ADS8320 [TI]

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER; 16位高速2.7V到5V微功耗采样模拟数字转换器
ADS8320
型号: ADS8320
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
16位高速2.7V到5V微功耗采样模拟数字转换器

转换器
文件: 总21页 (文件大小:860K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ADS8320  
SBAS108D MAY 2000 REVISED MARCH 2007  
16-Bit, High-Speed, 2.7V to 5V microPower Sampling  
ANALOG-TO-DIGITAL CONVERTER  
FEATURES  
DESCRIPTION  
100kHz SAMPLING RATE  
The ADS8320 is a 16-bit, sampling analog-to-digital (A/D)  
converter with ensured specifications over a 2.7V to 5.25V  
supply range. It requires very little power even when operat-  
ing at the full 100kHz data rate. At lower data rates, the high  
speed of the device enables it to spend most of its time in the  
power-down mode—the average power dissipation is less  
than 100mW at 10kHz data rate.  
microPOWER:  
1.8mW at 100kHz and 2.7V  
0.3mW at 10kHz and 2.7V  
POWER-DOWN: 3µA max  
MSOP-8 PACKAGE  
PIN-COMPATIBLE TO ADS7816 AND ADS7822  
SERIAL (SPI™/SSI) INTERFACE  
The ADS8320 also features operation from 2.0V to 5.25V, a  
synchronous serial (SPI/SSI compatible) interface, and a  
differential input. The reference voltage can be set to any  
level within the range of 500mV to VCC  
.
APPLICATIONS  
BATTERY-OPERATED SYSTEMS  
REMOTE DATA ACQUISITION  
ISOLATED DATA ACQUISITION  
Ultra-low power and small size make the ADS8320 ideal  
for portable and battery-operated systems. It is also a  
perfect fit for remote data acquisition modules, simulta-  
neous multi-channel systems, and isolated data acquisi-  
tion. The ADS8320 is available in an MSOP-8 package.  
SIMULTANEOUS SAMPLING,  
MULTICHANNEL SYSTEMS  
INDUSTRIAL CONTROLS  
ROBOTICS  
VIBRATION ANALYSIS  
Control  
SAR  
VREF  
DOUT  
+In  
CDAC  
Serial  
Interface  
DCLOCK  
CS/SHDN  
In  
Comparator  
S/H Amp  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SPI is a trademark of Motorola, Inc. All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 2000-2007, Texas Instruments Incorporated  
www.ti.com  
SPECIFICATIONS: +VCC = +5V  
At 40°C to +85°C, VREF = +5V, IN = GND, fSAMPLE = 100kHz, and fCLK = 24 fSAMPLE, unless otherwise specified.  
ADS8320E  
ADS8320EB  
TYP  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
UNITS  
16  
Bits  
ANALOG INPUT  
Full-Scale Input Span  
Absolute Input Range  
+In (In)  
+In  
0
VREF  
VCC + 0.1  
+1.0  
V
V
0.1  
0.1  
In  
V
Capacitance  
45  
1
pF  
nA  
Leakage Current  
SYSTEM PERFORMANCE  
No Missing Codes  
Integral Linearity Error  
Offset Error  
14  
15  
Bits  
±0.008 ±0.018  
±0.006  
±0.5  
±0.012 % of FSR  
±1  
±3  
±2  
±1  
mV  
µV/°C  
%
Offset Temperature Drift  
Gain Error  
±0.05  
±0.024  
Gain Temperature Drift  
Noise  
±0.3  
20  
3
ppm/°C  
µVrms  
LSB(1)  
Power-Supply Rejection Ratio  
+4.7V < VCC < 5.25V  
SAMPLING DYNAMICS  
Conversion Time  
16  
Clk Cycles  
Clk Cycles  
kHz  
Acquisition Time  
4.5  
Throughput Rate  
100  
2.4  
Clock Frequency Range  
0.024  
MHz  
DYNAMIC CHARACTERISTICS  
Total Harmonic Distortion  
SINAD  
VIN = 5VPP at 10kHz  
VIN = 5VPP at 10kHz  
VIN = 5VPP at 10kHz  
84  
82  
86  
84  
dB  
dB  
dB  
dB  
Spurious-Free Dynamic Range  
SNR  
84  
86  
90  
92  
REFERENCE INPUT  
Voltage Range  
Resistance  
0.5  
VCC  
V
CS = GND, fSAMPLE = 0Hz  
CS = VCC  
5
GΩ  
GΩ  
µA  
µA  
µA  
5
Current Drain  
40  
0.8  
0.1  
80  
3
fSAMPLE = 10kHz  
CS = VCC  
DIGITAL INPUT/OUTPUT  
Logic Family  
Logic Levels:  
VIH  
CMOS  
IIH = +5µA  
IIL = +5µA  
3.0  
0.3  
4.0  
VCC + 0.3  
0.8  
V
V
V
V
VIL  
VOH  
IOH = 250µA  
IOL = 250µA  
VOL  
0.4  
Data Format  
Straight Binary  
POWER-SUPPLY REQUIREMENTS  
VCC  
VCC Range(2)  
Specified Performance  
4.75  
2.0  
5.25  
5.25  
1700  
V
V
Quiescent Current  
900  
200  
4.5  
0.3  
µA  
µA  
mW  
µA  
fSAMPLE = 10kHz(3, 4)  
CS = VCC  
Power Dissipation  
Power-Down  
8.5  
3
TEMPERATURE RANGE  
Specified Performance  
40  
+85  
°C  
Specifications same as ADS8320E.  
NOTES: (1) LSB means Least Significant Bit. With VREF equal to +5.0V, one LSB is 0.076mV.  
(2) See Typical Performance Curves for more information.  
(3) fCLK = 2.4MHz, CS = VCC for 216 clock cycles out of every 240.  
(4) See the Power Dissipation section for more information regarding lower sample rates.  
ADS8320  
2
SBAS108D  
www.ti.com  
SPECIFICATIONS: +VCC = +2.7V  
At 40°C to +85°C, VREF = 2.5V, IN = GND, fSAMPLE = 100kHz, and fCLK = 24 fSAMPLE, unless otherwise specified.  
ADS8320E  
ADS8320EB  
TYP  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
UNITS  
16  
Bits  
ANALOG INPUT  
Full-Scale Input Span  
Absolute Input Range  
+In (In)  
+In  
0
VREF  
VCC + 0.1  
+0.5  
V
V
0.1  
0.1  
In  
V
Capacitance  
45  
1
pF  
nA  
Leakage Current  
SYSTEM PERFORMANCE  
No Missing Codes  
Integral Linearity Error  
Offset Error  
14  
15  
Bits  
±0.008 ±0.018  
±0.006  
±0.5  
±0.012 % of FSR  
±1  
±3  
±2  
±1  
mV  
Offset Temperature Drift  
Gain Error  
µV/°C  
±0.05  
±0.024 % of FSR  
ppm/°C  
Gain Temperature Drift  
Noise  
±0.3  
20  
3
µVrms  
LSB(1)  
Power-Supply Rejection Ratio  
+2.7V < VCC < +3.3V  
SAMPLING DYNAMICS  
Conversion Time  
16  
Clk Cycles  
Clk Cycles  
kHz  
Acquisition Time  
4.5  
Throughput Rate  
100  
2.4  
Clock Frequency Range  
0.024  
MHz  
DYNAMIC CHARACTERISTICS  
Total Harmonic Distortion  
SINAD  
VIN = 2.7Vp-p at 1kHz  
VIN = 2.7Vp-p at 1kHz  
VIN = 2.7Vp-p at 1kHz  
86  
84  
88  
86  
dB  
dB  
dB  
dB  
Spurious-Free Dynamic Range  
SNR  
86  
88  
88  
90  
REFERENCE INPUT  
Voltage Range  
Resistance  
0.5  
VCC  
V
CS = GND, fSAMPLE = 0Hz  
CS = VCC  
5
5
GΩ  
GΩ  
µA  
µA  
Current Drain  
20  
0.1  
50  
3
CS = VCC  
DIGITAL INPUT/OUTPUT  
Logic Family  
Logic Levels:  
VIH  
CMOS  
IIH = +5µA  
IIL = +5µA  
2.0  
0.3  
2.1  
VCC + 0.3  
0.8  
V
V
V
V
VIL  
VOH  
IOH = 250µA  
IOL = 250µA  
VOL  
0.4  
Data Format  
Straight Binary  
POWER-SUPPLY REQUIREMENTS  
VCC  
VCC Range(3)  
Specified Performance  
See Note 2  
2.7  
2.0  
2.0  
3.3  
5.25  
2.7  
V
V
V
Quiescent Current  
650  
100  
1.8  
0.3  
1300  
µA  
µA  
mW  
µA  
fSAMPLE = 10kHz(4,5)  
CS = VCC  
Power Dissipation  
Power-Down  
3.8  
3
TEMPERATURE RANGE  
Specified Performance  
40  
+85  
°C  
Specifications same as ADS8320E.  
NOTES: (1) LSB means Least Significant Bit. With VREF equal to +2.5V, one LSB is 0.038mV.  
(2) The maximum clock rate of the ADS8320 is less than 2.4MHz in this power supply range.  
(3) See the Typical Performance Curves for more information.  
(4) fCLK = 2.4MHz, CS = VCC for 216 clock cycles out of every 240.  
(5) See the Power Dissipation section for more information regarding lower sample rates.  
ADS8320  
SBAS108D  
3
www.ti.com  
PIN CONFIGURATION  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Top View  
MSOP  
Electrostatic discharge can cause damage ranging from  
performance degradation to complete device failure. Texas  
Instruments recommends that all integrated circuits be handled  
and stored using appropriate ESD protection methods.  
VREF  
+In  
1
2
3
4
8
7
6
5
+VCC  
DCLOCK  
DOUT  
ADS8320  
In  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet  
published specifications.  
GND  
CS/SHDN  
ABSOLUTE MAXIMUM RATINGS(1)  
PIN ASSIGNMENTS  
PIN  
NAME  
DESCRIPTION  
VCC ....................................................................................................... +6V  
Analog Input .............................................................. 0.3V to (VCC + 0.3V)  
Logic Input ...............................................................................0.3V to 6V  
Case Temperature ......................................................................... +100°C  
Junction Temperature .................................................................... +150°C  
Storage Temperature ..................................................................... +125°C  
External Reference Voltage .............................................................. +5.5V  
Input current to any pin except supply ............................................ ±10mA  
1
2
3
VREF  
+In  
Reference Input.  
Noninverting Input.  
In  
Inverting Input. Connect to ground or to remote  
ground sense point.  
4
5
GND  
Ground.  
CS/SHDN  
Chip Select when LOW, Shutdown Mode when  
HIGH.  
NOTE: (1) Stresses above these ratings may permanently damage the device.  
6
DOUT  
The serial output data word is comprised of 16  
bits of data. In operation the data is valid on the  
falling edge of DCLOCK. The  
second clock pulse after the falling edge of CS  
enables the serial output. After one null bit the  
data is valid for the next 16 edges.  
7
8
DCLOCK  
+VCC  
Data Clock synchronizes the serial data transfer  
and determines conversion speed.  
Power Supply.  
PACKAGE/ORDERING INFORMATION(1)  
MAXIMUM  
INTEGRAL  
LINEARITY  
ERROR  
NO  
MISSING  
CODE  
ERROR  
(LSB)  
SPECIFICATION  
TEMPERATURE  
RANGE  
PACKAGE  
DESIGNATOR  
PACKAGE  
MARKING(2)  
ORDERING  
NUMBER(3)  
TRANSPORT  
MEDIA  
PRODUCT  
(%)  
PACKAGE  
ADS8320E  
ADS8320E  
ADS8320EB  
ADS8320EB  
0.018  
14  
"
15  
"
MSOP-8  
DGK  
40°C to +85°C  
A20  
"
A20  
"
ADS8320E/250  
ADS8320E/2K5  
ADS8320EB/250  
ADS8320EB/2K5  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
"
0.012  
"
"
MSOP-8  
"
"
DGK  
"
"
40°C to +85°C  
"
NOTES: (1) For the most current product and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website  
at www.ti.com.  
(2) Performance Grade information is marked on the reel.  
(3) Models with a slash(/) are available only in tape and reel in quantities indicated (for example, /250 indicates 250 units per reel, /2K5 indicates  
2500 devices per reel). Ordering 2500 pieces of ADS8320E/2K5will get a single 2500-piece tape and reel.  
ADS8320  
4
SBAS108D  
www.ti.com  
TYPICAL PERFORMANCE CURVES  
At TA = +25°C, VCC = +5V, VREF = +5V, fSAMPLE = 100kHz, and fCLK = 24 fSAMPLE, unless otherwise specified.  
INTEGRAL LINEARITY ERROR vs CODE (+25°C)  
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)  
2 0  
1.0  
3.0  
2.0  
0.0  
1.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0.0  
1.0  
2.0  
3.0  
0000H  
4000H  
8000H  
C000H  
FFFFH  
100  
5
0000H  
4000H  
8000H  
C000H  
FFFFH  
Hex Code  
Hex Code  
POWER-DOWN SUPPLY CURRENT  
vs TEMPERATURE  
SUPPLY CURRENT vs TEMPERATURE  
1200  
1000  
800  
600  
400  
200  
0
600  
500  
400  
300  
200  
100  
0
5V  
2.7V  
5V  
50  
25  
0
25  
50  
75  
100  
50  
25  
0
25  
50  
75  
Temperature (°C)  
Temperature (°C)  
QUIESCENT CURRENT vs VCC  
MAXIMUM SAMPLE RATE vs VCC  
1200  
1000  
800  
1000  
100  
10  
600  
400  
200  
1
1
2
3
4
5
1
2
3
4
VCC (V)  
V
CC (V)  
ADS8320  
SBAS108D  
5
www.ti.com  
TYPICAL PERFORMANCE CURVES (Cont.)  
At TA = +25°C, VCC = +2.7V, VREF = +2.5V, fSAMPLE = 100kHz, and fCLK = 24 fSAMPLE, unless otherwise specified.  
CHANGE IN OFFSET vs TEMPERATURE  
CHANGE IN OFFSET vs REFERENCE VOLTAGE  
VCC = 5V  
3
2
6
5
4
1
3
5V  
2
0
2.7V  
1
1  
2  
3  
0
1  
2  
3  
50  
25  
0
25  
50  
75  
100  
100  
10  
1
2
3
4
5
Temperature (°C)  
Reference Voltage (V)  
CHANGE IN GAIN vs REFERENCE VOLTAGE  
VCC = 5V  
CHANGE IN GAIN vs TEMPERATURE  
5
4
6
4
2
3
2
0
1
5V  
2  
4  
6  
0
2.7V  
1  
2  
1
2
3
4
5
50  
25  
0
25  
50  
75  
Reference Voltage (V)  
Temperature (°C)  
FREQUENCY SPECTRUM  
PEAK-TO-PEAK NOISE vs REFERENCE VOLTAGE  
VCC = 5V  
(8192 Point FFT, FIN = 10.120kHz, 0.3dB)  
0
20  
10  
9
8
7
6
5
4
3
2
1
0
40  
60  
80  
100  
120  
140  
0
10  
20  
30  
40  
50  
0.1  
1
Frequency (kHz)  
Reference Voltage (V)  
ADS8320  
6
SBAS108D  
www.ti.com  
TYPICAL PERFORMANCE CURVES (Cont.)  
At TA = +25°C, VCC = +5V, VREF = +5V, fSAMPLE = 100kHz, and fCLK = 24 fSAMPLE, unless otherwise specified.  
SPURIOUS-FREE DYNAMIC RANGE AND  
SIGNAL-TO-NOISE RATIO vs FREQUENCY  
TOTAL HARMONIC DISTORTION vs FREQUENCY  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Signal-to-Noise Ratio  
Spurious-Free Dynamic Range  
1
10  
50  
100  
1
10  
100  
Frequency (kHz)  
Frequency (kHz)  
SIGNAL-TO-(NOISE + DISTORTION) vs FREQUENCY  
SIGNAL-TO-(NOISE + DISTORTION) vs INPUT LEVEL  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
1
10  
50  
100  
40  
35  
30  
25  
20  
15  
10  
5  
0
Frequency (kHz)  
Input Level (dB)  
REFERENCE CURRENT vs SAMPLE RATE  
REFERENCE CURRENT vs TEMPERATURE  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
5V  
5V  
2.7V  
2.7V  
0
20  
40  
60  
80  
100  
50  
25  
0
25  
50  
75  
100  
Sample Rate (kHz)  
Temperature (°C)  
ADS8320  
SBAS108D  
7
www.ti.com  
charges the internal capacitor array during the sample pe-  
riod. After this capacitance has been fully charged, there is  
no further input current. The source of the analog input  
voltage must be able to charge the input capacitance (45pF)  
to a 16-bit settling level within 4.5 clock cycles. When the  
converter goes into the hold mode or while it is in the power-  
down mode, the input impedance is greater than 1G.  
THEORY OF OPERATION  
The ADS8320 is a classic successive approximation register  
(SAR) analog-to-digital (A/D) converter. The architecture is  
based on capacitive redistribution, which inherently includes  
a sample/hold function. The converter is fabricated on a 0.6µ  
CMOS process. The architecture and process allow the  
ADS8320 to acquire and convert an analog signal at up to  
100,000 conversions per second while consuming less than  
Care must be taken regarding the absolute analog input  
voltage. To maintain the linearity of the converter, the –In  
input should not drop below GND – 100mV or exceed  
GND + 1V. The +In input should always remain within the  
range of GND – 100mV to VCC + 100mV. Outside of these  
ranges, the converter linearity may not meet specifications.  
To minimize noise, low bandwidth input signals with low-  
pass filters should be used.  
4.5mW from +VCC  
.
The ADS8320 requires an external reference, an external  
clock, and a single power source (VCC). The external refer-  
ence can be any voltage between 500mV and VCC. The value  
of the reference voltage directly sets the range of the analog  
input. The reference input current depends on the conversion  
rate of the ADS8320.  
The external clock can vary between 24kHz (1kHz through-  
put) and 2.4MHz (100kHz throughput). The duty cycle of  
the clock is essentially unimportant, as long as the minimum  
high and low times are at least 200ns (VCC = 2.7V or  
greater). The minimum clock frequency is set by the leakage  
on the capacitors internal to the ADS8320.  
REFERENCE INPUT  
The external reference sets the analog input range. The  
ADS8320 operates with a reference in the range of 500mV  
to VCC. There are several important implications of this.  
As the reference voltage is reduced, the analog voltage  
weight of each digital output code is reduced. This is often  
referred to as the Least Significant Bit (LSB) size and is  
equal to the reference voltage divided by 65,536. This means  
that any offset or gain error inherent in the A/D converter  
will appear to increase, in terms of LSB size, as the reference  
voltage is reduced.  
The analog input is provided to two input pins: +In and –In.  
When a conversion is initiated, the differential input on these  
pins is sampled on the internal capacitor array. While a  
conversion is in progress, both inputs are disconnected from  
any internal function.  
The digital result of the conversion is clocked out by the  
DCLOCK input and is provided serially, most significant bit  
first, on the DOUT pin. The digital data that is provided on the  
DOUT pin is for the conversion currently in progress—there  
is no pipeline delay. It is possible to continue to clock the  
ADS8320 after the conversion is complete and to obtain the  
serial data least significant bit first. See the digital timing  
section for more information.  
The noise inherent in the converter also appears to increase  
with lower LSB size. With a +5V reference, the internal  
noise of the converter typically contributes only 1.5 LSB  
peak-to-peak of potential error to the output code. When the  
external reference is 500mV, the potential error contribution  
from the internal noise will be 10 times larger—15 LSBs.  
The errors due to the internal noise are gaussian in nature  
and can be reduced by averaging consecutive conversion  
results.  
ANALOG INPUT  
For more information regarding noise, consult the typical  
performance curve “Peak-to-Peak Noise vs Reference Volt-  
age.” Note that the Effective Number of Bits (ENOB) figure  
is calculated based on the converter’s signal-to-(noise +  
distortion) ratio with a 1kHz, 0dB input signal. SINAD is  
related to ENOB as follows:  
The +In and –In input pins allow for a differential input  
signal. Unlike some converters of this type, the –In input is  
not re-sampled later in the conversion cycle. When the  
converter goes into the hold mode, the voltage difference  
between +In and –In is captured on the internal capacitor  
array.  
SINAD = 6.02 • ENOB + 1.76  
The range of the –In input is limited to –0.1V to +1V (–0.1V  
to +0.5V when using a 2.7V supply). Because of this, the  
differential input can be used to reject only small signals that  
are common to both inputs. Thus, the –In input is best used  
to sense a remote signal ground that may move slightly with  
respect to the local ground potential.  
With lower reference voltages, extra care should be taken to  
provide a clean layout including adequate bypassing, a clean  
power supply, a low-noise reference, and a low-noise input  
signal. Because the LSB size is lower, the converter is also  
more sensitive to external sources of error such as nearby  
digital signals and electromagnetic interference.  
The input current on the analog inputs depends on a number  
of factors: sample rate, input voltage, source impedance, and  
power-down mode. Essentially, the current into the ADS8320  
ADS8320  
8
SBAS108D  
www.ti.com  
converter varies in output code due to the internal noise of  
the ADS8320. This is true for all 16-bit SAR-type A/D  
converters. Using a histogram to plot the output codes, the  
distribution should appear bell-shaped with the peak of the  
bell curve representing the nominal code for the input value.  
The ±1σ, ±2σ, and ±3σ distributions represents the 68.3%,  
95.5%, and 99.7%, respectively, of all codes. The transition  
noise can be calculated by dividing the number of codes  
measured by 6 and this yields the ±3σ distribution or 99.7%  
of all codes. Statistically, up to 3 codes could fall outside the  
distribution when executing 1000 conversions. The  
ADS8320, with < 3 output codes for the ±3σ distribution,  
yields a < ±0.5LSB transition noise. Remember, to achieve  
this low noise performance, the peak-to-peak noise of the  
input signal and reference must be < 50µV.  
NOISE  
The noise floor of the ADS8320 itself is extremely low, as  
can be seen from Figures 1 and 2, and is much lower than  
competing A/D converters. It was tested by applying a low-  
noise DC input and a 5.0V reference to the ADS8320 and  
initiating 5000 conversions. The digital output of the A/D  
2510  
2490  
AVERAGING  
The noise of the A/D converter can be compensated by  
averaging the digital codes. By averaging conversion re-  
sults, transition noise is reduced by a factor of 1/n, where  
n is the number of averages. For example, averaging four  
conversion results reduces the transition noise by 1/2 to  
±0.25 LSBs. Averaging should only be used for input  
signals with frequencies near DC.  
0
1
0
2
0
5
0
6
3
4
Code  
FIGURE 1. Histogram of 5000 Conversions of a DC Input  
at the Code Transition.  
For AC signals, a digital filter can be used to low-pass filter  
and decimate the output codes. This works in a similar  
manner to averaging; for every decimation by 2, the signal-  
to-noise ratio improves 3dB.  
4864  
DIGITAL INTERFACE  
SIGNAL LEVELS  
The digital inputs of the ADS8320 can accommodate logic  
levels up to 5.5V regardless of the value of VCC. Thus, the  
ADS8320 can be powered at 3V and still accept inputs from  
logic powered at 5V.  
The CMOS digital output (DOUT) swings 0V to VCC. If VCC  
is 3V and this output is connected to a 5V CMOS logic  
input, then that IC may require more supply current than  
normal and may have a slightly longer propagation delay.  
0
1
0
2
72  
3
64  
5
0
6
4
Code  
FIGURE 2. Histogram of 5000 Conversions of a DC Input  
at the Code Center.  
ADS8320  
SBAS108D  
9
www.ti.com  
SERIAL INTERFACE  
DATA FORMAT  
The ADS8320 communicates with microprocessors and other  
digital systems via a synchronous 3-wire serial interface, as  
shown in Figure 3 and Table I. The DCLOCK signal syn-  
chronizes the data transfer with each bit being transmitted on  
the falling edge of DCLOCK. Most receiving systems will  
capture the bitstream on the rising edge of DCLOCK. How-  
ever, if the minimum hold time for DOUT is acceptable, the  
system can use the falling edge of DCLOCK to capture each  
bit.  
The output data from the ADS8320 is in Straight Binary  
format, as shown in Table II. This table represents the ideal  
output code for the given input voltage and does not include  
the effects of offset, gain error, or noise.  
DESCRIPTION  
ANALOG VALUE  
VREF  
DIGITAL OUTPUT  
STRAIGHT BINARY  
Full-Scale Range  
Least Significant  
Bit (LSB)  
VREF/65,536  
BINARY CODE  
HEX CODE  
FFFF  
A falling CS signal initiates the conversion and data transfer.  
The first 4.5 to 5.0 clock periods of the conversion cycle are  
used to sample the input signal. After the fifth falling  
DCLOCK edge, DOUT is enabled and outputs a LOW value  
for one clock period. For the next 16 DCLOCK periods,  
DOUT outputs the conversion result, most significant bit first.  
After the least significant bit (B0) has been output, subse-  
quent clocks repeat the output data but in a least significant  
bit first format.  
Full-Scale  
Midscale  
VREF 1 LSB  
1111 1111 1111 1111  
1000 0000 0000 0000  
0111 1111 1111 1111  
0000 0000 0000 0000  
V
REF/2  
8000  
Midscale 1LSB  
Zero  
V
REF/2 1 LSB  
7FFF  
0V  
0000  
TABLE II. Ideal Input Voltages and Output Codes.  
POWER DISSIPATION  
After the most significant bit (B15) has been repeated, DOUT  
will tri-state. Subsequent clocks will have no effect on the  
converter. A new conversion is initiated only when CS has  
been taken HIGH and returned LOW.  
The architecture of the converter, the semiconductor fabrica-  
tion process, and a careful design allow the ADS8320 to  
convert at up to a 100kHz rate while requiring very little  
power. Still, for the absolute lowest power dissipation, there  
are several things to keep in mind.  
SYMBOL  
tSMPL  
DESCRIPTION  
Analog Input Sample Time  
Conversion Time  
MIN  
TYP MAX  
UNITS  
The power dissipation of the ADS8320 scales directly with  
conversion rate. Therefore, the first step to achieving the  
lowest power dissipation is to find the lowest conversion  
rate that satisfies the requirements of the system.  
4.5  
5.0  
Clk Cycles  
Clk Cycles  
kHz  
tCONV  
tCYC  
16  
100  
0
Throughput Rate  
tCSD  
CS Falling to  
ns  
DCLOCK LOW  
In addition, the ADS8320 is in power-down mode under two  
conditions: when the conversion is complete and whenever  
CS is HIGH (as shown in Figure 3). Ideally, each conversion  
should occur as quickly as possible, preferably at a 2.4MHz  
clock rate. This way, the converter spends the longest  
possible time in the power-down mode. This is very impor-  
tant as the converter not only uses power on each DCLOCK  
transition (as is typical for digital CMOS components), but  
also uses some current for the analog circuitry, such as the  
comparator. The analog section dissipates power continu-  
ously, until the power-down mode is entered.  
tSUCS  
thDO  
tdDO  
CS Falling to  
DCLOCK Rising  
20  
5
ns  
ns  
ns  
DCLOCK Falling to  
Current DOUT Not Valid  
15  
DCLOCK Falling to Next  
DOUT Valid  
30  
50  
tdis  
ten  
CS Rising to DOUT Tri-State  
70  
20  
100  
50  
ns  
ns  
DCLOCK Falling to DOUT  
Enabled  
tf  
tr  
DOUT Fall Time  
DOUT Rise Time  
5
7
25  
25  
ns  
ns  
TABLE I. Timing Specifications (VCC = 2.7V and above,  
–40°C to +85°C.  
Complete Cycle  
CS/SHDN  
tSUCS  
Power Down  
Sample  
Conversion  
DCLOCK  
DOUT  
tCSD  
Use positive clock edge for data transfer  
Hi-Z  
Hi-Z  
0
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0  
(MSB) (LSB)  
tSMPL  
tCONV  
NOTE: Minimum 22 clock cycles required for 16-bit conversion. Shown are 24 clock cycles.  
If CS remains LOW at the end of conversion, a new datastream with LSB-first is shifted out again.  
FIGURE 3. ADS8320 Basic Timing Diagrams.  
ADS8320  
10  
SBAS108D  
www.ti.com  
1.4V  
VOH  
VOL  
3kΩ  
DOUT  
DOUT  
Test Point  
tr  
tf  
100pF  
CLOAD  
Voltage Waveforms for DOUT Rise and Fall Times, tr, tf  
Load Circuit for tdDO, tr, and tf  
Test Point  
DCLOCK  
VIL  
VCC  
tdis Waveform 2, ten  
3kΩ  
DOUT  
tdDO  
VOH  
VOL  
tdis Waveform 1  
100pF  
CLOAD  
DOUT  
thDO  
Voltage Waveforms for DOUT Delay Times, tdDO  
Load Circuit for tdis and ten  
VIH  
CS/SHDN  
CS/SHDN  
DCLOCK  
1
4
5
DOUT  
Waveform 1(1)  
90%  
10%  
tdis  
VOL  
DOUT  
B11  
DOUT  
Waveform 2(2)  
ten  
Voltage Waveforms for ten  
Voltage Waveforms for tdis  
NOTES: (1) Waveform 1 is for an output with internal conditions such that the output  
is HIGH unless disabled by the output control. (2) Waveform 2 is for an output with  
internal conditions such that the output is LOW unless disabled by the output control.  
FIGURE 4. Timing Diagrams and Test Circuits for the Parameters in Table I.  
ADS8320  
SBAS108D  
11  
www.ti.com  
Figure 5 shows the current consumption of the ADS8320  
versus sample rate. For this graph, the converter is clocked  
at 2.4MHz regardless of the sample rate—CS is HIGH for  
the remaining sample period. Figure 6 also shows current  
consumption versus sample rate. However, in this case, the  
DCLOCK period is 1/24th of the sample period—CS is  
HIGH for one DCLOCK cycle out of every 16.  
1000  
100  
10  
TA = 25°C  
CLK = 2.4MHz  
f
VCC = 5.0V  
VREF = 5.0V  
VCC = 2.7V  
REF = 2.5V  
V
There is an important distinction between the power-down  
mode that is entered after a conversion is complete and the  
full power-down mode which is enabled when CS is HIGH.  
CS LOW will shut down only the analog section. The digital  
section is completely shut down only when CS is HIGH.  
Thus, if CS is left LOW at the end of a conversion and the  
converter is continually clocked, the power consumption  
will not be as low as when CS is HIGH. Figure 7 shows  
more information.  
1
0.1  
1
10  
100  
Sample Rate (kHz)  
FIGURE 5. Maintaining fCLK at the Highest Possible Rate  
Allows Supply Current to Drop Linearly with  
Sample Rate.  
Power dissipation can also be reduced by lowering the  
power-supply voltage and the reference voltage. The  
ADS8320 operates over a VCC range of 2.0V to 5.25V.  
However, at voltages below 2.7V, the converter will not run  
at a 100kHz sample rate. See the typical performance curves  
for more information regarding power supply voltage and  
maximum sample rate.  
1000  
100  
SHORT CYCLING  
Another way of saving power is to utilize the CS signal to  
short cycle the conversion. Because the ADS8320 places the  
latest data bit on the DOUT line as it is generated, the  
converter can easily be short cycled. This term means that  
the conversion can be terminated at any time. For example,  
if only 14 bits of the conversion result are needed, then the  
conversion can be terminated (by pulling CS HIGH) after  
the 14th bit has been clocked out.  
10  
TA = 25°C  
V
V
CC = 5.0V  
REF = 5.0V  
f
CLK = 24 fSAMPLE  
1
0.1  
1
10  
100  
Sample Rate (kHz)  
This technique can be used to lower the power dissipation  
(or to increase the conversion rate) in those applications  
where an analog signal is being monitored until some con-  
dition becomes true. For example, if the signal is outside a  
predetermined range, the full 16-bit conversion result may  
not be needed. If so, the conversion can be terminated after  
the first n bits, where n might be as low as 3 or 4. This results  
in lower power dissipation in both the converter and the rest  
of the system, as they spend more time in the power-down  
mode.  
FIGURE 6. Scaling fCLK Reduces Supply Current Only  
Slightly with Sample Rate.  
1000  
TA = 25°C  
V
V
CC = 5.0V  
REF = 5.0V  
800  
600  
400  
200  
0.0  
f
CLK = 24 fSAMPLE  
CS LOW (GND)  
LAYOUT  
For optimum performance, care should be taken with the  
physical layout of the ADS8320 circuitry. This is particu-  
larly true if the reference voltage is low and/or the conver-  
sion rate is high. At a 100kHz conversion rate, the ADS8320  
makes a bit decision every 416ns. That is, for each subse-  
quent bit decision, the digital output must be updated with  
the results of the last bit decision, the capacitor array  
appropriately switched and charged, and the input to the  
comparator settled to a 16-bit level all within one clock  
cycle.  
CS HIGH (VCC  
)
0.250  
0.00  
0.1  
1
10  
100  
Sample Rate (kHz)  
FIGURE 7. Shutdown Current with CS HIGH is 50nA  
Typically, Regardless of the Clock. Shutdown  
Current with CS LOW Varies with Sample  
Rate.  
ADS8320  
12  
SBAS108D  
www.ti.com  
The basic SAR architecture is sensitive to spikes on the  
power supply, reference, and ground connections that occur  
just prior to latching the comparator output. Thus, during  
any single conversion for an n-bit SAR converter, there are  
n “windows” in which large external transient voltages can  
easily affect the conversion result. Such spikes might origi-  
nate from switching power supplies, digital logic, and high  
power devices, to name a few. This particular source of error  
can be very difficult to track down if the glitch is almost  
synchronous to the converter DCLOCK signal—as the phase  
difference between the two changes with time and tempera-  
ture, causing sporadic misoperation.  
Also, keep in mind that the ADS8320 offers no inherent  
rejection of noise or voltage variation in regards to the  
reference input. This is of particular concern when the  
reference input is tied to the power supply. Any noise and  
ripple from the supply will appear directly in the digital  
results. While high-frequency noise can be filtered out as  
described in the previous paragraph, voltage variation due to  
the line frequency (50Hz or 60Hz), can be difficult to  
remove.  
The GND pin on the ADS8320 should be placed on a clean  
ground point. In many cases, this will be the “analog”  
ground. Avoid connecting the GND pin too close to the  
grounding point for a microprocessor, microcontroller, or  
digital signal processor. If needed, run a ground trace di-  
rectly from the converter to the power-supply connection  
point. The ideal layout includes an analog ground plane for  
the converter and associated analog circuitry.  
With this in mind, power to the ADS8320 should be clean  
and well bypassed. A 0.1µF ceramic bypass capacitor should  
be placed as close to the ADS8320 package as possible. In  
addition, a 1µF to 10µF capacitor and a 5or 10series  
resistor may be used to low-pass filter a noisy supply.  
The reference should be similarly bypassed with a 0.1µF  
capacitor. Again, a series resistor and large capacitor can be  
used to low-pass filter the reference voltage. If the reference  
voltage originates from an op amp, be careful that the op  
amp can drive the bypass capacitor without oscillation (the  
series resistor can help in this case). Keep in mind that while  
the ADS8320 draws very little current from the reference on  
average, there are still instantaneous current demands placed  
on the external input and reference circuitry.  
APPLICATION CIRCUITS  
Figure 8 shows a basic data acquisition system. The ADS8320  
input range is 0V to VCC, as the reference input is connected  
directly to the power supply. The 5resistor and 1µF to  
10µF capacitor filter the microcontroller “noise” on the  
supply, as well as any high-frequency noise from the supply  
itself. The exact values should be picked such that the filter  
provides adequate rejection of the noise.  
Texas Instruments' OPA627 op amp provides optimum  
performance for buffering both the signal and reference  
inputs. For low-cost, low-voltage, single-supply applica-  
tions, the OPA2350 or OPA2340 dual op amps are recom-  
mended.  
+2.7V to +5.25V  
5Ω  
+
1µF to  
10µF  
ADS8320  
VREF  
VCC  
1µF to  
10µF  
+
0.1µF  
Microcontroller  
+In  
CS  
DOUT  
In  
GND  
DCLOCK  
FIGURE 8. Basic Data Acquisition System.  
ADS8320  
SBAS108D  
13  
www.ti.com  
Revision History  
DATE  
3/07  
REVISION PAGE  
SECTION  
DESCRIPTION  
Added last row, Input current to any pin except supply...±10mA  
D
C
4
6
Absolute Max Ratings  
7/06  
Typ Performance Curves Changed CHANGE IN OFFSET vs TEMPERATURE plot  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
ADS8320  
14  
SBAS108D  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
ADS8320E/250  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
8
8
8
8
8
8
8
8
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
A20  
A20  
A20  
A20  
A20  
A20  
A20  
A20  
ADS8320E/250G4  
ADS8320E/2K5  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
250  
2500  
2500  
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
ADS8320E/2K5G4  
ADS8320EB/250  
ADS8320EB/250G4  
ADS8320EB/2K5  
ADS8320EB/2K5G4  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
2500  
2500  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF ADS8320 :  
NOTE: Qualified Version Definitions:  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
6-Nov-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
ADS8320E/250  
ADS8320E/2K5  
ADS8320EB/250  
ADS8320EB/2K5  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
250  
2500  
250  
180.0  
330.0  
180.0  
330.0  
12.4  
12.4  
12.4  
12.4  
5.3  
5.3  
5.3  
5.3  
3.4  
3.4  
3.4  
3.4  
1.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
2500  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
6-Nov-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
ADS8320E/250  
ADS8320E/2K5  
ADS8320EB/250  
ADS8320EB/2K5  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
250  
2500  
250  
210.0  
367.0  
210.0  
367.0  
185.0  
367.0  
185.0  
367.0  
35.0  
35.0  
35.0  
35.0  
2500  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号:

ADS8320-HT

16-BIT, HIGH-SPEED, 2.7-V TO 5-V, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER
TI

ADS8320E

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
BB

ADS8320E/250

16 位高速 2.7V 至 5V 微功耗采样模数转换器 (ADC) | DGK | 8 | -40 to 85
TI

ADS8320E/250G4

16 位高速 2.7V 至 5V 微功耗采样模数转换器 (ADC) | DGK | 8 | -40 to 85
TI

ADS8320E/2K5

16 位高速 2.7V 至 5V 微功耗采样模数转换器 (ADC) | DGK | 8 | -40 to 85
TI

ADS8320E250

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
TI

ADS8320E250G4

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
TI

ADS8320E2K5

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
TI

ADS8320E2K5G4

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
TI

ADS8320EB

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
BB

ADS8320EB

16-Bit, High-Speed, 2.7V to 5V microPower Sampling ANALOG-TO-DIGITAL CONVERTER
TI

ADS8320EB/250

16 位高速 2.7V 至 5V 微功耗采样模数转换器 (ADC) | DGK | 8 | -40 to 85
TI