AFE7422 [TI]
具有旁路模式 14 位 9GSPS DAC 和 3GSPS ADC 的双通道射频采样 AFE;
| 型号： | AFE7422 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有旁路模式 14 位 9GSPS DAC 和 3GSPS ADC 的双通道射频采样 AFE 射频 |
| 文件： | 总13页 (文件大小：786K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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AFE7422
ZHCSIY6A –OCTOBER 2018–REVISED JANUARY 2019
具有 14 位、9GSPS DAC 和 14 位、3GSPS ADC 的AFE7422 双通道射频
采样 AFE
1 特性
3 说明
1
•
两通道、14 位 9GSPS DAC
AFE7422 是具有 14 位 9GSPS DAC 和 14 位 3GSPS
ADC 的双路通道宽频带射频采样模拟前端 (AFE)。可
在高达 6GHz 的射频下工作，此器件支持直接射频采
样到 C 频带，无需其他频率转换阶段。密度和灵活性
的改进实现了对高通道数、多任务系统的支持。
–
–
信号带宽高达 1200MHz
每通道 1个 DSA 调节输出功率
•
两通道、14 位 3GSPS ADC
–
–
–
信号带宽高达 1500MHz
NSD：–151dBFS/Hz
DAC 信号路径支持插值和数字上变频选项，提供高达
1200MHz 信号带宽。差动输出路径包括支持输出功率
调优的数字步进衰减器 (DSA)。
fIN = 2.6GHz、–3dBFS 时的交流性能
–
–
–
SNR：55dBFS
SFDR：73dBc HD2 和 HD3
SFDR：91dBc（最严重毛刺）
每个 ADC 输入路径包括一个双通道 DSA 和射频数字
功率检测器。灵活的抽取选项提供数据带宽优化，并且
抽取旁路模式也可用于最大信号带宽。
–
–
每通道 2 个 DSA 扩展动态范围
射频和数字功率检测器
8 通道 (8 TX + 8 RX) 子类 1 兼容性 JESD204B 接口
运行速度高达 15Gbps。可旁路片上 PLL 通过可选时
钟输出简化时钟运行。
•
•
•
射频频率范围：10MHz 至 6GHz
快速跳频 < 1µs
接收数字信号路径：
–
–
–
每个 ADC 连接可旁路的四通道 DDC
每个 DDC 有 3 个相位同调 32 位 NCO
抽取率：2 倍至 32 倍
器件信息(1)
器件型号
AFE7422
封装
封装尺寸（标称值）
FCBGA (400)
17.00mm x 17.00mm
•
发送数字信号路径：
(1) 如需了解所有可用封装，请参阅数据表末尾的封装选项附录。
–
–
–
–
每个带有 32 位 NCO 的 DAC 连接四通道 DUC
插值率：6 倍至 36 倍
功能框图
1.8 V
1.5 V
1.15 V
1 V
œ1.8 V
1.85 V
Sin(x)/x 校正和可配置延迟
功率放大器保护 (PAP)
RXBDSA1P
Quad
RXBDSA1M
RXBDSA2P
DDC
with
Bypass
•
•
JESD204B 接口：
STX1P
STX1M
ADC
–
–
8 个高达 15Gbps 的收发器
子类 1 多芯片同步
RXBDSA2M
STX2P
STX2M
PWR DET
RXDDSA1P
Quad
DDC
with
STX8P
STX8M
RXDDSA1M
RXDDSA2P
时钟：
ADC
Bypass
RXDDSA2M
–
–
具有旁路选项的内部 PLL 和 VCO
利用时钟分频器产生最高为 3GHz 的时钟输出
SYNC
CLKP
CLKM
CLKOUTP
CLKOUTM
/2, /3, /4
PLL
SYSREFP
SYSREFM
•
•
•
DAC 功耗：9GSPS 时为 1.8W/ch
TXAP
TXAM
ADC 功耗：3GSPS 时为 1.9W/ch
sin(x)
x
Quad
DUC
DAC
DSA
DAC
Delay
SRX1P
SRX1M
封装：17mm x 17mm FC BGA，0.8mm 间距
SRX2P
SRX2M
PA Protect
2 应用
SRX8P
SRX8M
TXCP
TXCM
sin(x)
x
Quad
DUC
Delay
•
•
•
•
相控阵雷达
CTRL IO
CTRL IO
GPIO
GPIO
SPI
SPI
JTAG
JTAG
信号情报和电子情报
通信设备和测试仪
宽带数字转换器和波形发生器
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLASES9
AFE7422
ZHCSIY6A –OCTOBER 2018–REVISED JANUARY 2019
www.ti.com.cn
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Original (October 2018) to Revision A
Page
•
已更改 将状态从预告信息改为了生产数据 ............................................................................................................................. 1
2
版权 © 2018–2019, Texas Instruments Incorporated
AFE7422
www.ti.com.cn
ZHCSIY6A –OCTOBER 2018–REVISED JANUARY 2019
5 器件和文档支持
5.1 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
5.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
5.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
6 "机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2018–2019, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE7422IABJ
AFE7422IALK
ACTIVE
ACTIVE
FCBGA
FCBGA
ABJ
ALK
400
400
90
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-220C-168 HR
-40 to 85
-40 to 85
AFE7422I
AFE7422IZ
Non-RoHS
& Green
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AFE7422IABJ
AFE7422IALK
ABJ
ALK
FCBGA
FCBGA
400
400
90
90
6 x 16
6 x 16
150
150
315 135.9 7620 19.5
315 135.9 7620 19.5
21
21
19.2
19.2
Pack Materials-Page 1
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/C 03/2022
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/C 03/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
PACKAGE OUTLINE
ALK0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4225930/B 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
5. Pb-Free die bump and SnPb solder ball.
www.ti.com
EXAMPLE BOARD LAYOUT
ALK0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4225930/B 03/2022
NOTES: (continued)
6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ALK0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4225930/B 03/2022
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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