AFE7769 [TI]
具有双反馈路径和四个 PLL 的四通道射频收发器;型号: | AFE7769 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有双反馈路径和四个 PLL 的四通道射频收发器 射频 |
文件: | 总10页 (文件大小:588K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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AFE7769
ZHCSK41 –AUGUST 2019
具有反馈路径的 AFE7769 四通道射频收发器
1 特性
3 说明
1
•
•
•
基于直接上变频架构的四路发送器:
每个链的射频传输带宽高达 600MHz
基于 0-IF 下变频架构的四路接收器:
每个链的射频接收带宽高达 200MHz
基于射频采样 ADC 的反馈链:
射频接收带宽高达 600MHz
AFE7769 器件是一款高性能的多通道收发器,集成了
四条直接上变频发送器链、四条直接下变频接收器链和
两条宽带射频采样数字化辅助链(反馈路径)。发送器
链和接收器链的高动态范围可使无线基站生成和接收
2G、3G、4G 和 5G 信号。
–
–
–
AFE7769 的低功率耗散和大规模通道集成特性能克服
4G 和 5G 大规模 MIMO 基站的功率和尺寸限制。宽带
和高动态范围反馈路径可以帮助发送器链中的功率放大
器进行数字预失真 (DPD)。串行器/解串器的高速度有
助于减少传入和传出数据时所需的通道数。
•
•
•
•
射频频率范围:600MHz 至 6GHz
用于 TX 和 RX LO 的四路宽带分数 N PLL 和 VCO
专门用于生成数据转换器时钟的整数 N PLL、VCO
JESD204B 和 JESD204C 串行器/解串器接口支
持:
器件信息(1)
–
–
–
–
8 个高达 29.5Gbps 的串行器/解串器收发器
8b/10b 和 64b/66b 编码
器件型号
AFE7769
封装
封装尺寸(标称值)
FCBGA (400)
17.00mm × 17.00mm
16 位、12 位、24 位和 32 位格式
子类 1 多器件同步
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
•
封装:17mm × 17mm FCBGA,间距 0.8mm
AFE7769 方框图
2 应用
•
•
•
•
•
宏远程无线电单元 (RRU)
RF PLL 3
LO
Dist
小型蜂窝基站
VDD1p2TX
PLL-VCO
VSSTX
有源天线系统 mMIMO (AAS)
分布式天线系统 (DAS)
中继器
TX Chain 1
1SRX
1STX
DAC
1TX+/-
2SRX
2STX
VDD1p8TX
VSSTX
TX Chain 2
DAC
2TX+/-
3SRX
3STX
SYSREF
TX DIG
TX DIG
From
SPI
4SRX
REFCLK_+/
-
4STX
VDD1p8PLL
VSSPLL
Common Dig
Syncbin/out
5SRX
5STX
TX Chain 4
TX DIG
TX DIG
DAC
3TX+/-
6SRX
6STX
From
SPI
TX Chain 3
VDD1p8TX
VSSTX
DAC
7SRX
7STX
4TX+/-
VDD1p2TX
VSSTX
From SPI
8SRX
8STX
MCU
GPIO
GPIOs
RF PLL 4
Config
LO
Dist
PLL-VCO
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SBASA09
AFE7769
ZHCSK41 –AUGUST 2019
www.ti.com.cn
目录
6.1 接收文档更新通知 ..................................................... 4
6.2 社区资源.................................................................... 4
6.3 商标........................................................................... 4
6.4 静电放电警告............................................................. 4
6.5 Glossary.................................................................... 4
机械、封装和可订购信息 ......................................... 4
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明 (续).............................................................. 3
器件和文档支持........................................................ 4
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
日期
修订版本
说明
8 月2019 年
*
初始发行版。
2
版权 © 2019, Texas Instruments Incorporated
AFE7769
www.ti.com.cn
ZHCSK41 –AUGUST 2019
5 说明 (续)
AFE7769 的每个接收器链都具有一个 28dB 范围的数字步进衰减器 (DSA),后跟一个宽带无源 IQ 解调器和一个基
带放大器,此基带放大器具有集成式可编程抗混叠低通滤波器,用于驱动连续时间 Σ-Δ ADC。RX 链可接收高达
200MHz 的瞬时带宽 (IBW)。每个接收器通道都有两个模拟峰值功耗检测器和多个数字功耗检测器,可在接收器通
道上辅助进行外部或内部自主 AGC,另外还具有一个射频过载检测器,可提供器件可靠性保护。集成式 QMC(正
交不匹配补偿)算法能够持续监控和校正 RX 链 I 和 Q 不平衡不匹配的情况,无需注入任何专用信号或执行离线校
准。
每个发送器链都具有两个 14 位、3Gsps IQ DAC,后跟一个可编程重建和 DAC 镜像抑制滤波器以及一个 IQ 调制
器,用于驱动具有 39dB 范围增益控制功能的宽带射频放大器。TX 链集成了 QMC 和 LO 漏电消除算法,利用反馈
路径来持续跟踪和更正 TX 链 IQ 不匹配和 LO 漏电的情况。
每条反馈路径均基于射频采样架构,并具有一个驱动 14 位 3Gsps 射频 ADC 的输入射频 DSA。直接采样架构提供
了一个固有的宽带接收器链,并简化了 TX 链损失校准。反馈路径集成了两个独立的 NCO,可在两个观察到的射频
输入带之间进行快速切换。
合成器部分集成了四路分数 N 射频 PLL,可产生四个不同的射频 LO,从而可支持最多两个不同的频带。每个频带
可配置为两个发射器、两个接收器和一条反馈路径。
版权 © 2019, Texas Instruments Incorporated
3
AFE7769
ZHCSK41 –AUGUST 2019
www.ti.com.cn
6 器件和文档支持
6.1 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
6.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
6.3 商标
E2E is a trademark of Texas Instruments.
6.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
6.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
4
版权 © 2019, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
12-Mar-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE7769IABJ
ACTIVE
FCBGA
ABJ
400
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
AFE7769
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AFE7769IABJ
ABJ
FCBGA
400
90
6 x 16
150
315 135.9 7620 19.5
21
19.2
Pack Materials-Page 1
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/C 03/2022
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/C 03/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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