA
MSB
Figure 3. DATA Communication is 2-Byte, MSB First
t
SLOADS
t
SEN
SLOADH
t
t
t
SCLK
WSCLK WSCLK
SCLK
t
t
h(D)
su(D)
SDATA
MSB
LSB
MSB
LSB
16 x M
Figure 4. Serial Programming Interface Timing Diagram
Table 1. Serial Programming Interface Timing Characteristics
SYMBOL
tSCLK
PARAMETER
SCLK period
MIN(1)
TYP(1)
MAX(1)
UNIT
50
ns
tWSCLK
tSLOADS
tSLOADH
tDS
SCLK duty cycle
SEN to SCLK setup time
SCLK to SEN hold time
Data setup time
25%
50%
75%
8
6
8
6
ns
ns
ns
ns
tDH
Data hold time
(1) Typ, min, and max values are characterized, but not production tested.
8
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Table 2. Serial Register Table(1)
A3 A2 A1 A0 D11
D10
D9
D8 D7 D6 D5 D4 D3 D2
D1
D0
DESCRIPTION
DLL
CTRL
Clock DLL
1
1
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
Internal DLL is on; recommended for 60 MSPS to 125 MSPS
clock speeds.
Internal DLL is off; recommended for 2 MSPS to 80 MSPS
clock speeds.
TP<1> TP<0>
Test Mode
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
X
X
X
X
0
0
0
0
Normal mode of operation
All outputs forced to 0
All outputs forced to 1
0
(2)(3)
0
Each output bit toggles between 0 and 1.
PDN
0
Power Down
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
X
X
0
0
Normal mode of operation
1
Device is put in power-down (low-current) mode.
(1) The register contents default to the appropriate setting for normal operation up on RESET.
(2) The patterns given are applicable to the straight offset binary output format. If two's complement output format is selected, the test mode
outputs will be the binary two's complement equivalent of these patterns as described in the Output Information section.
(3) While each bit toggles between 1 and 0 in this mode, there is no assured phase relationship between the data bits D0 through D10. For
example, when D0 is a 1, D1 in not assured to be a 0, and vice versa.
Table 3. Data Format Select (DFS) Table
DFS-PIN VOLTAGE (VDFS
)
DATA FORMAT
CLOCK OUTPUT POLARITY
2
12
Straight Binary
Data valid on rising edge
V
t
AV
DD
DFS
5
12
4
12
Two's Complement
Straight Binary
Data valid on rising edge
Data valid on falling edge
Data valid on falling edge
AV
AV
u
t V
t
AV
AV
DD
DD
DFS
8
12
7
12
t V
t
DD
DD
DFS
10
12
Two's Complement
V
AV
DD
DFS
9
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PIN CONFIGURATION
PAP PACKAGE
HTQFP-64
(TOP VIEW)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
2
48
47
46
DRGND
DRGND
D0 (LSB)
NC
SCLK
SDATA
SEN
3
4
45 NC
AVDD
AGND
5
44 NC
6
43 CLKOUT
7
42
41
AVDD
AGND
DRGND
OE
ADS5510
8
PowerPAD
AVDD
CLKP
CLKM
AGND
9
40 DFS
10
11
12
39
38
37
AVDD
AGND
AVDD
AGND 13
AGND 14
AVDD 15
36 AGND
35 RESET
34 AVDD
16
33
AVDD
AGND
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
10
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PIN CONFIGURATION (continued)
PIN ASSIGNMENTS(1)
TERMINAL
NO. OF
PINS
NAME
AVDD
NO.
I/O DESCRIPTION
5, 7, 9, 15, 22,
24, 26, 28, 33,
34, 37, 39
12
I
Analog power supply
6, 8, 12, 13,
14, 16, 18, 21,
23, 25, 27, 32,
36, 38
AGND
14
I
Analog ground
DRVDD
DRGND
49, 58
2
6
I
I
Output driver power supply
Output driver ground
1, 42, 48, 50,
57, 59
NC
44, 45, 46
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
—
I
Not connected
INP
19
20
29
30
31
17
35
41
40
10
11
4
Differential analog input (positive)
Differential analog input (negative)
INM
I
REFP
REFM
IREF
CM
O
O
I
Reference voltage (positive); 0.1-µF capacitor in series with a 1-Ω resistor to GND
Reference voltage (negative); 0.1-µF capacitor in series with a 1-Ω resistor to GND
Current set; 56-kΩ resistor to GND; do not connect capacitors
Common-mode output voltage
O
I
(2)
RESET
OE
Reset (active high), 200-kΩ resistor to AVDD
I
Output enable (active high)
DFS
I
Data format and clock out polarity select(3)(4)
Data converter differential input clock (positive)
Data converter differential input clock (negative)
Serial interface chip select(4)
Serial interface data(4)
Serial interface clock(4)
CLKP
CLKM
SEN
I
I
I
SDATA
SCLK
3
I
2
I
D0 (LSB) to
D10 (MSB)
47, 51-56,
60-63
11
O
11 bit parallel data output
OVR
64
43
1
1
O
O
Over-range indicator bit
CLKOUT
CMOS clock out in sync with data
(1) PowerPAD is connected to analog ground.
(2) If unused, the RESET pin should be tied to AGND. See the serial programming interface section for details.
(3) Table 3 defines the voltage levels for each mode selectable via the DFS pin.
(4) Pins OE, DFS, SEN, SDATA, and SCLK have internal clamping diodes to the DRVDD supply. Any external circuit driving these pins
must also run off the same supply voltage as DRVDD.
11
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DEFINITION OF SPECIFICATIONS
Offset Error
Analog Bandwidth
The offset error is the difference, given in number of
LSBs, between the ADC's actual average idle
channel output code and the ideal average idle
channel output code. This quantity is often mapped
into mV.
The analog input frequency at which the power of the
fundamental is reduced by 3 dB with respect to the
low frequency value.
Aperture Delay
Temperature Drift
The delay in time between the falling edge of the
input sampling clock and the actual time at which the
sampling occurs.
The temperature drift coefficient (with respect to gain
error and offset error) specifies the change per
degree Celsius of the parameter from TMIN to TMAX. It
is calculated by dividing the maximum deviation of
the parameter across the TMIN to TMAX range by the
difference (TMAX – TMIN).
Aperture Uncertainty (Jitter)
The sample-to-sample variation in aperture delay.
Clock Pulse Width/Duty Cycle
Signal-to-Noise Ratio (SNR)
The duty cycle of a clock signal is the ratio of the
time the clock signal remains at a logic high (clock
pulse width) to the period of the clock signal. Duty
cycle is typically expressed as a percentage. A
perfect differential sine wave clock results in a 50%
duty cycle.
SNR is the ratio of the power of the fundamental (PS)
to the noise floor power (PN), excluding the power at
dc and the first eight harmonics.
PS
SNR + 10Log
10 PN
Maximum Conversion Rate
SNR is either given in units of dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference or dBFS (dB to Full-Scale) when the
power of the fundamental is extrapolated to the
converter's full-scale range.
The maximum sampling rate at which certified
operation is given. All parametric testing is performed
at this sampling rate unless otherwise noted.
Minimum Conversion Rate
Signal-to-Noise and Distortion (SINAD)
The minimum sampling rate at which the ADC
functions.
SINAD is the ratio of the power of the fundamental
(PS) to the power of all the other spectral
components including noise (PN) and distortion (PD),
but excluding dc.
Differential Nonlinearity (DNL)
An ideal ADC exhibits code transitions at analog
input values spaced exactly 1 LSB apart. The DNL is
the deviation of any single step from this ideal value,
measured in units of LSBs.
PS
SINAD + 10Log
10 PN ) PD
Integral Nonlinearity (INL)
SINAD is either given in units of dBc (dB to carrier)
when the absolute power of the fundamental is used
as the reference or dBFS (dB to full-scale) when the
power of the fundamental is extrapolated to the
converter's full-scale range.
The INL is the deviation of the ADC's transfer
function from a best fit line determined by a least
squares curve fit of that transfer function, measured
in units of LSBs.
Effective Number of Bits (ENOB)
Gain Error
The ENOB is
performance as compared to the theoretical limit
based on quantization noise.
a
measure of
a
converter's
The gain error is the deviation of the ADC's actual
input full-scale range from its ideal value. The gain
error is given as a percentage of the ideal input
full-scale range. Gain error does not account for
variations in the internal reference voltages (see the
Electrical Specifications section for limits on the
variation of VREFP and VREFM).
SINAD * 1.76
ENOB +
6.02
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Total Harmonic Distortion (THD)
Two-Tone Intermodulation Distortion (IMD3)
THD is the ratio of the power of the fundamental (PS)
to the power of the first eight harmonics (PD).
IMD3 is the ratio of the power of the fundamental (at
frequencies f1 and f2) to the power of the worst
spectral component at either frequency 2f1 – f2 or
2f2 – f1. IMD3 is either given in units of dBc (dB to
carrier) when the absolute power of the fundamental
is used as the reference, or dBFS (dB to Full-Scale)
when the power of the fundamental is extrapolated to
the converter's full-scale range.
PS
THD + 10Log
10 PD
THD is typically given in units of dBc (dB to carrier).
Spurious-Free Dynamic Range (SFDR)
The ratio of the power of the fundamental to the
highest other spectral component (either spur or
harmonic). SFDR is typically given in units of dBc
(dB to carrier).
DC Power Supply Rejection Ration (DC PSRR)
The DC PSSR is the ratio of the change in offset
error to a change in analog supply voltage. The DC
PSRR is typically given in units of mV/V.
Reference Error
The reference error is the variation of the actual
reference voltage (VREFP - VREFM) from its ideal
value. The reference error is typically given as a
percentage.
Voltage Overload Recovery Time
The voltage overload recovery time is defined as the
time required for the ADC to recover to within 1% of
the full-scale range in response to an input voltage
overload of 10% beyond the full-scale range.
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TYPICAL CHARACTERISTICS
Typical values given at TA = 25°C, AVDD = DRVDD = 3.3 V, differential input amplitude = -1 dBFS, sampling rate = 125 MSPS,
DLL On, and 3-V differential clock, unless otherwise noted
SPECTRAL PERFORMANCE
(FFT for 20 MHZ input signal)
SPECTRAL PERFORMANCE
(FFT for 40 MHZ input signal)
0
-20
0
-20
SFDR = 80.21 dBc,
SNR = 66.84 dBFS,
SINAD = 66.47 dBFS
SFDR = 83.8 dBc,
SNR = 66.87 dBFS,
SINAD = 66.67dBFS
-40
-40
-60
-60
-80
-80
-100
-100
-120
-140
-120
-140
0
0
0
10
20
30
40
50
60
0
0
0
10
20
30
40
50
60
f - Frequency - MHz
f - Frequency - MHz
Figure 5.
Figure 6.
SPECTRAL PERFORMANCE
(FFT for 70 MHZ input signal)
SPECTRAL PERFORMANCE
(FFT for 100 MHZ input signal)
0
-20
0
-20
SFDR = 80.98 dBc,
SNR = 66.76 dBFS,
SINAD = 66.46 dBFS
SFDR = 80.8 dBc,
SNR = 67.47 dBFS,
SINAD = 66.16 dBFS
-40
-40
-60
-60
-80
-80
-100
-100
-120
-140
-120
-140
10
20
30
40
50
60
10
20
30
40
50
60
f - Frequency - MHz
f - Frequency - MHz
Figure 7.
Figure 8.
SPECTRAL PERFORMANCE
(FFT for 150 MHZ input signal)
SPECTRAL PERFORMANCE
(FFT for 170 MHZ input signal)
0
-20
0
-20
SFDR = 69.93 dBc,
SNR = 65.58 dBFS,
SINAD = 63.41dBFS
SFDR = 78.62 dBc,
SNR = 66.15 dBFS,
SINAD = 65.58 dBFS
-40
-40
-60
-60
-80
-80
-100
-100
-120
-140
-120
-140
10
20
30
40
50
60
10
20
30
40
50
60
f - Frequency - MHz
f - Frequency - MHz
Figure 9.
Figure 10.
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TYPICAL CHARACTERISTICS (continued)
Typical values given at TA = 25°C, AVDD = DRVDD = 3.3 V, differential input amplitude = -1 dBFS, sampling rate = 125 MSPS,
DLL On, and 3-V differential clock, unless otherwise noted
SPURIOUS FREE DYNAMIC RANGE
vs
TWO-TONE INTERMODULATION
INPUT FREQUENCY
90
0
-20
f
f
= 50.1 MHz, -7 dBFS,
= 46.1 MHz, -7 dBFS,
IN1
86
82
78
74
IN2
SFDR = -90 dBFS,
2-Tone IMD, -85 dBFS
-40
-60
-80
70
66
62
-100
-120
-140
0
50
100
150
200 230
0
10
20
30
40
50
60
f
- Input Frequency - MHz
f - Frequency - MHz
IN
Figure 11.
Figure 12.
SIGNAL-TO-NOISE RATIO
vs
AC PERFORMANCE
vs
ANALOG SUPPLY VOLTAGE
INPUT FREQUENCY
78
74
70
66
89
70
FIN = 70 MHz
DRVDD = 3.3 V
86
69
68
SFDR
SNR
83
80
67
66
77
74
62
58
65
3
3.1
3.2
AV
3.3
3.4
3.5
3.6
0
50
100
150
200 230
- Supply Voltage - V
DD
fIN − Input Frequency − MHz
Figure 13.
Figure 14.
AC PERFORMANCE
vs
DIGITAL SUPPLY VOLTAGE
AC PERFORMANCE
vs
TEMPERATURE
70
69
68
67
66
86
70
89
fIN = 70 MHz
fIN = 70 MHz
83
80
69
68
86
83
AVDD = 3.3 V
SFDR
SNR
SFDR
SNR
77
67
80
74
71
66
65
77
74
65
−40
−15
10
35
50
85
3.0
3.1
3.2
3.3
3.4
3.5
3.6
TA − Free-Air Temperature − oC
DRVDD − Supply Voltage − V
Figure 15.
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
Typical values given at TA = 25°C, AVDD = DRVDD = 3.3 V, differential input amplitude = -1 dBFS, sampling rate = 125 MSPS,
DLL On, and 3-V differential clock, unless otherwise noted
AC PERFORMANCE
vs
INPUT AMPLITUDE
AC PERFORMANCE
vs
CLOCK AMPLITUDE
105
95
85
75
65
55
45
35
25
71
70
69
68
66
65
64
63
62
80
76
72
70
69
68
fIN = 70 MHz
SFDR (dBFS)
SFDR
SNR (dBFS)
SFDR (dBc)
f
= 70 MHz
IN
67
68
64
60
SNR
66
65
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
−50
−40
−30
−20
−10
0
Clock Amplitude - V
PP
Input Amplitude − dBFS
Figure 17.
Figure 18.
AC PERFORMANCE
vs
CLOCK DUTY CYCLE
OUTPUT NOISE
vs
HISTOGRAM
84
80
80
76
100
90
fIN = 10 MHz
80
70
SFDR
72
68
64
60
76
72
60
50
40
30
20
SNR
68
64
10
0
35
40
45
50
55
60
65
Input Clock Duty Cycle − %
Output Code
Figure 19.
Figure 20.
POWER DISSIPATION
vs
SAMPLE RATE
1
0.9
f
= 70 MHz
IN
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
10 20 30 40 50 60 70 80 90 100 110 120 130
Sampling Frequency - MSPS
Figure 21.
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TYPICAL CHARACTERISTICS (continued)
Typical values given at TA = 25°C, AVDD = DRVDD = 3.3 V, differential input amplitude = -1 dBFS, and 3-V differential clock,
unless otherwise noted
DLL ON for FS > 80 MSPS
DLL OFF for FS ≤ 80 MSPS
125
120
110
100
90
80
70
60
50
40
20
40
60
80
100
120
140
160
180
200 210
f
- Input Frequency - MHz
IN
72
74
76
78
80
82
84
86
88
90
SFDR - dBc
Figure 22. SFDR Contour in dBc
125
120
110
100
90
80
70
60
50
40
20
40
60
80
100
120
140
160
180
200 210
f
- Input Frequency - MHz
IN
64.5
65
65.5
66
66.5
67
SNR - dBFS
Figure 23. SNR Contour in dBFS
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APPLICATION INFORMATION
THEORY OF OPERATION
The ADS5510 is a low-power, 11-bit, 125 MSPS, CMOS, switched capacitor, pipeline ADC that operates from a
single 3.3-V supply. The conversion process is initiated by a falling edge of the external input clock. Once the
signal is captured by the input S&H, the input sample is sequentially converted by a series of small resolution
stages, with the outputs combined in a digital correction logic block. Both the rising and the falling clock edges
are used to propagate the sample through the pipeline every half clock cycle. This process results in a data
latency of 17.5 clock cycles, after which the output data is available as a 11-bit parallel word, coded in either
straight offset binary or binary two's complement format.
INPUT CONFIGURATION
The analog input for the ADS5510 consists of a differential sample-and-hold architecture implemented using the
switched capacitor technique shown in Figure 24.
S
3a
L1
R1a
C1a
INP
INM
S
S
1a
CP1
CP3
S
2
R3
CA
L2
R1b
C1b
VINCM
1V
1b
CP2
CP4
S
3b
L , L : 6 nH − 10 nH effective
1
2
R
1a
, R : 5W − 8W
1b
C , C : 2.2 pF − 2.6 pF
1a 1b
CP , CP : 2.5 pF − 3.5 pF
1
2
CP , CP : 1.2 pF − 1.8 pF
3
4
C : 0.8 pF − 1.2 pF
A
R : 80 W − 120 W
3
Swithches: S , S
On Resistance: 35 W − 50 W
1a 1b:
S : On Resistance: 7.5 W − 15 W
2
S
, S : On Resistance: 40 W − 60 W
3a 3b
All switches OFF Resistance: 10 GW
A. All Switches are ON in sampling phase which is approximately one half of a clock period.
Figure 24. Analog Input Stage
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This differential input topology produces a high level of ac-performance for high sampling rates. It also results in
a very high usable input bandwidth, especially important for high intermediate-frequency (IF) or undersampling
applications. The ADS5510 requires each of the analog inputs (INP, INM) to be externally biased around the
common-mode level of the internal circuitry (CM, pin 17). For a full-scale differential input, each of the differential
lines of the input signal (pins 19 and 20) swings symmetrically between CM + 0.575 V and CM – 0.575 V. This
means that each input is driven with a signal of up to CM ± 0.575 V, so that each input has a maximum
differential signal of 1.15 VPP for a total differential input signal swing of 2.3 VPP. The maximum swing is
determined by the two reference voltages, the top reference (REFP, pin 29), and the bottom reference (REFM,
pin 30).
The ADS5510 obtains optimum performance when the analog inputs are driven differentially. The circuit shown
in Figure 25 illustrates one possible configuration using an RF transformer.
R0
Z0
Ω
50
Ω
25
Ω
50
INP
1:1
R
50
AC Signal
Source
ADS5510
Ω
25
Ω
INM
CM
ADT1−1WT
Ω
10
µ
0.1 F
1nF
Figure 25. Transformer Input to Convert Single-Ended Signal to Differential Signal
The single-ended signal is fed to the primary winding of an RF transformer. Placing a 25-Ω resistor in series with
INP and INM is recommended to dampen ringing due to ADC kickback.
Since the input signal must be biased around the common-mode voltage of the internal circuitry, the
common-mode voltage (VCM) from the ADS5510 is connected to the center-tap of the secondary winding.
To ensure a steady low-noise VCM reference, best performance is attained when the CM output (pin 17) is
filtered to ground with a 10-Ω series resistor and parallel 0.1-µF and 0.001-µF low-inductance capacitors, as
illustrated in Figure 24.
Output VCM (pin 17) is designed to directly drive the ADC input. When providing a custom CM level, be aware
that the input structure of the ADC sinks a common-mode current in the order of 600 µA (300 µA per input).
Equation 1 describes the dependency of the common-mode current and the sampling frequency:
600mA fS (in MSPS)
125 MSPS
(1)
Where:
fS > 2 MSPS.
This equation helps to design the output capability and impedance of the driving circuit accordingly.
When it is necessary to buffer or apply a gain to the incoming analog signal, it is possible to combine
single-ended operational amplifiers with an RF transformer, or to use a differential input/output amplifier without
a transformer, to drive the input of the ADS5510. Texas Instruments offers a wide selection of single-ended
operational amplifiers (including the THS3201, THS3202, OPA695, and OPA847) that can be selected
depending on the application. An RF gain block amplifier, such as Texas Instruments THS9001, can also be
used with an RF transformer for high input frequency applications. The THS4503 is a recommended differential
input/output amplifier. Table 4 lists the recommended amplifiers.
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Table 4. Recommended Amplifiers to Drive the Input of the ADS5510
INPUT SIGNAL FREQUENCY
DC to 20 MHz
RECOMMENDED AMPLIFIER
THS4503
TYPE OF AMPLIFIER
Differential In/Out Amp
Operational Amp
USE WITH TRANSFORMER?
No
Yes
No
DC to 50 MHz
OPA847
DC to 100 MHz
THS4509
Differential In/Out Amp
Operational Amp
OPA695
Yes
Yes
Yes
Yes
10 MHz to 120 MHz
Over 100 MHz
THS3201
Operational Amp
THS3202
Operational Amp
THS9001
RF Gain Block
When using single-ended operational amplifiers (such as the THS3201, THS3202, OPA695, or OPA847) to
provide gain, a three-amplifier circuit is recommended with one amplifier driving the primary of an RF
transformer and one amplifier in each of the legs of the secondary driving the two differential inputs of the
ADS5510. These three amplifier circuits minimize even-order harmonics. For high frequency inputs, an RF gain
block amplifier can be used to drive a transformer primary; in this case, the transformer secondary connections
can drive the input of the ADS5510 directly, as shown in Figure 25, or with the addition of the filter circuit shown
in Figure 26.
Figure 26 illustrates how RIN and CIN can be placed to isolate the signal source from the switching inputs of the
ADC and to implement a low-pass RC filter to limit the input noise in the ADC. It is recommended that these
components be included in the ADS5510 circuit layout when any of the amplifier circuits discussed previously
are used. The components allow fine-tuning of the circuit performance. Any mismatch between the differential
lines of the ADS5510 input produces a degradation in performance at high input frequencies, mainly
characterized by an increase in the even-order harmonics. In this case, special care should be taken to keep as
much electrical symmetry as possible between both inputs.
Another possible configuration for lower-frequency signals is the use of differential input/output amplifiers that
can simplify the driver circuit for applications requiring dc-coupling of the input. Flexible in their configurations
(see Figure 27), such amplifiers can be used for single-ended-to-differential conversion signal amplification.
−
+5V 5V
RS
RIN
RIN
Ω
100
µ
0.1 F
VIN
1:1
INP
INM
OPA695
RT
100
CIN
1000pF
ADS5510
Ω
R1
Ω
400
CM
Ω
10
AV = 8V/V
(18dB)
R2
57.5
Ω
µ
0.1 F
Figure 26. Converting a Single-Ended Input Signal to a Differential Signal Using an RF Transformer
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RS
RG
RF
+5V
RT
+3.3V
m
m
10 F
0.1 F
RIN
RIN
INP
ADS5510
VOCM
11-Bit / 125MSPS
INM
m
1 F
THS4503
CM
m
m
10 F
0.1 F
W
10
-
5V
RG
RF
m
0.1 F
Figure 27. Using the THS4503 with the ADS5510
POWER-SUPPLY SEQUENCE
The preferred power-up sequence is to ramp AVDD first, followed by DRVDD, including a simultaneous ramp of
AVDD and DRVDD. In the event that DRVDD ramps up first in the system, care must be taken to ensure that AVDD
ramps up within 10 ms. Optionally, it is recommended to put a 2-kΩ resistor from REFP (pin 29) to AVDD as
shown in Figure 28. This helps to make the device more robust to power supply ramp-up timings.
28
AVDD
2 kW
29
REFP
1 W
1 mF
Figure 28.
POWER-DOWN
The device enters power-down in one of two ways: either by reducing the clock speed or by setting the PDN bit
throughout the serial programming interface. Using the reduced clock speed, power-down may be initiated for
clock frequency below 2 MSPS. The exact frequency at which the power down occurs varies from device to
device.
Using the serial interface PDN bit to power down the device places the outputs in a high-impedance state and
only the internal reference remains on to reduce the power-up time. The power-down mode reduces power
dissipation to approximately 180 mW.
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REFERENCE CIRCUIT
The ADS5510 has built-in internal reference generation, requiring no external circuitry on the printed circuit
board (PCB). For optimum performance, it is best to connect both REFP and REFM to ground with a 1-µF
decoupling capacitor (the 1-Ω resistor shown in Figure 29 is optional). In addition, an external 56.2-kΩ resistor
should be connected from IREF (pin 31) to AGND to set the proper current for the operation of the ADC, as
shown in Figure 29. No capacitor should be connected between pin 31 and ground; only the 56.2-kΩ resistor
should be used.
1 W
REFP
REFM
IREF
29
30
31
1 mF
1 mF
1 W
56.2 kW
Figure 29. REFP, REFM, and IREF Connections for Optimum Performance
CLOCK INPUT
The ADS5510 clock input can be driven with either a differential clock signal or a single-ended clock input, with
little or no difference in performance between both configurations. The common-mode voltage of the clock inputs
is set internally to CM (pin 17) using internal 5-kΩ resistors that connect CLKP (pin 10) and CLKM (pin 11) to
CM (pin 17), as shown in Figure 30.
CM
CM
5 kW
5 kW
CLKM
CLKP
6 pF
3 pF
3 pF
Figure 30. Clock Inputs
When driven with a single-ended CMOS clock input, it is best to connect CLKM (pin 11) to ground with a
0.01-µF capacitor, while CLKP is ac-coupled with a 0.01-µF capacitor to the clock source, as shown in
Figure 31.
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µ
0.01 F
Square Wave
or Sine Wave
CLKP
ADS5510
(3VPP
)
CLKM
µ
0.01
F
Figure 31. AC-Coupled, Single-Ended Clock Input
The ADS5510 clock input can also be driven differentially, reducing susceptibility to common-mode noise. In this
case, it is best to connect both clock inputs to the differential input clock signal with 0.01-µF capacitors, as
shown in Figure 32.
µ
0.01 F
CLKP
ADS5510
CLKM
Differential Square Wave
or Sine Wave
(3VPP
)
µ
0.01 F
Figure 32. AC-Coupled, Differential Clock Input
For high input frequency sampling, it is recommended to use a clock source with low jitter. Additionally, the
internal ADC core uses both edges of the clock for the conversion process. This means that, ideally, a 50% duty
cycle should be provided. Figure 19 shows the performance variation of the ADC versus clock duty cycle.
Bandpass filtering of the source can help produce a 50% duty cycle clock and reduce the effect of jitter. When
using a sinusoidal clock, the clock jitter further improves as the amplitude is increased. In that sense, using a
differential clock allows for the use of larger amplitudes without exceeding the supply rails and absolute
maximum ratings of the ADC clock input. Figure 18 shows the performance variation of the device versus input
clock amplitude. For detailed clocking schemes based on transformer or PECL-level clocks, see the
ADS55xxEVM User's Guide (SLWU010), available for download from www.ti.com.
INTERNAL DLL
In order to obtain the fastest sampling rates achievable with the ADS5510, the device uses an internal digital
delay lock loop (DLL). Nevertheless, the limited frequency range of operation of DLL degrades the performance
at clock frequencies below 60 MSPS. In order to operate the device below 60 MSPS, the internal DLL must be
shut off using the DLL OFF mode described in the Serial Interface Programming section. The Typical
Performance Curves show the performance obtained in both modes of operation: DLL ON (default) and DLL
OFF. In either of the two modes, the device enters power-down mode if no clock or slow clock is provided. The
limit of the clock frequency where the device functions properly with default settings is ensured to be over 2
MHz.
OUTPUT INFORMATION
The ADC provides 11 data outputs (D10 to D0, with D10 being the MSB and D0 the LSB), a data-ready signal
(CLKOUT, pin 43), and an out-of-range indicator (OVR, pin 64) that equals 1 when the output reaches the
full-scale limits.
Two different output formats (straight offset binary or two's complement) and two different output clock polarities
(latching output data on rising or falling edge of the output clock) can be selected by setting DFS (pin 40) to one
of four different voltages. Table 3 details the four modes. In addition, output enable control (OE, pin 41, active
high) is provided to put the outputs into a high-impedance state.
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In the event of an input voltage overdrive, the digital outputs go to the appropriate full-scale level. For a positive
overdrive, the output code is 0x7FF in straight offset binary output format and 0x3FF in two's complement output
format. For a negative input overdrive, the output code is 0x000 in straight offset binary output format and 0x400
in two's complement output format. These outputs to an overdrive signal are ensured through design and
characterization.
The output circuitry of the ADS5510, by design, minimizes the noise produced by the data switching transients,
and, in particular, its coupling to the ADC analog circuitry. Output D1 (pin 51) senses the load capacitance and
adjusts the drive capability of all the output pins of the ADC to maintain the same output slew rate described in
the timing diagram of Figure 1. Care should be taken to ensure that all output lines (including CLKOUT) have
nearly the same load as D1 (pin 51). This circuit also reduces the sensitivity of the output timing versus supply
voltage or temperature. Placing external resistors in series with the outputs is not recommended.
The timing characteristics of the digital outputs change for sampling rates below the 125 MSPS maximum
sampling frequency. Table 5 and Table 6 show the setup, hold, input clock to output data delays, and rise and
fall times for different sampling frequencies with the DLL on and off, respectively.
Table 7 and Table 8 show the rise and fall times at additional sampling frequencies with DLL on and off,
respectively.
To use the input clock as the data capture clock, it is necessary to delay the input clock by a delay, td, that
results in the desired setup or hold time. Use either Equation 2or Equation 3 to calculate the value of td.
Desired setup time = td – tSTART
Desired hold time = tEND – td
Table 5. Timing Characteristics at Additional Sampling Frequencies (DLL ON)
tSETUP (ns)
tHOLD (ns)
tSTART (ns)
tEND (ns)
tr (ns)
tf (ns)
fS
(MSPS)
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
105
93
2.4
3.2
2.8
3.8
3.1
4.6
3.7
4.6
2.2
2.3
2.8
3.6
2.6
3.7
3.3
4.1
1.7
2.6
5.8
7.3
4.4
5.1
3.3
3.8
80
0.5
1.7
0.8
5.3
5.3
7.9
8.5
5.8
6.7
6.6
7.2
4.4
5.5
5.3
6.4
65
–0.5
Table 6. Timing Characteristics at Additional Sampling Frequencies (DLL OFF)
tSETUP (ns)
tHOLD (ns)
tSTART (ns)
tEND (ns)
tr (ns)
tf (ns)
fS
(MSPS)
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
80
65
40
20
10
2
3.2
4.3
8.5
17
4.2
5.7
11
1.8
2
3
3.8
2.8
5
4.5
1.5
2
8.4
8.3
11
5.8
6.6
7.5
7.5
6.6
7.2
8
4.4
5.5
7.3
7.6
5.3
6.4
7.8
8
3
11.8
14.5
21.6
31
2.6
2.5
4
3.5
4.7
6.5
19
–1
8.9
25.7
51
–9.8
-30
185
9.5
8
27
-3
11.5
515
284
370
8
320
576
50
82
75
150
Table 7. Timing Characteristics at Additional Sampling Frequencies (DLL ON)
CLKOUT Jitter,
Peak-to-Peak
tJIT (ps)
CLKOUT, Rise Time
tr (ns)
CLKOUT, Fall Time
tf (ns)
Input-to-Output Clock Delay
tPDI (ns)
fS
(MSPS)
MIN
TYP
2
MAX
MIN
TYP
1.7
2.1
2.6
MAX
MIN
TYP
175
210
260
MAX
250
315
380
MIN
4
TYP
4.7
4.3
4.1
MAX
5.5
105
80
2.2
2.8
3.5
1.8
2.3
2.9
2.5
3.1
3.7
3.5
5.1
65
4.8
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SLAS499–JANUARY 2007
Table 8. Timing Characteristics at Additional Sampling Frequencies (DLL OFF)
CLKOUT Jitter,
Peak-to-Peak
tJIT (ps)
CLKOUT, Rise Time
tr (ns)
CLKOUT, Fall Time
tf (ns)
Input-to-Output Clock Delay
tPDI (ns)
fS
(MSPS)
MIN
TYP
2.5
3.1
4.8
8.3
MAX
MIN
TYP
2.1
2.6
4
MAX
MIN
TYP
210
260
445
800
MAX
MIN
7.1
7.8
9.5
13
TYP
8
MAX
8.9
80
65
40
20
10
2
2.8
3.5
5.3
9.5
2.3
2.9
4.4
8.2
315
380
8.5
9.4
650
10.4
15.5
20.7
551
11.4
18
7.6
1200
16
25.5
567
31
52
36
65
2610
4400
537
SERIAL PROGRAMMING INTERFACE
The ADS5510 has internal registers for the programming of some of the modes described in the previous
sections. The registers should be reset after power-up by applying a 2 µs (minimum) high pulse on RESET (pin
35); this also resets the entire ADC and sets the data outputs to low. This pin has a 200-kΩ internal pullup
resistor to AVDD. The programming is done through a three-wire interface. The timing diagram and serial
register setting in the Serial Programing Interface section describe the programming of this register.
Table 2 shows the different modes and the bit values to be written to the register to enable them.
Note that some of these modes may modify the standard operation of the device and possibly vary the
performance with respect to the typical data shown in this data sheet.
Applying a RESET signal is must to set the internal registers to their default states for normal operation. If the
hardware RESET function is not used in the system, the RESET pin must be tied to ground and it is necessary
to write the default values to the internal registers through the serial programming interface. The registers must
be written in the following order.
Write 9000h (Address 9, Data 000)
Write A000h (Address A, Data 000)
Write B000h (Address B, Data 000)
Write C000h (Address C, Data 000)
Write D000h (Address D, Data 000)
Write E000h (Address E, Data 804)
Write 0000h (Address 0, Data 000)
Write 1000h (Address 1, Data 000)
Write F000h (Address F, Data 000)
NOTE:
This procedure is only required if a RESET pulse is not provided to the device.
25
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PowerPAD PACKAGE
The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of
bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using
standard printed circuit board (PCB) assembly techniques and can be removed and replaced using standard
repair procedures.
The PowerPAD package is designed so that the lead frame die pad (or thermal pad) is exposed on the bottom
of the IC. This provides a low thermal resistance path between the die and the exterior of the package. The
thermal pad on the bottom of the IC can then be soldered directly to the printed circuit board (PCB), using the
PCB as a heatsink.
Assembly Process
1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as
illustrated in the Mechanical Data section. The recommended thermal pad dimension is 8 mm x 8 mm.
2. Place a 5-by-5 array of thermal vias in the thermal pad area. These holes should be 13 mils in diameter.
The small size prevents wicking of the solder through the holes.
3. It is recommended to place a small number of 25 mil diameter holes under the package, but outside the
thermal pad area to provide an additional heat path.
4. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such
as a ground plane).
5. Do not use the typical web or spoke via connection pattern when connecting the thermal vias to the
ground plane. The spoke pattern increases the thermal resistance to the ground plane.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area.
7. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking.
8. Apply solder paste to the exposed thermal pad area and all of the package terminals.
For more detailed information regarding the PowerPAD package and its thermal properties, see either the
application brief SLMA004B (PowerPAD Made Easy) or technical brief SLMA002 (PowerPAD Thermally
Enhanced Package).
26
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ADS5510IPAP
ACTIVE
HTQFP
PAP
64
160
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
ADS5510I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
ADS5510IPAP
PAP
HTQFP
64
160
8 x 20
150
315 135.9 7620 15.2
13.1
13
Pack Materials-Page 1
GENERIC PACKAGE VIEW
PAP 64
10 x 10, 0.5 mm pitch
HTQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
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