ADS7866_14 [TI]
1.2-V, 12-/10-/8-BIT, 200-KSPS/100-KSPS, MICRO-POWER, MINIATURE ANALOG-TO-DIGITAL CONVERTER WITH SERIAL INTERFACE;![ADS7866_14](http://pdffile.icpdf.com/pdf1/p00080/img/icpdf/ADS7868_421592_icpdf.jpg)
型号: | ADS7866_14 |
厂家: | ![]() |
描述: | 1.2-V, 12-/10-/8-BIT, 200-KSPS/100-KSPS, MICRO-POWER, MINIATURE ANALOG-TO-DIGITAL CONVERTER WITH SERIAL INTERFACE |
文件: | 总24页 (文件大小:532K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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B u r rĆ B ro w n P ro d u ct s
ADS7866
ADS7867
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ADS7868
SLAS465–JUNE 2005
1.2-V, 12-/10-/8-BIT, 200-KSPS/100-KSPS, MICRO-POWER, MINIATURE
ANALOG-TO-DIGITAL CONVERTER WITH SERIAL INTERFACE
The sampling, conversion, and activation of digital
output SDO are initiated on the falling edge of CS.
The serial clock SCLK is used for controlling the
conversion rate and shifting data out of the converter.
Furthermore, SCLK provides a mechanism to allow
digital host processors to synchronize with the con-
FEATURES
•
Single 1.2-V to 3.6-V Supply Operation
•
High Throughput
– 200/240/280KSPS for 12/10/8-Bit VDD ≥ 1.6 V
– 100/120/140KSPS for 12/10/8-Bit VDD ≥ 1.2 V
±1.5LSB INL, 12-Bit NMC (ADS7866)
verter.
These
converters
interface
with
•
•
micro-processors or DSPs through a high-speed SPI
compatible serial interface. There are no pipeline
delays associated with the device.
71 dB SNR, –83 dB THD at fIN = 30 kHz
(ADS7866)
•
•
•
•
Synchronized Conversion with SCLK
SPI Compatible Serial Interface
No Pipeline Delays
The minimum conversion time is determined by the
frequency of the serial clock input, SCLK, while the
maximum frequency of SCLK is determined by the
minimum sampling time required to charge the input
capacitance to 12/10/8-bit accuracy for the
Low Power
ADS7866/67/68,
respectively.
The
maximum
– 1.39 mW Typ at 200 KSPS, VDD = 3.6 V
– 0.39 mW Typ at 200 KSPS, VDD = 1.6 V
– 0.22 mW Typ at 100 KSPS, VDD = 1.2 V
Auto Power-Down: 8 nA Typ, 300 nA Max
0 V to VDD Unipolar Input Range
6-Pin SOT-23 Package
throughput is determined by how often a conversion
is initiated when the minimum sampling time is met
and the maximum SCLK frequency is used. Each
device automatically powers down after each conver-
sion, which allows each device to save power when
the throughput is reduced while using the maximum
SCLK frequency.
•
•
•
The converter reference is taken internally from the
supply. Hence, the analog input range for these
APPLICATIONS
•
•
•
•
•
•
Battery Powered Systems
Isolated Data Acquisition
Medical Instruments
Portable Communication
Portable Data Acquisition Systems
Automatic Test Equipment
devices is 0 V to VDD
.
These devices are available in a 6-pin SOT-23
package and are characterized over the industrial
–40°C to 85°C temperature range.
REF/V
DD
DESCRIPTION
12/10/8 BIT ADC
Comparator
The ADS7866/67/68 are low power, miniature,
12/10/8-bit A/D converters each with a unipolar,
single-ended input. These devices can operate from a
single 1.6 V to 3.6 V supply with a 200-KSPS
throughput for ADS7866. In addition, these devices
can maintain at least a 100-KSPS throughput with a
supply as low as 1.2 V.
+
VIN
S/H
CDAC
_
Conversion
and
Control
Logic
CS
SCLK
SDO
SAR
GND
Micro-Power Miniature SAR Converter Family
RESOLUTION/SPEED
< 200 KSPS
1 MSPS – 1.25 MSPS
12-Bit
10-Bit
8-Bit
ADS7866 (1.2 VDD to 3.6 VDD
ADS7867 (1.2 VDD to 3.6 VDD
ADS7868 (1.2 VDD to 3.6 VDD
)
)
)
ADS7886 (2.35 VDD to 5.25 VDD
ADS7887 (2.35 VDD to 5.25 VDD
ADS7888 (2.35 VDD to 5.25 VDD
)
)
)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
NO MISSING
CODES
RESOLULTION
(BIT)
PACKAGE
MARKING
(SYMBOL)
SPECIFIED
TEMPERATURE
RANGE
TRANSPORT
MEDIA,
QUANTITY
PACKAGE
TYPE
PACKAGE
DESIGNATOR
ORDERING
NUMBER
MODEL
ADS7866I
ADS7866I
ADS7867I
ADS7867I
ADS7868I
ADS7868I
±1.5
±1.5
±0.5
±0.5
±0.5
±0.5
–1/+1.5
–1/+1.5
±0.5
12
12
10
10
8
SOT23-6
SOT23-6
SOT23-6
SOT23-6
SOT23-6
SOT23-6
A66Y
A66Y
A67Y
A67Y
A68Y
A68Y
DBV
DBV
DBV
DBV
DBV
DBV
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
ADS7866IDBVT
ADS7866IDBVR
ADS7867IDBVT
ADS7867IDBVR
ADS7868IDBVT
ADS7868IDBVR
Small tape and reel, 250
Tape and reel, 3000
Small tape and reel, 250
Tape and reel, 3000
±0.5
±0.5
Small tape and reel, 250
Tape and reel, 3000
±0.5
8
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
RATING
VDD to GND
–0.3 V to 4.0 V
–0.3 V to VDD + 0.3 V
–0.3 V to 4.0 V
–0.3 V to VDD + 0.3 V
–40°C to 85°C
–65°C to 150°C
150°C
Analog input voltage to GND
Digital input voltage to GND
Digital output voltage to GND
Operating free-air temperature range
TA
TSTORAGE Storage temperature range
TJ
Junction temperature
θJA Thermal impedance
θJC Thermal impedance
Vapor phase (10–40 sec)
Infrared (10–30 sec)
110.9°C/W
SOT-23 Package
22.31°C/W
250°C
Lead temperature,
soldering
260°C
ESD
3 kV
2
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
SPECIFICATIONS, ADS7866
At –40°C to 85°C, fSAMPLE = 200 KSPS and fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSAMPLE = 100 KSPS and fSCLK = 1.7 MHz if
1.2 V ≤ VDD < 1.6 V (unless otherwise noted)
PARAMETER
SYSTEM PERFORMANCE
Resolution
TEST CONDITIONS
MIN
TYP
MAX
UNIT
12
Bits
Bits
No missing codes
12
–1.5
–1
Integral linearity
1.5 LSB(1)
Differential linearity
1.5
2
LSB
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
–2
Offset error(2)
LSB
–3
3
–2
2
Gain error(3)
LSB
LSB
–2
2
–2.5
–3.5
2.5
3.5
Total unadjusted error(4)
SAMPLING DYNAMICS (See Timing Characteristics Section)
tCONVERT Conversion time fSCLK = 3.4 MHz, 13 SCLK cycles
fSCLK = 3.4 MHz, 1.6 V ≤ VDD ≤ 3.6 V
3.82
0.64
µs
µs
tSAMPLE
fSAMPLE
Acquisition time
Throughput rate
Aperture delay
Aperture jitter
fSCLK = 3.4 MHz, 1.6 V ≤ VDD ≤ 3.6 V
200
KSPS
ns
10
40
ps
DYNAMIC CHARACTERISTICS
fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
At 0.1 dB, 1.2 V ≤ VDD < 1.6 V
At 0.1 dB, 1.6 V ≤ VDD ≤ 3.6 V
At 3 dB, 1.2 V ≤ VDD < 1.6 V
68
70
70
71
–70
–83
75
85
2
Signal-to-noise
SINAD
dB
dB
dB
dB
and distortion
69
70
SNR
THD
Signal-to-noise ratio
Total harmonic distortion(5)
Spurious free dynamic
range
SFDR
4
Full-power bandwidth(6)
MHz
3
At 3 dB, 1.6 V ≤ VDD ≤ 3.6 V
8
ANALOG INPUT
Full-scale input span(7)
VIN – GND
0
VDD
V
CS
Input capacitance
12
pF
µA
Input leakage current
–1
1
DIGITAL INPUT
Logic family , CMOS
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
0.7×VDD
0.7×VDD
0.7×VDD
2
3.6
3.6
3.6
3.6
VIH
Input logic high level
V
(1) LSB = Least Significant BIt
(2) The difference in the first code transition 000...000 to 000...001 from the ideal value of GND + 1 LSB.
(3) The difference in the last code transition 011...111 to 111...111 from the ideal value of VDD - 1 LSB with the offset error removed.
(4) The absolute difference from the ideal transfer function of the converter. This specification is similar to INL error except the effects of
offset error and gain error are included.
(5) The 2nd through 10th harmonics are used to determine THD.
(6) Input frequency where the amplitude of the digitized signal has decreased by 0.1 dB or 3 dB.
(7) Ideal input span which does not include gain or offset errors.
3
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
SPECIFICATIONS, ADS7866 (continued)
At –40°C to 85°C, fSAMPLE = 200 KSPS and fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSAMPLE = 100 KSPS and fSCLK = 1.7 MHz if
1.2 V ≤ VDD < 1.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
–0.2
–0.2
–0.2
–0.2
–1
TYP
MAX
0.2×VDD
0.2×VDD
0.3×VDD
0.8
UNIT
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
Digital input = 0 V or VDD
VIL
Input logic low level
V
ISCLK
ICS
SCLK pin leakage current
CS pin leakage current
0.02
1
µA
µA
pF
±1
CIN
Digital input pin capacitance
10
DIGITAL OUTPUT
VOH
VOL
ISDO
Output logic high level
ISOURCE = 200 µA
ISINK = 200 µA
Floating output
VDD–0.2
VDD
0.2
1
V
V
Output logic low level
0
SDO pin leakage current
–1
µA
Digital output pin
capacitance
COUT
Floating output
10
pF
Data format, straight binary
POWER SUPPLY REQUIREMENTS
VDD
IDD
IDD
Supply voltage
1.2
3.6
V
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 50 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 20 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 3 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 3 V
fSAMPLE = 50 KSPS, fSCLK = 3.4 MHz, VDD = 3 V
fSAMPLE = 20 KSPS, fSCLK = 3.4 MHz, VDD = 3 V
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 2.5 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 2.5 V
fSAMPLE = 50 KSPS, fSCLK = 3.4 MHz, VDD = 2.5 V
fSAMPLE = 20 KSPS, fSCLK = 3.4 MHz, VDD = 2.5 V
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 1.8 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 1.8 V
fSAMPLE = 50 KSPS, fSCLK = 3.4 MHz, VDD = 1.8 V
fSAMPLE = 20 KSPS, fSCLK = 3.4 MHz, VDD = 1.8 V
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 50 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 20 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 100 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
fSAMPLE = 50 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
fSAMPLE = 20 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
385
193
97
500
µA
39
340
170
85
µA
µA
µA
µA
35
305
153
77
Supply current,
normal operation
Digital inputs = 0 V
or VDD
31
256
128
65
26
241
121
61
330
25
186
93
250
0.3
µA
µA
37
Power-down mode
SCLK on or off
0.008
POWER DISSIPATION
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 200 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 100 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
SCLK on or off, VDD = 3.6 V
1.39
0.39
0.22
1.08
1.80
0.53
0.3
Normal operation
mW
µW
°C
Power-down mode
TEMPERATURE RANGE
Specified performance
–40
85
4
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
SPECIFICATIONS, ADS7867
At –40°C to 85°C, fSAMPLE = 240 KSPS and fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSAMPLE = 120 KSPS and fSCLK = 1.7 MHz if
1.2 V ≤ VDD < 1.6 V (unless otherwise noted)
PARAMETER
SYSTEM PERFORMANCE
Resolution
TEST CONDITIONS
MIN
TYP
MAX
UNIT
10
Bits
Bits
No missing codes
10
–0.5
–0.5
–0.75
–1
Integral linearity
0.5
0.5
0.75
1
LSB(1)
LSB
Differential linearity
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
Offset error(2)
LSB
LSB
LSB
–0.5
–0.5
–2
0.5
0.5
2
Gain error(3)
Total unadjusted error(4)
–2
2
SAMPLING DYNAMICS (See Timing Characteristics Section)
tCONVERT Conversion time fSCLK = 3.4 MHz, 11 SCLK cycles
fSCLK = 3.4 MHz, 1.6 V ≤ VDD ≤ 3.6 V
3.235
0.64
µs
µs
tSAMPLE
fSAMPLE
Acquisition time
Throughput rate
Aperture delay
Aperture jitter
fSCLK = 3.4 MHz, 1.6 V ≤ VDD ≤ 3.6 V
240
KSPS
ns
10
40
ps
DYNAMIC CHARACTERISTICS
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
At 0.1 dB, 1.2 V ≤ VDD < 1.6 V
61
61.7
61.5
61.8
-68
-78
73
Signal-to-noise
SINAD
dB
dB
dB
dB
and distortion
61
SNR
THD
Signal-to-noise ratio
Total harmonic distortion(5)
Spurious free dynamic range
-72
SFDR
74
80
2
At 0.1 dB, 1.6 V ≤ VDD ≤ 3.6 V
4
Full-power bandwidth(6)
MHz
At 3 dB, 1.2 V ≤ VDD < 1.6 V
3
At 3 dB, 1.6 V ≤ VDD ≤ 3.6 V
8
ANALOG INPUT
Full-scale input span(7)
VIN – GND
0
VDD
V
CS
Input capacitance
12
pF
µA
Input leakage current
–1
1
DIGITAL INPUT
Logic family, CMOS
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
0.7×VDD
0.7×VDD
0.7×VDD
2
3.6
3.6
3.6
3.6
VIH
Input logic high level
V
(1) LSB = Least Significant BIt
(2) The difference in the first code transition 000...000 to 000...001 from the ideal value of GND + 1 LSB.
(3) The difference in the last code transition 011...111 to 111...111 from the ideal value of VDD - 1 LSB with the offset error removed.
(4) The absolute difference from the ideal transfer function of the converter. This specification is similar to INL error except the effects of
offset error and gain error are included.
(5) The 2nd through 10th harmonics are used to determine THD.
(6) Input frequency where the amplitude of the digitized signal has decreased by 0.1 dB or 3 dB.
(7) Ideal input span which does not include gain or offset errors.
5
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
SPECIFICATIONS, ADS7867 (continued)
At –40°C to 85°C, fSAMPLE = 240 KSPS and fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSAMPLE = 120 KSPS and fSCLK = 1.7 MHz if
1.2 V ≤ VDD < 1.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
–0.2
–0.2
–0.2
–0.2
–1
TYP
MAX
0.2×VDD
0.2×VDD
0.3×VDD
0.8
UNIT
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
Digital input = 0 V or VDD
VIL
Input logic low level
V
ISCLK
ICS
SCLK pin leakage current
CS pin leakage current
0.02
1
µA
µA
pF
±1
CIN
Digital input pin capacitance
10
DIGITAL OUTPUT
VOH
VOL
ISDO
Output logic high level
ISOURCE = 200 µA
ISINK = 200 µA
Floating output
VDD–0.2
VDD
0.2
1
V
V
Output logic low level
0
SDO pin leakage current
–1
µA
Digital output pin
capacitance
COUT
Floating output
10
pF
Data format, straight binary
POWER SUPPLY REQUIREMENTS
VDD
IDD
IDD
Supply voltage
1.2
3.6
V
fSAMPLE = 240 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 240 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 120 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
fSAMPLE = 50 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
420
172
261
107
202
83
500
µA
330
250
0.3
Supply current,
normal operation
Digital Inputs = 0 V
or VDD
µA
µA
µA
Power-down mode
SCLK on or off
0.008
POWER DISSIPATION
fSAMPLE = 240 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 240 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 120 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
SCLK on or off, VDD = 3.6 V
1.51
0.42
0.24
1.80
0.53
0.30
1.08
Normal operation
mW
µW
°C
Power-down mode
TEMPERATURE RANGE
Specified performance
–40
85
6
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
SPECIFICATIONS, ADS7868
At –40°C to 85°C, fSAMPLE = 280 KSPS and fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSAMPLE = 140 KSPS and fSCLK = 1.7 MHz if
1.2 V ≤ VDD < 1.6 V (unless otherwise noted)
PARAMETER
SYSTEM PERFORMANCE
Resolution
TEST CONDITIONS
MIN
TYP
MAX
UNIT
8
Bits
Bits
No missing codes
Integral linearity
8
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–1
0.5
0.5
0.5
0.5
0.5
0.5
1
LSB(1)
LSB
Differential linearity
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD ≤ 3.6 V
Offset error(2)
LSB
LSB
LSB
Gain error(3)
Total unadjusted error(4)
–1
1
SAMPLING DYNAMICS (See Timing Characteristics Section)
tCONVERT Conversion time fSCLK = 3.4 MHz, 9 SCLK cycles
2.647
0.64
µs
µs
tSAMPLE
fSAMPLE
Acquisition time
Throughput rate
Aperture delay
Aperture jitter
fSCLK = 3.4 MHz, 1.6 V ≤ VDD ≤ 3.6 V
fSCLK = 3.4 MHz, 1.6 V ≤ VDD ≤ 3.6 V
280
KSPS
ns
10
40
ps
DYNAMIC CHARACTERISTICS
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
fSAMPLE = 100 KSPS, fIN = 30 kHz, 1.2 V ≤ VDD < 1.6 V
fSAMPLE = 200 KSPS, fIN = 30 kHz, 1.6 V ≤ VDD ≤ 3.6 V
At 0.1 dB, 1.2 V ≤ VDD < 1.6 V
49
49.4
49.4
49.8
–65
–72
67
Signal-to-noise
SINAD
dB
dB
dB
dB
and distortion
49
SNR
THD
Signal-to-noise ratio
Total harmonic
distortion(5)
-66
Spurious free dynamic
range
SFDR
66
67
2
At 0.1 dB, 1.6 V ≤ VDD ≤ 3.6 V
4
Full-power bandwidth(6)
MHz
At 3 dB, 1.2 V ≤ VDD < 1.6 V
3
At 3 dB, 1.6 V ≤ VDD ≤ 3.6 V
8
ANALOG INPUT
Full-scale input span(7)
VIN – GND
0
VDD
V
CS
Input capacitance
12
pF
µA
Input leakage current
–1
1
DIGITAL INPUT
Logic family, CMOS
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
0.7×VDD
0.7×VDD
0.7×VDD
2
3.6
3.6
3.6
3.6
VIH
Input logic high level
V
(1) LSB = Least Significant BIt
(2) The difference in the first code transition 000...000 to 000...001 from the ideal value of GND + 1 LSB.
(3) The difference in the last code transition 011...111 to 111...111 from the ideal value of VDD - 1 LSB with the offset error removed.
(4) The absolute difference from the ideal transfer function of the converter. This specification is similar to INL error except the effects of
offset error and gain error are included.
(5) The 2nd through 10th harmonics are used to determine THD.
(6) Input frequency where the amplitude of the digitized signal has decreased by 0.1 dB or 3 dB.
(7) Ideal input span which does not include gain or offset errors.
7
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SPECIFICATIONS, ADS7868 (continued)
At –40°C to 85°C, fSAMPLE = 280 KSPS and fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSAMPLE = 140 KSPS and fSCLK = 1.7 MHz if
1.2 V ≤ VDD < 1.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
–0.2
–0.2
–0.2
–0.2
–1
TYP
MAX
0.2×VDD
0.2×VDD
0.3×VDD
0.8
UNIT
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
VIL
Input logic low level
V
ISCLK
ICS
SCLK pin leakage current Digital input = 0 V or VDD
CS pin leakage current
0.02
1
µA
µA
±1
Digital input pin
capacitance
CIN
10
pF
DIGITAL OUTPUT
VOH
VOL
ISDO
Output logic high level
Output logic low level
ISOURCE = 200 µA
ISINK = 200 µA
VDD–0.2
VDD
0.2
1
V
V
0
SDO pin leakage current Floating output
–1
µA
Digital output pin
Floating output
capacitance
COUT
10
pF
Data format, straight
binary
POWER SUPPLY REQUIREMENTS
VDD
IDD
IDD
Supply voltage
1.2
3.6
V
fSAMPLE = 280 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 280 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 100 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 140 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
fSAMPLE = 50 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
439
154
264
93
500
µA
330
250
0.3
Supply current,
normal operation
Digital Inputs = 0 V
or VDD
µA
201
70
µA
µA
Power-down mode
SCLK on or off
0.008
POWER DISSIPATION
fSAMPLE = 280 KSPS, fSCLK = 3.4 MHz, VDD = 3.6 V
fSAMPLE = 280 KSPS, fSCLK = 3.4 MHz, VDD = 1.6 V
fSAMPLE = 140 KSPS, fSCLK = 1.7 MHz, VDD = 1.2 V
SCLK on or off, VDD = 3.6 V
1.58
0.42
0.24
1.8
0.53
0.3
Normal operation
mW
µW
°C
Power-down mode
TEMPERATURE RANGE
Specified performance
1.08
–40
85
8
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TIMING REQUIREMENTS(1)(2)
At –40°C to 85°C, fSCLK = 3.4 MHz if 1.6 V ≤ VDD ≤ 3.6 V; fSCLK = 1.7 MHz if 1.2 V ≤ VDD < 1.6 V, 50-pF Load on SDO Pin,
unless otherwise noted
PARAMETER
Sample time
TEST CONDITIONS
MIN
TYP
tSU(CSF-FSCLKF) + 2 × tC(SCLK)
13 × tC(SCLK)
MAX
UNIT
tsample
µs
ADS7866
tconvert
Conversion time
ADS7867
11 × tC(SCLK)
µs
µs
ADS7868
9 × tC(SCLK)
(3)
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD < 2.5 V
2.5 V ≤ VDD ≤ 3.6 V
See
100
100
(3)
(3)
(3)
See
See
See
tC(SCLK)
Cycle time
50
6.7
tWH(SCLK)
tWL(SCLK)
Pulse duration
Pulse duration
0.4 × tC(SCLK)
0.6 × tC(SCLK)
0.6 × tC(SCLK)
ns
ns
0.4 × tC(SCLK)
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
192
55
tSU(CSF-FSCLKF)
Setup time
Delay time
ns
ns
ns
ns
ns
ns
ns
55
65
55
55
tD(CSF-SDOVALID)
20
10
10
tH(SCLKF-SDOVALID) Hold time
140
140
140
80
tD(SCLKF-SDOVALID) Delay time
10
7
tDIS(EOC-SDOZ)
Disable time
Pulse duration
Setup time
60
7
60
20
10
10
20
10
10
tWH(CS)
tSU(LSBZ-CSF)
(1) All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
(2) See timing diagram in Figure 1.
(3) Min tC(SCLK) is determined by the Min tSAMPLE of the specific resolution and supply voltage. See Acquisition Time, Conversion Time, and
Total Cycle Time section for further details.
t
C(SCLK)
Last SCLK= 16 for ADS7866
14for ADS 7867
HOLD
3
EOC
12for ADS 7868
16
14
12
t
WH(SCLK)
6 7
t
SU(CSF−FSCLKF)
2
1
4
9
2
5
8
10
1
SCLK
t
WL(SCLK)
t
WH(CS)
t
SU(CSF−FSCLKF)
CS
t
SAMPLE
t
t
CONVERT
SU(LSBZ−CSF)
t
t
t
DIS(EOC−SDOZ)
H(SCLKF−SDOVALID)
D(SCLKF−SDOVALID)
t
D(CSF−SDOVALID)
t
D(CSF−SDOVALID)
Hi−Z
Hi−Z
SDO
MSB MSB−1 MSB−2 MSB−3 MSB−4 MSB−5
LSB
“0” “0”
“0”
“0” “0”
“0” “0”
−
−
Auto Power Down
Auto Power Down
t
CYCLE
Figure 1. Timing Diagram
9
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PIN CONFIGURATION
ADS7866/67/68
DBV PACKAGE
(TOP VIEW)
1
2
3
6
5
4
CS
REF/V
DD
SDO
SCLK
GND
VIN
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
REF/VDD
GND
NO.
1
External reference input and power supply
2
Ground for signal and power supply. All analog and digital signals are referred with respect to this pin.
Analog signal input
VIN
3
SCLK
4
Serial clock input. This clock is used for clocking data out, and it is the source of conversion clock.
This is the serial data output of the conversion result. The serial stream comes with MSB first. The MSB is clocked out
(changed) on the falling edge one SCLK after the sampling period ends. This results in four leading zeros after CS
becomes active. SDO is 3-stated once all the valid bits are clocked out (12 for ADS7866, 10 for ADS7867, and 8 for
ADS7868).
SDO
CS
5
6
This is an active low input signal. It is used as a chip select to gate the SCLK input, to initiate a conversion, and to
frame output data.
10
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TYPICAL CHARACTERISTICS ADS7866
FFT (8192 Points)
0
−10
V
= 1.6 V,
DD
f
= 200 kSPS,
SAMPLE
−20
−30
−40
−50
−60
−70
−80
−90
−100
f = 30 kHz,
SNR = 72.31 dB,
SINAD = 71.97 dB,
THD (9) = −83.18 dB,
SFDR = 86.83 dB
i
0
10
20
30
40
50
60
70
80
90
100
f − Input Frquency − kHz
i
Figure 2.
FFT (8192 Points)
0
−10
−20
−30
−40
−50
−60
V
= 1.2 V,
DD
f
= 100 kSPS,
SAMPLE
f = 30 kHz,
i
SNR = 71.42 dB,
SINAD = 67.62 dB,
THD (9) = −69.96 dB,
SFDR = 75.14 dB
−70
−80
−90
−100
0
5
10
15
20
25
30
35
40
45
50
f − Input Frquency − kHz
i
Figure 3.
SIGNAL-TO-NOISE RATIO
vs
SIGNAL-TO-NOISE
AND DISTORTION
vs
TOTAL HARMONIC DISTORTION
vs
INPUT FREQUENCY
INPUT FREQUENCY
INPUT FREQUENCY
73
72.5
72
−56
−58
−60
−62
−64
−66
−68
−70
−72
−74
−76
−78
73
71
69
67
65
63
61
59
57
THD Using 2nd − 10th harmonics,
V
DD
= 3.6 V, 200 KSPS
T
A
= 25°C
V
DD
= 2.5 V, 200 KSPS
V
= 3.6 V,
DD
V
= 1.2 V,
DD
V
= 2.5 V,
200 KSPS
DD
100 KSPS
200 KSPS
71.5
71
V
DD
= 1.6 V, 200 KSPS
70.5
70
V
= 1.6 V,
DD
V
= 1.2 V,
V
= 2.5 V,
DD
V
= 1.6 V,
DD
DD
200 KSPS
100 KSPS
200 KSPS
200 KSPS
V
= 1.2 V,
DD
100 KSPS
69.5
69
68.5
68
V
= 3.6V,
DD
−80
−82
67.5
67
200 KSPS
10
100
1000
10
1
1
10
100
1000
100
1000
1
f − Input Frequency − kHz
i
f − Input Frequency − kHz
i
f − Input Frequency − kHz
i
Figure 4.
Figure 5.
Figure 6.
11
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TYPICAL CHARACTERISTICS ADS7866 (continued)
SPURIOUS FREE DYNAMIC RANGE
SUPPLY CURRENT
SUPPLY CURRENT
vs
vs
vs
INPUT FREQUENCY
SCLK FREQUENCY
SUPPLY VOLTAGE
425
400
375
350
325
300
275
250
84
82
325
300
V
= 3.6V,
f
f
= 200 KSPS,
DD
200 KSPS
T
= 25°C,
SAMPLE
SCLK
A
V
DD
= 3.6 V
= 3.4 MHz
f
= 100 KSPS
SAMPLE
T
A
= 855C
V
DD
= 3 V
80
78
V
= 2.5 V
DD
V
= 2.5V,
DD
200 KSPS
275
250
225
T
A
= 255C
V
DD
= 1.8 V
V
= 1.6 V
DD
T
A
= −405C
76
74
72
70
68
66
64
62
V
= 1.6 V,
200 KSPS
DD
200
175
150
V
DD
= 1.2 V, 100 KSPS
125
100
225
200
10
− Input Frequency − kHz
100
1000
1
1.6 1.8
2
2.2 2.4 2.6 2.8
3
3.2 3.4
1.6 1.8
2
2.2 2.4 2.6 2.8
3
3.2 3.4 3.6
f
i
SCLK Frequency − MHz
V
DD
− Supply Voltage − V
Figure 7.
Figure 8.
Figure 9.
POWER CONSUMPTION
TOTAL HARMONIC DISTORTION
vs
vs
THROUGHPUT
INPUT FREQUENCY
1.4
1.2
1
−58
−60
−62
−64
T
= 25°C,
A
V
T
= 1.6 V,
DD
A
SCLK = 3.4 MHz
V
= 3.6 V
= 25°C,
DD
f
f
= 200 KSPS,
SAMPLE
= 3.4 MHz
SCLK
V
= 3 V
DD
V
= 2.5 V
DD
−66
−68
−70
−72
−74
−76
V
= 1.8 V
DD
0.8
0.6
0.4
0.2
0
V
DD
= 1.6 V
R
= 100 W
I
R
I
= 500 W
R
= 1000 W
I
−78
−80
−82
−84
R
I
= 0 W
R
I
= 10 W
20 40
60 80 100 120 140 160 180 200
Throughput − KSPS
1
10
100
1000
f
i
− Input Frequency − kHz
Figure 10.
Figure 11.
INL
1
V
= 1.6 V,
DD
0.8
0.6
T = 25°C,
A
f
f
= 200 KSPS,
= 3.4 MHz
SAMPLE
SCLK
0.4
0.2
0
−0.2
−0.4
−0.6
−0.8
−1
0
512
1024
1536
2048
Code
2560
3072
3584
4096
(Straight Binary in Decimal)
Figure 12.
12
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SLAS465–JUNE 2005
TYPICAL CHARACTERISTICS ADS7866 (continued)
DNL
1
V
= 1.6 V,
DD
0.8
0.6
0.4
0.2
0
T = 25°C,
A
f
f
= 200 KSPS,
= 3.4 MHz
SAMPLE
SCLK
−0.2
−0.4
−0.6
−0.8
0
512
1024
1536
2048
2560
3072
3584
4096
Code
(Straight Binary in Decimal)
Figure 13.
INL
1
0.8
V
= 1.2 V,
DD
T = 25°C,
A
f
f
= 100 KSPS,
= 1.7 MHz
0.6
SAMPLE
SCLK
0.4
0.2
0
−0.2
−0.4
−0.6
−0.8
−1
0
512
1024
1536
2048
2560
3072
3584
4096
Code
(Straight Binary in Decimal)
Figure 14.
DNL
1
0.8
0.6
0.4
0.2
0
V
= 1.2 V,
DD
T = 25°C,
A
f
f
= 100 KSPS,
= 1.7 MHz
SAMPLE
SCLK
−0.2
−0.4
−0.6
−0.8
0
512
1024
1536
2048
2560
3072
3584
4096
Code
(Straight Binary in Decimal)
Figure 15.
13
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SLAS465–JUNE 2005
TYPICAL CHARACTERISTICS ADS7866 (continued)
MAX SUPPLY CURRENT
vs
THROUGHPUT RATE
THROUGHPUT RATE
vs
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
SUPPLY VOLTAGE
425
400
375
350
325
300
275
250
300
275
250
225
200
450
425
400
375
12-Bit NMC, T = 25°C,
T
= 25°C,
A
A
f
= (f
)/16
t
t
= 2.375/f
,
SAMPLE
SCLK
SAMPLE
SCLK
+t
= 0.375/f
,
DIS(EOC-SDOZ) SU(LSBZ-CSF)
SCLK
Throughput Rate = 16 SCLK Cycles
f
= 3.4 MHz
SCLK
f
= 2.4 MHz
SCLK
f
= 1.7 MHz
350
325
300
275
250
SCLK
12-Bit NMC, T = 25°C,
175
150
A
t
t
= 2.25/f
,
SAMPLE
DIS(EOC-SDOZ) SU(LSBZ-CSF)
SCLK
225
200
+t
= 0.25/f
,
SCLK
Throughput Rate = 16 SCLK Cycles
1.2
1.4
V − Supply Voltage − V
DD
1.6
1.8
1.6 1.8
2
2.2 2.4 2.6 2.8
3
3.2 3.4 3.6
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
− Supply Voltage − V
3
3.2 3.4 3.6
V
V
DD
− Supply Voltage − V
DD
Figure 16.
Figure 17.
Figure 18.
14
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SLAS465–JUNE 2005
TYPICAL CHARACTERISTICS ADS7867
FFT (8192 Points)
0
−10
−20
−30
−40
V
= 1.2 V,
DD
f
= 100 KSPS,
SAMPLE
f = 30 kHz,
i
SNR = 60.419 dB,
SINAD = 59.877 dB,
THD (9) = −69.181 dB,
SFDR = 73.682 dB
−50
−60
−70
−80
−90
−100
0
5
10
15
20
25
30
35
40
45
50
f − Input Frequency − kHz
i
Figure 19.
FFT (8192 Points)
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
V
= 1.6 V,
DD
f
= 200 KSPS,
SAMPLE
f = 30 kHz,
i
SNR = 61.173 dB,
SINAD = 61.128 dB,
THD (9) = −80.986 dB,
SFDR = 83.468 dB
0
10
20
30
40
50
60
70
80
90
100
f − Input Frequency − kHz
i
Figure 20.
THROUGHPUT RATE
vs
SUPPLY VOLTAGE
THROUGHPUT RATE
vs
SUPPLY VOLTAGE
450
425
400
375
350
325
300
275
250
275
250
225
200
10-Bit NMC, T = 25°C,
A
175
150
t
t
= 2.25/f
,
SAMPLE
DIS(EOC-SDOZ) SU(LSBZ-CSF)
SCLK
10-Bit NMC, T = 25°C,
A
+t
= 0.25/f
,
SCLK
t
t
= 2.375/f
,
SAMPLE
DIS(EOC-SDOZ) SU(LSBZ-CSF)
SCLK
Throughput Rate = 14 SCLK Cycles
+t
= 0.375/f
,
SCLK
Throughput Rate = 14 SCLK Cycles
1.6 1.8
2
2.2 2.4 2.6 2.8
3
3.2 3.4 3.6
1.2
1.4
1.6
1.8
V
DD
− Supply Voltage − V
V
DD
− Supply Voltage − V
Figure 21.
Figure 22.
15
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SLAS465–JUNE 2005
TYPICAL CHARACTERISTICS ADS7868
FFT (8192 Points)
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
V
= 1.2 V,
DD
f
= 100 KSPS,
SAMPLE
f = 30 kHz,
i
SNR = 48.669 dB,
SINAD = 48.605 dB,
THD (9) = −66.910 dB,
SFDR = 67.041 dB
10
15
0
5
20
25
30
35
40
45
50
f − Input Frequency − kHz
i
Figure 23.
FFT (8192 Points)
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
V
= 1.6 V,
DD
f
= 200 KSPS,
SAMPLE
f = 30 kHz,
i
SNR = 49.420 dB,
SINAD = 49.413 dB,
THD (9) = −77.085 dB,
SFDR = 67.893 dB
0
10
20
30
40
50
60
70
80
90
100
f − Input Frequency − kHz
i
Figure 24.
THROUGHPUT RATE
vs
SUPPLY VOLTAGE
THROUGHPUT RATE
vs
SUPPLY VOLTAGE
300
275
250
225
575
550
525
500
475
450
425
400
375
350
200
175
8-Bit NMC, T = 25°C,
A
8-Bit NMC, T = 25°C,
A
t
t
= 2.375/f
,
SAMPLE
DIS(EOC-SDOZ) SU(LSBZ-CSF)
SCLK
t
t
= 2.25/f
,
SAMPLE
DIS(EOC-SDOZ) SU(LSBZ-CSF)
Throughput Rate = 12 SCLK Cycles
SCLK
+t
= 0.375/f
,
SCLK
+t
= 0.25/f
,
325
300
SCLK
Throughput Rate = 12 SCLK Cycles
150
1.2
1.4
1.6
1.8
1.6 1.8
2
2.2 2.4 2.6 2.8
3
3.2 3.4 3.6
V
DD
− Supply Voltage − V
V
DD
− Supply Voltage − V
Figure 25.
Figure 26.
16
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
THEORY OF OPERATION
The ADS7866/67/68 is a family of low supply voltage, low power, high-speed successive approximation register
(SAR) analog-to-digital converters (ADCs). The devices can be operated from a supply range from 1.2 V to 3.6
V. There is no need for an external reference. The reference is derived internally from the supply voltage, so the
analog input range can be from 0 V to VDD. These ADCs use a charge redistribution architecture, which
inherently includes a sample/hold function.
START OF A CONVERSION CYCLE
A conversion cycle is initiated by bringing the CS pin low and supplying the serial clock SCLK. The time between
the falling edge of CS and the third falling edge of SCLK after CS falls is used to acquire the input signal. This
must be greater than or equal to the minimum acquisition time (MIN tSAMPLE in Table 1) specified for the desired
resolution and supply voltage. On the third falling edge of SCLK after CS falls, the device goes into hold mode
and the process of digitizing the sampled input signal starts.
Acquisition Time, Conversion Time, and Total Cycle Time
The maximum SCLK frequency is determined by the minimum acquisition time (MIN tSAMPLE) specified for the
specific resolution and supply voltage of the device. The conversion time is determined by the frequency of SCLK
since this is a synchronous converter. The conversion time is 13 times the SCLK cycle time tC(SCLK) for the
ADS7866, 11 times for the ADS7867, and 9 times for the ADS7868. The acquisition time, which is also the
power up time, is the set-up time between the first falling edge of SCLK after CS falls (tSU(CSF-FSCLKF)) plus 2
times tC(SCLK)
.
The total cycle time, tCYCLE, which is the inverse of the maximum sample rate, can be calculated as follows:
tCYCLE = tSAMPLE + tCONVERT + 0.5 × tC(SCLK)
if tDIS(EOC-SDOZ) + tSU(LSBZ-CSF) ≤ 0.5 × tC(SCLK)
tCYCLE = tSAMPLE + tCONVERT + tDIS(EOC-SDOZ) + tSU(LSBZ-CSF)
if tDIS(EOC-SDOZ) + tSU(LSBZ-CSF) > 0.5 × tC(SCLK)
17
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
THEORY OF OPERATION (continued)
Table 1. Acquisition, Conversion, SCLK, and Potential Throughput Calculation
PARAMETER
SUPPLY VOLTAGE
1.2 V ≤ VDD < 1.6 V
ADS7866
192
ADS7867
192
ADS7868
UNIT
192
55
MIN tSU(CSF-FSCLKF)
MAX tDIS(EOC-SDOZ)
MIN tSU(LSBZ-CSF)
MAX fSCLK
Setup time
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
1.2 V ≤ VDD < 1.6 V
1.6 V ≤ VDD < 1.8 V
1.8 V ≤ VDD ≤ 3.6 V
55
55
55
55
ns
ns
55
80
80
80
Disable time
Setup time
60
60
60
60
60
60
20
20
20
10
10
10
ns
10
10
10
1.7
1.7
1.7
Frequency
3.4
3.4
3.4
MHz
ns
3.4
3.4
3.4
1368
643
643
7647
3824
3824
9116
4537
4537
110
220
220
1368
643
643
6471
3235
3235
7939
3949
3949
126
253
253
1368
643
643
5294
2647
2647
6763
3360
3360
148
298
298
MIN tsample
Sample time
Conversion time
Cycle time
MIN tconvert
ns
MIN tCYCLE
ns
Theoretical sample fre-
quency
fsample
KSPS
TYPICAL CONNECTION
For a typical connection circuit for the ADS7866/67/68 see Figure 27. A REF3112 is used to supply 1.2 V to the
device. A 0.1-µF decoupling capacitor is required between the REF/VDD and GND pins of the converter. This
capacitor should be placed as close as possible to the pins of the device. Designers should strive to minimize the
routing length of the traces that connect the terminals of the capacitor to the pins of the converter.
Keep in mind the converter offers no inherent rejection of noise or voltage variation in regards to the reference
input. This is of particular concern because the reference input is tied to the power supply. Any noise and ripple
from the supply appears directly in the digital results. While high frequency noise can be filtered out as described
in the previous paragraph, voltage variation due to the line frequency (50 Hz or 60 Hz) can be difficult to remove.
1.8 V
REF3112
1.2 V
GND
0.1 mF
Host
Processor
REF/V
GND
DD
CS
SS
ADS7866/67/68
SCK
SCLK
VIN
Analog Input
MISO
SDO
Figure 27. Typical Circuit Configuration
18
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
ANALOG INPUT
Figure 28 shows the analog input equivalent circuit for the ADS7866/67/68. The analog input is provided
between the VIN and GND pins. When a conversion is initiated, the input signal is sampled on the internal
capacitor array. When the converter enters hold mode, the input signal is captured on the internal capacitor
array. The VIN input range is limited to 0 V to VDD because the reference is derived from the supply.
The current flowing into the analog input depends upon a number of factors, such as the sample rate, the input
voltage, and the input source impedance. The current from the input source charges the internal capacitor array
during the sample period. After this capacitance has been fully charged, there is no further input current. The
source of the analog input voltage must be able to charge the input capacitance CS (12 pF typical) within the
minimum acquisition time (MIN tSAMPLE) specified for the desired resolution and supply voltage. In the case of the
ADS7866, the MIN tSAMPLE for 12-bit resolution is 643 ns (VDD between 1.6 V and 3.6 V). When the converter
goes into hold mode, the input impedance is greater than 1 GΩ.
Care must be taken regarding the absolute analog input voltage. In order to maintain the linearity of the
converter, the span (VIN – GND) should be within the limits specified. Outside of these limits, the converter’s
linearity may not meet specifications. Noise introduced into the converter from the input source may be
minimized by using low bandwidth input signals along with low-pass filters.
V
DD
Device is in Hold Mode
12 pF
60 W
VIN
+
4 pF
2.105 kW
_
V
MID
GND
Figure 28. Analog Input Equivalent Circuit (Typical Impedance Values at VDD = 1.6 V, TA = 27°C)
Choice of Input Driving Amplifier
The analog input to the converter needs to be driven with a low noise, low voltage op amp like the OPA364 or
OPA333. An RC filter is recommended at the input pin to low-pass filter the noise from the source. The input to
the converter is a unipolar input voltage in the range 0 V to VDD
.
DIGITAL INTERFACE
The ADS7866/67/68 interface with microprocessors or DSPs through a high-speed SPI compatible serial
interface with CPOL = 1 (inactive SCLK returns to logic high or SCLK leading edge is the rising edge), CPHA = 1
(output data changes on falling edge of SCLK and is available on the rising edge of SCLK). The sampling,
conversion, and activation of SDO are initiated on the falling edge of CS. The serial clock (SCLK) is used for
controlling the rate of conversion. It also provides a mechanism allowing synchronization with digital host
processors.
The digital inputs, CS and SCLK, can exceed the supply voltage VDD as long as they do not exceed the
maximum VIH of 3.6 V. This allows the ADS7866/67/68 family to interface with host processors which use a
different supply voltage than the converter without requiring external level-shifting circuitry. Furthermore, the
digital inputs can be applied to CS and SCLK before the supply voltage of the converter is activated without the
risk of creating a latch-up condition.
Conversion Result
The ADS7866/67/68 outputs 12/10/8-bit data after 4 leading zeros, respectively. These codes are in straight
binary format as shown in Table 2.
19
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
The serial output SDO is activated on the falling edge of CS. The first leading zero is available on SDO until the
first falling edge of SCLK after CS falls. The remaining 3 leading zeros are shifted out on SDO on the first,
second, and third falling edges of SCLK after CS falls. The MSB of the converted result follows 4 leading zeros
and is clocked out on the fourth falling edge of SCLK. The rising edge of CS or the falling edge of SCLK when
the EOC occurs puts SDO output into 3-state. Refer to Table 2 for ideal output codes versus input voltages.
Table 2. ADS7866/67/68 Ideal Output Codes Versus Input Voltages
DIGITAL OUTPUT STRAIGHT BINARY
DESCRIPTION
ADS7866
ANALOG INPUT VOLTAGE
BINARY CODE
HEX CODE
Least Significant Bit (LSB)
Full Scale
VDD/4096
VDD – 1LSB
VDD/2
1111 1111 1111
1000 0000 0000
0111 1111 1111
0000 0000 0000
FFF
800
7FF
000
Midscale
Midscale – 1LSB
Zero
VDD/2 – 1LSB
0V
ADS7867
Least Significant Bit (LSB)
Full Scale
VDD/1024
VDD – 1LSB
VDD/2
11 1111 1111
10 0000 0000
01 1111 1111
00 0000 0000
3FF
200
1FF
000
Midscale
Midscale – 1LSB
Zero
VDD/2 – 1LSB
0V
ADS7868
Least Significant Bit (LSB)
Full Scale
VDD/256
VDD – 1LSB
VDD/2
1111 1111
1000 0000
0111 1111
0000 0000
FF
80
7F
00
Midscale
Midscale – 1LSB
Zero
VDD/2 – 1LSB
0V
POWER DISSIPATION
The ADS7866/67/68 family is capable of operating with very low supply voltages while drawing a fraction of a
milliamp. Furthermore, there is an auto power-down mode to reduce the power dissipation between conversion
cycles. Carefully selected system design can take advantage of these features to achieve optimum power
performance.
Auto Power-Down Mode
The ADS7866/67/68 family has an auto power-down feature. Besides powering down all circuitry, the converter
consumes only 8 nA typically in this mode. The device automatically wakes up when CS falls. However, not all of
the functional blocks are fully powered until sometime before the third falling edge of SCLK. The device powers
down once it reaches the end of conversion (EOC) which is the 16th falling edge of SCLK for the ADS7866 (the
14th and 12th for the ADS7867 and ADS7868, respectively). If CS is pulled high before the device reaches the
EOC, the converter goes into power-down mode and the ongoing conversion is aborted. Refer to the timing
diagram in Figure 1 for further information.
Power Saving: SCLK Frequency and Throughput
These converters achieve lower power dissipation for a fixed throughput rate fsample = 1/tcycle by using higher
SCLK frequencies. Higher SCLK frequencies reduce the acquisition time (tsample) and conversion time (tconvert).
This means the converters spend more time in auto power-down mode per conversion cycle. This can be
observed in Figure 8 which shows the ADS7866 supply current versus SCLK frequency for fsample = 100 KSPS.
For a particular SCLK frequency, the acquisition time and conversion time are fixed. Therefore, a lower
throughput increases the proportion of the time the converters are in power down. Figure 10 shows this case for
the ADS7866 power consumption versus throughput rate for fSCLK = 3.4 MHz.
20
ADS7866
ADS7867
ADS7868
www.ti.com
SLAS465–JUNE 2005
Power-On Initialization
There is no specific initialization requirement for these converters after power-on, but the first conversion might
not yield a valid result. In order to set the converter in a known state, CS should be toggled low then high after
VDD has stabilized during power-on. By doing this, the converter is placed in auto power-down mode, and the
serial data output (SDO) is 3-stated.
21
PACKAGE OPTION ADDENDUM
www.ti.com
8-Aug-2005
PACKAGING INFORMATION
Orderable Device
ADS7866IDBVR
ADS7866IDBVRG4
ADS7866IDBVT
ADS7866IDBVTG4
ADS7867IDBVR
ADS7867IDBVRG4
ADS7867IDBVT
ADS7867IDBVTG4
ADS7868IDBVR
ADS7868IDBVRG4
ADS7868IDBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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Copyright 2005, Texas Instruments Incorporated
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