AM26C31MFKB中文资料_数据手册_规格书

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

AM26C31M . . . J OR W PACKAGE

AM26C31Q . . . D PACKAGE

AM26C31C . . . D, DB, N, OR NS PACKAGE

AM26C31I . . . D, DB, N, NS, OR PW PACKAGE

(TOP VIEW)

D

Meets or Exceeds the Requirements of

TIA/EIA-422-B and ITU Recommendation

V.11

D

Low Power, I

= 100 µA Typ

CC

Operates From a Single 5-V Supply

High Speed, t = t = 7 ns Typ

1A

1Y

V

CC

15 4A

14 4Y

1

2

3

4

5

6

7

8

16

PLH

PHL

Low Pulse Distortion, t

= 0.5 ns Typ

1Z

sk(p)

13

12

11

10

9

G

4Z

G

High Output Impedance in Power-Off

Conditions

2Z

2Y

3Z

3Y

3A

D

Improved Replacement for AM26LS31

2A

D

Available in Q-Temp Automotive

GND

− High-Reliability Automotive Applications

− Configuration Control/Print Support

− Qualification to Automotive Standards

AM26C31M . . . FK PACKAGE

(TOP VIEW)

description/ordering information

The AM26C31 is a differential line driver with

complementary outputs, designed to meet the

requirements of TIA/EIA-422-B and ITU (formerly

CCITT). The 3-state outputs have high-current

capability for driving balanced lines, such as

twisted-pair or parallel-wire transmission lines,

and they provide the high-impedance state in the

power-off condition. The enable functions are

common to all four drivers and offer the choice of

an active-high (G) or active-low (G) enable input.

BiCMOS circuitry reduces power consumption

without sacrificing speed.

3

2

1 20 19

18

4Y

4Z

NC

G

1Z

G

4

5

6

7

8

17

16

15

14

NC

2Z

2Y

3Z

9 10 11 12 13

NC − No internal connection

The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation

from −40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range of

−40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range of

−55°C to 125°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Copyright  2004, Texas Instruments Incorporated

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1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

description/ordering information (continued)

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

T

A

PDIP (N)

SOIC (D)

Tube of 25

Tube of 40

Reel of 2500

Reel of 2000

Tube of 25

Tube of 40

Reel of 2500

Reel of 2000

Tube of 90

Tube of 40

Reel of 2500

Tube of 25

Tube of 150

Tube of 55

AM26C31CN

AM26C31CD

AM26C31CDR

AM26C31CNSR

AM26C31CDBR

AM26C31IN

AM26C31CN

AM26C31C

0°C to 70°C

SOP (NS)

SSOP (DB)

PDIP (N)

26C31

AM26C31IN

AM26C31ID

SOIC (D)

AM26C31C

AM26C31IDR

AM26C31INSR

AM26C31IDBR

AM26C31IPW

AM26C31QD

AM26C31QDR

AM26C31MJ

AM26C31MW

AM26C31MFK

−40°C to 85°C

SOP (NS)

26C31

26C31I

SSOP (DB)

TSSOP (PW)

−40°C to 125°C

−55°C to 125°C

SOIC (D)

AM26C31QD

CDIP (J)

AM26C31MJ

AM26C31MW

AM26C31MFK

CFP (W)

LCCC (FK)

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

FUNCTION TABLE

(each driver)

ENABLES

OUTPUTS

INPUT

A

G

H

X

L

G

X

L

Y

H

L

Z

L

H

L

H

L

H

L

H

L

H

Z

X

H

Z

H = High level, L = Low level, X = Irrelevant,

Z = High impedance (off)

2

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

logic diagram (positive logic)

4

G

12

2

1Y

1

7

9

1A

2A

3A

3

1Z

6

2Y

5

2Z

10

3Y

11

3Z

14

4Y

15

4A

13

4Z

Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.

schematics of inputs and outputs

EQUIVALENT OF EACH INPUT

TYPICAL OF ALL OUTPUTS

V

CC

V

CC

Output

Input

GND

3

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

CC

Input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V

+ 0.5 V

I

CC

Differential input voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 14 V

ID

Output voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

O

Input or output clamp current, I or I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA

IK

OK

Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mA

O

V

current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA

CC

GND current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −200 mA

Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W

JA

DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W

N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W

NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W

PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W

Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

J

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values, except differential output voltage (V

), are with respect to the network ground terminal.

OD

2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable

JA

J

A

ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.

D

J

A

JA

J

3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions

MIN NOM

MAX

UNIT

V

Supply voltage

4.5

5

7

5.5

CC

Differential input voltage

High-level input voltage

Low-level input voltage

High-level output current

Low-level output current

V

ID

2

V

IH

0.8

−20

20

V

IL

I

mA

OH

OL

AM26C31C

0

−40

−55

70

AM26C31I

AM26C31Q

AM26C31M

85

T

A

Operating free-air temperature

°C

125

4

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted)

AM26C31C

AM26C31I

PARAMETER

TEST CONDITIONS

UNIT

†

MIN TYP

MAX

V

High-level output voltage

I

= −20 mA

2.4

3.4

0.2

3.1

V

OH

O

Low-level output voltage

= 20 mA

= 100 Ω,

0.4

OL

O

|V

|

Differential output voltage magnitude

Change in magnitude of differential output voltage

Common-mode output voltage

R

See Figure 1

2

V

OD

L

‡

∆|V

|

0.4

3

V

OD

V

OC

V

‡

∆|V

Change in magnitude of common-mode output voltage

0.4

V

OC

I

Input current

V = V

I CC

or GND

1

µA

V

= 6 V

100

−100

−150

20

O

I

Driver output current with power off

Driver output short-circuit current

V

= 0

µA

O(off)

OS

CC

V

O

= −0.25 V

I

V

O

V

O

V

O

= 0

−30

mA

= 2.5 V

= 0.5 V

I

High-impedance off-state output current

µA

OZ

−20

100

V = 0 V or 5 V

I

V = 2.4 V

I

Quiescent supply current

Input capacitance

I

O

= 0

CC

or 0.5 V,

1.5

6

3

mA

pF

See Note 4

C

i

†

‡

All typical values are at V

CC

OD

level.

= 5 V and T = 25°C.

A

∆|V

| and ∆|V

| are the changes in magnitude of V

OC OD

and V , respectively, that occur when the input is changed from a high level to a low

OC

NOTE 4: This parameter is measured per input. All other inputs are at 0 or 5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted)

AM26C31C

AM26C31I

PARAMETER

TEST CONDITIONS

UNIT

†

MIN TYP

MAX

12

4

t

Propagation delay time, low- to high-level output

Propagation delay time, high- to low-level output

S1 is open,

See Figure 2

See Figure 3

See Figure 4

3

7

ns

PLH

PHL

sk(p)

S1 is open,

S1 is closed,

Pulse skew time (|t

− t

|)

0.5

5

PLH PHL

, t

Differential output rise and fall times

Output enable time to high level

Output enable time to low level

Output disable time from high level

Output disable time from low level

10

19

16

r(OD) f(OD)

10

7

PZH

PZL

PHZ

7

PLZ

Power dissipation capacitance (each driver)

(see Note 5)

C

S1 is open,

See Figure 2

170

pF

pd

†

All typical values are at V

= 5 V and T = 25°C.

A

CC

2

NOTE 5:

C

is used to estimate the switching losses according to P = C × V

× f, where f is the switching frequency.

pd

D

pd CC

5

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted)

AM26C31Q

AM26C31M

PARAMETER

TEST CONDITIONS

UNIT

†

MIN TYP

MAX

V

High-level output voltage

I

= −20 mA

2.2

3.4

0.2

3.1

V

OH

O

Low-level output voltage

= 20 mA

= 100 Ω,

0.4

OL

O

|V

|

Differential output voltage magnitude

Change in magnitude of differential output voltage

Common-mode output voltage

R

See Figure 1

2

V

OD

L

‡

∆|V

|

0.4

3

V

OD

V

OC

V

‡

∆|V

Change in magnitude of common-mode output voltage

0.4

V

OC

I

Input current

V = V

I CC

or GND

1

µA

V

= 6 V

100

−100

−170

20

O

I

Driver output current with power off

Driver output short-circuit current

V

= 0

µA

O(off)

OS

CC

V

O

= −0.25 V

I

V

O

V

O

V

O

= 0

mA

= 2.5 V

= 0.5 V

I

High-impedance off-state output current

µA

OZ

−20

100

I

O

= 0

V = 0 V or 5 V

I

V = 2.4 V

I

Quiescent supply current

Input capacitance

CC

I

O

= 0

or 0.5 V,

3.2

mA

pF

See Note 4

C

6

i

†

‡

All typical values are at V

CC

= 5 V and T = 25°C.

A

∆|V

| and ∆|V

| are the changes in magnitude of V

and V , respectively, that occur when the input is changed from a high level to a low

OC

OD

level.

OC OD

NOTE 4: This parameter is measured per input. All other inputs are at 0 V or 5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted)

AM26C31Q

AM26C31M

PARAMETER

TEST CONDITIONS

UNIT

†

MIN TYP

MAX

12

4

t

Propagation delay time, low- to high-level output

Propagation delay time, high- to low-level output

S1 is open,

See Figure 2

See Figure 3

See Figure 4

7

ns

PLH

PHL

sk(p)

S1 is open,

S1 is closed,

6.5

0.5

5

Pulse skew time (|t |)

− t

PLH PHL

, t

Differential output rise and fall times

Output enable time to high level

Output enable time to low level

Output disable time from high level

Output disable time from low level

12

19

16

r(OD) f(OD)

10

7

PZH

PZL

PHZ

7

PLZ

Power dissipation capacitance (each driver)

(see Note 5)

C

S1 is open,

See Figure 2

100

pF

pd

†

All typical values are at V

= 5 V and T = 25°C.

A

CC

2

NOTE 5:

C

is used to estimate the switching losses according to P = C × V

× f, where f is the switching frequency.

pd

D

pd CC

6

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

PARAMETER MEASUREMENT INFORMATION

R /2

L

V

OD2

V

OC

R /2

L

Figure 1. Differential and Common-Mode Output Voltages

R /2

L

C2 = 40 pF

C3 = 40 pF

500 Ω

C1 =

1.5 V

Input

S1

40 pF

R /2

L

See Note A

TEST CIRCUIT

3 V

Input A

1.3 V

0 V

(see Note B)

t

PHL

PLH

Output Y

50%

1.3 V

t

sk(p)

Output Z

50%

t

PLH

PHL

NOTES: A. C1, C2, and C3 include probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and t , t ≤ 6 ns.

r f

Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit

7

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SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

PARAMETER MEASUREMENT INFORMATION

R /2

L

C2 = 40 pF

C3 = 40 pF

500 Ω

C1 =

1.5 V

Input

S1

40 pF

R /2

L

See Note A

TEST CIRCUIT

3 V

0 V

Input A

(see Note B)

90%

10%

Differential

Output

10%

t

f(OD)

r(OD)

VOLTAGE WAVEFORMS

NOTES: A. C1, C2, and C3 include probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and t , t ≤ 6 ns.

r f

Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit

8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢄ ꢅꢆ

ꢇ ꢈꢀꢉꢊ ꢈꢋꢌ ꢍ ꢉꢎ ꢏꢏ ꢍꢊ ꢍꢐꢑ ꢎꢀ ꢌ ꢌ ꢎꢐ ꢍ ꢉ ꢊꢎ ꢒ ꢍꢊ

SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

PARAMETER MEASUREMENT INFORMATION

Output

C2 =

40 pF

50 Ω

500 Ω

0 V

3 V

C1 =

40 pF

Input A

1.5 V

S1

C3 =

40 pF

G

Enable Inputs

(see Note B)

Output

G

See Note A

TEST CIRCUIT

Enable G Input

(see Note C)

3 V

1.3 V

Enable G Input

0 V

1.5 V

Output WIth

0 V to A Input

0.8 V

V

OL

+ 0.3 V

V

OL

t

PZL

PLZ

V

OH

Output WIth

3 V to A Input

V

OH

− 0.3 V

2 V

1.5 V

t

PZH

PHZ

VOLTAGE WAVEFORMS

NOTES: A. C1, C2, and C3 includes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, t < 6 ns, and

r

t < 6 ns.

f

C. Each enable is tested separately.

Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit

9

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁ ꢂꢃ ꢄꢅ ꢆ

ꢇꢈ ꢀ ꢉꢊ ꢈ ꢋꢌ ꢍ ꢉꢎ ꢏ ꢏꢍ ꢊꢍ ꢐꢑ ꢎ ꢀꢌ ꢌꢎ ꢐ ꢍ ꢉꢊ ꢎ ꢒꢍ ꢊ

SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS

SUPPLY CURRENT

vs

SWITCHING FREQUENCY

300

250

200

150

100

50

V

T

A

= 5 V

CC

= 25°C

See Figure 2

S1 Open

All Four Channels Switching Simultaneously

N Package

0

5

10

15

20

25

30

35

40

f − Switching Frequency − MHz

Figure 5

10

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

11-Feb-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

LCCC

CDIP

CFP

Drawing

5962-9163901Q2A

5962-9163901QEA

5962-9163901QFA

AM26C31CD

ACTIVE

FK

J

20

16

1

None

POST-PLATE Level-NC-NC-NC

A42 SNPB

Level-NC-NC-NC

W

D

1

SOIC

40

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR

AM26C31CDBLE

AM26C31CDBR

OBSOLETE

ACTIVE

SSOP

DB

16

None

Call TI Call TI

2000

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

AM26C31CDR

AM26C31CN

AM26C31CNSR

AM26C31ID

ACTIVE

SOIC

PDIP

SO

D

N

16

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

NS

D

2000

40

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SOIC

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR

AM26C31IDBLE

AM26C31IDBR

OBSOLETE

ACTIVE

SSOP

DB

16

None

Call TI

2000

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

AM26C31IDR

AM26C31IN

ACTIVE

SOIC

PDIP

SO

D

N

16

Pb-Free

(RoHS)

CU NIPDAU Level-2-250C-1 YEAR

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

AM26C31INSR

AM26C31IPW

NS

PW

2000

90

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

AM26C31MFKB

AM26C31MJB

AM26C31MWB

AM26C31QD

ACTIVE

LCCC

CDIP

CFP

FK

J

20

16

1

None

POST-PLATE Level-NC-NC-NC

A42 SNPB

Level-NC-NC-NC

W

D

1

SOIC

40

2500

CU NIPDAU Level-1-220C-UNLIM

AM26C31QDR

D

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Feb-2005

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A

B

NO. OF

TERMINALS

**

18 17 16 15 14 13 12

MIN

MAX

MIN

MAX

0.342

(8,69)

0.358

(9,09)

0.307

(7,80)

0.358

(9,09)

19

20

11

10

9

20

28

44

52

68

84

0.442

(11,23)

0.458

(11,63)

0.406

(10,31)

0.458

(11,63)

21

B SQ

22

0.640

(16,26)

0.660

(16,76)

0.495

(12,58)

0.560

(14,22)

8

A SQ

23

0.739

(18,78)

0.761

(19,32)

0.495

(12,58)

0.560

(14,22)

7

24

25

6

0.938

(23,83)

0.962

(24,43)

0.850

(21,6)

0.858

(21,8)

5

1.141

(28,99)

1.165

(29,59)

1.047

(26,6)

1.063

(27,0)

26 27 28

1

2

3

4

0.080 (2,03)

0.064 (1,63)

0.020 (0,51)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

0.055 (1,40)

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

4040140/D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

28

M

0,15

15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

1

14

0,25

A

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

14

16

20

24

28

30

38

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process

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Use of such information may require a license from a third party under the patents or other intellectual property

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solutions:

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Amplifiers

amplifier.ti.com

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dsp.ti.com

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Military

www.ti.com/broadband

www.ti.com/digitalcontrol

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Logic

interface.ti.com

logic.ti.com

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power.ti.com

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www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

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Post Office Box 655303 Dallas, Texas 75265

型号	制造商	描述	替代类型	文档
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AM26C31MFKB

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