AMC60804 [TI]
具有 4 通道电流和电压输出 DAC 和多通道 ADC 的真正 EML 监视器和控制器;
| 型号： | AMC60804 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 4 通道电流和电压输出 DAC 和多通道 ADC 的真正 EML 监视器和控制器 控制器 监视器 |
| 文件： | 总7页 (文件大小：946K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AMC60804
SLASEZ2 – FEBRUARY 2021
AMC60804 4-Channel, EML Monitor and Controller
With Current and Voltage Output DACs and Multichannel ADC
1 Features
3 Description
•
Four 12-bit current output DACs (IDACs)
The AMC60804 is a highly integrated, low-power
analog monitor and controller optimized for electro-
absorption modulated lasers (EML).
– 150-mA full-scale output range
Four 12-bit voltage output DACs (VDACs)
– Selectable full-scale output ranges:
–5 V, –2.5 V, +2.5 V and +5 V
– High-current drive capability: ±50 mA
Twelve channel, 12-bit, 1-MSPS SAR ADC
– Four external inputs: 2.5-V and 5-V input
ranges
– Four IDAC voltage monitor channels
– Four VDAC current monitor channels
– Programmable sequencer
– Programmable out-of-range alarms
Internal 2.5-V reference
•
The AMC60804 includes four 12-bit current output
digital-to-analog converters (IDACs) and four 12-bit
voltage output DACs (VDACs) with programmable
output ranges. The AMC60804 also includes a 12-bit,
1-MSPS analog-to-digital converter (ADC) used for
external signal and internal signal monitoring, supply
and temperature alarm monitors, and a high-precision
internal reference.
•
The AMC60804 VDACs support both positive and
negative output range operation and are capable or
sourcing and sinking up to 50 mA, making them an
excellent choice for biasing the electro-absorption
modulator (EAM) in an EML. Additionally, the
AMC60804 IDACs support a full-scale output range of
150 mA with very low power dissipation, thus
eliminating the need for external components to bias
the EML laser diode. In combination the AMC60804
four VDACs and four IDACs enable accurate biasing
of up to four EML lasers.
•
•
•
Suppy and temperature fault alarms
SPI and I2C interfaces: 1.7-V to 3.6-V operation
– SPI: 4-wire interface
– I2C: Four slave addresses
Specified temperature range: –40°C to +125°C
•
2 Applications
•
•
Optical module
Intra-dc interconnect (metro)
The AMC60804 includes four input pins that are
multiplexed to the ADC and incorporate a low-latency
window comparator, making this device an excellent
choice for received signal strength indicator (RSSI)
and loss-of-signal (LOS) detection. The ADC is also
capable of measuring the voltage at the IDAC pins, as
well as the current being sourced or sinked by the
VDACs, thus enabling monitoring of these outputs.
AMC60804
Supply and Temperature Monitors
IDAC Channels 1 - 4
IDAC
IDAC1
IDAC2
IDAC3
IDAC4
I2C / SPI
Serial Interface
Voltage
Monitors
x4
The AMC60804 low power, high integration, very
small size, and wide operating temperature range
make the device an excellent choice as an all-in-one,
low-cost control circuit for the EML lasers found in
optical modules. Contact TI sales for the full data
sheet.
VDAC Channels 1 - 4
VDAC
VDAC1
VDAC2
VDAC3
VDAC4
Interrupt Control
and
Alarm Detector
Current
Monitors
x4
ADC1
ADC2
ADC3
ADC4
ADC
MUX
Device Information
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
Reference
2.5 V
AMC60804
DSBGA (36)
2.56 mm × 2.56 mm
(1) For all available packages, see the package option
addendum at the end of the data sheet.
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AMC60804
SLASEZ2 – FEBRUARY 2021
www.ti.com
4 Device and Documentation Support
4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
4.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include packaging, and orderable information. This information is the most current data
available for the designated devices. This data is subject to change without notice and revision of this document.
For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
2
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Product Folder Links: AMC60804
PACKAGE OPTION ADDENDUM
www.ti.com
7-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AMC60804YBHR
AMC60804YBHT
ACTIVE
ACTIVE
DSBGA
DSBGA
YBH
YBH
36
36
3000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 105
-40 to 105
AMC60804
AMC60804
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-Feb-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Feb-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AMC60804YBHR
AMC60804YBHT
DSBGA
DSBGA
YBH
YBH
36
36
3000
250
180.0
180.0
8.4
8.4
2.71
2.71
2.71
2.71
0.6
0.6
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Feb-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
AMC60804YBHR
AMC60804YBHT
DSBGA
DSBGA
YBH
YBH
36
36
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
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