ADS7820U [TI]

12-Bit 10us Sampling CMOS Analog-To-Digital Converter 28-SOIC -40 to 85;
ADS7820U
型号: ADS7820U
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

12-Bit 10us Sampling CMOS Analog-To-Digital Converter 28-SOIC -40 to 85

光电二极管 转换器
文件: 总11页 (文件大小:198K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
ADS7820  
ADS7820  
ADS7820  
12-Bit 10µs Sampling CMOS  
ANALOG-to-DIGITAL CONVERTER  
DESCRIPTION  
FEATURES  
The ADS7820 is a complete 12-bit sampling A/D  
using state-of-the-art CMOS structures. It contains a  
complete 12-bit, capacitor-based SAR A/D with S/H,  
reference, clock, interface for microprocessor use, and  
three-state output drivers.  
100kHz min SAMPLING RATE  
0 to +5V INPUT RANGE  
72dB min SINAD WITH 45kHz INPUT  
±1/2 LSB max INL AND DNL  
SINGLE +5V SUPPLY OPERATION  
PIN-COMPATIBLE WITH 16-BIT ADS7821  
The ADS7820 is specified at a 100kHz sampling rate,  
and guaranteed over the full temperature range. Laser-  
trimmed scaling resistors provide a 0 to +5V input  
range, with power dissipation under 100mW.  
USES INTERNAL OR EXTERNAL  
REFERENCE  
The 28-pin ADS7820 is available in a plastic 0.3" DIP  
and in an SOIC, both fully specified for operation over  
the industrial –40°C to +85°C range.  
COMPLETE WITH S/H, REF, CLOCK, ETC.  
FULL PARALLEL DATA OUTPUT  
100mW max POWER DISSIPATION  
28-PIN 0.3" PLASTIC DIP AND SOIC  
R/C  
Clock  
CS  
BYTE  
BUSY  
Successive Approximation Register and Control Logic  
CDAC  
Output  
Three  
Latches  
State  
and  
5k  
0 to +5V Input  
Parallel  
Three  
Data  
6.66kΩ  
20kΩ  
State  
Bus  
Comparator  
Drivers  
CAP  
Internal  
+2.5V Ref  
Buffer  
4kΩ  
REF  
International Airport Industrial Park  
Mailing Address: PO Box 11400  
Cable: BBRCORP  
Tucson, AZ 85734  
Street Address: 6730 S. Tucson Blvd.  
Tucson, AZ 85706  
Tel: (520) 746-1111  
Twx: 910-952-1111  
Telex: 066-6491  
FAX: (520) 889-1510  
Immediate Product Info: (800) 548-6132  
©1996 Burr-Brown Corporation  
Printed in U.S.A. June, 1996  
PDS-1322  
SBAS047  
SPECIFICATIONS  
ELECTRICAL  
TA = –40°C to +85°C, fS = 100kHz, VDIG = VANA = +5V, using internal reference, unless otherwise specified.  
ADS7820P/U  
ADS7820PB/UB  
TYP  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
UNITS  
12  
Bits  
ANALOG INPUT  
Voltage Ranges  
Impedance  
0 to +5  
10  
35  
V
kΩ  
pF  
Capacitance  
THROUGHPUT SPEED  
Conversion Time  
Complete Cycle  
5.7  
8
10  
µs  
µs  
Acquire and Convert  
Throughput Rate  
100  
kHz  
DC ACCURACY  
Integral Linearity Error  
Differential Linearity Error  
No Missing Codes  
Transition Noise(2)  
Full Scale Error(3,4)  
Full Scale Error Drift  
Full Scale Error(3,4)  
Full Scale Error Drift  
Offset Error  
±1.0  
±1.0  
±0.5  
±0.5  
LSB(1)  
LSB  
Bits  
LSB  
%
ppm/°C  
%
ppm/°C  
mV  
ppm/°C  
LSB  
Guaranteed  
0.1  
±0.5  
±0.5  
±8  
±0.25  
±0.25  
±4  
±7  
±2  
±2  
±5  
Ext. 2.5000V Ref  
Ext. 2.5000V Ref  
Offset Error Drift  
Power Supply Sensitivity  
(VDIG = VANA = VD)  
+4.75V < VD < +5.25V  
±0.75  
±0.5  
AC ACCURACY  
Spurious-Free Dynamic Range  
Total Harmonic Distortion  
Signal-to-(Noise+Distortion)  
Signal-to-Noise  
f
IN = 45kHz  
80  
dB(5)  
dB  
dB  
dB  
kHz  
fIN = 45kHz  
fIN = 45kHz  
fIN = 45kHz  
–80  
70  
70  
72  
72  
Full-Power Bandwidth(6)  
250  
SAMPLING DYNAMICS  
Aperture Delay  
Transient Response  
Overvoltage Recovery(7)  
40  
ns  
µs  
ns  
FS Step  
2
150  
REFERENCE  
Internal Reference Voltage  
Internal Reference Source Current  
(Must use external buffer.)  
External Reference Voltage Range  
for Specified Linearity  
2.48  
2.3  
2.5  
1
2.52  
V
µA  
2.5  
2.7  
V
External Reference Current Drain  
Ext. 2.5000V Ref  
100  
µA  
DIGITAL INPUTS  
Logic Levels  
VIL  
VIH  
IIL  
–0.3  
+2.0  
+0.8  
VD +0.3V  
±10  
V
V
µA  
µA  
IIH  
±10  
DIGITAL OUTPUTS  
Data Format  
Data Coding  
VOL  
Parallel 12 bits  
Straight Binary  
+0.4  
ISINK = 1.6mA  
ISOURCE = 500µA  
High-Z State,  
VOUT = 0V to VDIG  
High-Z State  
V
V
µA  
VOH  
+4  
Leakage Current  
±5  
Output Capacitance  
15  
pF  
DIGITAL TIMING  
Bus Access Time  
Bus Relinquish Time  
83  
83  
ns  
ns  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN  
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject  
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not  
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.  
®
2
ADS7820  
SPECIFICATIONS (CONT)  
ELECTRICAL  
TA = –40°C to +85°C, fS = 100kHz, VDIG = VANA = +5V, using internal reference, unless otherwise specified.  
ADS7820P/U  
ADS7820PB/UB  
TYP  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
UNITS  
POWER SUPPLIES  
Specified Performance  
VDIG  
Must be VANA  
+4.75  
+4.75  
+5  
+5  
0.3  
16  
+5.25  
+5.25  
V
V
mA  
mA  
VANA  
+IDIG  
+IANA  
Power Dissipation  
f
S = 100kHz  
100  
mW  
TEMPERATURE RANGE  
Specified Performance  
Derated Performance  
Storage  
–40  
–55  
–65  
+85  
+125  
+150  
°C  
°C  
°C  
Thermal Resistance (θJA  
)
Plastic DIP  
SOIC  
75  
75  
°C/W  
°C/W  
NOTES: (1) LSB means Least Significant Bit. For the 12-bit, 0 to +5V input ADS7820, one LSB is 1.22mV. (2) Typical rms noise at worst case transitions and  
temperatures. (3) Adjustable to zero with external potentiometer as shown in Figure 4b. (4) Full scale error is the worst case of Full Scale untrimmed deviation from  
ideal last code transition divided by the transition voltage and includes the effect of offset error. (5) All specifications in dB are referred to a full-scale input. (6) Full-  
Power Bandwidth defined as Full-Scale input frequency at which Signal-to-(Noise + Distortion) degrades to 60dB, or 10 bits of accuracy. (7) Recovers to specified  
performance after 2 x FS input overvoltage.  
ABSOLUTE MAXIMUM RATINGS  
ELECTROSTATIC  
Analog Inputs: VIN ....................................................0.7V to +VANA +0.3V  
REF .................................... +VANA +0.3V to AGND2 –0.3V  
DISCHARGE SENSITIVITY  
CAP ........................................... Indefinite Short to AGND2  
Momentary Short to VANA  
Electrostatic discharge can cause damage ranging from per-  
formance degradation to complete device failure. Burr-  
Brown Corporation recommends that all integrated circuits  
Ground Voltage Differences: DGND, AGND1, AGND2 ................... ±0.3V  
VANA ....................................................................................................... 7V  
VDIG to VANA ..................................................................................... +0.3V  
VDIG ....................................................................................................... 7V  
be handled and stored using appropriate ESD protection  
methods.  
Digital Inputs ............................................................ –0.3V to +VDIG +0.3V  
Maximum Junction Temperature ................................................... +165°C  
Internal Power Dissipation ............................................................. 825mW  
Lead Temperature (soldering, 10s) ................................................ +300°C  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet  
PACKAGE INFORMATION  
PACKAGE DRAWING  
published specifications.  
PRODUCT  
PACKAGE  
NUMBER(1)  
ADS7820P  
ADS7820PB  
ADS7820U  
ADS7820UB  
Plastic DIP  
Plastic DIP  
SOIC  
246  
246  
217  
217  
SOIC  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix D of Burr-Brown IC Data Book.  
ORDERING INFORMATION  
MINIMUM  
SIGNAL-TO-  
MAXIMUM  
LINEARITY  
ERROR (LSB)  
(NOISE +  
DISTORTION)  
RATIO (dB)  
SPECIFICATION  
TEMPERATURE  
RANGE  
PRODUCT  
PACKAGE  
ADS7820P  
ADS7820PB  
ADS7820U  
ADS7820UB  
±1.0  
±0.5  
±1.0  
±0.5  
70  
72  
70  
72  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
Plastic DIP  
Plastic DIP  
SOIC  
SOIC  
®
3
ADS7820  
PIN CONFIGURATION  
1
2
3
4
5
6
7
8
9
28  
VDIG  
VIN  
AGND1  
REF  
27 VANA  
26 BUSY  
25 CS  
CAP  
AGND2  
D11 (MSB)  
D10  
24 R/C  
23 BYTE  
22 DZ  
ADS7820  
D9  
21 DZ  
D8  
20 DZ  
D7 10  
D6 11  
19 DZ  
18 D0 (LSB)  
17 D1  
D5 12  
D4 13  
16 D2  
DGND 14  
15 D3  
PIN ASSIGNMENTS  
PIN #  
NAME  
DESCRIPTION  
1
2
3
VIN  
AGND1  
REF  
Analog Input. Full-scale input range is 0 to +5V.  
Analog Ground. Used internally as ground reference point.  
Reference Input/Output. Outputs internal reference of +2.5V nominal. Can also be driven by external system reference. In both  
cases, connect to ground with a 2.2µF Tantalum capacitor.  
4
CAP  
Reference Buffer Capacitor. 2.2µF Tantalum to ground.  
5
AGND2  
Analog Ground.  
6
D11 (MSB) Data Bit 11. Most Significant Bit (MSB) of conversion results. Hi-Z state when CS is HIGH, or when R/C is LOW.  
7
D10  
D9  
Data Bit 10. Hi-Z state when CS is HIGH, or when R/C is LOW.  
8
Data Bit 9. Hi-Z state when CS is HIGH, or when R/C is LOW.  
9
D8  
Data Bit 8. Hi-Z state when CS is HIGH, or when R/C is LOW.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
D7  
Data Bit 7. Hi-Z state when CS is HIGH, or when R/C is LOW.  
D6  
Data Bit 6. Hi-Z state when CS is HIGH, or when R/C is LOW.  
D5  
Data Bit 5. Hi-Z state when CS is HIGH, or when R/C is LOW.  
D4  
Data Bit 4. Hi-Z state when CS is HIGH, or when R/C is LOW.  
DGND  
D3  
Digital Ground.  
Data Bit 3. Hi-Z state when CS is HIGH, or when R/C is LOW.  
D2  
Data Bit 2. Hi-Z state when CS is HIGH, or when R/C is LOW.  
D1  
Data Bit 1. Hi-Z state when CS is HIGH, or when R/C is LOW.  
D0 (LSB)  
DZ  
Data Bit 0. Lease Significant Bit (LSB) of conversion results. Hi-Z state when CS is HIGH, or when R/C is LOW.  
Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW.  
Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW.  
Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW.  
Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW.  
DZ  
DZ  
DZ  
BYTE  
Byte Select. With BYTE LOW, data will be output as indicated above, causing pin 6 (D11) to output the MSB, and pin 18 (D0) to  
output the LSB. Pins 19 to 22 will output LOWs. With BYTE HIGH, the top and bottom 8 bits of data will be switched, so that pin 6  
outputs data bit 3, pin 9 outputs data bit 0 (LSB), pin 10 to 13 output LOWs, pin 15 outputs data bit 11 (MSB) and pin 22 outputs  
data bit 4.  
24  
25  
26  
R/C  
CS  
Read/Convert input. With CS LOW, a falling edge on R/C puts the internal sample/hold into the hold state and starts a conversion.  
With CS LOW, a rising edge on R/C enables the output data bits.  
Chip Select. Internally OR’d with R/C. With R/C LOW, a falling edge on CS will initiate a conversion. With R/C HIGH, a falling edge  
on CS will enable the output data bits.  
BUSY  
Busy Output. Falls when a conversion is started, and remains LOW until the conversion is completed and the data is latched into the  
output register. With CS LOW and R/C HIGH, output data will be valid when BUSY rises, so that the rising edge can be used to  
latch the data. CS or R/C must be high when BUSY rises, or another conversion will start, without time for signal acquisition.  
27  
28  
VANA  
Analog Supply Input. Nominally +5V. Connect directly to pin 28. Decouple to ground with 0.1µF ceramic and 10µF Tantalum  
capacitors.  
VDIG  
Digital Supply Input. Nominally +5V. Connect directly to pin 27. Must be VANA.  
®
4
ADS7820  
TYPICAL PERFORMANCE CURVES  
At TA = –40°C to +85°C, fS = 100kHz, VDIG = VANA = +5V, using internal reference, unless otherwise specified.  
INTERNAL REFERENCE VOLTAGE vs TEMPERATURE  
CONVERSION TIME vs TEMPERATURE  
2.52  
2.515  
2.51  
6.2  
6.1  
6
2.505  
2.5  
5.9  
5.8  
5.7  
5.6  
5.5  
5.4  
2.495  
2.49  
2.485  
2.48  
–40  
–15  
10  
35  
60  
85  
–40  
–15  
10  
35  
60  
85  
Temperature (°C)  
Temperature (°C)  
ADS7820 AT +25°C  
ADS7820 AT +25°C  
Min/Max INL Errors  
–0.051 at 03962  
0.086 at 02048  
Min/Max DNL Errors  
–0.073 at 00512  
0.087 at 02047  
0.2  
+0.1  
0
0.2  
+0.1  
0
–0.1  
–0.2  
–0.1  
–0.2  
0
512 1024 1536 2048 2560 3072 3584 4096  
Decimal Code  
0
512 1024 1536 2048 2560 3072 3584 4096  
Decimal Code  
®
5
ADS7820  
CS and R/C are internally OR’d and level triggered. There  
is not a requirement which input goes LOW first when  
initiating a conversion. If, however, it is critical that CS or  
R/C initiates conversion ‘n’, be sure the less critical input is  
LOW at least 10ns prior to the initiating input.  
BASIC OPERATION  
Figure 1 shows a basic circuit to operate the ADS7820 with  
a full parallel data output. Taking R/C (pin 24) LOW for a  
minimum of 40ns (5.4µs max) will initiate a conversion.  
BUSY (pin 26) will go LOW and stay LOW until the  
conversion is completed and the output registers are up-  
dated. Data will be output in Straight Binary with the MSB  
on pin 6. BUSY going HIGH can be used to latch the data.  
All convert commands will be ignored while BUSY is  
LOW.  
To reduce the number of control pins, CS can be tied LOW  
using R/C to control the read and convert modes. However,  
the output will become active whenever R/C goes HIGH.  
Refer to the Reading Data section.  
The ADS7820 will begin tracking the input signal at the end  
of the conversion. Allowing 10µs between convert com-  
mands assures accurate acquisition of a new signal.  
CS  
1
R/C BUSY OPERATION  
X
0
X
1
None. Databus is in Hi-Z state.  
Initiates conversion “n”. Databus remains  
in Hi-Z state.  
0
0
0
0
1
1
1
0
1
1
0
0
Initiates conversion “n”. Databus enters Hi-Z  
state.  
STARTING A CONVERSION  
Conversion “n” completed. Valid data from  
conversion “n” on the databus.  
The combination of CS (pin 25) and R/C (pin 24) LOW for  
a minimum of 40ns immediately puts the sample/hold of the  
ADS7820 in the hold state and starts conversion ‘n’. BUSY  
(pin 26) will go LOW and stay LOW until conversion ‘n’ is  
completed and the internal output register has been updated.  
All new convert commands during BUSY LOW will be  
ignored. CS and/or R/C must go HIGH before BUSY goes  
HIGH or a new conversion will be initiated without suffi-  
cient time to acquire a new signal.  
Enables databus with valid data from  
conversion “n”.  
Enables databus with valid data from  
conversion “n-1”(1). Conversion n in process.  
Enables databus with valid data from  
conversion “n-1”(1). Conversion “n” in process.  
New conversion initiated without acquisition  
of a new signal. Data will be invalid. CS and/or  
R/C must be HIGH when BUSY goes HIGH.  
The ADS7820 will begin tracking the input signal at the end  
of the conversion. Allowing 10µs between convert com-  
mands assures accurate acquisition of a new signal. Refer to  
Table I for a summary of CS, R/C, and BUSY states and  
Figures 3 through 5 for timing diagrams.  
X
X
0
New convert commands ignored. Conversion  
“n” in process.  
NOTE: (1) See Figures 2 and 3 for constraints on data valid from  
conversion “n-1”.  
Table I. Control Line Functions for “Read” and “Convert”.  
0 to +5V  
1
2
28  
+5V  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
+
+
0.1µF  
10µF  
2.2µF  
+
+
3
4
2.2µF  
Convert Pulse  
5
B11 (MSB)  
6
B10  
B9  
B8  
B7  
B6  
B5  
B4  
LOW  
7
40ns min  
ADS7820  
5.4µs max  
LOW  
LOW  
LOW  
B0 (LSB)  
B1  
8
9
10  
11  
12  
13  
14  
B2  
B3  
FIGURE 1. Basic Operation (Byte Low).  
®
6
ADS7820  
PARALLEL OUTPUT (During a Conversion)  
READING DATA  
After conversion ‘n’ has been initiated, valid data from  
conversion ‘n-1’ can be read and will be valid up to 16µs  
after the start of conversion ‘n’. Do not attempt to read data  
from 16µs after the start of conversion ‘n’ until BUSY (pin  
26) goes HIGH; this may result in reading invalid data.  
Refer to Table III and Figures 3 and 5 for timing specifica-  
tions.  
The ADS7820 outputs full or byte-reading parallel data in  
Straight Binary data output format. The parallel output will  
be active when R/C (pin 24) is HIGH and CS (pin 25) is  
LOW. Any other combination of CS and R/C will tri-state  
the parallel output. Valid conversion data can be read in a  
full parallel, 12-bit word or two 8-bit bytes on pins 6-13 and  
pins 15-22. BYTE (pin 23) can be toggled to read both bytes  
within one conversion cycle. Refer to Table II for ideal  
output codes and Figure 2 for bit locations relative to the  
state of BYTE.  
Note! For the best possible performance, data should not be  
read during a conversion. The switching noise of the asyn-  
chronous data transfer can cause digital feedthrough degrad-  
ing the converter’s performance.  
The number of control lines can be reduced by tieing CS  
LOW while using R/C to initiate conversions and activate  
the output mode of the converter. See Figure 3.  
DIGITAL OUTPUT  
STRAIGHT BINARY  
DESCRIPTION  
ANALOG INPUT  
0 to +5V  
BINARY CODE  
HEX CODE  
Full Scale Range  
Least Significant  
Bit (LSB)  
1.22mV  
SYMBOL  
DESCRIPTION  
Convert Pulse Width  
MIN TYP MAX UNITS  
t1  
t2  
40  
5400  
8
ns  
Full Scale  
Midscale  
4.99878V  
2.5V  
1111 1111 1111  
1000 0000 0000  
0111 1111 1111  
FFF  
800  
7FF  
Data Valid Delay after R/C LOW  
µs  
t3  
t4  
BUSY Delay from R/C LOW  
BUSY LOW  
65  
8
ns  
µs  
One LSB below  
Midscale  
2.49878V  
t5  
BUSY Delay after  
End of Conversion  
220  
ns  
Zero Scale  
0V  
0000 0000 0000  
0
Table II. Ideal Input Voltages and Output Codes.  
t6  
t7  
Aperture Delay  
Conversion Time  
40  
ns  
µs  
µs  
ns  
ns  
µs  
7.6  
8
2
t8  
Acquisition Time  
PARALLEL OUTPUT (After a Conversion)  
t9  
Bus Relinquish Time  
BUSY Delay after Data Valid  
10  
35  
83  
After conversion ‘n’ is completed and the output registers  
have been updated, BUSY (pin 26) will go HIGH. Valid data  
from conversion ‘n’ will be available on D11-D0 (pin 6-13  
and 15-18 when BYTE is LOW). BUSY going HIGH can be  
used to latch the data. Refer to Table III and Figures 3 and  
5 for timing specifications.  
t10  
t11  
50 200  
7.4  
Previous Data Valid  
after R/C LOW  
t
7 + t6  
Throughput Time  
R/C to CS Setup Time  
Time Between Conversions  
9
10  
83  
µs  
ns  
µs  
ns  
t12  
10  
t13  
10  
t14  
Bus Access Time  
and BYTE Delay  
10  
TABLE III. Conversion Timing.  
BYTE LOW  
BYTE HIGH  
+5V  
6
7
23  
22  
21  
20  
19  
18  
17  
16  
15  
6
7
23  
22  
21  
20  
19  
18  
17  
16  
15  
Bit 11 (MSB)  
Bit 10  
Bit 9  
Bit 3  
Bit 2  
LOW  
LOW  
LOW  
LOW  
Bit 0 (LSB)  
Bit 1  
Bit 4  
Bit 5  
Bit 6  
Bit 7  
Bit 8  
Bit 9  
ADS7820  
ADS7820  
8
8
Bit 1  
9
9
Bit 8  
Bit 0 (LSB)  
LOW  
10  
11  
12  
13  
14  
10  
11  
12  
13  
14  
Bit 7  
Bit 6  
LOW  
Bit 5  
LOW  
Bit 4  
Bit 2  
LOW  
Bit 10  
Bit 11  
Bit 3  
FIGURE 2. Bit Locations Relative to State of BYTE (pin 23).  
®
7
ADS7820  
t1  
R/C  
BUSY  
t13  
t2  
t4  
t3  
t6  
t5  
Convert  
t7  
Acquire  
t8  
Convert  
Acquire  
MODE  
Previous  
Data Valid  
Previous  
Data Valid  
Hi-Z  
Not Valid  
Data Valid  
t10  
Hi-Z  
Data Valid  
DATA BUS  
t9  
t11  
FIGURE 3. Conversion Timing with Outputs Enabled after Conversion (CS Tied LOW.)  
t12  
t12  
t12  
t12  
R/C  
CS  
t1  
t3  
t4  
BUSY  
MODE  
t6  
Convert  
t7  
Acquire  
Acquire  
Hi-Z State  
Data Valid  
t9  
Hi-Z State  
DATA BUS  
t14  
FIGURE 4. Using CS to Control Conversion and Read Timing.  
t12  
t12  
R/C  
CS  
BYTE  
Pins 6 - 13  
Hi-Z  
Hi-Z  
High Byte  
t14  
Low Byte  
Hi-Z  
t14  
High Byte  
t9  
Pins 15 - 22  
Low Byte  
Hi-Z  
FIGURE 5. Using CS and BYTE to Control Data Bus.  
®
8
ADS7820  
INPUT RANGE  
REF  
The ADS7820 offers a standard 0V to 5V input range.  
Figure 6 shows the required circuit connections for the  
ADS7820 with and without the gain adjustment hardware.  
Adjustments for offset and gain are described in the calibra-  
tion section of this data sheet.  
REF (pin 3) is an input for an external reference or the output  
for the internal 2.5V reference. A 2.2µF capacitor should be  
connected as close to the REF pin as possible. The capacitor  
and the output resistance of REF create a low pass filter to  
bandlimit noise on the reference. Using a smaller value  
capacitor will introduce more noise to the reference degrad-  
ing the SNR and SINAD. The REF pin should not be used  
to drive external AC or DC loads.  
CALIBRATION  
The range for the external reference is 2.3V to 2.7V and  
determines the actual LSB size. Increasing the reference  
voltage will increase the full scale range and the LSB size of  
the converter which can improve the SNR.  
The ADS7820 can be trimmed in hardware or software. There  
is no external, offset adjustment. If offset adjustment is re-  
quired, an op amp featuring an offset trim pin should be used  
to drive the ADS7820. The offset should be trimmed before  
the gain since the offset directly affects the gain. To achieve  
optimum performance, several iterations may be required.  
CAP  
CAP (pin 4) is the output of the internal reference buffer. A  
2.2µF capacitor should be placed as close to the CAP pin as  
possible to provide optimum switching currents for the  
CDAC throughout the conversion cycle and compensation  
for the output of the internal buffer. Using a capacitor any  
smaller than 1µF can cause the output buffer to oscillate and  
may not have sufficient charge for the CDAC. Capacitor  
values larger than 2.2µF will have little affect on improving  
performance.  
GAIN ADJUSTMENT  
To calibrate the gain of the ADS7820, a 576kresistor must  
be tied between the REF pin and a 5V potentiometer (see  
Figure 6b). The calibration range is ±15mV for the gain.  
REFERENCE  
The ADS7820 can operate with its internal 2.5V reference or  
an external reference. By applying an external reference to  
pin 3, the internal reference can be bypassed. The reference  
voltage at REF is buffered internally with the output on CAP  
(pin 4).  
The output of the buffer is capable of driving up to 2mA of  
current to a DC load. DC loads requiring more than 2mA of  
current from the CAP pin will begin to degrade the linearity  
of the ADS7820. Using an external buffer will allow the  
internal reference to be used for larger DC loads and AC  
loads. Do not attempt to directly drive an AC load with the  
output voltage on CAP. This will cause performance degra-  
dation of the converter.  
The internal reference has an 8 ppm/°C drift (typical) and  
accounts for approximately 20% of the full scale error  
(FSE = ±0.5% for low grade, ±0.25% for high grade).  
a) WITHOUT EXTERNAL GAIN ADJUSTMENT  
b) WITH EXTERNAL GAIN ADJUSTMENT  
1
1
0 to +5V  
VIN  
0 to +5V  
2.2µF  
VIN  
2
3
4
5
2
3
4
5
AGND1  
REF  
AGND1  
REF  
2.2µF  
576k  
2.2µF  
+5V  
+
+
+
+
50kΩ  
CAP  
CAP  
Gain  
2.2µF  
AGND2  
AGND2  
FIGURE 6. Circuit Diagram With and Without External Gain Adjustment.  
®
9
ADS7820  
SIGNAL CONDITIONING  
LAYOUT  
The FET switches used for the sample hold on many CMOS  
A/D converters release a significant amount of charge injec-  
tion which can cause the driving op amp to oscillate. The  
FET switch on the ADS7820, compared to the FET switches  
on other CMOS A/D converters, releases 5%-10% of the  
charge. There is also a resistive front end which attenuates  
any charge which is released. The end result is a minimal  
requirement for the anti-alias filter on the front end. Any op  
amp sufficient for the signal in an application will be  
sufficient to drive the ADS7820.  
POWER  
For optimum performance, tie the analog and digital power  
pins to the same +5V power supply and tie the analog and  
digital grounds together. As noted in the electrical specifica-  
tions, the ADS7820 uses 90% of its power for the analog  
circuitry. The ADS7820 should be considered as an analog  
component.  
The +5V power for the A/D should be separate from the +5V  
used for the system’s digital logic. Connecting VDIG (pin 28)  
directly to a digital supply can reduce converter performance  
due to switching noise from the digital logic. For best  
performance, the +5V supply can be produced from what-  
ever analog supply is used for the rest of the analog signal  
conditioning. If +12V or +15V supplies are present, a simple  
+5V regulator can be used. Although it is not suggested, if  
the digital supply must be used to power the converter, be  
sure to properly filter the supply. Either using a filtered  
digital supply or a regulated analog supply, both VDIG and  
VANA should be tied to the same +5V source.  
INTERMEDIATE LATCHES  
The ADS7820 does have tri-state outputs for the parallel  
port, but intermediate latches should be used if the bus will  
be active during conversions. If the bus is not active during  
conversion, the tri-state outputs can be used to isolate the  
A/D from other peripherals on the same bus. Tri-state  
outputs can also be used when the A/D is the only peripheral  
on the data bus.  
Intermediate latches are beneficial on any monolithic A/D  
converter. The ADS7820 has an internal LSB size of 610µV.  
Transients from fast switching signals on the parallel port,  
even when the A/D is tri-stated, can be coupled through the  
substrate to the analog circuitry causing degradation of  
converter performance. The effects of this phenomenon will  
be more obvious when using the pin-compatible ADS7821  
or any of the other 16-bit converters in the ADS Family. This  
is due to the smaller internal LSB size of 38µV.  
GROUNDING  
Three ground pins are present on the ADS7820. DGND is  
the digital supply ground. AGND2 is the analog supply  
ground. AGND1 is the ground which all analog signals  
internal to the A/D are referenced. AGND1 is more suscep-  
tible to current induced voltage drops and must have the path  
of least resistance back to the power supply.  
All the ground pins of the A/D should be tied to the analog  
ground plane, separated from the system’s digital logic  
ground, to achieve optimum performance. Both analog and  
digital ground planes should be tied to the “system” ground  
as near to the power supplies as possible. This helps to  
prevent dynamic digital ground currents from modulating  
the analog ground through a common impedance to power  
ground.  
®
10  
ADS7820  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
Customers are responsible for their applications using TI components.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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