ADS8383IPFBT [TI]
18-BIT, 500-kHz, UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE; 18位, 500千赫,单极性输入,并行接口微功耗采样模拟数字转换器型号: | ADS8383IPFBT |
厂家: | TEXAS INSTRUMENTS |
描述: | 18-BIT, 500-kHz, UNIPOLAR INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE |
文件: | 总29页 (文件大小:164K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ADS8383
SLAS005B – DECEMBER 2002 – REVISED MAY 2003
18-BIT, 500-kHz, UNIPOLAR INPUT, MICROPOWER SAMPLING
ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE
FEATURES
APPLICATIONS
D
D
D
D
D
Medical Instruments
D
D
D
D
D
D
D
D
D
D
500-kHz Sample Rate
Optical Networking
Transducer Interface
18-Bit NMC Ensured Over Temperature
Zero Latency
High Accuracy Data Acquisition Systems
Magnetometers
Low Power: 110 mW at 500 kHz
Unipolar Input Range
DESCRIPTION
The ADS8383 is an 18-bit, 500 kHz A/D converter. The
device includes a 18-bit capacitor-based SAR A/D
converter with inherent sample and hold. The ADS8383
offers a full 18-bit interface, a 16-bit option where data is
read using two read cycles or an 8-bit bus option using
three read cycles.
Onboard Reference Buffer
High-Speed Parallel Interface
Wide Digital Supply
TheADS8383isavailableina48-leadTQFPpackageand
is characterized over the industrial –40°C to 85°C
temperature range.
8-/16-/18-Bit Bus Transfer
48-Pin TQFP Package
BUS 18/16
Output
Latches
and
3-State
Drivers
BYTE
SAR
18-/16-/8-Bit
Parallel DATA
Output Bus
+
_
+IN
–IN
CDAC
Comparator
Clock
REFIN
CONVST
Conversion
and
Control Logic
BUSY
CS
RD
Pleasebe aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2002–2003, Texas Instruments Incorporated
ADS8383
www.ti.com
SLAS005B – DECEMBER 2002 – REVISED MAY 2003
Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoamduring
storageor handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
NO
MISSING
CODES
RESOLU-
TION (BIT)
MAXIMUM
INTEGRAL DIFFERENTIAL
LINEARITY
(LSB)
MAXIMUM
TRANS-
PORT
MEDIA
TEMPER-
ATURE
RANGE
PACKAGE
TYPE
PACKAGE
DESIGNATOR
ORDERING
INFORMATION
MODEL
LINEARITY
(LSB)
QUANTITY
Tape and
reel 250
ADS8383IPFBT
ADS8383IPFBR
ADS8383IBPFBT
ADS8383IBPFBR
48 Pin
TQFP
–40°C to
85°C
ADS8383I
±10
±7
–2~7
17
18
PFB
PFB
Tape and
reel1000
Tape and
reel 250
48 Pin
TQFP
–40°C to
85°C
ADS8383IB
–1~2.5
Tape and
reel1000
NOTE:
For the most current specifications and package information, refer to our website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
overoperating free-air temperature range unless otherwise noted
(1)
UNIT
+IN to AGND
+VA + 0.1 V
0.5 V
Voltage
–IN to AGND
+VA to AGND
–0.3 V to 7 V
–0.3 V to 7 V
+VBD to BDGND
+VA to +VBD
Voltagerange
–0.3 V to 2.5 V
–0.3 V to +VBD + 0.3 V
–0.3 V to +VBD + 0.3 V
–40°C to 85°C
Digital input voltage to BDGND
Digital output voltage to BDGND
Operating free-air temperature range, T
A
Storage temperature range, T
stg
–65°C to 150°C
150°C
Junctiontemperature(T max)
J
Powerdissipation
thermalimpedance
(T Max – T )/θ
J
A
JA
TQFP package
θ
86°C/W
JA
Vapor phase (60 sec)
Infrared (15 sec)
215°C
220°C
Leadtemperature,soldering
(1)
Stressesbeyondthoselistedunder“absolutemaximumratings”maycausepermanentdamagetothedevice. Thesearestressratingsonly,and
functionaloperation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
ADS8383
www.ti.com
SLAS005B– DECEMBER 2002 – REVISED MAY 2003
SPECIFICATIONS
A
T
= –40°C to 85°C, +VA = 5 V, +VBD = 3 V or 5 V, V = 4.096 V, f
= 500 kHz (unless otherwise noted)
ref
SAMPLE
TEST CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
Analog Input
Full-scale input voltage (see Note 1)
+IN – –IN
0
–0.2
–0.2
V
V
V
ref
+IN
V
ref
+ 0.2
0.2
Absoluteinputvoltage
–IN
Inputcapacitance
Input leakage current
SystemPerformance
Resolution
45
1
pF
nA
18
Bits
Bits
(+IN – –IN) < 0.5 FS
(+IN – –IN) ≥ 0.5 FS
18
17
ADS8383I
No missing codes
ADS8383IB
18
(+IN – –IN) < 0.125 FS
(+IN – –IN) < 0.5 FS
(+IN – –IN) ≥ 0.5 FS
–4
4
6
–6
ADS8383I
LSB
(18 bit)
Integral linearity (see Notes 2 and 3)
–10
–7
10
7
ADS8383IB
–2/3
(+IN – –IN) < 0.125 FS
(+IN – –IN) < 0.5 FS
(+IN – –IN) ≥ 0.5 FS
–1
2
–1
3
ADS8383I
Differentiallinearity
LSB (18 bit)
mV
–2
7
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
–1
–1/1.4
±0.5
2.5
1
–1
Offset error (see Note 4)
Gain error (see Note 4)
–0.75
–0.1
–0.06
±0.25
0.75
0.1
0.06
V
ref
= 4.096 V
= 4.096 V
%FS
%FS
V
ref
Noise
60
75
µV RMS
dB
Power supply rejection ratio
SamplingDynamics
Conversiontime
Acquisitiontime
Throughputrate
Aperturedelay
At 3FFFFh output code
1.5
µs
µs
0.4
500
kHz
ns
4
15
Aperturejitter
ps
Stepresponse
150
150
ns
Over voltage recovery
ns
(1)
Ideal input span, does not include gain or offset error.
LSB means least significant bit
This is endpoint INL, not best fit.
(2)
(3)
(4)
Measured relative to an ideal full-scale input (+IN – –IN) of 4.096 V
3
ADS8383
www.ti.com
SLAS005B – DECEMBER 2002 – REVISED MAY 2003
SPECIFICATIONS (CONTINUED)
A
T
= –40°C to 85°C, +VA = +5 V, +VBD = 3 V or 5 V, V = 4.096 V, f
= 500 kHz (unless otherwise noted)
ref
SAMPLE
TEST CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
DynamicCharacteristics
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
ADS8383I
ADS8383IB
–110
–112
–98
–108
–98
–99
–90
–91
87
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
= 4 V at 1 kHz
pp
= 4 V at 10 kHz
pp
Total harmonic distortion (THD)
(see Note 1)
dB
dB
dB
= 4 V at 50 kHz
pp
= 4 V at 100 kHz
pp
= 4 V at 1 kHz
pp
88
87
= 4 V at 10 kHz
pp
87
Signal to noise ratio (SNR) (see Note 1)
87
= 4 V at 50 kHz
pp
87
87
= 4 V at 100 kHz
pp
87
86
= 4 V at 1 kHz
pp
87
86
= 4 V at 10 kHz
pp
86
Signal to noise + distortion (SINAD)
(see Note 1)
86
= 4 V at 50 kHz
pp
86
85
= 4 V at 100 kHz
pp
85
110
112
98
= 4 V at 1 kHz
pp
= 4 V at 10 kHz
pp
108
98
Spurious free dynamic range (SFDR)
(see Note 1)
dB
= 4 V at 50 kHz
pp
98
90
= 4 V at 100 kHz
pp
94
–3dB Small signal bandwidth
3
MHz
Voltage Reference Input
Reference voltage at REFIN, V
ref
2.5
4.096
500
4.2
1
V
Reference resistance (see Note 2)
Reference current drain
Bias Input
kΩ
mA
f = 500 kHz
s
Bias input range
2
2.048
2.1
V
Bias input drift
±5
%FS
µA
Bias input current, sink
–150
–100
(1)
(2)
Calculated on the first nine harmonics of the input frequency
Can vary ±20%
4
ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
SPECIFICATIONS (CONTINUED)
A
T
= –40°C to 85°C, +VA = +5 V, +VBD = 3 V or 5 V, V = 4.096 V, f
= 500 kHz (unless otherwise noted)
SAMPLE
ref
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DigitalInput/Output
Logicfamily
CMOS
V
V
V
V
I
I
I
I
= 5 µA
= 5 µA
+VBD–1
–0.3
+V
BD
+ 0.3
0.8
IH
IH
IL
IL
Logic level
V
= 2 TTL loads
= 2 TTL loads
+V
BD
– 0.6
OH
OL
OH
OL
0.4
Straight
Binary
Dataformat
PowerSupplyRequirements
+VBD (see Notes 1 and 2)
+VA (see Note 2)
2.95
4.75
3.3
5
5.25
5.25
26
V
V
Power supply voltage
Supply current, 500-kHz sample rate (see Note 3)
Power dissipation, 500-kHz sample rate (see Note 3)
TemperatureRange
22
110
mA
mW
130
Operatingfree-air
–40
85
°C
(1)
(2)
(3)
The difference between +VA and +VBD should be no less than 2.3 V, i.e. if +VA is 5.5 V, +VBD should be at least 2.95 V.
+VBD ≥ +VA – 2.3 V
This includes only +VA current. +VBD current is typical 1 mA with 5 pF load capacitance on all output pins.
5
ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
TIMING CHARACTERISTICS
All specifications typical at –40°C to 85°C, +VA = +VBD = 5 V (see Notes 1, 2, and 3)
PARAMETER
MIN
TYP
MAX
UNIT
t
t
t
t
t
t
t
Conversiontime
1.5
µs
µs
ns
ns
ns
ns
ns
ps
µs
µs
CONV
ACQ
pd1
pd2
w1
Acquisitiontime
0.4
10
10
40
20
20
CONVST low to conversion started (BUSY high)
Propagation delay time, End of conversion to BUSY low
Pulse duration, CONVST low
50
20
Setup time, CS low to CONVST low
Pulse duration, CONVST high
CONVST falling edge jitter
su1
w2
10
1
t
t
Pulse duration, BUSY signal low
Pulse duration, BUSY signal high
Min(t )
ACQ
w3
1.52
w4
Hold time, First data bus data transition (RD low, or CS low for read cycle, or BYTE or
BUS18/16input changes) after CONVST low
t
h1
40
ns
t
t
t
t
t
t
t
t
t
t
t
t
Delay time, CS low to RD low
0
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
d1
Setup time, RD high to CS high
su2
w5
en
Pulse duration, RD low time
50
Enable time, RD low (or CS low for read cycle) to data valid
Delay time, data hold from RD high
20
20
5
10
d2
Delay time, BUS18/16 or BYTE rising edge or falling edge to data valid
RD high
d3
20
w6
h2
Hold time, last RD (or CS for read cycle ) rising edge to CONVST falling edge
Propagation delay time, BUSY falling edge to next RD (or CS for read cycle) falling edge
Delay time, BYTE edge to BUS18/16 edge skew
Setup time, BYTE or BUS18/16 rising edge to RD falling edge
Hold time, BYTE or BUS18/16 falling edge to RD falling edge
125
Max(t
)
d5
pd4
d4
0
10
10
su3
h3
t
t
t
Disable time, RD High (CS high for read cycle) to 3-stated data bus
Delay time, BUSY low to MSB data valid
20
30
20
ns
ns
µs
dis
d5
Setup time, BYTE or BUS18/16 change before BUSY falling edge
10
su4
(1)
(2)
(3)
All input signals are specified with t = t = 5 ns (10% to 90% of +VBD) and timed from a voltage level of (V + V )/2.
IL IH
r
f
Seetimingdiagrams.
All timing are measured with 20 pF equivalent loads on all data bits and BUSY pins.
6
ADS8383
www.ti.com
SLAS005B– DECEMBER 2002 – REVISED MAY 2003
TIMING CHARACTERISTICS
All specifications typical at –40°C to 85°C, +VA = 5 V, +VBD = 3 V (see Notes 1, 2, and 3)
PARAMETER
MIN
TYP
MAX
UNIT
µs
µs
ns
t
t
t
t
t
t
t
Conversiontime
1.5
CONV
ACQ
pd1
pd2
w1
Acquisitiontime
0.4
10
10
40
20
20
CONVST low to conversion started (BUSY high)
Propagation delay time, end of conversion to BUSY low
Pulse duration, CONVST low
50
20
ns
ns
Setup time, CS low to CONVST low
Pulse duration, CONVST high
CONVST falling edge jitter
ns
su1
ns
w2
10
1
ps
t
t
t
Pulse duration, BUSY signal low
Pulse duration, BUSY signal high
Min(t
ACQ
)
µs
µs
ns
w3
w4
h1
1.52
Hold time, first data bus transition (RD low, or CS low for read cycle, or BYTE or BUS
18/16input changes) after CONVST low
40
t
t
t
t
t
t
t
t
t
t
t
t
Delay time, CS low to RD low
0
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
d1
Setup time, RD high to CS high
su2
w5
en
Pulse duration, RD low
50
Enable time, RD low (or CS low for read cycle) to data valid
Delay time, data hold from RD high
30
30
10
10
d2
Delay time, BUS18/16 or BYTE rising edge or falling edge to data valid
Pulse duration, RD high time
d3
20
w6
h2
Hold time, last RD (or CS for read cycle ) rising edge to CONVST falling edge
Propagation delay time, BUSY falling edge to next RD (or CS for read cycle) falling edge
Delay time, BYTE edge to BUS18/16 edge skew
Setup time, BYTE or BUS18/16 rising edge to RD falling edge
Hold time, BYTE or BUS18/16 falling edge to RD falling edge
125
Max(td5)
pd4
d4
0
10
10
su3
h3
t
t
t
Disable time, RD High (CS high for read cycle) to 3-stated data bus
Delay time, BUSY low to MSB data valid delay time
30
40
30
ns
ns
µs
dis
d5
Setup time, BYTE or BUS18/16 change before BUSY falling edge
10
su4
(1)
(2)
(3)
All input signals are specified with t = t = 5 ns (10% to 90% of +VBD) and timed from a voltage level of (V + V )/2.
IL IH
r
f
Seetimingdiagrams.
All timing are measured with 10 pF equivalent loads on all data bits and BUSY pins.
7
ADS8383
www.ti.com
SLAS005B– DECEMBER 2002 – REVISED MAY 2003
PIN ASSIGNMENTS
PFB PACKAGE
(TOP VIEW)
36 35 34 33 32 31 30 29 28 27 26 25
+VBD
BUS18/16
BYTE
CONVST
RD
+VBD
DB10
DB11
DB12
DB13
DB14
DB15
DB16
DB17
AGND
AGND
+VA
37
38
39
40
41
42
43
44
45
46
47
48
24
23
22
21
20
19
18
17
16
15
14
13
CS
+VA
AGND
AGND
+VA
REFM
REFM
1
2
3
4
5
6
7
8
9 10 11 12
NC – No connection.
8
ADS8383
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NAME
SLAS005B– DECEMBER 2002 – REVISED MAY 2003
TERMINAL FUNCTIONS
NO.
I/O
DESCRIPTION
AGND
5, 8, 11,
12, 14, 15,
44, 45
–
Analogground
BDGND
BIAS
25
2
–
I
Digital ground for bus interface digital supply
Bias to internal circuit
BUSY
36
38
O
I
Status output. High when a conversion is in progress.
BUS18/16
Bus size select input. Used for selecting 18-bit or 16-bit wide bus transfer.
0: Data bits output on the 18-bit data bus pins DB[17:0].
1: Last two data bits D[1:0] from 18-bit wide bus output on:
a) the low byte pins DB[9:2] if BYTE = 0
b) the high byte pins DB[17:10] if BYTE = 1
BYTE
39
I
Byte select input. Used for 8-bit bus reading.
0: No fold back
1: Low byte D[9:2] of the 16 most significant bits is folded back to high byte of the 16 most significant
pinsDB[17:10].
CONVST
CS
40
42
I
I
Convert start
Chip select
8-Bit Bus
BYTE = 1
16-Bit Bus
BYTE = 0 BYTE = 0
18-Bit Bus
BYTE = 0
BYTE = 0
BYTE = 1
Data Bus
BUS18/16 = 0 BUS18/16 = 0 BUS18/16 = 1 BUS18/16 = 0 BUS18/16 = 1 BUS18/16 = 0
DB17
DB16
DB15
DB14
DB13
DB12
DB11
DB10
DB9
16
17
18
19
20
21
22
23
26
27
28
29
30
31
32
33
34
35
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
D17 (MSB)
D16
D15
D14
D13
D12
D11
D10
D9
D9
All ones
All ones
All ones
All ones
All ones
All ones
D1
D17 (MSB)
D16
D15
D14
D13
D12
D11
D10
D9
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
D1
D17 (MSB)
D16
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D0(LSB)
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
All ones
DB8
D8
D8
D8
DB7
D7
D7
D7
DB6
D6
D6
D6
DB5
D5
D5
D5
DB4
D4
D4
D4
DB3
D3
D3
D3
DB2
D2
D2
D0 (LSB)
All ones
All ones
D2
DB1
D1
D1
D1
DB0
D0 (LSB)
D0 (LSB)
D0 (LSB)
–IN
7
I
I
Invertinginputchannel
Noninvertinginputchannel
Noconnection
+IN
6
3
NC
–
I
REFIN
REFM
RD
1
Referenceinput.
47, 48
41
I
Referenceground.
I
Synchronization pulse for the parallel output.
Analog power supplies, 5-V dc
+VA
4, 9, 10,
–
13, 43, 46
+VBD
24, 37
–
Digital power supply for bus
9
ADS8383
www.ti.com
SLAS005B– DECEMBER 2002 – REVISED MAY 2003
TIMING DIAGRAMS
t
t
w2
w1
CONVST
t
t
pd2
pd1
t
w4
t
w3
BUSY
t
su1
CS
†
CONVERT
t
(CONV)
t
(CONV)
†
SAMPLING
(When CS Toggle)
t
(ACQ)
BYTE
t
h1
BUS 18/16
t
su2
t
pd4
t
h2
t
d1
RD
t
t
en
dis
Hi–Z
Hi–Z
MSB
D[17:12] D[9:4]
DB[17:12]
Hi–Z
Hi–Z
Hi–Z
Hi–Z
DB[11:10]
DB[9:0]
D[11:10]
D[9:0]
D[3:2] D[1:0]
†
Signal internal to device
Figure 1. Timing for Conversion and Acquisition Cycles With CS and RD Toggling
10
ADS8383
www.ti.com
CONVST
SLAS005B– DECEMBER 2002 – REVISED MAY 2003
t
w1
t
w2
t
t
pd2
pd1
t
w4
t
w3
BUSY
t
su1
CS
†
CONVERT
t
(CONV)
t
(CONV)
†
SAMPLING
(When CS Toggle)
t
(ACQ)
BYTE
t
h1
BUS 18/16
t
pd4
t
h2
RD = 0
t
en
t
dis
Hi–Z
Hi–Z
MSB
D[17:12] D[9:4]
DB[17:12]
Hi–Z
Hi–Z
Hi–Z
Hi–Z
DB[11:10]
DB[9:0]
D[11:10]
D[9:0]
D[3:2] D[1:0]
†
Signal internal to device
NOTE:
RD cannot be tied to BDGND. Three read cycles are required at power on.
Figure 2. Timing for Conversion and Acquisition Cycles With CS Toggling, RD Held at BDGND After
Power-On Initialization
11
ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
t
w1
t
w2
CONVST
t
t
pd1
pd2
t
w4
t
w3
BUSY
CS = 0
†
CONVERT
t
(CONV)
t
(CONV)
t
(ACQ)
†
SAMPLING
(When CS = 0)
BYTE
t
h1
BUS 18/16
t
pd4
t
h2
RD
t
t
en
dis
Hi–Z
Hi–Z
MSB
D[17:12] D[9:4]
DB[17:12]
Hi–Z
Hi–Z
Hi–Z
Hi–Z
DB[11:10]
DB[9:0]
D[11:10]
D[9:0]
D[3:2] D[1:0]
†
Signal internal to device
Figure 3. Timing for Conversion and Acquisition Cycles With CS Tied to BDGND, RD Toggling
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ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
t
w2
t
w1
CONVST
t
t
pd2
pd1
t
w4
t
w3
BUSY
CS = 0
†
CONVERT
t
t
(CONV)
(CONV)
t
(ACQ)
†
SAMPLING
(When CS = 0)
BYTE
BUS 18/16
t
h1
t
h1
RD = 0
t
d5
D[9:4]
DB[17:12]
DB[11:10]
NextD[17:12]
D[17:12]
D[3:2]
D[11:10]
D[9:0]
D[1:0]
Next D[11:10]
Next D[9:0]
DB[9:0]
†
Signal internal to device
NOTE:
RD cannot be tied to BDGND. Three read cycles are required at power on.
Figure 4. Timing for Conversion and Acquisition Cycles With CS and RD Held at BDGND After Power-On
Initialization - Auto Read
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ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
CS
RD
BYTE
BUS 18/16
t
en
t
d3
t
t
en
t
d3
dis
t
dis
Hi–Z
Hi–Z
Hi–Z
Valid
Valid
Valid
DB[17:0]
Figure 5. Detailed Timing for Read Cycles
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ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
TYPICAL CHARACTERISTICS†
SIGNAL-TO-NOISE RATIO
vs
HISTOGRAM (DC Code Spread)
FREE-AIR TEMPERATURE
HALF SCALE 131071 CONVERSIONS
18000
16000
14000
12000
10000
8000
6000
4000
2000
0
87.9
87.8
87.7
87.6
87.5
87.4
87.3
87.2
+VA = 5 V,
+VBD = 3 V
Code = 131046
+VA = 5 V,
+VBD = 3 V
–40 –25 –10
5
20
35
50
65
80
T
A
– Free-Air Temperature – °C
Figure 7
Figure 6
SIGNAL-TO-NOISE + DISTORTION
vs
SPURIOUS FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
87.9
116
115
114
113
112
111
110
109
108
107
106
+VA = 5 V,
+VBD = 3 V
+VA = 5 V,
+VBD = 3 V
87.8
87.7
87.6
87.5
87.4
87.3
87.2
–40 –25 –10
5
20
35
50
65
80
–40 –25 –10
5
20
35
50
65
80
T
A
– Free-Air Temperature – °C
T
A
– Free-Air Temperature – °C
Figure 9
Figure 8
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
EFFECTIVE NUMBER OF BITS
vs
FREE-AIR TEMPERATURE
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
14.31
14.30
14.29
14.28
14.27
14.26
14.25
14.24
14.23
14.22
14.21
14.20
–104
+VA = 5 V,
+VBD = 3 V
+VA = 5 V,
+VBD = 3 V
–105
–106
–107
–108
–109
–110
–111
–40 –25 –10
5
20
35
50
65
80
–40 –25 –10
5
20
35
50
65
80
T
A
– Free-Air Temperature – °C
T
A
– Free-Air Temperature – °C
Figure 11
Figure 10
SIGNAL-TO-NOISE RATIO
vs
SIGNAL-TO-NOISE + DISTORTION
vs
INPUT FREQUENCY
INPUT FREQUENCY
87.26
87.25
87.24
87.23
87.22
87.21
87.20
87.19
87.18
87.17
87.16
87.15
89.0
88.5
88.0
87.5
87.0
86.5
86.0
85.5
85.0
+VA = 5 V,
+VBD = 3 V
+VA = 5 V,
+VBD = 3 V
0
20
40
60
80
100
0
20
40
60
80
100
f – Input Frequency – kHz
i
f – Input Frequency – kHz
i
Figure 12
Figure 13
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
SPURIOUS FREE DYNAMIC RANGE
EFFECTIVE NUMBER OF BITS
vs
vs
INPUT FREQUENCY
INPUT FREQUENCY
120
115
110
105
100
95
14.25
14.20
14.15
14.10
14.05
14.00
13.95
13.90
+VA = 5 V,
+VBD = 3 V
+VA = 5 V,
+VBD = 3 V
90
13.85
0
0
20
40
60
80
100
20
40
60
80
100
f – Input Frequency – kHz
i
f – Input Frequency – kHz
i
Figure 15
Figure 14
TOTAL HARMONIC DISTORTION
SUPPLY CURRENT
vs
vs
INPUT FREQUENCY
SAMPLE RATE
–80
–85
19
18
17
16
15
14
+VA = 5 V,
+VBD = 3 V
+VA = 5 V,
Current of +VA only
–90
–95
–100
–105
–110
–115
0
20
40
60
80
100
125
250
375
500
Sample Rate – KSPS
f – Input Frequency – kHZ
i
Figure 16
Figure 17
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
INTEGRAL NONLINEARITY
DIFFERENTIAL NONLINEARITY
vs
vs
SAMPLE RATE
SAMPLE RATE
3.0
2.5
2.0
1.50
1.25
Max
1.00
+VA = 5 V,
= 25 °C
1.5
Max
T
A
1.0
0.75
0.5
+VA = 5 V,
0.50
0.0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
T
A
= 25 °C
0.25
0.00
–0.25
–0.50
–0.75
–1.00
Min
Min
350
125
200
275
350
425
500
125
200
275
425
500
Sample Rate – KSPS
Sample Rate – KSPS
Figure 18
Figure 19
OFFSET VOLTAGE
vs
SUPPLY VOLTAGE
GAIN ERROR
vs
SUPPLY VOLTAGE
–0.30
–0.32
–0.34
–0.36
–0.38
–0.40
–0.42
–0.44
–0.46
–0.48
0
T
A
= 25 °C
–0.002
–0.004
–0.006
–0.008
–0.010
–0.012
4.75
5.00
5.25
4.75
5.00
5.25
+V – Supply Voltage – V
A
+V – Supply Voltage – V
A
Figure 21
Figure 20
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
GAIN ERROR
vs
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY VOLTAGE
–0.01
–0.02
–0.03
20.0
19.5
19.0
18.5
18.0
17.5
T
= 25 °C,
A
Current of +VA only
V
= 4.1 V
ref
V
ref
= 2.5 V
17.0
4.75
–40
–20
0
20
40
60
80
5.00
5.25
+V – Supply Voltage – V
A
T
A
– Free-Air Temperature – °C
Figure 23
Figure 22
OFFSET VOLTAGE
vs
TEMPERATURE
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
–0.20
–0.22
–0.24
–0.26
–0.28
–0.30
–0.32
18.14
V
ref
= 4.096 V
+VA = 5 V,
+VA = 5 V
18.12
18.10
18.08
18.06
18.04
18.02
18.00
17.98
17.96
T
A
= 25 °C
V
= 2.5 V
ref
–40 –25 –10
5
20
35
50
65
80
–40
–20
0
T
A
20
40
60
80
T
A
– Temperature – °C
– Temperature – °C
Figure 24
Figure 25
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
DIFFERENTIAL NONLINEARITY (Min)
DIFFERENTIAL NONLINEARITY (Max)
vs
vs
TEMPERATURE
TEMPERATURE
–0.60
–0.65
–0.70
–0.75
–0.80
–0.85
–0.90
–0.95
–1.00
1.8
1.7
1.6
1.5
1.4
1.3
1.2
+VA = 5 V,
= 25 °C
+VA = 5 V,
= 25 °C
T
A
T
A
Max
Min
–40 –25 –10
5
20
35
50
65
80
–40 –25 –10
5
20
35
50
65
80
T
A
– Temperature – °C
T
A
– Temperature – °C
Figure 27
Figure 26
INTEGRAL NONLINEARITY (Max)
INTEGRAL NONLINEARITY (Min)
vs
vs
TEMPERATURE
TEMPERATURE
4.5
4.0
3.5
3.0
2.5
2.0
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
–3.2
–3.4
–3.6
+VA = 5 V,
+VA = 5 V,
T = 25 °C
A
T
= 25 °C
A
Max
Min
–40 –25 –10
5
20
35
50
65
80
–40 –25 –10
5
20
T – Temperature – °C
A
35
50
65
80
T
– Temperature – °C
A
Figure 28
Figure 29
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
OFFSET VOLTAGE
vs
REFERENCE VOLTAGE
INTEGRAL NONLINEARITY
vs
REFERENCE VOLTAGE
–0.20
–0.22
–0.24
–0.26
–0.28
–0.30
–0.32
–0.34
–0.36
–0.38
–0.40
5
4
+VA = 5 V,
T
A
= 25 °C
Max
3
2
1
+VA = 5 V
Min
0
–1
–2
–3
–4
–5
–6
2.5
3.0
3.5
4.0
2.0
2.5
3.0
3.5
4.0
4.5
V
ref
– Reference Voltage – V
V
ref
– Reference Voltage – V
Figure 30
Figure 31
DIFFERENTIAL NONLINEARITY
vs
REFERENCE VOLTAGE
5
4
+VA = 5 V
Max
3
2
1
0
Min
–1
–2
2.0
2.5
3.0
3.5
4.0
4.5
V
ref
– Reference Voltage – V
Figure 32
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
DIFFERENTIAL LINEARITY ERROR
vs
CODE
3
2.5
2
1.5
1
0.5
0
–0.5
–1
–1.5
–2
–2.5
–3
0
65536
131072
Code
196605
262144
Figure 33
INTEGRAL LINEARITY ERROR
vs
CODE
7
5
3
1
–1
–3
–5
–7
0
65536
131072
Code
196608
262144
Figure 34
FFT SPECTRAL RESPONSE (100 kHz Input)
0
–20
–40
–60
16384Points, f = 500 kHz,
s
(+IN – –IN) = 4 V
P-P
–80
–100
–120
–140
–160
–180
0
50000
100000
150000
200000
250000
f – Frequency – Hz
Figure 35
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
FFT SPECTRAL RESPONSE (50 kHz Input)
0
–20
–40
16384Points, f = 500 kHz,
s
(+IN – –IN) = 4 V
P-P
–60
–80
–100
–120
–140
–160
–180
0
50000
100000
150000
200000
250000
f – Frequency – Hz
Figure 36
†
At –40°C to 85°C, +VA = 5 V, +VBD = 5 V, REFIN = 4.096 V and f
= 500 kHz (unless otherwise noted)
sample
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ADS8383
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
APPLICATION INFORMATION
MICROCONTROLLER INTERFACING
ADS8383 to 8-Bit Microcontroller Interface
Figure 37 shows a parallel interface between the ADS8383 and a typical microcontroller using the 8-bit data bus.
The BUSY signal is used as a falling-edge interrupt to the microprocessor.
Analog 5 V
0.1 µF
AGND
10 µF
Ext Ref Input
0.1 µF
Analog Input
Ext Bias Voltage
BIAS
Micro
Controller
1 µF
Digital 3 V
AGND
GPIO
CS
BYTE
BUS18/16
CONVST
RD
AD8383
0.1 µF
GPIO
GPIO
GPIO
BDGND
+VBD
BDGND
RD
AD[7:0]
DB[17:10]
Data Bus D[17:0]
Figure 37. ADS8383 Application Circuitry
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
PRINCIPLES OF OPERATION
The ADS8383 is a high-speed successive approximation register (SAR) analog-to-digital converter (ADC). The
architecture is based on charge redistribution which inherently includes a sample/hold function. See Figure 37 for
the application circuit for the ADS8383.
The conversion clock is generated internally. The conversion time of 1.6 µs is capable of sustaining a 500-kHz
throughput.
The analog input is provided to two input pins: +IN and –IN. When a conversion is initiated, the differential input on
these pins is sampled on the internal capacitor array. While a conversion is in progress, both inputs are disconnected
from any internal function.
REFERENCE
The ADS8383 can operate with an external 4.096-V reference for a corresponding full-scale range of 4.096 V.
BIASING THE ADS8383
The ADS8383 requires an external 2.048-V bandgap reference to generate the bias currents for internal circuitry.
Figure 38 shows the internal circuitry used to generate the bias currents. The bias generation circuit also pumps
100 µA (150 µA max) out from the BIAS pin. The bandgap used should be capable of sinking 100 µA (150 µA max)
while holding the voltage on the pin steady. Table 1 shows the specification of the bandgap used to drive the BIAS
pin of the ADS8383.
5 V
+V
A
ADS8383
100 µA
BIAS_INT
BIAS
AGND
Figure 38. Bias Current Generation
Table 1. Bias Specifications
PARAMETER
MIN
TYP
2.048
100
MAX
2.1
UNITS
Output Voltage
2
V
I
150
µA
sink
Any common bandgap like REF3020 can be used to drive the BIAS pin of the ADS8383. Figure 39 shows how
REF3020 can be used with the ADS8383. A 1 µF decoupling capacitor is recommended between pins 2 and AGND
of the ADS8383 for optimal performance.
5 V
1
2
50 Ω
REF3020
3
2
0.47 µF
ADS8383
22 µF
AGND
AGND
Figure 39. Using the REF3020 to Drive the ADS8383 BIAS Pin
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
ANALOG INPUT
When the converter enters the hold mode, the voltage difference between the +IN and –IN inputs is captured on the
internal capacitor array. The voltage on the –IN input is limited between –0.2 V and 0.2 V, allowing the input to reject
small signals which are common to both the +IN and –IN inputs. The +IN input has a range of –0.2 V to V + 0.2 V.
ref
The input span (+IN – (–IN)) is limited to 0 V to V
.
ref
The input current on the analog inputs depends upon a number of factors: sample rate, input voltage, and source
impedance. Essentially, the current into the ADS8383 charges the internal capacitor array during the sample period.
After this capacitance has been fully charged, there is no further input current. The source of the analog input voltage
must be able to charge the input capacitance (45 pF) to an 18-bit settling level within the acquisition time (400 ns)
of the device. When the converter goes into the hold mode, the input impedance is greater than 1 GΩ.
Care must be taken regarding the absolute analog input voltage. To maintain the linearity of the converter, the +IN
and –IN inputs and the span (+IN – (–IN)) should be within the limits specified. Outside of these ranges, the
converter’s linearity may not meet specifications. To minimize noise, low bandwidth input signals with low-pass filters
should be used.
Care should be taken to ensure that the output impedance of the sources driving the +IN and –IN inputs are matched.
If this is not observed, the two inputs could have different setting times. This may result in offset error, gain error, and
linearity error which changes with temperature and input voltage.
DIGITAL INTERFACE
Timing And Control
Seethetimingdiagramsinthespecificationssectionfordetailedinformationontimingsignalsandtheirrequirements.
The ADS8383 uses an internal oscillator generated clock which controls the conversion rate and in turn the
throughput of the converter. No external clock input is required.
Conversions are initiated by bringing the CONVST pin low for a minimum of 20 ns (after the 20 ns minimum
requirement has been met, the CONVST pin can be brought high), while CS is low. The ADS8383 switches from the
sample to the hold mode on the falling edge of the CONVST command. A clean and low jitter falling edge of this signal
is important to the performance of the converter. The BUSY output is brought high immediately following CONVST
going low. BUSY stays high through the conversion process and returns low when the conversion has ended.
Sampling starts with the falling edge of the BUSY signal when CS is tied low or starts with the falling edge of CS when
BUSY is low.
Both RD and CS can be high during and before a conversion with one exception (CS must be low when CONVST
goes low to initiate a conversion). Both the RD and CS pins are brought low in order to enable the parallel output bus
with the conversion.
Reading Data
The ADS8383outputsfullparalleldatainstraightbinaryformatasshowninTable 2. The parallel output is activewhen
CS and RD are both low. There is a minimal quiet zone requirement around the falling edge of CONVST. This is 125
ns prior to the falling edge of CONVST and 40 ns after the falling edge. No data read should be attempted within this
zone. Any other combination of CS and RD sets the parallel output to 3-state. BYTE and BUS18/16 are used for
multiword read operations. BYTE is used whenever lower bits on the bus are output on the higher byte of the bus.
BUS18/16 is used whenever the last two bits on the 18-bit bus is output on either bytes of the higher 16-bit bus. Refer
to Table 2 for ideal output codes.
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SLAS005B– DECEMBER 2002 – REVISED MAY 2003
Table 2. Ideal Input Voltages and Output Codes
DESCRIPTION
FULL SCALE RANGE
Least significant bit (LSB)
Full scale
ANALOG VALUE
DIGITAL OUTPUT STRAIGHT BINARY
V
ref
V
/262144
– 1 LSB
/2
BINARY CODE
HEX CODE
3FFFF
ref
V
11 1111 1111 1111 1111
10 0000 0000 0000 0000
01 1111 1111 1111 1111
00 0000 0000 0000 0000
ref
Midscale
V
20000
ref
Midscale – 1 LSB
Zero
V
/2 – 1 LSB
ref
0 V
1FFFF
00000
The output data is a full 18-bit word (D17–D0) on DB17–DB0 pins (MSB–LSB) if both BUS18/16 and BYTE are low.
The result may also be read on a 16-bit bus by using only pins DB17–DB2. In this case two reads are necessary:
the first as before, leaving both BUS18/16 and BYTE low and reading the 16 most significant bits (D17–D2) on pins
DB17–DB2, then bringing BUS18/16 high while holding BYTE low. When BUS18/16 is high, the lower two bits
(D1–D0) appear on pins DB3–DB2.
The result may also be read on an 8-bit bus for convenience. This is done by using only pins DB17–DB10. In this
case three reads are necessary: the first as before, leaving both BUS18/16 and BYTE low and reading the 8 most
significant bits on pins DB17–DB10, then bringing BYTE high while holding BUS18/16 low. When BYTE is high, the
medium bits (D9–D2) appear on pins DB17–DB10. The last read is done by bringing BUS18/16 high while holding
BYTE high. When BUS18/16 is high, the lower two bits (D1–D0) appear on pins DB11–DB10. The last read cycle
is not necessary if only the first 16 most significant bits are of interest.
All of these multiword read operations can be performed with multiple active RD (toggling) or with RD held low for
simplicity. This is referred to as the AUTO READ operation. Note that RD may not be tied to BDGND permanently
due to the requirement of power-on initialization.
Table 3. Conversion Data Read Out
DATA READ OUT
BYTE
BUS18/16
High
DB17–DB12 DB11–DB10
DB9–DB4
All One’s
All One’s
All One’s
D9–D4
DB3–DB2
All One’s
D1–D0
DB1–DB0
All One’s
All One’s
All One’s
D1–D0
High
Low
High
Low
All One’s
All One’s
D9–D4
D1–D0
High
Low
Low
All One’s
D3–D2
All One’s
D3–D2
D17–D12
D11–D10
POWER-ON INITIALIZATION
At first power on there are three read cycles required (RD must be toggled three times). If conversion cycle is
attempted before these intialization read cycles, the first three conversion cycles will not produce valid results. This
is used to load factory trimming data for a specific device to assure high accuracy of the converter. Because of this
requirement, the RD pin cannot be tied permanently to BDGND. System designers can still achieve the AUTO READ
function if the power-on requirement is satisfied.
LAYOUT
For optimum performance, care should be taken with the physical layout of the ADS8383 circuitry.
As the ADS8383 offers single-supply operation, it will often be used in close proximity with digital logic,
microcontrollers, microprocessors, and digital signal processors. The more digital logic present in the design and the
higher the switching speed, the more difficult it is to achieve good performance from the converter.
The basic SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground
connections and digital inputs that occur just prior to latching the output of the analog comparator. Thus, driving any
single conversion for an n-bit SAR converter, there are at least n windows in which large external transient voltages
can affect the conversion result. Such glitches might originate from switching power supplies, nearby digital logic,
or high power devices.
The degree of error in the digital output depends on the reference voltage, layout, and the exact timing of the external
event.
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SLAS005B – DECEMBER 2002 – REVISED MAY 2003
On average, the ADS8383 draws very little current from an external reference as the reference voltage is internally
buffered. If the reference voltage is external and originates from an op amp, make sure that it can drive the bypass
capacitor or capacitors without oscillation. A 0.1-µF bypass capacitor is recommended from pin 1 (REFIN) directly
to pin 48 (REFM). REFM and AGND should be shorted on the same ground plane under the device.
The AGND and BDGND pins should be connected to a clean ground point. In all cases, this should be the analog
ground. Avoid connections which are too close to the grounding point of a microcontroller or digital signal processor.
If required, run a ground trace directly from the converter to the power supply entry point. The ideal layout consists
of an analog ground plane dedicated to the converter and associated analog circuitry.
As with the AGND connections, +VA should be connected to a 5-V power supply plane or trace that is separate from
the connection for digital logic until they are connected at the power entry point. Power to the ADS8383 should be
clean and well bypassed. A 0.1-µF ceramic bypass capacitor should be placed as close to the device as possible.
See Table 4 for the placement of the capacitor. In addition, a 1-µF to 10-µF capacitor is recommended. In some
situations, additional bypassing may be required, such as a 100-µF electrolytic capacitor or even a Pi filter made up
of inductors and capacitors—all designed to essentially low-pass filter the 5-V supply, removing the high frequency
noise.
Table 4. Power Supply Decoupling Capacitor Placement
POWER SUPPLY PLANE
CONVERTER ANALOG SIDE
CONVERTER DIGITAL SIDE
SUPPLY PINS
Pin pairs that require shortest path to decoupling capacitors
Pins that require no decoupling
(4,5), (8,9), (10,11), (13,15),
(43,44),(45,46)
(24,25)
37
12, 14
28
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