AMC7924PAPT [TI]

具有多通道 ADC、双极 DAC 和温度传感器的 24 通道 12 位模拟监控器和控制器 | PAP | 64 | -40 to 125;


型号：	AMC7924PAPT
厂家：	TEXAS INSTRUMENTS
描述：	具有多通道 ADC、双极 DAC 和温度传感器的 24 通道 12 位模拟监控器和控制器 \| PAP \| 64 \| -40 to 125 控制器温度传感监控传感器温度传感器
文件：	总9页 (文件大小：1542K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AMC7924

ZHCSP47 –NOVEMBER 2021

具有多通道ADC、双极DAC、温度传感器和GPIO 端口的AMC7924 24 通道12

位模拟监控器和控制器

1 特性

3 说明

• 24 个单调性12 位DAC

AMC7924 是一款高度集成的模拟监控器和控制器件，

专为高密度通用监控器和控制系统而设计。AMC7924

包含 24 个 12 位数模转换器 (DAC)，其输出范围可通

过编程实现。器件还包含带有可编程阈值检测器、温度

传感器和内部基准的多路复用 12 位模数转换器

(ADC)。AMC7924 的高集成度可显著减少组件数量并

简化闭环系统设计，从而使该器件成为布板空间至关重

要的高密度应用的理想选择。

– 可编程范围：–10V 至0V、

–5V 至0V、0V 至5V 和0V 至10V

– 高电流驱动能力

– 自动范围检测器

• 24 个输入，12 位SAR ADC

– 高采样率：250kSPS

– 输入范围：0V 到5V 和0V 到2.5V

– 可编程超限报警

器件包括 24 个专用 ADC 输入和 6 个灵活输入/输出

(FlexIO) 引脚，可配置为 ADC 的附加模拟输入或

GPIO。与器件之间的通信通过与 SPI 兼容的 4 线接口

实现。

• 6 个FlexIO 引脚；可配置的ADC 和GPIO

• 内置时序控制特性

• 内部2.5V 基准电压

• 内部温度传感器

AMC7924 具有高集成度和宽工作温度范围等优势，因

此非常适合用作多通道射频通信系统中功率放大器

(PA) 的一体化偏置控制电路。凭借灵活的 DAC 输出范

围和内置时序控制特性，该器件可用作面向多种晶体管

技术（例如 LDMOS、GaA 和 GaN）的偏置控制器。

AMC7924 功能集对通用监控器和控制系统而言同样有

益。

– 精度：±2.5°C，最大值

– 分辨率：0.0625°C

• 与SPI 兼容的4 线接口

– 1.65V 至5.5V 工作电压

• 额定温度范围：–40°C 至+125°C

• 工作温度范围：–40°C 至+150°C

2 应用

器件信息

封装⁽¹⁾

封装尺寸（标称值）

器件型号

AMC7924

• 有源天线系统mMIMO (AAS)

• 宏远程无线电单元(RRU)

• 雷达

HTQFP (64)

10.00mm × 10.00mm

(1) 如需了解所有可用封装，请参阅产品说明书末尾的封装选项附

录。

• 数据采集(DAQ)

AMC7924

2.5-V

Reference

DAC-0

DAC-23

GPIO

Control

4-Wire

SPI

ADC

Temperature

Sensor

简化版原理图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLASF16

AMC7924

ZHCSP47 –NOVEMBER 2021

www.ti.com.cn

4 Device and Documentation Support

4.1 Documentation Support

4.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, AMC7924EVM user's guide

• Texas Instruments, Temperature Compensation of Power Amplifier FET Bias Voltages application note

4.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

4.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

4.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

4.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

4.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: AMC7924

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jan-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AMC7924PAPR

AMC7924PAPT

ACTIVE

HTQFP

PAP

1000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-3-260C-168 HR

-40 to 125

AMC7924

NIPDAU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jan-2022

Addendum-Page 2

GENERIC PACKAGE VIEW

PAP 64

10 x 10, 0.5 mm pitch

HTQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226442/A

www.ti.com

PACKAGE OUTLINE

HTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

PAP0064N

10.2

9.8

PIN 1 ID

10.2

9.8

12.2

11.8

0.27

0.17

64X

60X 0.5

0.08

C A

4X 7.5

1.2

SEE DETAIL A

SEATING PLANE

0.08 C

0.09- 0.20

TYP

(0.11) TYP

NOTE 5

0° MIN

0.25

(1)

GAGE PLANE

5.30

4.06

0.15

0.05

0°- 7°

0.75

0.45

(0.11) TYP

NOTE 5

EXPOSED

THERMAL PAD

4225982/B 07/2021

NOTES:

PowerPAD is a trademark of Texas Instruments

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15

per side.

4. Body width does not include interlead flash. Interlead flash shall not exceed 0.50 per side.

5. Strap features may not be present.

6. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

HTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

PAP0064N

(

8) NOTE 9

SYMM

(

5.3)

SOLDER MASK

OPENING

SOLDER MASK

DEFINED PAD

64X (1.5)

64X (0.3)

(0.65)

TYP

SYMM

(11.4)

60X (0.5)

(1.3)

TYP

(Ø 0.2) TYP

VIA

METAL COVERED

BY SOLDER MASK

SEE DETAIL

(0.65) TYP

(1.3) TYP

(11.4)

LAND PATTERN EXAMPLE

0.05 MAX

ALL AROUND

SCALE: 8X

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

4225982/B 07/2021

NOTES: (continued)

7. Publication IPC-7351 may have alternate designs.

8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

9. This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, PowerPAD Thermally Enhanced

Package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

www.ti.com

EXAMPLE STENCIL DESIGN

HTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

PAP0064N

(

5.3)

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

BASED ON

0.1 THICK STENCIL

THICKNESSES

64X (1.5)

64X (0.3)

SYMM

(11.4)

60X (0.5)

METAL COVERED

BY SOLDER MASK

SYMM

(11.4)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED COVERAGE BY AREA

SCALE: 8X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

5.3X5.3 (SHOWN)

4.44 X 4.44

0.1

0.127

0.152

0.178

4.06 X 4.06

3.75 X 3.75

4225982/B 07/2021

NOTES: (continued)

9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

10. Board assembly site may have different recommendations for stencil design.

www.ti.com

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AMC7924PAPT [TI]

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