AM26C31_16 [TI]
AM26C31 Quadruple Differential Line Driver;
| 型号： | AM26C31_16 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AM26C31 Quadruple Differential Line Driver |
| 文件： | 总20页 (文件大小：634K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AM26C31
www.ti.com................................................................................................................................................... SLLS103M–DECEMBER 1990–REVISED JUNE 2008
QUADRUPLE DIFFERENTIAL LINE DRIVER
1
FEATURES
AM26C31M. . .J OR W PACKAGE
•
Meets or Exceeds the Requirements of
TIA/EIA-422-B and ITU Recommendation V.11
AM26C31Q. . .D PACKAGE
AM26C31C. . .D, DB, OR NS PACKAGE
AM26C31I. . .D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
•
•
•
•
•
Low Power, ICC = 100 µA Typ
Operates From a Single 5-V Supply
High Speed, tPLH = tPHL = 7 ns Typ
Low Pulse Distortion, tsk(p) = 0.5 ns Typ
V
CC
1A
1Y
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4A
4Y
4Z
G
1Z
High Output Impedance in Power-Off
Conditions
G
2Z
•
•
Improved Replacement for AM26LS31
Available in Q-Temp Automotive
2Y
3Z
3Y
3A
2A
–
–
–
High-Reliability Automotive Applications
Configuration Control/Print Support
Qualification to Automotive Standards
GND
AM26C31M. . .FK PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
The AM26C31 is a differential line driver with
complementary outputs, designed to meet the
requirements of TIA/EIA-422-B and ITU (formerly
CCITT). The 3-state outputs have high-current
capability for driving balanced lines, such as
twisted-pair or parallel-wire transmission lines, and
they provide the high-impedance state in the
power-off condition. The enable functions are
common to all four drivers and offer the choice of an
active-high (G) or active-low (G) enable input.
BiCMOS circuitry reduces power consumption without
sacrificing speed.
3
2
1
20
19
4
5
6
7
8
18
17
16
15
14
1Z
G
4Y
4Z
NC
NC
2Z
2Y
G
3Z
9
10 11 12 13
NC – No internal connection
The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation
from –40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range of
–40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range of
–55°C to 125°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1990–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
AM26C31
SLLS103M–DECEMBER 1990–REVISED JUNE 2008................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
AM26C31CN
TOP-SIDE MARKING
PDIP (N)
SOIC (D)
Tube of 25
AM26C31CN
Tube of 40
AM26C31CD
AM26C31C
0°C to 70°C
Reel of 2500
Reel of 2000
Reel of 2000
Tube of 25
AM26C31CDR
AM26C31CNSR
AM26C31CDBR
AM26C31IN
SOP (NS)
SSOP (DB)
PDIP (N)
26C31
26C31
AM26C31IN
Tube of 40
AM26C31ID
SOIC (D)
AM26C31I
Reel of 2500
Reel of 2000
Reel of 2000
Tube of 90
AM26C31IDR
–40°C to 85°C
SOP (NS)
AM26C31INSR
AM26C31IDBR
AM26C31IPW
AM26C31QD
26C31I
26C31I
26C31I
SSOP (DB)
TSSOP (PW)
Tube of 40
–40°C to 125°C
–55°C to 125°C
SOIC (D)
AM26C31QD
Reel of 2500
Tube of 25
AM26C31QDR
AM26C31MJ
CDIP (J)
AM26C31MJ
AM26C31MW
AM26C31MFK
CFP (W)
LCCC (FK)
Tube of 150
Tube of 55
AM26C31MW
AM26C31MFK
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE
(Each Driver)(1)
INPUT
A
ENABLES
OUTPUTS
G
H
H
X
X
L
G
X
X
L
Y
H
L
Z
L
H
L
H
L
H
L
H
L
L
H
Z
X
H
Z
(1) H = High level, L = Low level, X = Irrelevant,
Z = High impedance (off)
2
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Copyright © 1990–2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M–DECEMBER 1990–REVISED JUNE 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
4
G
12
G
2
3
1Y
1Z
1
1A
6
5
2Y
2Z
7
2A
3A
4A
10
11
3Y
3Z
9
14
13
4Y
4Z
15
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
SCHEMATICS OF INPUTS AND OUTPUTS
EQUIVALENT OF EACH INPUT
TYPICAL OF ALL OUTPUTS
V
V
CC
CC
Output
Input
GND
GND
Copyright © 1990–2008, Texas Instruments Incorporated
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3
Product Folder Link(s): AM26C31
AM26C31
SLLS103M–DECEMBER 1990–REVISED JUNE 2008................................................................................................................................................... www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–14
MAX UNIT
VCC
VI
Supply voltage range(2)
Input voltage range
7
V
V
V
VCC + 0.5
VID
VO
Differential input voltage range
Output voltage range
14
7
–0.5
IIK
IOK
Input or output clamp current
±20
mA
IO
Output current
VCC current
±150
200
mA
mA
mA
GND current
–200
D package
DB package
N package
NS package
PW package
73
82
θJA
Package thermal impedance(3)(4)
67 °C/W
64
108
TJ
Operating virtual junction temperature
Storage temperature range
150
150
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground terminal.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
5
MAX
UNIT
V
VCC
VID
VIH
VIL
Supply voltage
4.5
5.5
Differential input voltage
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
±7
V
2
V
0.8
–20
20
V
IOH
IOL
µA
mA
AM26C31C
AM26C31I
AM26C31Q
AM26C31M
0
–40
–40
–55
70
85
TA
Operating free-air temperature
°C
125
125
4
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Copyright © 1990–2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M–DECEMBER 1990–REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31C
AM26C31I
MIN TYP(1)
PARAMETER
High-level output voltage
TEST CONDITIONS
IO = –20 mA
UNIT
MAX
VOH
VOL
2.4
2
3.4
0.2
3.1
V
V
Low-level output voltage
IO = 20 mA
RL = 100 Ω,
RL = 100 Ω,
RL = 100 Ω,
0.4
VOD
Δ|VOD
VOC
Δ|VOC
II
Differential output voltage magnitude
Change in magnitude of differential output voltage(2)
Common-mode output voltage
See Figure 1
See Figure 1
See Figure 1
See Figure 1
V
|
|
±0.4
3
V
V
Change in magnitude of common-mode output voltage(2) RL = 100 Ω,
±0.4
±1
V
Input current
VI = VCC or GND
µA
VO = 6 V
100
–100
–150
20
IO(off)
IOS
Driver output current with power off
Driver output short-circuit current
High-impedance off-state output current
VCC = 0
µA
mA
µA
VO = –0.25 V
VO = 0
–30
VO = 2.5 V
VO = 0.5 V
IOZ
–20
100
VI = 0 or 5 V
µA
mA
pF
ICC
Ci
Quiescent supply current
Input capacitance
IO = 0
VI = 2.4 V or 0.5
V(3)
1.5
6
3
(1) All typical values are at VCC = 5 V and TA = 25°C.
(2) Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
(3) This parameter is measured per input. All other inputs are at 0 or 5 V.
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31C
AM26C31I
MIN TYP(1)
PARAMETER
TEST CONDITIONS
UNIT
MAX
12
12
4
tPLH
Propagation delay time, low-to-high-level output
Propagation delay time, high-to-low-level output
Pulse skew time (|tPLH – tPHL|)
3
3
7
7
S1 is open,
See Figure 2
ns
tPHL
tsk(p)
tr(OD), tf(OD)
tPZH
S1 is open,
S1 is open,
See Figure 2
See Figure 3
0.5
5
ns
ns
Differential output rise and fall times
Output enable time to high level
10
19
19
16
16
10
10
7
S1 is closed, See Figure 4
S1 is closed, See Figure 4
ns
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
ns
tPLZ
Output disable time from low level
7
Cpd
Power dissipation capacitance (each driver)(2)
S1 is open,
See Figure 2
170
pF
(1) All typical values are at VCC = 5 V and TA = 25°C.
(2) Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency.
Copyright © 1990–2008, Texas Instruments Incorporated
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Product Folder Link(s): AM26C31
AM26C31
SLLS103M–DECEMBER 1990–REVISED JUNE 2008................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31Q
AM26C31M
MIN TYP(1)
PARAMETER
High-level output voltage
TEST CONDITIONS
IO = –20 mA
UNIT
MAX
VOH
VOL
2.2
2
3.4
0.2
3.1
V
V
Low-level output voltage
IO = 20 mA
RL = 100 Ω,
RL = 100 Ω,
RL = 100 Ω,
0.4
VOD
Δ|VOD
VOC
Δ|VOC
II
Differential output voltage magnitude
Change in magnitude of differential output voltage(2)
Common-mode output voltage
See Figure 1
See Figure 1
See Figure 1
See Figure 1
V
|
|
±0.4
3
V
V
Change in magnitude of common-mode output voltage(2) RL = 100 Ω,
±0.4
±1
V
Input current
VI = VCC or GND
µA
VO = 6 V
100
–100
–170
20
IO(off)
IOS
Driver output current with power off
Driver output short-circuit current
High-impedance off-state output current
VCC = 0
µA
mA
µA
VO = –0.25 V
VO = 0
VO = 2.5 V
VO = 0.5 V
IOZ
–20
100
VI = 0 or 5 V
µA
mA
pF
ICC
Ci
Quiescent supply current
Input capacitance
IO = 0
VI = 2.4 V or 0.5
V(3)
3.2
6
(1) All typical values are at VCC = 5 V and TA = 25°C.
(2) Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
(3) This parameter is measured per input. All other inputs are at 0 or 5 V.
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
AM26C31Q
AM26C31M
MIN TYP(1)
PARAMETER
TEST CONDITIONS
UNIT
MAX
12
12
4
tPLH
Propagation delay time, low-to-high-level output
Propagation delay time, high-to-low-level output
Pulse skew time (|tPLH – tPHL|)
7
6.5
0.5
5
S1 is open,
See Figure 2
ns
tPHL
tsk(p)
tr(OD), tf(OD)
tPZH
S1 is open,
S1 is open,
See Figure 2
See Figure 3
ns
ns
Differential output rise and fall times
Output enable time to high level
12
19
19
16
16
10
10
7
S1 is closed, See Figure 4
S1 is closed, See Figure 4
ns
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
ns
tPLZ
Output disable time from low level
7
Cpd
Power dissipation capacitance (each driver)(2)
S1 is open,
See Figure 2
100
pF
(1) All typical values are at VCC = 5 V and TA = 25°C.
(2) Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency.
6
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Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M–DECEMBER 1990–REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION
Figure 1. Differential and Common-Mode Output Voltages
R /2
L
C2 = 40 pF
500 Ω
C1 =
40 pF
1.5 V
Input
S1
R /2
L
C3 = 40 pF
See Note A
TEST CIRCUIT
3 V
Input A
1.3 V
0 V
(see Note B)
t
t
PHL
PLH
OutputY
50%
50%
1.3 V
1.3 V
t
t
sk(p)
sk(p)
Output Z
50%
50%
t
t
PHL
PLH
A. C1, C2, and C3 include probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit
Copyright © 1990–2008, Texas Instruments Incorporated
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Product Folder Link(s): AM26C31
AM26C31
SLLS103M–DECEMBER 1990–REVISED JUNE 2008................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
A. C1, C2, and C3 include probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit
8
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Copyright © 1990–2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M–DECEMBER 1990–REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Output
C2 =
50 Ω
40 pF
500 Ω
0 V
3 V
C1 =
Input A
1.5 V
40 pF
S1
C3 =
50 Ω
40 pF
G
Enable Inputs
(see Note B)
Output
G
See Note A
TEST CIRCUIT
Enable G Input
(see Note C)
3 V
1.3 V1.3 V
Enable G Input
0 V
1.5 V
Output WIth
0.8 V
t
V
+ 0.3 V
OL
0 V to A Input
V
OL
t
PLZ
PZL
V
OH
Output WIth
V
- 0.3 V
2 V
t
OH
3 V to A Input
1.5 V
t
PHZ
PZH
VOLTAGE WAVEFORMS
A. C1, C2, and C3 include probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
C. Each enable is tested separately.
Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit
Copyright © 1990–2008, Texas Instruments Incorporated
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Product Folder Link(s): AM26C31
AM26C31
SLLS103M–DECEMBER 1990–REVISED JUNE 2008................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SWITCHING FREQUENCY
Figure 5.
10
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Copyright © 1990–2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
AM26C31CD
ACTIVE
SOIC
D
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31CDBLE
AM26C31CDBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31CDBRE4
AM26C31CDBRG4
AM26C31CDE4
AM26C31CDG4
AM26C31CDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
D
16
16
16
16
16
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31CDRE4
AM26C31CDRG4
AM26C31CN
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26C31CNE4
AM26C31CNSR
AM26C31CNSRE4
AM26C31CNSRG4
AM26C31ID
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
NS
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31IDBLE
AM26C31IDBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31IDBRE4
AM26C31IDBRG4
AM26C31IDE4
AM26C31IDG4
AM26C31IDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
D
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31IDRE4
AM26C31IDRG4
AM26C31IN
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
CU NIPDAU N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
(RoHS)
AM26C31INE4
AM26C31INSR
AM26C31INSRG4
AM26C31IPW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
N
16
16
16
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31IPWE4
AM26C31IPWG4
AM26C31IPWR
AM26C31IPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31QD
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
40
TBD
CU NIPDAU Level-1-220C-UNLIM
AM26C31QDG4
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C31QDR
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
2500
TBD
CU NIPDAU Level-1-220C-UNLIM
AM26C31QDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
AM26C31CDBR
AM26C31CDR
AM26C31CNSR
AM26C31IDBR
AM26C31IDR
SSOP
SOIC
SO
DB
D
16
16
16
16
16
16
16
2000
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
16.4
16.4
12.4
8.2
6.5
8.2
8.2
6.5
8.2
7.0
6.6
10.3
10.5
6.6
2.5
2.1
2.5
2.5
2.1
2.5
1.6
12.0
8.0
16.0
16.0
16.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
DB
D
12.0
12.0
8.0
SSOP
SOIC
SO
10.3
10.5
5.6
AM26C31INSR
AM26C31IPWR
NS
PW
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Apr-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
AM26C31CDBR
AM26C31CDR
AM26C31CNSR
AM26C31IDBR
AM26C31IDR
SSOP
SOIC
SO
DB
D
16
16
16
16
16
16
16
2000
2500
2000
2000
2500
2000
2000
346.0
333.2
346.0
346.0
333.2
346.0
346.0
346.0
345.9
346.0
346.0
345.9
346.0
346.0
33.0
28.6
33.0
33.0
28.6
33.0
29.0
NS
DB
D
SSOP
SOIC
SO
AM26C31INSR
AM26C31IPWR
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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