AM26LS31MJB [TI]
QUADRUPLE DIFFERENTIAL LINE DRIVER; 四路差动线路驱动器
| 型号： | AM26LS31MJB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE DIFFERENTIAL LINE DRIVER |
| 文件： | 总18页 (文件大小：559K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
FEATURES
D, DB, N, NS, J, OR W PACKAGE
(TOP VIEW)
•
Meets or Exceeds the Requirements of ANSI
TIA/EIA-422-B and ITU
1A
1Y
1Z
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
•
•
•
•
Operates From a Single 5-V Supply
TTL Compatible
4A
4Y
4Z
G
Complementary Outputs
G
2Z
High Output Impedance in Power-Off
Conditions
2Y
3Z
3Y
3A
•
Complementary Output-Enable Inputs
2A
GND
DESCRIPTION/ORDERING INFORMATION
The AM26LS31 is a quadruple complementary-output
line driver designed to meet the requirements of ANSI
FK PACKAGE
(TOP VIEW)
TIA/EIA-422-B
and
ITU
(formerly
CCITT)
Recommendation V.11. The 3-state outputs have
high-current capability for driving balanced lines such
as twisted-pair or parallel-wire transmission lines, and
they are in the high-impedance state in the power-off
condition. The enable function is common to all four
drivers and offers the choice of an active-high or
active-low enable (G, G) input. Low-power Schottky
circuitry reduces power consumption without
sacrificing speed.
3
4
2
1
20 19
1Z
G
4Y
4Z
NC
G
18
5
6
7
17
16
15
14
NC
2Z
2Y
3Z
8
9
10 11 12 13
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
AM26LS31CN
TOP-SIDE MARKING
AM26LS31CN
PDIP – N
SOIC – D
Tube
Tube
AM26LS31CD
AM26LS31C
0°C to 70°C
Tape and reel
AM26LS31CDR
SOP – NS
SSOP – DB
CDIP – J
Tape and reel
Tape and reel
Tube
AM26LS31CNSR
AM26LS31CDBR
AM26LS31MJB
26LS31
SA31C
AM26LS31MJB
AM26LS31MFKB
AM26LS31MWB
–55°C to 125°C
LCCC – FK
CFP – W
Tube
AM26LS31MFKB
AM26LS31MWB
Tube
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1979–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
FUNCTION TABLE(1)
(EACH DRIVER)
ENABLES
OUTPUTS
INPUT
A
G
H
H
X
X
L
G
X
X
L
Y
H
L
Z
L
H
L
H
L
H
L
H
L
L
H
Z
X
H
Z
(1) H = high level, L = low level,
X = irrelevant,
Z = high impedance (off)
LOGIC DIAGRAM (POSITIVE LOGIC)
4
G
G
12
2
1Y
1Z
1
1A
3
6
2Y
2Z
7
2A
5
10
3Y
3Z
9
3A
4A
11
14
4Y
4Z
15
13
2
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AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
SCHEMATIC (EACH DRIVER)
Input A
V
22 kΩ
9 Ω
9 Ω
Output Z
Output Y
Common to All Four Drivers
V
CC
22 kΩ
22 kΩ
V
To Three Other Drivers
Enable G
Enable G
GND
All resistor values are nominal.
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
7
UNIT
VCC
VI
Supply voltage(2)
Input voltage
V
V
V
7
Output off-state voltage
5.5
73
D package
DB package
N package
NS package
82
θJA
Package thermal impedance(3)
°C/W
67
64
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Lead temperature 1,6 mm (1/16 in) from case for 60 s
Storage temperature range
260
300
150
°C
°C
°C
J package
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential output voltage VOD, are with respect to network GND.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
3
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AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
Recommended Operating Conditions
MIN NOM
MAX UNIT
AM26LS31C
AM26LS31M
4.75
4.5
2
5
5
5.25
V
VCC
Supply voltage
5.5
VIH
VIL
IOH
IOL
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
V
0.8
V
–20 mA
20 mA
AM26LS31C
AM26LS31M
0
70
°C
TA
Operating free-air temperature
–55
125
Electrical Characteristics(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Input clamp voltage
TEST CONDITIONS
II = –18 mA
MIN TYP(2)
MAX UNIT
VIK
VCC = MIN,
VCC = MIN,
VCC = MIN,
–1.5
V
V
V
VOH
VOL
High-level output voltage
Low-level output voltage
IOH = –20 mA
IOL = 20 mA
VO = 0.5 V
VO = 2.5 V
VI = 7 V
2.5
0.5
–20
20
Off-state (high-impedance-state)
output current
IOZ
VCC = MIN,
µA
II
Input current at maximum input voltage
High-level input current
VCC = MAX,
VCC = MAX,
VCC = MAX,
VCC = MAX
VCC = MAX,
0.1
mA
µA
IIH
IIL
VI = 2.7 V
VI = 0.4 V
20
Low-level input current
Short-circuit output current(3)
–0.36
–150
80
mA
mA
mA
IOS
ICC
–30
Supply current
All outputs disabled
32
(1) For C-suffix devices, VCC min = 4.75 V and VCC max = 5.25 V. For M-suffix devices, VCC min = 4.5 V and VCC max = 5.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
(3) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second.
Switching Characteristics
VCC = 5 V (see Figure 1)
TA = 25°C
AM26LS31M
PARAMETER
TEST CONDITIONS
UNIT
ns
MIN
TYP
MAX
MIN
MAX
Propagation delay time, low- to
high-level output
tPLH
tPHL
14
14
20
30
CL = 30 pF, S1 and S2 open
Propagation delay time, high- to
low-level output
20
30
tPZH
tPZL
tPHZ
tPLZ
Output enable time to high level
Output enable time to low level
Output disable time from high level
Output disable time from low level
Output-to-output skew
RL = 75 Ω
CL = 30 pF
25
37
21
23
1
40
45
30
35
6
60
68
45
53
9
ns
RL = 180 Ω
CL = 10 pF, S1 and S2 closed
CL = 30 pF, S1 and S2 open
ns
ns
tSKEW
4
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AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
PARAMETER MEASUREMENT INFORMATION
Input A
(see Notes B
and C)
3 V
0 V
1.3 V
1.3 V
Test Point
V
CC
t
t
PHL
PLH
V
OH
180 Ω
1.5 V
Output Y
t
S1
S2
From Output
Under Test
V
OL
Skew
Skew
t
75 Ω
C
L
PHL
PLH
(see Note A)
V
V
OH
1.5 V
Output Z
OL
PROPAGATION DELAY TIMES AND SKEW
Enable G
TEST CIRCUIT
3 V
0 V
(see Note D)
Enable G
1.5 V
1.5 V
See Note D
t
t
PLZ
PZL
S1 Closed
S2 Closed
≈4.5 V
Waveform 1
(see Note E)
S1 Closed
S2 Open
≈1.5 V
1.5 V
V
OL
0.5 V
0.5 V
t
t
PHZ
PZH
V
OH
S1 Open
S2 Closed
Waveform 2
(see Note E)
≈1.5 V
1.5 V
≈0 V
S1 Closed
S2 Closed
ENABLE AND DISABLE TIME WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z ≈ 50 Ω, t ≤ 15 ns, t ≤ 6 ns.
O
r
f
C. When measuring propagation delay times and skew, switches S1 and S2 are open.
D. Each enable is tested separately.
E. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
Figure 1. Test Circuit and Voltage Waveforms
5
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AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
ENABLE G INPUT VOLTAGE
4
3
4
3
Load = 470 Ω to GND
= 25°C
See Note A
V
CC
= 5 V
V
V
= 5.25 V
= 5 V
CC
T
A
= 70°C
T
A
Load = 470 Ω to GND
See Note A
CC
T
= 0°C
A
V
CC
= 4.75 V
T
A
= 25°C
2
1
0
2
1
0
0
1
2
3
0
1
2
3
V − Enable G Input Voltage − V
I
V − Enable G Input Voltage − V
I
Figure 2.
Figure 3.
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
ENABLE G INPUT VOLTAGE
6
5
4
3
2
6
5
4
3
2
V
V
= 5.25 V
CC
= 5 V
CC
CC
V
= 4.75 V
T
A
= 70°C
T
= 25°C
A
T
A
= 0°C
1
0
1
0
Load = 470 Ω to V
V
= 5 V
CC
CC
T
A
= 25°C
Load = 470 Ω to V
See Note B
CC
See Note B
0
1
2
3
0
1
2
3
V − Enable G Input Voltage − V
I
V − Enable G Input Voltage − V
I
Figure 4.
Figure 5.
A. The A input is connected to VCC during testing of the Y outputs and to ground during testing of the Z outputs.
B. The A input is connected to ground during testing of the Y outputs and to VCC during testing of the Z outputs.
6
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AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
HIGH-LEVEL OUTPUT CURRENT
5
4
3
2
1
0
V
= 5 V
CC
V
CC
= 5.25 V
See Note A
V
CC
= 5 V
4
3
2
1
0
I
= −20 mA
= −40 mA
OH
V
CC
= 4.75 V
I
OH
T
A
= 25°C
See Note A
0
25
50
75
−40
−60
−80
−100
0
−20
T
A
− Free-Air Temperature − °C
I
− High-Level Output Current − mA
OH
Figure 6.
Figure 7.
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
LOW-LEVEL OUTPUT CURRENT
0.5
0.4
0.3
0.2
0.1
0
1
V
= 5 V
= 40 mA
CC
T
= 25°C
A
I
OL
0.9
0.8
0.7
0.6
0.5
See Note B
See Note B
V
CC
= 4.75 V
0.4
0.3
0.2
V
CC
= 5.25 V
0.1
0
0
25
50
75
0
20
40
60
80
100
120
T
A
− Free-Air Temperature − °C
I
− Low-Level Output Current − mA
OL
Figure 8.
Figure 9.
A. The A input is connected to VCC during testing of the Y outputs and to ground during testing of the Z outputs.
B. The A input is connected to ground during testing of the Y outputs and to VCC during testing of the Z outputs.
7
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AM26LS31C, AM26LS31M
QUADRUPLE DIFFERENTIAL LINE DRIVER
www.ti.com
SLLS114I–JANUARY 1979–REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
Y OUTPUT VOLTAGE
vs
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE
DATA INPUT VOLTAGE
5
4
3
2
1
0
5
4
3
2
1
0
No Load
= 25°C
No Load
T
A
V
= 5.25 V
= 5 V
CC
T
= 70°C
A
V
CC
V
CC
= 4.75 V
T
= 0°C
A
T
= 25°C
A
0
1
2
3
0
1
2
3
V − Data Input Voltage − V
I
V − Data Input Voltage − V
I
Figure 10.
Figure 11.
8
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PACKAGE OPTION ADDENDUM
www.ti.com
7-Aug-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-7802301M2A
5962-7802301MEA
5962-7802301MFA
AM26LS31CD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
20
16
16
16
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
W
D
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26LS31CDBR
AM26LS31CDBRE4
AM26LS31CDE4
AM26LS31CDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
D
16
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26LS31CDRE4
AM26LS31CN
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS31CNE4
AM26LS31CNSR
AM26LS31CNSRG4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26LS31MFKB
AM26LS31MJB
AM26LS31MWB
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
16
16
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-Aug-2006
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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