AWR6843ARBSALPQ1 [TI]

AWR6843AOP Single-Chip 60- to 64-GHz mmWave Sensor Antennas-On-Package (AOP);


型号：	AWR6843ARBSALPQ1
厂家：	TEXAS INSTRUMENTS
描述：	AWR6843AOP Single-Chip 60- to 64-GHz mmWave Sensor Antennas-On-Package (AOP)
文件：	总87页 (文件大小：3329K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AWR6843AOP

SWRS246B – NOVEMBER 2020 – REVISED JUNE 2021

AWR6843AOP Single-Chip 60- to 64-GHz mmWave Sensor

Antennas-On-Package (AOP)

•

Other interfaces available to user application

– Up to 6 ADC channels (low sample rate

monitoring)

1 Features

•

FMCW transceiver

– Integrated 4 receivers and 3 transmitters

Antennas-On-Package (AOP)

– Integrated PLL, transmitter, receiver, Baseband,

and ADC

– Up to 2 SPI ports

– Up to 2 UARTs

– 2 CAN-FD interfaces

– I2C

– 60- to 64-GHz coverage with 4-GHz continuous

bandwidth

– Supports 6-bit phase shifter

– Ultra-accurate chirp engine based on fractional-

N PLL

Built-in calibration and self-test

– Arm^®Cortex^®-R4F-based radio control system

– Built-in firmware (ROM)

– Self-calibrating system across frequency and

temperature

– GPIOs

– 2 lane LVDS interface for raw ADC data and

debug instrumentation

•

Functional Safety-Compliant targeted

– Developed for functional safety applications

– Documentation will be available to aid ISO

26262 functional safety system design

– Hardware integrity up to ASIL-B targeted

– Safety-related certification

•

ISO 26262 certification by TUV Sud planned

– Embedded self-monitoring with no host

processor involvement on Functional Safety-

Compliant targeted devices

C674x DSP for advanced signal processing

(AWR6843 only)

Hardware accelerator for FFT, filtering, and CFAR

processing

Memory compression

Arm® Cortex®-R4F microcontroller for object

detection, and interface control

– Supports autonomous mode (loading user

application from QSPI flash memory)

Internal memory with ECC

– AWR6843:1.75 MB, divided into MSS program

RAM (512 KB), MSS data RAM (192 KB), DSP

L1RAM (64KB) and L2 RAM (256 KB), and L3

radar data cube RAM (768 KB)

•

AEC-Q100 qualified

Power management

– Built-in LDO network for enhanced PSRR

– I/Os support dual voltage 3.3 V/1.8 V

Clock source

– 40.0 MHz crystal with internal oscillator

– Supports external oscillator at 40 MHz

– Supports externally driven clock (square/sine)

at 40 MHz

•

Easy hardware design

– 0.8-mm pitch, 180-pin 15 mm × 15 mm flip chip

BGA package (ALP) for easy assembly and

low-cost PCB design

– Small solution size

Supports automotive temperature operating range

•

– AWR6443: 1.4 MB, divided into MSS program

RAM (512 KB), MSS data RAM (192 KB), and

L3 radar data cube RAM (768 KB)

– Technical reference manual includes allowed

size modifications

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

AWR6843AOP

SWRS246B – NOVEMBER 2020 – REVISED JUNE 2021

www.ti.com

•

Seat belt reminder

2 Applications

Driver vital sign monitoring

Kick sensor/access sensor

Gesture recognition

•

Interior Cabin sensing

Child presence detection

Occupancy detection

3 Description

The AWR6843AOP is an Antenna-on-Package (AOP) device that is an evolution within the single-chip radar

device family from Texas Instruments (TI). This device enables unprecedented levels of integration in an

extremely small form factor and is an ideal solution for low power, self-monitored, ultra-accurate radar systems

in the Automtive space.Multiple automotive qualified variants are currently available including Functional Safety-

Compliant targeted devices and non-functional safety devices.

Device Information

PART NUMBER

AWR6843ARBGALPQ1

AWR6843ARBGALPRQ1

AWR6843ARBSALPQ1

AWR6843ARBSALPRQ1

PACKAGE⁽¹⁾

FCBGA (180)

BODY SIZE

TRAY / TAPE AND REEL

Tray (Functional Safety-Compliant targeted, ASIL-B)

Tape and Reel (Functional Safety-Compliant targeted, ASIL-B)

Tray (Non-Functional Safety)

15 mm × 15 mm

Tape and Reel (Non-Functional Safety)

(1) For more information, see Section 13, Mechanical, Packaging, and Orderable information.

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4 Functional Block Diagram

Figure 4-1 shows the functional block diagram of the device.

Antennas are on Package

QSPI

SPI

Serial Flash interface

LNA

ADC

Cortex R4F

@ 200MHz

External MCU interface

(User programmable)

PMIC control

SPI / I2C

CAN-FD

Digital Front-end

Data

RAM

Boot

ROM

Prog RAM

(Decimation filter

chain)

Primary Communication

Interfaces (Automotive)

DMA

Debug

UARTs

For debug

Main Sub-System

(Customer Programmed)

Test/Debug

JTAG for debug/development

Phase

Shift

Mailbox

High-speed ADC output

interface (for recording)

LVDS

HIL

Phase

Shift

Synth

(20 GHz)

Ramp

Generator

High-speed input for hardware-in-

loop verification

C674x DSP

@600 MHz

Phase

Shift

ADC

Buffer

Accel

L1P

(32kB)

L1D

(32kB)

(256kB)

GPADC

DMA

CRC

Temp

Osc.

Radar Data Memory

(L3)

DSP Sub-System

(Customer Programmed)

RF/Analog Sub-System

Figure 4-1. Functional Block Diagram

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Table of Contents

1 Features............................................................................1

2 Applications.....................................................................2

3 Description.......................................................................2

4 Functional Block Diagram.............................................. 3

5 Revision History.............................................................. 4

6 Device Comparison.........................................................6

6.1 Related Products........................................................ 7

7 Terminal Configuration and Functions..........................8

7.1 Pin Diagram................................................................ 8

7.2 Signal Descriptions..................................................... 9

7.3 Pin Attributes.............................................................14

8 Specifications................................................................ 28

8.1 Absolute Maximum Ratings...................................... 28

8.2 ESD Ratings............................................................. 28

8.3 Power-On Hours (POH)............................................29

8.4 Recommended Operating Conditions.......................30

8.5 Power Supply Specifications.....................................30

8.6 Power Consumption Summary................................. 31

8.7 RF Specification........................................................32

8.8 CPU Specifications................................................... 32

8.9 Thermal Resistance Characteristics for FCBGA

9 Detailed Description......................................................61

9.1 Overview...................................................................61

9.2 Functional Block Diagram.........................................61

9.3 Subsystems.............................................................. 62

9.4 Other Subsystems.................................................... 66

10 Monitoring and Diagnostics....................................... 68

10.1 Monitoring and Diagnostic Mechanisms................. 68

11 Applications, Implementation, and Layout............... 73

11.1 Application Information............................................73

11.2 Reference Schematic..............................................73

12 Device and Documentation Support..........................74

12.1 Device Nomenclature..............................................74

12.2 Tools and Software................................................. 76

12.3 Documentation Support.......................................... 76

12.4 Support Resources................................................. 76

12.5 Trademarks.............................................................76

12.6 Electrostatic Discharge Caution..............................76

12.7 Glossary..................................................................76

13 Mechanical, Packaging, and Orderable

Information.................................................................... 77

13.1 Packaging Information............................................ 77

13.2 Tray Information for ALP, 15 × 15 mm ................... 77

Package [ALP0180A].................................................. 33

8.10 Timing and Switching Characteristics..................... 34

5 Revision History

Changes from November 13, 2020 to May 27, 2021 (from Revision * (November 2020) to

Revision A (May 2021))

Page

•

Global: Updated/Changed AWR6843AOP device information and document Product Status from "Advanced

Information" to "Production Data (PD)" ..............................................................................................................1

Global: Updated/Changed A2D to ADC, Updated/Changed Master Subsystem to Main Subsystem and

Masters R4F to MSS R4F...................................................................................................................................1

Device Information: Updated/Added part numbers and Tray/Tape and Reel information". Updated/Changed

Description paragraph........................................................................................................................................ 2

Device Features Comparison: Changed/Updated to include AWR6843AOP product status to PD and included

note about LVDS debug......................................................................................................................................6

(Pin Attributes): Updated/Changed table to remove unsupported mux modes ............................................... 14

Power Consumption Summary: Updated/Modified VIOIN current consumption value (changing from a TYP to

a MAX value of 50 mA).....................................................................................................................................31

RF Specification: Updated/Changed Reciever Effective isotropic noise figure (EINF) TYP value from 14 to 9

dB and added Transmitter Power backoff range row .......................................................................................32

Antenna radiation patterns: Updated/Changed RX and TX radiation pattern figures ......................................34

Transmit Subsystem: Updated/Changed figure................................................................................................64

Receive Subsystem: Updated/Changed figure.................................................................................................64

Packaging Information: Updated/Added note on the expected variability in the color of the AOP product...... 77

Tray Information for ALP, 15 × 15 mm: Added tray information........................................................................77

•

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Changes from May 28, 2021 to June 1, 2021 (from Revision A (May 2021) to Revision B (June

2021))

Page

•

Global: Updated/Changed CAN to CAN-FD.......................................................................................................1

(Pin Functions): Updated "CAN_FD_RX" to "CAN1_FD_RX" and added a row for signal name

"CAN2_FD_RX" to the list and reassociated ball no. D2....................................................................................9

(Pin Functions): Updated "CAN_FD_TX" to "CAN1_FD_TX" and added a row for signal name

•

"CAN2_FD_TX" to the list and reassociated ball no. B4.................................................................................... 9

(Pin Attributes): Updated/Changed ball number B4 to show correct signal name as "CAN2_FD_TX"............ 14

(Pin Attributes): Updated/Changed ball number D2 to show correct signal name as "CAN2_FD_RX"............14

(Pin Attributes): Updated/Changed signal name from "CAN_FD_RX" to "CAN1_FD_RX'...............................14

(Pin Attributes): Updated/Changed signal name from "CAN_FD_TX" to "CAN1_FD_TX'................................14

Updated/changed the CAN-FD description...................................................................................................... 52

Updated/changed "CAN_FD_rx" to "CANx_FD_RX" and "CAN_FD_tx" to "CANx_FD_TX" in the table to

include both instances...................................................................................................................................... 52

Updated/changed "CAN" to "CAN-FD"............................................................................................................. 68

•

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6 Device Comparison

Table 6-1. Device Features Comparison

FUNCTION

AWR6843AOP

AWR1843AOP

AWR6843

AWR6443

AWR1843

AWR1642

AWR1443

Antenna on Package (AOP)

Number of receivers

Yes

—

3⁽¹⁾

Number of transmitters

RF frequency range

3⁽¹⁾

76 to 81 GHz

1.5MB

B-Targeted

—

60 to 64 GHz

1.75MB

B-Targeted

—

76 to 81 GHz

60 to 64 GHz 60 to 64 GHz 60 to 64 GHz

76 to 81 GHz

On-chip memory

2MB

B-Targeted

—

1.75MB

—

1.4MB

2MB

B-Targeted

—

576KB

—

ASIL

B-Targeted

Non-Functional Safety

Max I/F (Intermediate Frequency) (MHz)

Max real sampling rate (Msps)

Max complex sampling rate (Msps)

Processors

—

Yes

—

Yes

12.5

6.25

12.5

6.25

MCU (R4F)

Yes

—

Yes

—

DSP (C674x)

Peripherals

Serial Peripheral Interface (SPI) ports

Quad Serial Peripheral Interface (QSPI)

Inter-Integrated Circuit (I²C) interface

Yes

Controller Area Network (DCAN)

interface

—

Controller Area Network (CAN-FD)

interface

—

Trace

Yes

Yes⁽⁴⁾

—

Yes

Yes⁽⁴⁾

—

Yes

Yes⁽⁴⁾

—

Yes

Yes⁽⁴⁾

—

Yes

Yes⁽⁴⁾

—

Yes

Yes⁽⁴⁾

—

Yes

Yes⁽⁴⁾

—

PWM

Hardware In Loop (HIL/DMM)

GPADC

—

Yes

Yes⁽⁴⁾

—

LVDS/Debug

CSI2

Hardware accelerator

1-V bypass mode

JTAG

Yes

—

Yes

Product Preview (PP),

Product

Advance Information (AI),

status

PD⁽²⁾

AI⁽³⁾

PD⁽²⁾

or Production Data (PD)

(1) 3 Tx Simultaneous operation is supported only with 1-V LDO bypass and PA LDO disable mode. In this mode, the 1-V supply needs to

be fed on the VOUT PA pin.

(2) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas

Instruments standard warranty.

(3) ADVANCE INFORMATION for pre-production products; subject to change without notice.

(4) The LVDS interface is not a production interface and is only used for debug.

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6.1 Related Products

For information about other devices in this family of products or related products see the links that follow.

mmWave sensors

TI’s mmWave sensors rapidly and accurately sense range, angle and velocity with less

power using the smallest footprint mmWave sensor portfolio for industrial applications.

Automotive mmWave TI’s automotive mmWave sensor portfolio offers high-performance radar front end to

sensors

ultra-high resolution, small and low-power single-chip radar solutions. TI’s scalable

sensor portfolio enables design and development of ADAS system solution for every

performance, application and sensor configuration ranging from comfort functions to

safety functions in all vehicles.

Companion products Review products that are frequently purchased or used in conjunction with this product.

for AWR6843AOP

Reference designs

for AWR6843AOP

TI Designs Reference Design Library is a robust reference design library spanning

analog, embedded processor and connectivity. Created by TI experts to help you

jump-start your system design, all TI Designs include schematic or block diagrams,

BOMs, and design files to speed your time to market. Search and download designs at

ti.com/tidesigns.

Vehicle occupant

detection reference

design

This reference design demonstrates the use of the AWR6843 60GHz single-chip

mmWave sensor with integrated DSP, as a Vehicle Occupant Detection (VOD) and

Child Presence Detection (CPD) Sensor enabling the detection of life forms in a

vehicle. This design provides a reference software processing chain which runs on

the C674x DSP, enabling the generation of a heat map to detect occupants in a Field of

View (FOV) of ±60 degrees.

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7 Terminal Configuration and Functions

7.1 Pin Diagram

Figure 7-1 shows the pin locations for the 180-pin 15 × 15 mm FCBGA package

Figure 7-1. Pin Diagram (Top View)

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7.2 Signal Descriptions

Note

All IO pins of the device (except NERROR IN, NERROR_OUT, and WARM_RESET) are non-failsafe;

hence, care needs to be taken that they are not driven externally without the VIO supply being present

to the device.

Note

The GPIO state during the power supply ramp is not ensured. In case the GPIO is used in the

application where the state of the GPIO is critical, even when NRESET is low , a tri-state buffer

should be used to isolate the GPIO output from the radar device and a pull resister used to define the

required state in the application. The NRESET signal to the radar device could be used to control the

output enable (OE) of the tri-state buffer.

7.2.1 Pin Functions - Digital and Analog [ALP Package]

NAME

I/O

DESCRIPTION

DIGITAL

NO.

D3, E2, K3, L2, U8, U10,

U16, V16

BSS_UART_TX

CAN1_FD_RX

CAN1_FD_TX

Debug UART Transmit [Radar Block]

CAN1 FD (MCAN) Receive Signal

CAN1 FD (MCAN) Transmit Signal

A4, B3, E2, F2, K2, U8,

V16

C2, C3, D1, D3, J3, T3,

U16

CAN2_FD_RX

CAN2_FD_TX

DMM0

CAN2 FD (MCAN) Receive Signal

CAN2 FD (MCAN) Transmit Signal

Debug Interface (Hardware In Loop) - Data Line

Debug Interface (Hardware In Loop) - Clock

DMM1

DMM2

DMM3

DMM4

DMM5

DMM6

DMM7

DMM8

DMM9

DMM10

DMM11

DMM12

DMM13

DMM14

DMM15

DMM_CLK

Debug Interface (Hardware In Loop) Mux Select between DMM1 and

DMM2 (Two Instances)

DMM_MUX_IN

L3, M3, U12

DMM_SYNC

DSS_UART_TX

EPWM1A

Debug Interface (Hardware In Loop) - Sync

Debug UART Transmit [DSP]

PWM Module 1 - Output A

D2, F2, G3, H2, L1

B4, U16, V13

EPWM1B

PWM Module 1 - Output B

A4, M2, U16, V10

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NAME

EPWM1SYNCI

EPWM1SYNCO

EPWM2A

EPWM2B

EPWM2SYNCO

EPWM3A

EPWM3B

EPWM3SYNCO

GPIO_0

I/O

DESCRIPTION

PWM Module 1 - Sync Input

NO.

C3, L3

PWM Module 1 - Sync Output

PWM Module 2- Output A

PWM Module 2 - Output B

PWM Module 2 - Sync Output

PWM Module 3 - Output A

PWM Module 3 - Sync Output

General-purpose I/O

C5, M2, U16, V10, V16

B5, V16

C4, V16

GPIO_1

GPIO_2

GPIO_3

GPIO_4

GPIO_5

GPIO_6

GPIO_7

GPIO_8

GPIO_9

GPIO_10

GPIO_11

GPIO_12

GPIO_13

GPIO_14

GPIO_15

GPIO_16

GPIO_17

GPIO_18

GPIO_19

GPIO_20

GPIO_21

GPIO_22

GPIO_23

GPIO_24

GPIO_25

GPIO_26

GPIO_27

GPIO_28

GPIO_29

GPIO_30

GPIO_31

GPIO_32

GPIO_33

GPIO_34

GPIO_35

GPIO_36

GPIO_37

U16

V16

U10

V13

V10

U12

C2, D2

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NAME

SWRS246B – NOVEMBER 2020 – REVISED JUNE 2021

I/O

DESCRIPTION

NO.

GPIO_38

General-purpose I/O

I2C Clock

GPIO_39

GPIO_40

GPIO_41

GPIO_42

GPIO_43

GPIO_44

GPIO_45

GPIO_46

GPIO_47

I2C_SCL

G3, V16

G1, U16

I2C_SDA

I2C Data

LVDS_TXP[0]

LVDS_TXM[0]

LVDS_TXP[1]

LVDS_TXM[1]

LVDS_CLKP

LVDS_CLKM

LVDS_FRCLKP

LVDS_FRCLKM

MCU_CLKOUT

MSS_UARTA_RX

MSS_UARTA_TX

MSS_UARTB_RX

Differential data Out – Lane 0

Differential data Out – Lane 1

Differential clock Out

Differential Frame Clock

Programmable clock given out to external MCU or the processor

Main Subsystem - UART A Receive

V13

E2, U9, V16

D3, U7, U10, U16

U12, V16

Main Subsystem - UART A Transmit

Main Subsystem - UART B Receive

D3, E2, K3, M1, T3, U10,

U16

MSS_UARTB_TX

NDMM_EN

Main Subsystem - UART B Transmit

Debug Interface (Hardware In Loop) Enable - Active Low Signal

U10, U16

Failsafe input to the device. Nerror output from any other device

can be concentrated in the error signaling monitor module inside the

device and appropriate action can be taken by Firmware

NERROR_IN

U14

Open drain fail safe output signal. Connected to PMIC/

Processor/MCU to indicate that some severe criticality fault has

happened. Recovery would be through reset.

NERROR_OUT

U15

PMIC_CLKOUT

QSPI[0]

Output Clock from AWR6843AOP device for PMIC

QSPI Data Line #0 (Used with Serial Data Flash)

QSPI Data Line #1 (Used with Serial Data Flash)

QSPI Data Line #2 (Used with Serial Data Flash)

QSPI Data Line #3 (Used with Serial Data Flash)

QSPI Clock (Used with Serial Data Flash)

QSPI Chip Select (Used with Serial Data Flash)

Debug UART (Operates as Bus Master) - Receive Signal

Debug UART (Operates as Bus Master) - Transmit Signal

Sense On Power - Line#0

K3, M2, V10

QSPI[1]

QSPI[2]

QSPI[3]

QSPI_CLK

QSPI_CLK_EXT

QSPI_CS_N

RS232_RX

RS232_TX

SOP[0]

V16

U16

U10

SOP[1]

Sense On Power - Line#1

SOP[2]

Sense On Power - Line#2

V10

SPIA_CLK

SPIA_CS_N

SPI Channel A - Clock

SPI Channel A - Chip Select

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NAME

SPIA_MISO

I/O

DESCRIPTION

SPI Channel A - Master In Slave Out

NO.

SPIA_MOSI

SPI Channel A - Master Out Slave In

SPI Channel B - Clock

SPIB_CLK

E2, H2

SPIB_CS_N

SPI Channel B Chip Select (Instance ID 0)

SPI Channel B Chip Select (Instance ID 1)

SPI Channel B Chip Select (Instance ID 2)

SPI Channel B - Master In Slave Out

SPI Channel B - Master Out Slave In

Out of Band Interrupt to an external host communicating over SPI

Low frequency Synchronization signal input

Low Frequency Synchronization Signal output

JTAG Test Clock

D3, J2

SPIB_CS_N_1

SPIB_CS_N_2

SPIB_MISO

B2, L3, M3

G2, L3, M3

G3, H3

SPIB_MOSI

G1, G2

SPI_HOST_INTR

SYNC_IN

U12

SYNC_OUT

K3, L3, M3, U12

TCK

TDI

JTAG Test Data Input

TDO

JTAG Test Data Output

U10

TMS

JTAG Test Mode Signal

TRACE_CLK

TRACE_CTL

TRACE_DATA_0

TRACE_DATA_1

TRACE_DATA_2

TRACE_DATA_3

TRACE_DATA_4

TRACE_DATA_5

TRACE_DATA_6

TRACE_DATA_7

TRACE_DATA_8

TRACE_DATA_9

TRACE_DATA_10

TRACE_DATA_11

TRACE_DATA_12

TRACE_DATA_13

TRACE_DATA_14

TRACE_DATA_15

FRAME_START

CHIRP_START

CHIRP_END

ADC_VALID

Debug Trace Output - Clock

Debug Trace Output - Control

Debug Trace Output - Data Line

Pulse signal indicating the start of each frame

Pulse signal indicating the start of each chirp

Pulse signal indicating the end of each chirp

When high, indicating valid ADC samples

K3, V10, V13

B2, L3, M2

Open drain fail safe warm reset signal. Can be driven from PMIC for

diagnostic or can be used as status signal that the device is going

through reset.

WARM_RESET

U13

ANALOG

NRESET

CLKP

Power on reset for chip. Active low

U11

In XTAL mode: Differential port for reference crystal In External clock

mode: Single ended input reference clock port

In XTAL mode: Differential port for reference crystal In External clock

mode: Connect this port to ground

CLKM

Reference clock output from clocking sub system after cleanup PLL

(1.4-V output voltage swing).

OSC_CLKOUT

A14, K3

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NAME

SWRS246B – NOVEMBER 2020 – REVISED JUNE 2021

I/O

DESCRIPTION

Device's Band Gap Reference Output

NO.

A16

VBGAP

VDDIN

Power

1.2V digital power supply

E1, J1, V4, V8, V15

A5, V6, V12

C1, V7, V14

VIN_SRAM

VNWA

1.2V power rail for internal SRAM

1.2V power rail for SRAM array back bias

I/O Supply (3.3V or 1.8V): All CMOS I/Os would operate on this

supply

VIOIN

Power

H1, V9

VIOIN_18

VIN_18CLK

VIOIN_18DIFF

VPP

Power

1.8V supply for CMOS IO

1.8V supply for clock module

1.8V supply for LVDS port

Voltage supply for fuse chain

B1, F1, K1, V11

C15, C18

1.3V Analog and RF supply,VIN_13RF1 and VIN_13RF2 could be

shorted on the board

VIN_13RF1

Power

J16, J17, J18

VIN_13RF2

VIN_18BB

VIN_18VCO

Power

1.3V Analog and RF supply

1.8V Analog base band power supply

1.8V RF VCO supply

H16, H17, H18

M16, M17, M18

A12, C11

A1, A2, E3, F3, N3, P3,

R3, T4, T5, T6, T7, T8, T9,

T10, T11, T12, T13, T14,

T15, T16, U1, V1, Y6

VSS

Ground

Digital ground

A6, A8, A11, A13, A15,

A17, A18, B6, B8, B9,

B10, B11, B12, B13, B14,

B15, B16, B17, B18, C6,

C7, C8, C12, C13, C14,

C16, C17, D16, D17, D18,

E16, E17, E18, F16, F17,

F18, K16, K17, K18, L16,

L17, L18, N16, N17, N18,

P16, R16, R17, T17, U17,

U18, V17, V18

VSSA

Analog ground

VOUT_14APLL

Internal LDO output

A10

VOUT_14SYNTH

Internal LDO output

VOUT_PA

Internal LDO output

G16, G17, G18

Analog Test1 / GPADC1

Analog Test2 / GPADC2

Analog Test3 / GPADC3

Analog Test4 / GPADC4

ANAMUX / GPADC5

VSENSE / GPADC6

Analog IO dedicated for ADC service

P18

P17

R18

T18

C10

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7.3 Pin Attributes

Table 7-1. Pin Attributes (ALP180A Package)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

GPIO_0

GPIO_13

0xFFFFEA04

Output Disabled

Pull Down

GPIO_0

PMIC_CLKOUT

EPWM1B

ePWM2A

GPIO_1

GPIO_16

0xFFFFEA08

Output Disabled

Pull Down

GPIO_1

SYNC_OUT

DMM_MUX_IN

SPIB_CS_N_1

SPIB_CS_N_2

EPWM1SYNCI

GPIO_26

GPIO_2

0xFFFFEA64

Output Disabled

Pull Down

GPIO_2

OSC_CLKOUT

MSS_UARTB_TX

BSS_UART_TX

SYNC_OUT

PMIC_CLKOUT

CHIRP_START

CHIRP_END

FRAME_START

TRACE_DATA_0

GPIO_31

GPIO_31 (DP0)

0xFFFFEA7C

Output Disabled

Pull Down

DMM0

MSS_UARTA_TX

TRACE_DATA_1

GPIO_32

GPIO_32 (DP1)

GPIO_33 (DP2)

GPIO_34 (DP3)

0xFFFFEA80

0xFFFFEA84

0xFFFFEA88

Output Disabled

Pull Down

DMM1

TRACE_DATA_2

GPIO_33

DMM2

TRACE_DATA_3

GPIO_34

DMM3

EPWM3SYNCO

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

GPIO_35 (DP4)

GPIO_36 (DP5)

GPIO_37 (DP6)

GPIO_38 (DP7)

GPIO_39 (DP8)

TRACE_DATA_4

GPIO_35

0xFFFFEA8C

Output Disabled

Pull Down

DMM4

EPWM2SYNCO

TRACE_DATA_5

GPIO_36

0xFFFFEA90

0xFFFFEA94

0xFFFFEA98

0xFFFFEA9C

DMM5

MSS_UARTB_TX

TRACE_DATA_6

GPIO_37

DMM6

BSS_UART_TX

TRACE_DATA_7

GPIO_38

DMM7

DSS_UART_TX

TRACE_DATA_8

GPIO_39

DMM8

CAN1_FD_TX

EPWM1SYNCI

TRACE_DATA_9

GPIO_40

GPIO_40 (DP9)

0xFFFFEAA0

Output Disabled

Pull Down

DMM9

CAN1_FD_RX

EPWM1SYNCO

TRACE_DATA_10

GPIO_41

GPIO_41 (DP10)

GPIO_42 (DP11)

GPIO_43 (DP12)

0xFFFFEAA4

0xFFFFEAA8

0xFFFFEAAC

Output Disabled

Pull Down

DMM10

EPWM3A

TRACE_DATA_11

GPIO_42

DMM11

EPWM3B

TRACE_DATA_12

GPIO_43

DMM12

EPWM1A

CAN2_FD_TX

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

GPIO_44 (DP13)

TRACE_DATA_13

GPIO_44

0xFFFFEAB0

Output Disabled

Pull Down

DMM13

EPWM1B

CAN1_FD_RX

TRACE_DATA_14

GPIO_45

GPIO_45 (DP14)

GPIO_46 (DP15)

0xFFFFEAB4

0xFFFFEAB8

0xFFFFEABC

Output Disabled

Pull Down

DMM14

EPWM2A

TRACE_DATA_15

GPIO_46

DMM15

EPWM2B

GPIO_47 (DMM_CLK)

TRACE_CLK

GPIO_47

DMM_CLK

TRACE_CTL

DMM_SYNC

GPIO_25

DMM_SYNC

0xFFFFEAC0

0xFFFFEA60

Output Disabled

Pull Down

V13

MCU_CLKOUT

CHIRP_START

CHIRP_END

FRAME_START

EPWM1A

U14

U15

V10

NERROR_IN

NERROR_OUT

SOP[2]

0xFFFFEA44

0xFFFFEA4C

0xFFFFEA68

Input

NERROR_OUT

PMIC_CLKOUT

Hi-Z (Open Drain)

Output Disabled

During Power Up

Pull Down

GPIO_27

PMIC_CLKOUT

CHIRP_START

CHIRP_END

FRAME_START

EPWM1B

EPWM2A

QSPI[0]

GPIO_8

0xFFFFEA2C

Output Disabled

Pull Down

QSPI[0]

SPIB_MISO

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

QSPI[1]

GPIO_9

0xFFFFEA30

Output Disabled

Pull Down

QSPI[1]

SPIB_MOSI

SPIB_CS_N_2

GPIO_10

QSPI[2]

0xFFFFEA34

0xFFFFEA38

0xFFFFEA3C

Output Disabled

Pull Down

QSPI[2]

CAN1_FD_TX

GPIO_11

QSPI[3]

CAN1_FD_RX

GPIO_7

QSPI_CLK

SPIB_CLK

DSS_UART_TX

GPIO_6

QSPI_CS_N

RS232_RX

0xFFFFEA40

0xFFFFEA74

Output Disabled

Input Enabled

Pull Up

QSPI_CS_N

SPIB_CS_N

GPIO_15

V16

RS232_RX

MSS_UARTA_RX

BSS_UART_TX

MSS_UARTB_RX

CAN1_FD_RX

I2C_SCL

EPWM2A

EPWM2B

EPWM3A

U16

RS232_TX

GPIO_14

0xFFFFEA78

Output Enabled

RS232_TX

MSS_UARTA_TX

MSS_UARTB_TX

BSS_UART_TX

CAN1_FD_TX

I2C_SDA

EPWM1A

EPWM1B

NDMM_EN

EPWM2A

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

SPIA_CLK

GPIO_3

0xFFFFEA14

Output Disabled

Pull Up

SPIA_CLK

CAN2_FD_RX

DSS_UART_TX

GPIO_30

SPIA_CS_N

SPIA_MISO

SPIA_MOSI

0xFFFFEA18

0xFFFFEA10

0xFFFFEA0C

Output Disabled

Pull Up

SPIA_CS_N

CAN1_FD_TX

GPIO_20

SPIA_MISO

CAN1_FD_TX

GPIO_19

SPIA_MOSI

CAN1_FD_RX

DSS_UART_TX

GPIO_5

SPIB_CLK

0xFFFFEA24

Output Disabled

Pull Up

SPIB_CLK

MSS_UARTA_RX

MSS_UARTB_TX

BSS_UART_TX

CAN1_FD_RX

GPIO_4

SPIB_CS_N

0xFFFFEA28

Output Disabled

Pull Up

SPIB_CS_N

MSS_UARTA_TX

MSS_UARTB_TX

BSS_UART_TX

QSPI_CLK_EXT

CAN1_FD_TX

GPIO_22

SPIB_MISO

0xFFFFEA20

Output Disabled

Pull Up

SPIB_MISO

I2C_SCL

DSS_UART_TX

GPIO_21

SPIB_MOSI

0xFFFFEA1C

0xFFFFEA00

Output Disabled

Pull Up

SPIB_MOSI

I2C_SDA

SPI_HOST_INTR

GPIO_12

Pull Down

SPI_HOST_INTR

SPIB_CS_N_1

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

U12

SYNC_IN

GPIO_28

0xFFFFEA6C

Output Disabled

Pull Down

SYNC_IN

MSS_UARTB_RX

DMM_MUX_IN

SYNC_OUT

SOP[1]

SYNC_OUT

0xFFFFEA70

During Power Up

Output Disabled

Pull Down

GPIO_29

SYNC_OUT

DMM_MUX_IN

SPIB_CS_N_1

SPIB_CS_N_2

GPIO_17

TCK

0xFFFFEA50

Input Enabled

Pull Down

Pull Up

TCK

MSS_UARTB_TX

CAN1_FD_TX

GPIO_23

TDI

0xFFFFEA58

0xFFFFEA5C

Input Enabled

TDI

MSS_UARTA_RX

SOP[0]

U10

TDO

During Power Up

Output Enabled

GPIO_24

TDO

MSS_UARTA_TX

MSS_UARTB_TX

BSS_UART_TX

NDMM_EN

GPIO_18

TMS

0xFFFFEA54

0xFFFFEA48

Input Enabled

Pull Down

TMS

BSS_UART_TX

CAN1_FD_RX

WARM_RESET

U13

WARM_RESET

Hi-Z Input (Open

Drain)

LVDS_CLKM

LVDS_CLKP

LVDS_CLKM

LVDS_CLKP

LVDS_TXP[0]

LVDS_TXM[0]

LVDS_TXP[1]

LVDS_TXM[1]

LVDS_FRCLKP

LVDS_FRCLKM

LVDS_TXP[0]

LVDS_TXM[0]

LVDS_TXP[1]

LVDS_TXM[1]

LVDS_FRCLKP

LVDS_FRCLKM

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

U11

NRESET

CLKP

NRESET

CLKP

CLKM

A14

A16

OSC_CLKOUT

VBGAP

OSC_CLKOUT

VBGAP

VDDIN

PWR

GND

VDDIN

V15

VDDIN

VIN_SRAM

VNWA

VIN_SRAM

VNWA

V12

VNWA

V14

VNWA

VIOIN

VIOIN_18

VIN_18CLK

VIOIN_18DIFF

VPP

VIOIN_18

VIN_18CLK

VIOIN_18DIFF

VPP

V11

C15

C18

J16

J17

J18

H16

H17

H18

M16

M17

M18

A12

C11

VIN_13RF1

VIN_13RF2

VIN_18BB

VIN_18VCO

VSS

VIN_13RF1

VIN_13RF2

VIN_18BB

VIN_18VCO

VSS

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

VSS

GND

VSS

T10

T11

T12

T13

T14

T15

T16

VSS

VSSA

A11

A13

A15

A17

A18

B10

B11

B12

B13

B14

B15

B16

B17

B18

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

VSSA

GND

VSSA

C12

C13

C14

C16

C17

D16

D17

D18

E16

E17

E18

F16

F17

F18

K16

K17

K18

L16

L17

L18

N16

N17

N18

P16

R16

R17

T17

U17

U18

V17

V18

A10

VSSA

VOUT_14APLL

VOUT_14SYNTH

VOUT_PA

VOUT_14APLL

VOUT_14SYNTH

VOUT_PA

G16

G17

G18

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Table 7-1. Pin Attributes (ALP180A Package) (continued)

PINCNTL

BALL RESET

STATE [7]

PULL UP/DOWN

BALL NUMBER [1]

BALL NAME [2]

Analog Test1 / GPADC1

SIGNAL NAME [3]

MODE [5] [9]

TYPE [6]

ADDRESS [4]

TYPE [8]

P18

P17

R18

T18

Analog Test1 / GPADC1

Analog Test2 / GPADC2

Analog Test3 / GPADC3

Analog Test4 / GPADC4

ANAMUX / GPADC5

VSENSE / GPADC6

Analog Test2 / GPADC2

Analog Test3 / GPADC3

Analog Test4 / GPADC4

ANAMUX / GPADC5

VSENSE / GPADC6

C10

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The following list describes the table column headers:

1. BALL NUMBER: Ball numbers on the bottom side associated with each signal on the bottom.

2. BALL NAME: Mechanical name from package device (name is taken from muxmode 1).

3. SIGNAL NAME: Names of signals multiplexed on each ball (also notice that the name of the ball is the signal name in muxmode 1).

4. PINCNTL ADDRESS: MSS Address for PinMux Control

5. MODE: Multiplexing mode number: value written to PinMux Cntl register to select specific Signal name for this Ball number. Mode column has bit

range value.

6. TYPE: Signal type and direction:

•

I = Input

O = Output

IO = Input or Output

7. BALL RESET STATE: The state of the terminal after supplies are stable after power-on-reset (NRESET) is asserted

8. PULL UP/DOWN TYPE: indicates the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can be enabled or disabled

via software.

•

Pull Up: Internal pullup

Pull Down: Internal pulldown

An empty box means No pull.

9. Pin Mux Control Value maps to lower 4 bits of register.

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IO MUX registers are available in the MSS memory map and the respective mapping to device pins is as follows:

Table 7-2. PAD IO Control Registers

Default Pin/Ball Name

SPI_HOST_INTR

GPIO_0

Package Ball /Pin (Address)

Pin Mux Config Register

0xFFFFEA00

0xFFFFEA04

0xFFFFEA08

0xFFFFEA0C

0xFFFFEA10

0xFFFFEA14

0xFFFFEA18

0xFFFFEA1C

0xFFFFEA20

0xFFFFEA24

0xFFFFEA28

0xFFFFEA2C

0xFFFFEA30

0xFFFFEA34

0xFFFFEA38

0xFFFFEA3C

0xFFFFEA40

0xFFFFEA44

0xFFFFEA48

0xFFFFEA4C

0xFFFFEA50

0xFFFFEA54

0xFFFFEA58

0xFFFFEA5C

0xFFFFEA60

0xFFFFEA64

0xFFFFEA68

0xFFFFEA6C

0xFFFFEA70

0xFFFFEA74

0xFFFFEA78

GPIO_1

SPIA_MOSI

SPIA_MISO

SPIA_CLK

SPIA_CS_N

SPIB_MOSI

SPIB_MISO

SPIB_CLK

SPIB_CS_N

QSPI[0]

QSPI[1]

QSPI[2]

QSPI[3]

QSPI_CLK

QSPI_CS_N

NERROR_IN

WARM_RESET

NERROR_OUT

TCK

U14

U13

U15

TMS

TDI

TDO

U10

V13

MCU_CLKOUT

GPIO_2

PMIC_CLKOUT

SYNC_IN

V10

U12

V16

U16

SYNC_OUT

RS232_RX

RS232_TX

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Table 7-2. PAD IO Control Registers (continued)

Default Pin/Ball Name

GPIO_31

GPIO_32

GPIO_33

GPIO_34

GPIO_35

GPIO_36

GPIO_37

GPIO_38

GPIO_39

GPIO_40

GPIO_41

GPIO_42

GPIO_43

GPIO_44

GPIO_45

GPIO_46

GPIO_47

DMM_SYNC

Package Ball /Pin (Address)

Pin Mux Config Register

0xFFFFEA7C

0xFFFFEA80

0xFFFFEA84

0xFFFFEA88

0xFFFFEA8C

0xFFFFEA90

0xFFFFEA94

0xFFFFEA98

0xFFFFEA9C

0xFFFFEAA0

0xFFFFEAA4

0xFFFFEAA8

0xFFFFEAAC

0xFFFFEAB0

0xFFFFEAB4

0xFFFFEAB8

0xFFFFEABC

0xFFFFEAC0

The register layout is as follows:

Table 7-3. PAD IO Register Bit Descriptions

RESET (POWER

ON DEFAULT)

BIT

FIELD

TYPE

DESCRIPTION

31-11 NU

Reserved

IO slew rate control:

0 = Higher slew rate

1 = Lower slew rate

PUPDSEL

Pullup/PullDown Selection

0 = Pull Down

1 = Pull Up (This field is valid only if Pull Inhibit is set as '0')

Pull Inhibit/Pull Disable

0 = Enable

1 = Disable

OE_OVERRIDE

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Table 7-3. PAD IO Register Bit Descriptions (continued)

RESET (POWER

ON DEFAULT)

BIT

FIELD

TYPE

DESCRIPTION

OE_OVERRIDE_CTRL

Output Override Control:

(A '1' here overrides any o/p manipulation of this IO by any of the peripheral block hardware it is

associated with for example a SPI Chip select)

IE_OVERRIDE

Input Override

IE_OVERRIDE_CTRL

Input Override Control:

(A '1' here overrides any i/p value on this IO with a desired value)

3-0

FUNC_SEL

Function select for Pin Multiplexing (Refer to the Pin Mux Sheet)

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8 Specifications

8.1 Absolute Maximum Ratings

PARAMETERS^{(1) (2)}

MIN

–0.5

MAX

1.4

UNIT

VDDIN

1.2 V digital power supply

VIN_SRAM

VNWA

1.2 V power rail for internal SRAM

1.2 V power rail for SRAM array back bias

1.4

I/O supply (3.3 V or 1.8 V): All CMOS I/Os would operate on this

supply.

VIOIN

–0.5

3.8

VIOIN_18

1.8 V supply for CMOS IO

1.8 V supply for clock module

1.8 V supply for LVDS port

–0.5

VIN_18CLK

VIOIN_18DIFF

VIN_13RF1

VIN_13RF2

1.3 V Analog and RF supply, VIN_13RF1 and VIN_13RF2 could

be shorted on the board.

–0.5

1.45

VIN_13RF1

(1-V Internal LDO

bypass mode)

Device supports mode where external Power Management

block can supply 1 V on VIN_13RF1 and VIN_13RF2 rails. In

this configuration, the internal LDO of the device would be kept

bypassed.

–0.5

1.4

VIN_13RF2

(1-V Internal LDO

bypass mode)

VIN_18BB

1.8-V Analog baseband power supply

1.8-V RF VCO supply

–0.5

VIN_18VCO supply

Dual-voltage LVCMOS inputs, 3.3 V or 1.8 V (Steady State)

–0.3V

VIOIN + 0.3

Input and output

voltage range

Dual-voltage LVCMOS inputs, operated at 3.3 V/1.8 V

(Transient Overshoot/Undershoot) or external oscillator input

VIOIN + 20% up to

20% of signal period

CLKP, CLKM

Clamp current

Input ports for reference crystal

–0.5

Input or Output Voltages 0.3 V above or below their respective

power rails. Limit clamp current that flows through the internal

diode protection cells of the I/O.

–20

T_J

Operating junction temperature range

–40

–55

125

150

°C

T_STG

Storage temperature range after soldered onto PC board

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to V_SS, unless otherwise noted.

8.2 ESD Ratings

VALUE

±2000

±500

UNIT

Human-body model (HBM), per AEC Q100-002⁽¹⁾

Charged-device model (CDM), per AEC Q100-011⁽²⁾

V_(ESD)

Electrostatic discharge

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

(2) Corner pins are rated as ±750 V

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8.3 Power-On Hours (POH)

JUNCTION TEMPERATURE (T_J)^{(1) (2)}

OPERATING

CONDITION

NOMINAL CVDD VOLTAGE (V)

POWER-ON HOURS [POH] (HOURS)

–40°C

75°C

600 (6%)

2000 (20%)

6500 (65%)

900 (9%)

100% duty cycle

1.2

95°C

125°C

(1) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard

terms and conditions for TI semiconductor products.

(2) The specified POH are applicable with max Tx output power settings using the default firmware gain tables. The specified POH would

not be applicable, if the Tx gain table is overwritten using an API.

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8.4 Recommended Operating Conditions

MIN

1.14

3.13

1.71

NOM

1.2

3.3

1.8

MAX

1.32

3.45

1.89

1.9

UNIT

VDDIN

1.2 V digital power supply

VIN_SRAM

VNWA

1.2 V power rail for internal SRAM

1.2 V power rail for SRAM array back bias

I/O supply (3.3 V or 1.8 V):

All CMOS I/Os would operate on this supply.

VIOIN

VIOIN_18

1.8 V supply for CMOS IO

1.8 V supply for clock module

1.8 V supply for LVDS port

VIN_18CLK

VIOIN_18DIFF

VIN_13RF1

VIN_13RF2

1.9

1.3 V Analog and RF supply. VIN_13RF1 and VIN_13RF2

could be shorted on the board

1.23

1.3

1.36

VIN_13RF1

(1-V Internal LDO

bypass mode)

0.95

1.05

VIN_13RF2

(1-V Internal LDO

bypass mode)

VIN18BB

1.8-V Analog baseband power supply

1.8V RF VCO supply

1.71

1.17

2.25

1.8

1.9

VIN_18VCO

Voltage Input High (1.8 V mode)

Voltage Input High (3.3 V mode)

Voltage Input Low (1.8 V mode)

Voltage Input Low (3.3 V mode)

High-level output threshold (I_OH= 6 mA)

Low-level output threshold (I_OL= 6 mA)

V_IL(1.8V Mode)

V_IH

V_IL

0.3*VIOIN

0.62

V_OH

V_OL

VIOIN – 450

450

0.45

V_IH(1.8V Mode)

0.96

1.57

NRESET

SOP[2:0]

V_IL(3.3V Mode)

0.65

V_IH(3.3V Mode)

8.5 Power Supply Specifications

Table 8-1 describes the four rails from an external power supply block of the AWR6843AOP device.

Table 8-1. Power Supply Rails Characteristics

SUPPLY

DEVICE BLOCKS POWERED FROM THE SUPPLY

RELEVANT IOS IN THE DEVICE

Input: VIN_18VCO, VIN18CLK, VIN_18BB,

VIOIN_18DIFF, VIOIN_18

LDO Output: VOUT_14SYNTH, VOUT_14APLL

Synthesizer and APLL VCOs, crystal oscillator, IF

Amplifier stages, ADC, LVDS

1.8 V

1.3 V (or 1 V in internal

LDO bypass mode)⁽¹⁾

Power Amplifier, Low Noise Amplifier, Mixers and LO

Distribution

Input: VIN_13RF2, VIN_13RF1

LDO Output: VOUT_PA

3.3 V (or 1.8 V for 1.8 V

I/O mode)

Digital I/Os

Input VIOIN

1.2 V

Core Digital and SRAMs

Input: VDDIN, VIN_SRAM

(1) Three simultaneous transmitter operation is supported only in 1-V LDO bypass and PA LDO disable mode. In this mode 1V supply

needs to be fed on the VOUT PA pin.

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The 1.3-V (1.0 V) and 1.8-V power supply ripple specifications mentioned in Table 8-2 are defined to meet

a target spur level of –105 dBc (RF Pin = –15 dBm) at the RX. The spur and ripple levels have a dB-to-dB

relationship, for example, a 1-dB increase in supply ripple leads to a ~1 dB increase in spur level. Values quoted

are rms levels for a sinusoidal input applied at the specified frequency.

Table 8-2. Ripple Specifications

RF RAIL

VCO/IF RAIL

FREQUENCY (kHz)

1.0 V (INTERNAL LDO BYPASS)

1.3 V (µV_RMS

)

1.8 V (µV_RMS)

(µV_RMS

)

137.5

275

648

550

1100

2200

4400

6600

117

8.6 Power Consumption Summary

Table 8-3 and Table 8-4 summarize the power consumption at the power terminals.

Table 8-3. Maximum Current Ratings at Power Terminals

PARAMETER

SUPPLY NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

Total current drawn by all

nodes driven by 1.2V rail

VDDIN, VIN_SRAM, VNWA

1000

Total current drawn by

all nodes driven by 1.3V

rail (or 1V rail in LDO

VIN_13RF1, VIN_13RF2

2000

Bypass mode), when only

2 transmitters are used.⁽³⁾

Current consumption ⁽¹⁾

VIOIN_18, VIN_18CLK,

VIOIN_18DIFF, VIN_18BB,

VIN_18VCO

Total current drawn by all

nodes driven by 1.8V rail

850

Total current drawn by

all nodes driven by 3.3V

rail⁽²⁾

VIOIN

(1) The specified current values are at typical supply voltage level.

(2) The exact VIOIN current depends on the peripherals used and their frequency of operation.

(3) Simultaneous 3 Transmitter operation is supported only with 1-V LDO bypass and PA LDO disable mode. In this mode, the 1-V supply

needs to be fed on the VOUT_PA pin. In this case, the peak 1-V supply current goes up to 2500 mA. To enable the LDO bypass mode,

see the Interface Control document in the mmWave software development kit (SDK).

Table 8-4. Average Power Consumption at Power Terminals

PARAMETER

CONDITION

DESCRIPTION

MIN

TYP MAX UNIT

1TX, 4RX

Regular power ADC mode

6.4 Msps complex transceiver,

13.13-ms frame, 64 chirps, 256

samples/chirp, 8.5-µs interchirp

time, DSP + Hardware

1.19

24% duty cycle

2TX, 4RX⁽¹⁾

1TX, 4RX

1.25

1.0-V internal

LDO bypass

mode

accelerator active

Average power

consumption⁽¹⁾

Regular power ADC mode

6.4 Msps complex transceiver,

13.13-ms frame, 64 chirps, 256

samples/chirp, 8.5-µs interchirp

time, DSP + Hardware

1.62

48% duty cycle

2TX, 4RX⁽¹⁾

1.75

accelerator active

(1) Two TX antennas are on simultaneously.

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8.7 RF Specification

over recommended operating conditions (unless otherwise noted)

PARAMETER

MIN

TYP

MAX UNIT

Effective isotropic noise figure (EINF)

IF bandwidth⁽¹⁾

60 to 64 GHz

10 MHz

25 Msps

12.5 Msps

Bits

ADC sampling rate (real)

ADC sampling rate (complex 1x)

ADC resolution

Receiver

–90

Idle Channel Spurs

dBFS

Single transmitter effective isotropic radiated power (EIRP)

Power backoff range

dBm

Transmitter

Frequency range

64 GHz

250 MHz/µs

dBc/Hz

Clock

subsystem

Ramp rate

Phase noise at 1-MHz offset

60 to 64 GHz

–92

(1) The analog IF stages include high-pass filtering, with two independently configurable first-order high-pass corner frequencies. The set

of available HPF corners is summarized as follows:

Available HPF Corner Frequencies (kHz)

HPF1

HPF2

175, 235, 350, 700

350, 700, 1400, 2800

The filtering performed by the digital baseband chain is targeted to provide:

•

Less than ±0.5 dB pass-band ripple/droop, and

Better than 60 dB anti-aliasing attenuation for any frequency that can alias back into the pass-band.

8.8 CPU Specifications

over recommended operating conditions (unless otherwise noted)

PARAMETER

MIN

TYP

600

MAX UNIT

Clock Speed

DSP

MHz

L1 Code Memory

Subsystem

(C674

Family)

L1 Data Memory

L2 Memory

256

200

512

192

Main

Clock Speed

MHz

Controller

Subsystem

(R4F Family)

Tightly Coupled Memory - A (Program)

Tightly Coupled Memory - B (Data)

Shared

Memory

Shared L3 Memory

768

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8.9 Thermal Resistance Characteristics for FCBGA Package [ALP0180A]

THERMAL METRICS⁽¹⁾

°C/W^{(2) (3)}

2.6

RΘ_JC

RΘ_JB

RΘ_JA

RΘ_JMA

Psi_JT

Psi_JB

Junction-to-case

Junction-to-board

7.5

Junction-to-free air

Junction-to-moving air

Junction-to-package top

Junction-to-board

20.3

N/A⁽⁴⁾

0.9

7.3

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2) °C/W = degrees Celsius per watt.

(3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(4) N/A = not applicable. Heatsink on this device.

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8.10 Timing and Switching Characteristics

8.10.1 Antenna Radiation Patterns

This section discusses transmitter and receiver antenna radiation patterns in both Azmiuth and Elevaton planes

for a specified frequency.

8.10.1.1 Antenna Radiation Patterns for Receiver

Figure 8-1 shows typical antenna radiation gain plots normalized to boresight at various frequencies for the four

receivers in both Azimuth (H-Plane) and Elevation (E-Plane) planes

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RX Gain Across Azimuth

RX2

RX1

Angle

RX3

Angle

RX4

Angle

RX1

Angle

RX2

RX Gain Across Elevation

Angle

RX3

Angle

RX4

Angle

Figure 8-1. Receiver Antenna Radiation Pattern

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8.10.1.2 Antenna Radiation Patterns for Transmitter

Figure 8-2 shows typical antenna radiation patterns for the three transmitters in both Azimuth and Elevation planes.

TX Output Power Across Azimuth

TX1

TX2

TX3

Angle

TX3

Angle

TX1

TX Output Power Across Elevation

TX2

Angle

Figure 8-2. Transmitter Antenna Radiation Pattern

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8.10.2 Antenna Positions

Figure 8-3 shows the placement and relative spacing of the antennas.

‹=5mm

MIMO Virtual

Antenna Array

RX2

RX4

RX1

RX3

‹/2

TX2

‹

‹/2

TX1

TX3

‹

Pin A1

Figure 8-3. Antenna Positions (Placement and Relative Spacing)

8.10.3 Power Supply Sequencing and Reset Timing

The AWR6843AOP device expects all external voltage rails to be stable before reset is deasserted. Figure 8-4

describes the device wake-up sequence.

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SOP

Setup

Time

SOP

Hold time to

nRESET

DC power

MSS

BOOT

START

nRESET

ASSERT

tPGDEL

Power

notOK

Stable before

nRESET

release

Power

QSPI

READ

VDDIN,

VIN_SRAM

VNWA

VIOIN_18

VIN18_CLK

VIOIN_18DIFF

VIN18_BB

VIN_13RF1

VIN_13RF2

VIOIN

SOP IO

Reuse

SOP IO‘s can be used as functional IO‘s

SOP[2.1.0]

nRESET

WARMRESET

OUTPUT

VBGAP

OUTPUT

CLKP, CLKM

Using Crystal

MCUCLK

OUTPUT (1)

QSPI_CS

OUTPUT

8 ms (XTAL Mode)

850 µs (REFCLK Mode)

A. MCU_CLK_OUT in autonomous mode, where AWR6843AOP application is booted from the serial flash, MCU_CLK_OUT is not

enabled by default by the device bootloader.

Figure 8-4. Device Wake-up Sequence

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8.10.4 Input Clocks and Oscillators

8.10.4.1 Clock Specifications

The AWR6843AOP requires external clock source (that is, a 40-MHz crystal or external oscillator to CLKP) for

initial boot and as a reference for an internal APLL hosted in the device. An external crystal is connected to the

device pins. Figure 8-5 shows the crystal implementation.

C_f1

XTALP

C_p

40 MHz

XTALM

C_f2

Figure 8-5. Crystal Implementation

Note

The load capacitors, C_f1and C_f2in Figure 8-5, should be chosen such that Equation 1 is satisfied.

C_Lin the equation is the load specified by the crystal manufacturer. All discrete components used

to implement the oscillator circuit should be placed as close as possible to the associated oscillator

CLKP and CLKM pins.

C _f2

C_L= C _f1

+C_P

_f1+C _f2

(1)

Table 8-5 lists the electrical characteristics of the clock crystal.

Table 8-5. Crystal Electrical Characteristics (Oscillator Mode)

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

MHz

f_P

Parallel resonance crystal frequency

C_L

Crystal load capacitance

Crystal ESR

ESR

Temperature range Expected temperature range of operation

–40

–50

105

°C

Frequency

Crystal frequency tolerance^{(1) (2) (3)}

tolerance

ppm

µW

Drive level

200

(1) The crystal manufacturer's specification must satisfy this requirement.

(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance.

(3) Crystal tolerance affects radar sensor accuracy.

In the case where an external clock is used as the clock resource, the signal is fed to the CLKP pin only; CLKM

is grounded. The phase noise requirement is very important when a 40-MHz clock is fed externally. Table 8-6

lists the electrical characteristics of the external clock signal.

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Table 8-6. External Clock Mode Specifications

SPECIFICATION

PARAMETER

MIN

TYP

MAX

Frequency

MHz

mV (pp)

AC-Amplitude

700

0.00

1.6

1200

0.20

1.95

–132

–143

–152

–153

DC-V_il

DC-V_ih

Input Clock:

External AC-coupled sine wave or DC-

coupled square wave

Phase Noise at 1 kHz

Phase Noise at 10 kHz

Phase Noise at 100 kHz

Phase Noise at 1 MHz

Duty Cycle

dBc/Hz

Phase Noise referred to 40 MHz

Freq Tolerance

–50

ppm

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8.10.5 Multibuffered / Standard Serial Peripheral Interface (MibSPI)

8.10.5.1 Peripheral Description

The SPI uses a MibSPI Protocol by TI.

The MibSPI/SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of

programmed length (2 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate.

The MibSPI/SPI is normally used for communication between the microcontroller and external peripherals or

another microcontroller.

Standard and MibSPI modules have the following features:

•

16-bit shift register

Receive buffer register

8-bit baud clock generator

SPICLK can be internally-generated (master mode) or received from an external clock source

(slave mode)

•

Each word transferred can have a unique format.

SPI I/Os not used in the communication can be used as digital input/output signals

8.10.5.2 MibSPI Transmit and Receive RAM Organization

The Multibuffer RAM is comprised of 256 buffers. Each entry in the Multibuffer RAM consists of 4 parts: a 16-bit

transmit field, a 16-bit receive field, a 16-bit control field and a 16-bit status field. The Multibuffer RAM can be

partitioned into multiple transfer group with variable number of buffers each.

Section 8.10.5.2.2 and Section 8.10.5.2.3 assume the operating conditions stated in Section 8.10.5.2.1.

8.10.5.2.1 SPI Timing Conditions

MIN

TYP

MAX

UNIT

Input Conditions

t_R

t_F

Input rise time

Input fall time

Output Conditions

C_LOADOutput load capacitance

8.10.5.2.2 SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and

SPISOMI = input)

NO.^{(1) (2) (3)}

PARAMETER

Cycle time, SPICLK⁽⁴⁾

MIN

TYP

MAX UNIT

t_c(SPC)M

256_tc(VCLK)

t_w(SPCH)M

t_w(SPCL)M

t_w(SPCH)M

Pulse duration, SPICLK high (clock polarity = 0)

Pulse duration, SPICLK low (clock polarity = 1)

Pulse duration, SPICLK low (clock polarity = 0)

Pulse duration, SPICLK high (clock polarity = 1)

0.5t_c(SPC)M– 4

0.5t_c(SPC)M– 3

0.5t_c(SPC)M+ 4

2⁽⁴⁾

3⁽⁴⁾

t_d(SPCH-

Delay time, SPISIMO valid before SPICLK low, (clock

polarity = 0)

SIMO)M

4⁽⁴⁾

t_d(SPCL-

Delay time, SPISIMO valid before SPICLK high, (clock

polarity = 1)

0.5t_c(SPC)M– 3

SIMO)M

t_v(SPCL-

Valid time, SPISIMO data valid after SPICLK low, (clock 0.5t_c(SPC)M– 10.5

polarity = 0)

SIMO)M

5⁽⁴⁾

t_v(SPCH-

Valid time, SPISIMO data valid after SPICLK high, (clock 0.5t_c(SPC)M– 10.5

polarity = 1)

SIMO)M

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NO.^{(1) (2) (3)}

PARAMETER

MIN

TYP

CSHOLD = 0

CSHOLD = 1

CSHOLD = 0

CSHOLD = 1

(C2TDELAY+2)*t

_c(VCLK)– 7.5

(C2TDELAY+2)

Setup time CS active until SPICLK

high

(clock polarity = 0)

* t_c(VCLK)+ 7

(C2TDELAY +3)

* t_c(VCLK)– 7.5

(C2TDELAY+3)

* t_c(VCLK)+ 7

6⁽⁵⁾

t_C2TDELAY

(C2TDELAY+2)*t

_c(VCLK)– 7.5

(C2TDELAY+2)

* t_c(VCLK)+ 7

Setup time CS active until SPICLK

low

(clock polarity = 1)

(C2TDELAY +3)

* t_c(VCLK)– 7.5

(C2TDELAY+3)

* t_c(VCLK)+ 7

Hold time, SPICLK low until CS inactive (clock polarity =

0.5*t_c(SPC)M

(T2CDELAY + 1)

*t_c(VCLK)– 7

0.5*t_c(SPC)M

(T2CDELAY +

1) * t_c(VCLK)

7.5

7⁽⁵⁾

t_T2CDELAY

Hold time, SPICLK high until CS inactive (clock polarity =

0.5*t_c(SPC)M

(T2CDELAY + 1)

*t_c(VCLK)– 7

0.5*t_c(SPC)M

(T2CDELAY +

1) * t_c(VCLK)

7.5

t_su(SOMI-

Setup time, SPISOMI before SPICLK low

(clock polarity = 0)

SPCL)M

8⁽⁴⁾

t_su(SOMI-

Setup time, SPISOMI before SPICLK high

(clock polarity = 1)

SPCH)M

t_h(SPCL-

Hold time, SPISOMI data valid after SPICLK low

(clock polarity = 0)

SOMI)M

9⁽⁴⁾

t_h(SPCH-

Hold time, SPISOMI data valid after SPICLK high

(clock polarity = 1)

SOMI)M

(1) The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is cleared (where x= 0 or 1).

(2) t_{c(MSS_VCLK)}= main subsystem clock time = 1 / f_{(MSS_VCLK)}. For more details, see the Technical Reference Manual.

(3) When the SPI is in Master mode, the following must be true: For PS values from 1 to 255: t_c(SPC)M≥ (PS +1)t_{c(MSS_VCLK)}≥ 25ns, where

PS is the prescale value set in the SPIFMTx.[15:8] register bits. For PS values of 0: t_c(SPC)M= 2t_{c(MSS_VCLK)}≥ 25ns.

(4) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).

(5) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register

SPICLK

(clock polarity = 0)

SPICLK

(clock polarity = 1

Master Out Data Is Valid

SPISIMO

Master In Data

Must Be Valid

SPISOMI

Figure 8-6. SPI Master Mode External Timing (CLOCK PHASE = 0)

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Write to buffer

SPICLK

(clock polarity=0)

SPICLK

(clock polarity=1)

SPISIMO

SPICSn

Master Out Data Is Valid

Figure 8-7. SPI Master Mode Chip Select Timing (CLOCK PHASE = 0)

8.10.5.2.3 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output,

SPISIMO = output, and SPISOMI = input)

NO.^{(1) (2) (3)}

PARAMETER

Cycle time, SPICLK⁽⁴⁾

MIN

TYP

MAX UNIT

t_c(SPC)M

256t_c(VCLK)

t_w(SPCH)M

t_w(SPCL)M

t_w(SPCH)M

Pulse duration, SPICLK high (clock polarity = 0)

Pulse duration, SPICLK low (clock polarity = 1)

Pulse duration, SPICLK low (clock polarity = 0)

Pulse duration, SPICLK high (clock polarity = 1)

0.5t_c(SPC)M– 4

0.5t_c(SPC)M+ 4

2⁽⁴⁾

3⁽⁴⁾

t_d(SPCH-

Delay time, SPISIMO valid before SPICLK low, (clock polarity 0.5t_c(SPC)M– 3

= 0)

SIMO)M

4⁽⁴⁾

t_d(SPCL-

Delay time, SPISIMO valid before SPICLK high, (clock

polarity = 1)

0.5t_c(SPC)M– 3

SIMO)M

t_v(SPCL-

Valid time, SPISIMO data valid after SPICLK low, (clock

polarity = 0)

0.5t_c(SPC)M

–

10.5

SIMO)M

5⁽⁴⁾

t_v(SPCH-

Valid time, SPISIMO data valid after SPICLK high, (clock

polarity = 1)

0.5t_c(SPC)M

–

10.5

SIMO)M

t_C2TDELAY

Setup time CS active until SPICLK

high

(clock polarity = 0)

CSHOLD = 0

CSHOLD = 1

CSHOLD = 0

CSHOLD = 1

0.5*t_c(SPC)M

(C2TDELAY +

2)*t_c(VCLK)– 7

0.5*t_c(SPC)M

(C2TDELAY+2

) * t_c(VCLK)

7.5

0.5*t_c(SPC)M

(C2TDELAY +

2)*t_c(VCLK)– 7

0.5*t_c(SPC)M

(C2TDELAY+2

) * t_c(VCLK)

7.5

6⁽⁵⁾

0.5*t_c(SPC)M

(C2TDELAY+2

)*t_c(VCLK)– 7

0.5*t_c(SPC)M

(C2TDELAY+2

) * t_c(VCLK)

Setup time CS active until SPICLK

low

(clock polarity = 1)

7.5

0.5*t_c(SPC)M

(C2TDELAY+3

)*t_c(VCLK)– 7

0.5*t_c(SPC)M

(C2TDELAY+3

) * t_c(VCLK)

7.5

Hold time, SPICLK low until CS inactive (clock polarity = 0)

Hold time, SPICLK high until CS inactive (clock polarity = 1)

(T2CDELAY +

1) *t_c(VCLK)+ 7

1) *t_c(VCLK)

–

7.5

7⁽⁵⁾

t_T2CDELAY

(T2CDELAY +

1) *t_c(VCLK)+ 7

1) *t_c(VCLK)

–

7.5

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NO.^{(1) (2) (3)}

PARAMETER

MIN

TYP

t_su(SOMI-

Setup time, SPISOMI before SPICLK low

(clock polarity = 0)

SPCL)M

8⁽⁴⁾

t_su(SOMI-

Setup time, SPISOMI before SPICLK high

(clock polarity = 1)

SPCH)M

t_h(SPCL-

Hold time, SPISOMI data valid after SPICLK low

(clock polarity = 0)

SOMI)M

9⁽⁴⁾

t_h(SPCH-

Hold time, SPISOMI data valid after SPICLK high

(clock polarity = 1)

SOMI)M

(1) The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is set ( where x = 0 or 1 ).

(2) t_{c(MSS_VCLK)}= main subsystem clock time = 1 / f_{(MSS_VCLK)}. For more details, see the Technical Reference Manual.

(3) When the SPI is in Master mode, the following must be true: For PS values from 1 to 255: t_c(SPC)M≥ (PS +1)t_{c(MSS_VCLK)}≥ 25 ns,

where PS is the prescale value set in the SPIFMTx.[15:8] register bits. For PS values of 0: t_c(SPC)M= 2t_{c(MSS_VCLK)}≥ 25 ns.

(4) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).

(5) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register

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SPICLK

(clock polarity = 0)

SPICLK

(clock polarity = 1)

Master Out Data Is Valid

Data Valid

SPISIMO

Master In Data

Must Be Valid

SPISOMI

Figure 8-8. SPI Master Mode External Timing (CLOCK PHASE = 1)

Write to buffer

SPICLK

(clock polarity=0)

SPICLK

(clock polarity=1)

SPISIMO

SPICSn

Master Out Data Is Valid

Figure 8-9. SPI Master Mode Chip Select Timing (CLOCK PHASE = 1)

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8.10.5.3 SPI Slave Mode I/O Timings

8.10.5.3.1 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input,

and SPISOMI = output)^{(1) (2) (3)}

NO.

PARAMETER

MIN

TYP

MAX

UNIT

t_c(SPC)S

Cycle time, SPICLK⁽⁴⁾

t_w(SPCH)S

t_w(SPCL)S

t_w(SPCH)S

t_{d(SPCH-SOMI)S}

Pulse duration, SPICLK high (clock polarity = 0)

Pulse duration, SPICLK low (clock polarity = 1)

Pulse duration, SPICLK low (clock polarity = 0)

Pulse duration, SPICLK high (clock polarity = 1)

2⁽⁵⁾

3⁽⁵⁾

Delay time, SPISOMI valid after SPICLK high

(clock polarity = 0)

4⁽⁵⁾

t_{d(SPCL-SOMI)S}

t_{h(SPCH-SOMI)S}

t_{h(SPCL-SOMI)S}

Delay time, SPISOMI valid after SPICLK low (clock

polarity = 1)

Hold time, SPISOMI data valid after SPICLK high

(clock polarity = 0)

5⁽⁵⁾

Hold time, SPISOMI data valid after SPICLK low

(clock polarity = 1)

(1) The MASTER bit (SPIGCRx.0) is cleared ( where x = 0 or 1 ).

(2) The CLOCK PHASE bit (SPIFMTx.16) is either cleared or set for CLOCK PHASE = 0 or CLOCK PHASE = 1 respectively.

(3) t_{c(MSS_VCLK)}= main subsystem clock time = 1 / f_{(MSS_VCLK)}. For more details, see the Technical Reference Manual.

(4) When the SPI is in Slave mode, the following must be true: For PS values from 1 to 255: t_c(SPC)S≥ (PS +1)t_{c(MSS_VCLK)}≥ 25 ns, where

PS is the prescale value set in the SPIFMTx.[15:8] register bits.For PS values of 0: t_c(SPC)S= 2t_{c(MSS_VCLK)}≥ 25 ns.

(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).

SPICLK

(clock polarity = 0)

SPICLK

(clock polarity = 1)

SPISOMI

SPISOMI Data Is Valid

SPISIMO Data

Must Be Valid

SPISIMO

Figure 8-10. SPI Slave Mode External Timing (CLOCK PHASE = 0)

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SPICLK

(clock polarity = 0)

SPICLK

(clock polarity = 1)

SPISOMI

SPISOMI Data Is Valid

SPISIMO Data

Must Be Valid

SPISIMO

Figure 8-11. SPI Slave Mode External Timing (CLOCK PHASE = 1)

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8.10.5.4 Typical Interface Protocol Diagram (Slave Mode)

1. Host should ensure that there is a delay of two SPI clocks between CS going low and start of SPI clock.

2. Host should ensure that CS is toggled for every 16 bits of transfer through SPI.

Figure 8-12 shows the SPI communication timing of the typical interface protocol.

2 SPI clocks

CLK

0x4321

0x1234

CRC

0x5678

0x8765

MOSI

MISO

IRQ

0xDCBA

0xABCD

CRC

16 bytes

Figure 8-12. SPI Communication

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8.10.6 LVDS Interface Configuration

The supported AWR6843AOP LVDS lane configuration is two Data lanes (LVDS_TXP/M), one Bit Clock lane

(LVDS_CLKP/M) and one Frame clock lane (LVDS_FRCLKP/M). The LVDS interface is used for debugging. The

LVDS interface supports the following data rates:

•

900 Mbps (450 MHz DDR Clock)

600 Mbps (300 MHz DDR Clock)

450 Mbps (225 MHz DDR Clock)

400 Mbps (200 MHz DDR Clock)

300 Mbps (150 MHz DDR Clock)

225 Mbps (112.5 MHz DDR Clock)

150 Mbps (75 MHz DDR Clock)

Note that the bit clock is in DDR format and hence the numbers of toggles in the clock is equivalent to data.

LVDS_TXP/M

LVDS_FRCLKP/M

Data bitwidth

LVDS_CLKP/M

Figure 8-13. LVDS Interface Lane Configuration And Relative Timings

8.10.6.1 LVDS Interface Timings

Table 8-7. LVDS Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Duty Cycle Requirements

max 1 pF lumped capacitive load on

LVDS lanes

48%

52%

Output Differential Voltage

peak-to-peak single-ended with 100 Ω

resistive load between differential pairs

250

450

Output Offset Voltage

Trise and Tfall

1125

1275

20%-80%, 900 Mbps

900 Mbps

330

Jitter (pk-pk)

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Trise

LVDS_CLK

Clock Jitter = 6sigma

LVDS_TXP/M

LVDS_FRCLKP/M

1100 ps

Figure 8-14. Timing Parameters

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8.10.7 General-Purpose Input/Output

Section 8.10.7.1 lists the switching characteristics of output timing relative to load capacitance.

8.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (C_L)

PARAMETER^{(1) (2)}

TEST CONDITIONS

C_L= 20 pF

VIOIN = 1.8V

VIOIN = 3.3V

UNIT

2.8

6.4

9.4

2.8

6.4

9.4

3.3

6.7

9.6

3.1

6.6

9.6

3.0

6.9

10.2

2.8

6.6

9.8

3.3

7.2

10.5

3.1

6.6

9.6

t_r

t_f

t_r

t_f

Max rise time

C_L= 50 pF

C_L= 75 pF

Slew control = 0

C_L= 20 pF

C_L= 50 pF

C_L= 75 pF

C_L= 20 pF

C_L= 50 pF

C_L= 75 pF

C_L= 20 pF

C_L= 50 pF

C_L= 75 pF

Max fall time

Max rise time

Max fall time

Slew control = 1

(1) Slew control, which is configured by PADxx_CFG_REG, changes behavior of the output driver (faster or slower output slew rate).

(2) The rise/fall time is measured as the time taken by the signal to transition from 10% and 90% of VIOIN voltage.

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8.10.8 Controller Area Network - Flexible Data-rate (CAN-FD)

The device integrates two CAN-FD (CAN with Flexible Data-rate) interfaces which allows high throughput and

increased payload per data frame. This enables support of a typical use case where one CAN-FD interface is

used as an ECU network interface while the other as a local network interface, providing communication with the

neighboring sensors.

The CAN-FD has the following features:

•

Conforms with CAN Protocol 2.0 A, B and ISO 11898-1

Full CAN FD support (up to 64 data bytes per frame)

AUTOSAR and SAE J1939 support

Up to 32 dedicated Transmit Buffers

Configurable Transmit FIFO, up to 32 elements

Configurable Transmit Queue, up to 32 elements

Configurable Transmit Event FIFO, up to 32 elements

Up to 64 dedicated Receive Buffers

Two configurable Receive FIFOs, up to 64 elements each

Up to 128 11-bit filter elements

Internal Loopback mode for self-test

Mask-able interrupts, two interrupt lines

Two clock domains (CAN clock / Host clock)

Parity / ECC support - Message RAM single error correction and double error detection (SECDED)

mechanism

•

Full Message Memory capacity (4352 words).

8.10.8.1 Dynamic Characteristics for the CANx TX and RX Pins

PARAMETER

MIN

TYP

MAX

UNIT

t_{d(CANx_FD_TX)}

t_{d(CANx_FD_RX)}

Delay time, transmit shift register to

CANx_FD_TX pin⁽¹⁾

Delay time, CANx_FD_RX pin to receive shift

(1) These values do not include rise/fall times of the output buffer.

8.10.9 Serial Communication Interface (SCI)

The SCI has the following features:

•

Standard universal asynchronous receiver-transmitter (UART) communication

Standard non-return to zero (NRZ) format

Double-buffered receive and transmit functions

Asynchronous or iso-synchronous communication modes with no CLK pin

Capability to use Direct Memory Access (DMA) for transmit and receive data

Two external pins: RS232_RX and RS232_TX

8.10.9.1 SCI Timing Requirements

MIN

TYP

921.6

MAX

UNIT

f(baud)

Supported baud rate at 20 pF

kHz

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8.10.10 Inter-Integrated Circuit Interface (I2C)

The inter-integrated circuit (I2C) module is a multimaster communication module providing an interface between

devices compliant with Philips Semiconductor I2C-bus specification version 2.1 and connected by an I²C-bus™.

This module will support any slave or master I2C compatible device.

The I2C has the following features:

•

Compliance to the Philips I2C bus specification, v2.1 (The I2C Specification, Philips document number 9398

393 40011)

– Bit/Byte format transfer

– 7-bit and 10-bit device addressing modes

– General call

– START byte

– Multi-master transmitter/ slave receiver mode

– Multi-master receiver/ slave transmitter mode

– Combined master transmit/receive and receive/transmit mode

– Transfer rates of 100 kbps up to 400 kbps (Phillips fast-mode rate)

Free data format

Two DMA events (transmit and receive)

DMA event enable/disable capability

Module enable/disable capability

The SDA and SCL are optionally configurable as general purpose I/O

Slew rate control of the outputs

Open drain control of the outputs

Programmable pullup/pulldown capability on the inputs

Supports Ignore NACK mode

•

Note

This I2C module does not support:

•

High-speed (HS) mode

C-bus compatibility mode

The combined format in 10-bit address mode (the I2C sends the slave address second byte every

time it sends the slave address first byte)

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UNIT

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8.10.10.1 I2C Timing Requirements

(1)

STANDARD MODE

FAST MODE

MIN

MAX

MIN

2.5

MAX

t_c(SCL)

Cycle time, SCL

μs

t_{su(SCLH-SDAL)}

Setup time, SCL high before SDA low

(for a repeated START condition)

4.7

0.6

t_h(SCLL-SDAL)

Hold time, SCL low after SDA low

0.6

μs

(for a START and a repeated START condition)

t_w(SCLL)

Pulse duration, SCL low

4.7

1.3

0.6

100

μs

t_w(SCLH)

Pulse duration, SCL high

t_su(SDA-SCLH)

t_h(SCLL-SDA)

t_w(SDAH)

Setup time, SDA valid before SCL high

Hold time, SDA valid after SCL low

250

3.45⁽¹⁾

0.9

Pulse duration, SDA high between STOP and START

conditions

4.7

1.3

t_{su(SCLH-SDAH)}

t_w(SP)

Setup time, SCL high before SDA high

(for STOP condition)

0.6

μs

Pulse duration, spike (must be suppressed)

Capacitive load for each bus line

(2) (3)

C_b

400

(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered

down.

(2) The maximum th(SDA-SCLL) for I2C bus devices has only to be met if the device does not stretch the low period (tw(SCLL)) of the

SCL signal.

(3) C_b= total capacitance of one bus line in pF. If mixed with fast-mode devices, faster fall-times are allowed.

SDA

t_w(SDAH)

t_su(SDA-SCLH)

t_w(SP)

t_w(SCLL)

t_r(SCL)

t_{su(SCLH-SDAH)}

t_w(SCLH)

SCL

t_c(SCL)

t_h(SCLL-SDAL)

t_f(SCL)

t_h(SCLL-SDAL)

t_{su(SCLH-SDAL)}

t_h(SDA-SCLL)

Stop

Start

Repeated Start

Stop

Figure 8-15. I2C Timing Diagram

Note

•

A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the

VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL.

The maximum th(SDA-SCLL) has only to be met if the device does not stretch the LOW

period (tw(SCLL)) of the SCL signal. E.A Fast-mode I2C-bus device can be used in a Standard-

mode I2C-bus system, but the requirement t_su(SDA-SCLH)≥ 250 ns must then be met. This will

automatically be the case if the device does not stretch the LOW period of the SCL signal. If such

a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA

line tr max + t_su(SDA-SCLH)

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8.10.11 Quad Serial Peripheral Interface (QSPI)

The quad serial peripheral interface (QSPI) module is a kind of SPI module that allows single, dual, or quad

read access to external SPI devices. This module has a memory mapped register interface, which provides a

direct interface for accessing data from external SPI devices and thus simplifying software requirements. The

QSPI works as a master only. The QSPI in the device is primarily intended for fast booting from quad-SPI flash

memories.

The QSPI supports the following features:

•

Programmable clock divider

Six-pin interface

Programmable length (from 1 to 128 bits) of the words transferred

Programmable number (from 1 to 4096) of the words transferred

Support for 3-, 4-, or 6-pin SPI interface

Optional interrupt generation on word or frame (number of words) completion

Programmable delay between chip select activation and output data from 0 to 3 QSPI clock cycles

Section 8.10.11.2 and Section 8.10.11.3 assume the operating conditions stated in Section 8.10.11.1.

8.10.11.1 QSPI Timing Conditions

MIN

TYP

MAX

UNIT

Input Conditions

t_R

t_F

Input rise time

Input fall time

Output Conditions

C_LOAD

Output load capacitance

8.10.11.2 Timing Requirements for QSPI Input (Read) Timings

Clock Mode 0 (clk polarity = 0 ; clk phase = 0 ) is the mode of operation.⁽¹⁾

MIN

7.3

TYP

MAX

UNIT

t_su(D-SCLK)

t_h(SCLK-D)

t_su(D-SCLK)

t_h(SCLK-D)

Setup time, d[3:0] valid before falling sclk edge

Hold time, d[3:0] valid after falling sclk edge

1.5

Setup time, final d[3:0] bit valid before final falling sclk edge

Hold time, final d[3:0] bit valid after final falling sclk edge

7.3 – P⁽²⁾

1.5 + P⁽²⁾

(1) The Device captures data on the falling clock edge in Clock Mode 0, as opposed to the traditional rising clock edge. Although

non-standard, the falling-edge-based setup and hold time timings have been designed to be compatible with standard SPI devices that

launch data on the falling edge in Clock Mode 0.

(2) P = SCLK period in ns.

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8.10.11.3 QSPI Switching Characteristics

NO.

PARAMETER

Cycle time, sclk

MIN

TYP

MAX

UNIT

t_c(SCLK)

t_w(SCLKL)

t_w(SCLKH)

t_d(CS-SCLK)

Pulse duration, sclk low

Y*P – 3^{(1) (2)}

Y*P – 3⁽¹⁾

Pulse duration, sclk high

Delay time, sclk falling edge to cs active edge

–M*P + 2.5⁽¹⁾

–M*P – 1^{(1) (3)}

N*P – 1^{(1) (3)}

(3)

t_d(SCLK-CS)

Delay time, sclk falling edge to cs inactive edge

N*P + 2.5⁽¹⁾

(3)

t_d(SCLK-D1)

t_ena(CS-D1LZ)

t_dis(CS-D1Z)

t_d(SCLK-D1)

Delay time, sclk falling edge to d[1] transition

Enable time, cs active edge to d[1] driven (lo-z)

Disable time, cs active edge to d[1] tri-stated (hi-z)

–3.5

–P – 4⁽³⁾

–P +1⁽³⁾

Delay time, sclk first falling edge to first d[1] transition

(for PHA = 0 only)

–3.5 – P⁽³⁾

7 – P⁽³⁾

Q12

Q13

t_su(D-SCLK)

t_h(SCLK-D)

t_su(D-SCLK)

Setup time, d[3:0] valid before falling sclk edge

Hold time, d[3:0] valid after falling sclk edge

7.3

1.5

Setup time, final d[3:0] bit valid before final falling

sclk edge

Q14

Q15

7.3 — P⁽³⁾

1.5 + P⁽³⁾

t_h(SCLK-D)

Hold time, final d[3:0] bit valid after final falling sclk

edge

(1) The Y parameter is defined as follows: If DCLK_DIV is 0 or ODD then, Y equals 0.5. If DCLK_DIV is EVEN then, Y equals

(DCLK_DIV/2) / (DCLK_DIV+1). For best performance, it is recommended to use a DCLK_DIV of 0 or ODD to minimize the duty cycle

distortion. All required details about clock division factor DCLK_DIV can be found in the device-specific Technical Reference Manual.

(2) P = SCLK period in ns.

(3) M = QSPI_SPI_DC_REG.DDx + 1, N = 2

Figure 8-16. QSPI Read (Clock Mode 0)

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PHA=0

POL=0

sclk

Command

Bit n-1

Command

Bit n-2

Write Data

Bit 1

Write Data

Bit 0

d[0]

d[3:1]

SPRS85v_TIMING_OSPI1_04

Figure 8-17. QSPI Write (Clock Mode 0)

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8.10.12 ETM Trace Interface

Section 8.10.12.2 and List item.referenceTitle assume the recommended operating conditions stated in Section

8.10.12.1.

8.10.12.1 ETMTRACE Timing Conditions

MIN

TYP

MAX

UNIT

Output Conditions

C_LOAD

Output load capacitance

8.10.12.2 ETM TRACE Switching Characteristics

NO.

PARAMETER

Cycle time, TRACECLK period

Pulse Duration, TRACECLK High

Pulse Duration, TRACECLK Low

Clock and data rise time

MIN

TYP

MAX

UNIT

t_cyc(ETM)

t_h(ETM)

t_l(ETM)

t_r(ETM)

t_f(ETM)

3.3

Clock and data fall time

t_d(ETMTRACEDelay time, ETM trace clock high to ETM data valid

CLKH-

ETMDATAV)

t_d(ETMTRACEDelay time, ETM trace clock low to ETM data valid

CLKl-

ETMDATAV)

t_l(ETM)

t_h(ETM)

t_r(ETM)

t_f(ETM)

t_cyc(ETM)

Figure 8-18. ETMTRACECLKOUT Timing

Figure 8-19. ETMDATA Timing

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8.10.13 Data Modification Module (DMM)

A Data Modification Module (DMM) gives the ability to write external data into the device memory.

The DMM has the following features:

•

Acts as a bus master, thus enabling direct writes to the 4GB address space without CPU intervention

Writes to memory locations specified in the received packet (leverages packets defined by trace mode of the

RAM trace port [RTP] module)

•

Writes received data to consecutive addresses, which are specified by the DMM (leverages packets defined

by direct data mode of RTP module)

•

Configurable port width (1, 2, 4, 8, 16 pins)

Up to 100 Mbit/s pin data rate

8.10.13.1 DMM Timing Requirements

MIN

TYP

MAX

UNIT

t_cyc(DMM)

t_R

Clock period

Clock rise time

t_F

Clock fall time

t_h(DMM)

t_l(DMM)

t_ssu(DMM)

t_sh(DMM)

t_dsu(DMM)

t_dh(DMM)

High pulse width

Low pulse width

SYNC active to clk falling edge setup time

DMM clk falling edge to SYNC deactive hold time

DATA to DMM clk falling edge setup time

DMM clk falling edge to DATA hold time

t_l(DMM)

t_h(DMM)

t_f

t_r

t_cyc(DMM)

Figure 8-20. DMMCLK Timing

t_ssu(DMM)

t_sh(DMM)

DMMSYNC

DMMCLK

DMMDATA

t_dsu(DMM)

t_dh(DMM)

Figure 8-21. DMMDATA Timing

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8.10.14 JTAG Interface

Section 8.10.14.2 and Section 8.10.14.3 assume the operating conditions stated in Section 8.10.14.1.

8.10.14.1 JTAG Timing Conditions

MIN

TYP

MAX

UNIT

Input Conditions

t_R

t_F

Input rise time

Input fall time

Output Conditions

C_LOAD

Output load capacitance

8.10.14.2 Timing Requirements for IEEE 1149.1 JTAG

NO.

MIN

TYP

MAX

UNIT

t_c(TCK)

Cycle time TCK

66.66

26.67

2.5

t_w(TCKH)

Pulse duration TCK high (40% of tc)

Pulse duration TCK low(40% of tc)

Input setup time TDI valid to TCK high

Input setup time TMS valid to TCK high

Input hold time TDI valid from TCK high

Input hold time TMS valid from TCK high

t_w(TCKL)

t_su(TDI-TCK)

t_su(TMS-TCK)

t_h(TCK-TDI)

t_h(TCK-TMS)

2.5

8.10.14.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG

NO.

PARAMETER

MIN

TYP

MAX

UNIT

t_d(TCKL-TDOV)

Delay time, TCK low to TDO valid

TCK

TDO

TDI/TMS

SPRS91v_JTAG_01

Figure 8-22. JTAG Timing

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9 Detailed Description

9.1 Overview

The AWR6843AOP device includes the entire Millimeter Wave blocks and analog baseband signal chain for

three transmitters and four receivers, as well as a customer-programmable MCU and DSP. This device is

applicable as a radar-on-a-chip in use cases with modest requirements for memory, processing capacity, and

application code size.These could be cost-sensitive automotive applications that are evolving from 24-GHz

narrowband implementation and some emerging simple ultra-short-range radar applications. Typical application

examples for this device include:

•

Child presence detection

Occupant detection

Seat belt reminder

Gesture detection

Driver vital sign montioring

In terms of scalability, the AWR6843AOP device could be paired with a low-end external MCU, to address more

complex applications that might require additional memory for larger application software footprint and faster

interfaces. Because the AWR6843AOP device also provides high speed data interfaces like Serial-LVDS, it is

suitable for interfacing with more capable external processing blocks. Here system designers can choose the

AWR6843AOP to provide raw ADC data.

9.2 Functional Block Diagram

Antennas are on Package

QSPI

SPI

Serial Flash interface

LNA

ADC

Cortex R4F

@ 200MHz

External MCU interface

(User programmable)

PMIC control

SPI / I2C

CAN-FD

Digital Front-end

Data

RAM

Boot

ROM

Prog RAM

(Decimation filter

chain)

Primary Communication

Interfaces (Automotive)

DMA

Debug

UARTs

For debug

Main Sub-System

(Customer Programmed)

Test/Debug

JTAG for debug/development

Phase

Shift

Mailbox

High-speed ADC output

interface (for recording)

LVDS

HIL

Phase

Shift

Synth

(20 GHz)

Ramp

Generator

High-speed input for hardware-in-

loop verification

C674x DSP

@600 MHz

Phase

Shift

ADC

Buffer

Accel

L1P

(32kB)

L1D

(32kB)

(256kB)

GPADC

DMA

CRC

Temp

Osc.

Radar Data Memory

(L3)

DSP Sub-System

(Customer Programmed)

RF/Analog Sub-System

Figure 9-1. Functional Block Diagram

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9.3 Subsystems

9.3.1 RF and Analog Subsystem

The RF and analog subsystem includes the RF and analog circuitry – namely, the synthesizer, PA, LNA, mixer,

IF, and ADC. This subsystem also includes the crystal oscillator and temperature sensors. The three transmit

channels can be operated up to a maximum of two at a time (simultaneously) in 1.3-V mode. The three Transmit

channels simultaneous operation is supported only with 1-V LDO bypass and PA LDO disabled mode for

transmit beamforming purpose, as required. In this mode, the 1-V supply needs to be fed on the VIN_13RF1,

VIN_13RF2, and VOUT PA pin; whereas, the four receive channels can all be operated simultaneously.

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9.3.1.1 Clock Subsystem

The AWR6843AOP clock subsystem generates 60 to 64 GHz from an input reference of 40-MHz crystal. It

has a built-in oscillator circuit followed by a clean-up PLL and a RF synthesizer circuit. The output of the RF

synthesizer is then processed by an X3 multiplier to create the required frequency in the 60 to 64 GHz spectrum.

The RF synthesizer output is modulated by the timing engine block to create the required waveforms for effective

sensor operation.

The clean-up PLL also provides a reference clock for the host processor after system wakeup.

The clock subsystem also has built-in mechanisms for detecting the presence of a crystal and monitoring the

quality of the generated clock.

Figure 9-2 describes the clock subsystem.

Self Test

SYNC_OUT

RX LO

Timing Engine

x3 MULT

SYNC_IN

TX LO

RFSYNTH

Lock Detect

Clean-Up

PLL

SoC

Clock

XO / Slicer

CLK Detect

OSC_CLKOUT

40 MHz

Figure 9-2. Clock Subsystem

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9.3.1.2 Transmit Subsystem

The AWR6843AOP transmit subsystem consists of three parallel transmit chains, each with independent phase

and amplitude control. The device supports 6-bit linear phase modulation for MIMO radar and interference

mitigation.

The transmit chains also support programmable backoff for system optimization.

Figure 9-3 describes the transmit subsystem.

Self Test

Loopback

Path

Antenna on

package

∆N

6-bit linear phase

shifter

Figure 9-3. Transmit Subsystem (Per Channel)

9.3.1.3 Receive Subsystem

The AWR6843AOP receive subsystem consists of four parallel channels. A single receive channel consists of

an LNA, mixer, IF filtering, ADC conversion, and decimation. All four receive channels can be operational at the

same time an individual power-down option is also available for system optimization.

Unlike conventional real-only receivers, the AWR6843AOP device supports a complex baseband architecture,

which uses quadrature mixer and dual IF and ADC chains to provide complex I and Q outputs for each receiver

channel. The AWR6843AOP is targeted for fast chirp systems. The band-pass IF chain has configurable lower

cutoff frequencies above 175 kHz and can support bandwidths up to 10 MHz.

Figure 9-4 describes the receive subsystem.

Self Test

DAC

Loopback

Path

∆∑M

Antenna on

package

RSSI

∆∑M

DAC

Figure 9-4. Receive Subsystem (Per Channel)

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9.3.2 Processor Subsystem

Unified

128 KB x 2

ROM

Cache/

RAM

TCM A 512 KB

Main

R4F

L1P

32 KB

EDMA

DSP

HWA

HIL

JTAG

CRC

HIL

TCM B 192 KB

L1d

DSP/HWA Interconnect œ 128 bit @ 200 MHz

Main Interconnect

BSS Interconnect

Data

Handshake

Memory

CRC

ADC Buffer

Mail

Box

MSS

DMA

32 KB

32 KB Ping-Pong

(static sharing

with R4F Space)

Interconnect

LVDS

PWM,

PMIC

CLK

I²C

QSPI

UART

SPI

CAN-FD

Figure 9-5. Processor Subsystem

Figure 9-5shows the block diagram for customer programmable processor subsystems in the AWR6843AOP

device. At a high level there are two customer programmable subsystems, as shown separated by a dotted line

in the diagram. Left hand side shows the DSP Subsystem which contains TI's high-performance C674x DSP,

hardware accelerator, a high-bandwidth interconnect for high performance (128-bit, 200MHz), and associated

peripherals – four DMAs for data transfer,

LVDS interface for Measurement data output, L3 Radar data cube memory, ADC buffers, CRC engine, and data

handshake memory (additional memory provided on interconnect).

The C674x DSP and L1/L2 RAM portion of the DSP subsystem is not supported on the AWR6443 device and

therefore, the available memory is 1.4MB compared to 1.75MB on the IWR6843 device. For more information on

the features supported and not supported on each device, see the Device Features Comparison table.

The right side of the diagram shows the main subsystem. Main subsystem as name suggests is the master of

the device and controls all the device peripherals and house-keeping activities of the device. Main subsystem

contains Cortex-R4F (Main R4F) processor and associated peripherals and house-keeping components such as

DMAs, CRC and Peripherals (I²C, UART, SPIs, CAN-FD, PMIC clocking module, PWM, and others) connected

to Main Interconnect through Peripheral Central Resource (PCR interconnect).

Details of the DSP CPU core can be found at http://www.ti.com/product/TMS320C6748.

HIL module is shown in both the subsystems and can be used to perform the radar operations feeding the

captured data from outside into the device without involving the RF subsystem. HIL on main SS is for controlling

the configuration and HIL on DSPSS for high speed ADC data input to the device. Both HIL modules uses the

same IOs on the device, one additional IO (DMM_MUX_IN) allows selecting either of the two.

9.3.3 Automotive Interface

The AWR6843AOP communicates with the automotive network over the following main interfaces:

•

2 CAN-FD modules

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9.3.4 Host Interface

The host interface can be provided through a SPI, UART, or CAN-FD interface. In some cases the serial

interface for industrial applications is transcoded to a different serial standard.

This device communicates with the host radar processor over the following main interfaces:

•

Reference Clock – Reference clock available for host processor after device wakeup

Control – 4-port standard SPI (slave) for host control . All radio control commands (and response) flow

through this interface.

•

Reset – Active-low reset for device wakeup from host

Host Interrupt - an indication that the mmwave sensor needs host interface

Error – Used for notifying the host in case the radio controller detects a fault

9.3.5 Main Subsystem Cortex-R4F

The main system includes an ARM Cortex R4F processor, clock with a maximum operating frequency of

200 MHz. User applications executing on this processor control the overall operation of the device, including

radar control through well-defined API messages, radar signal processing (assisted by the radar hardware

accelerator), and peripherals for external interfaces.

See the Technical Reference Manual for a complete description and memory map.

9.3.6 DSP Subsystem

The DSP subsystem includes TI’s standard TMS320C674x megamodule and several blocks of internal memory

(L1P, L1D, and L2). For complete information including memory map, please refer to Technical Reference

Manual.

9.3.7 Hardware Accelerator

The Radar Hardware Accelerator (HWA) is an IP that enables off-loading the burden of certain frequently

used computations in FMCW radar signal processing from the main processor. FMCW radar signal processing

involves the use of FFT and Log-Magnitude computations to obtain a radar image across the range, velocity, and

angle dimensions. Some of the frequently used functions in FMCW radar signal processing can be done within

the radar hardware accelerator, while still retaining the flexibility of implementing other proprietary algorithms in

the main processor. See the Radar Hardware Accelerator User's Guide for a functional description and features

of this module and see the Technical Reference Manual for a complete list of register and memory map.

9.4 Other Subsystems

9.4.1 ADC Channels (Service) for User Application

The AWR6843AOP device includes provision for an ADC service for user application, where the

GPADC engine present inside the device can be used to measure up to six external voltages. The ADC1, ADC2,

ADC3, ADC4, ADC5, and ADC6 pins are used for this purpose.

•

ADC itself is controlled by TI firmware running inside the BIST subsystem and access to it for customer’s

external voltage monitoring purpose is via ‘monitoring API’ calls routed to the BIST subsystem. This API

could be linked with the user application running on the Main R4.

•

BIST subsystem firmware will internally schedule these measurements along with other RF and Analog

monitoring operations. The API allows configuring the settling time (number of ADC samples to skip) and

number of consecutive samples to take. At the end of a frame, the minimum, maximum and average of the

readings will be reported for each of the monitored voltages.

GPADC Specifications:

•

625 Ksps SAR ADC

0 to 1.8V input range

10-bit resolution

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•

For 5 out of the 6 inputs, an optional internal buffer (0.4-1.4V input range) is available. Without the buffer,

the ADC has a switched capacitor input load modeled with 5pF of sampling capacitance and 12pF parasitic

capacitance (GPADC channel 6, the internal buffer is not available).

ANALOG TEST 1-4,

GPADC

ANAMUX

VSENSE

A. GPADC structures are used for measuring the output of internal temperature sensors. The accuracy of these measurements is ±7°C.

Figure 9-6. ADC Path

9.4.1.1 GP-ADC Parameter

PARAMETER

TYP

1.8

UNIT

ADC supply

ADC unbuffered input voltage range

ADC buffered input voltage range⁽¹⁾

ADC resolution

0 – 1.8

0.4 – 1.3

bits

LSB

Ksps

ADC offset error

±5

ADC gain error

±5

ADC DNL

–1/+2.5

±2.5

625

400

ADC INL

ADC sample rate⁽²⁾

ADC sampling time⁽²⁾

ADC internal cap

ADC buffer input capacitance

ADC input leakage current

(1) Outside of given range, the buffer output will become nonlinear.

(2) ADC itself is controlled by TI firmware running inside the BIST subsystem. For more details please refer to the API calls.

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10 Monitoring and Diagnostics

10.1 Monitoring and Diagnostic Mechanisms

Table 10-1 is a list of the main monitoring and diagnostic mechanisms available in the Functional Safety-

Compliant targeted devices

Table 10-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Targeted Devices

FEATURE

DESCRIPTION

Device architecture supports hardware logic BIST (LBIST) engine self-test Controller (STC).

This logic is used to provide a very high diagnostic coverage (>90%) on the MSS R4F CPU

core and Vectored Interrupt Module (VIM) at a transistor level.

LBIST for the CPU and VIM need to be triggered by application code before starting the

functional safety application. CPU stays there in while loop and does not proceed further if a

fault is identified.

Boot time LBIST For MSS

R4F Core and associated

VIM

Main R4F has three Tightly coupled Memories (TCM) memories TCMA, TCMB0 and

TCMB1. Device architecture supports a hardware programmable memory BIST (PBIST)

engine. This logic is used to provide a very high diagnostic coverage (March-13n) on the

implemented MSS R4F TCMs at a transistor level.

PBIST for TCM memories is triggered by Bootloader at the boot time before starting

download of application from Flash or peripheral interface. CPU stays there in while loop

and does not proceed further if a fault is identified.

Boot time PBIST for MSS

R4F TCM Memories

TCMs diagnostic is supported by Single error correction double error detection (SECDED)

ECC diagnostic. An 8-bit code word is used to store the ECC data as calculated over the

64-bit data bus. ECC evaluation is done by the ECC control logic inside the CPU. This

scheme provides end-to-end diagnostics on the transmissions between CPU and TCM. CPU

can be configured to have predetermined response (Ignore or Abort generation) to single

and double bit error conditions.

End to End ECC for MSS

R4F TCM Memories

Logical TCM word and its associated ECC code is split and stored in two physical SRAM

banks. This scheme provides an inherent diagnostic mechanism for address decode failures

in the physical SRAM banks. Faults in the bank addressing are detected by the CPU as an

ECC fault.

Further, bit multiplexing scheme implemented such that the bits accessed to generate a

logical (CPU) word are not physically adjacent. This scheme helps to reduce the probability

of physical multi-bit faults resulting in logical multi-bit faults; rather they manifest as multiple

single bit faults. As the SECDED TCM ECC can correct a single bit fault in a logical word,

this scheme improves the usefulness of the TCM ECC diagnostic.

Main R4F TCM bit

multiplexing

Both these features are hardware features and cannot be enabled or disabled by application

software.

Device architecture supports Three Digital Clock Comparators (DCCs) and an internal

RCOSC. Dual functionality is provided by these modules – Clock detection and Clock

Monitoring.

DCCint is used to check the availability/range of Reference clock at boot otherwise the

device is moved into limp mode (Device still boots but on 10MHz RCOSC clock source.

This provides debug capability). DCCint is only used by boot loader during boot time. It is

disabled once the APLL is enabled and locked.

DCC1 is dedicated for APLL lock detection monitoring, comparing the APLL output divided

version with the Reference input clock of the device. Initially (before configuring APLL),

DCC1 is used by bootloader to identify the precise frequency of reference input clock

against the internal RCOSC clock source. Failure detection for DCC1 would cause the

device to go into limp mode.

Clock Monitor

DCC2 module is one which is available for user software . From the list of clock options

given in detailed spec, any two clocks can be compared. One example usage is to compare

the CPU clock with the Reference or internal RCOSC clock source. Failure detection is

indicated to the MSS R4F CPU via Error Signaling Module (ESM).

Device architecture supports the use of an internal watchdog that is implemented in the

real-time interrupt (RTI) module. The internal watchdog has two modes of operation: digital

watchdog (DWD) and digital windowed watchdog (DWWD). The modes of operation are

mutually exclusive; the designer can elect to use one mode or the other but not both at the

same time.

RTI/WD for MSS R4F

Watchdog can issue either an internal (warm) system reset or a CPU non-mask able

interrupt upon detection of a failure.

The Watchdog is enabled by the bootloader in DWD mode at boot time to track the boot

process. Once the application code takes up the control, Watchdog can be configured again

for mode and timings based on specific customer requirements.

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Table 10-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Targeted Devices

(continued)

FEATURE

DESCRIPTION

Cortex-R4F CPU includes an MPU. The MPU logic can be used to provide spatial

separation of software tasks in the device memory. Cortex-R4F MPU supports 12 regions.

It is expected that the operating system controls the MPU and changes the MPU settings

based on the needs of each task. A violation of a configured memory protection policy

results in a CPU abort.

MPU for MSS R4F

Device architecture supports a hardware programmable memory BIST (PBIST) engine for

Peripheral SRAMs as well.

PBIST for peripheral SRAM memories can be triggered by the application. User can elect

PBIST for Peripheral interface to run the PBIST on one SRAM or on groups of SRAMs based on the execution time,

SRAMs - SPIs, CAN-FDs

which can be allocated to the PBIST diagnostic. The PBIST tests are destructive to memory

contents, and as such are typically run only at boot time. However, the user has the freedom

to initiate the tests at any time if peripheral communication can be hindered.

Any fault detected by the PBIST results in an error indicated in PBIST status registers.

Peripheral interface SRAMs diagnostic is supported by Single error correction double error

detection (SECDED) ECC diagnostic. When a single or double bit error is detected the

ECC for Peripheral interface MSS R4F is notified via ESM (Error Signaling Module). This feature is disabled after reset.

SRAMs – SPIs, CAN-FDs

Software must configure and enable this feature in the peripheral and ESM module. ECC

failure (both single bit corrected and double bit uncorrectable error conditions) is reported to

the MSS R4F as an interrupt via ESM module.

All the Main SS peripherals (SPIs, CAN-FDs, I2C, DMAs, RTI/WD, DCCs, IOMUX etc.)

are connected to interconnect via Peripheral Central resource (PCR). This provides two

diagnostic mechanisms that can limit access to peripherals. Peripherals can be clock gated

per peripheral chip select in the PCR. This can be utilized to disable unused features such

that they cannot interfere. In addition, each peripheral chip select can be programmed to

limit access based on privilege level of transaction. This feature can be used to limit access

to entire peripherals to privileged operating system code only.

Configuration registers

protection for Main SS

peripherals

These diagnostic mechanisms are disabled after reset. Software must configure and enable

these mechanisms. Protection violation also generates an ‘aerror’ that result in abort to MSS

R4F or error response to other masters such as DMAs.

Device architecture supports hardware CRC engine on Main SS implementing the below

polynomials.

•

CRC16 CCITT – 0x10

CRC32 Ethernet – 0x04C11DB7

CRC64

CRC 32C – CASTAGNOLI – 0x1EDC6F4

CRC32P4 – E2E Profile4 – 0xF4ACFB1

CRC-8 – H2F Autosar – 0x2F

CRC-8 – VDA CAN-FD – 0x1D

Cyclic Redundancy Check –

Main SS

The read operation of the SRAM contents to the CRC can be done by CPU or by DMA.

The comparison of results, indication of fault, and fault response are the responsibility of the

software managing the test.

Device architecture supports MPUs on Main SS DMAs. Failure detection by MPU is reported

to the MSS R4F CPU core as an interrupt via ESM.

MPU for DMAs

DSPSS’s high performance EDMAs also includes MPUs on both read and writes master

ports. EDMA MPUs supports 8 regions. Failure detection by MPU is reported to the DSP

core as an interrupt via local ESM.

Device architecture supports hardware logic BIST (LBIST) even for BIST R4F core and

associated VIM module. This logic provides very high diagnostic coverage (>90%) on the

BIST R4F CPU core and VIM.

This is triggered by MSS R4F boot loader at boot time and it does not proceed further if the

fault is detected.

Boot time LBIST For BIST

R4F Core and associated

VIM

Device architecture supports a hardware programmable memory BIST (PBIST) engine for

BIST R4F TCMs which provide a very high diagnostic coverage (March-13n) on the BIST

R4F TCMs.

PBIST is triggered by MSS R4F Bootloader at the boot time and it does not proceed further

if the fault is detected.

Boot time PBIST for BIST

R4F TCM Memories

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Table 10-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Targeted Devices

(continued)

FEATURE

DESCRIPTION

BIST R4F TCMs diagnostic is supported by Single error correction double error detection

(SECDED) ECC diagnostic. Single bit error is communicated to the BIST R4FCPU while

double bit error is communicated to MSS R4F as an interrupt so that application code

becomes aware of this and takes appropriate action.

End to End ECC for BIST

R4F TCM Memories

Logical TCM word and its associated ECC code is split and stored in two physical SRAM

banks. This scheme provides an inherent diagnostic mechanism for address decode failures

in the physical SRAM banks and helps to reduce the probability of physical multi-bit faults

resulting in logical multi-bit faults.

BIST R4F TCM bit

multiplexing

Device architecture supports an internal watchdog for BIST R4F. Timeout condition is

reported via an interrupt to MSS R4F and rest is left to application code to either go for

SW reset for BIST SS or warm reset for the device to come out of faulty condition.

RTI/WD for BIST R4F

Device architecture supports a hardware programmable memory BIST (PBIST) engine for

DSPSS’s L1P, L1D, L2 and L3 memories which provide a very high diagnostic coverage

(March-13n).

PBIST is triggered by MSS R4F Bootloader at the boot time and it does not proceed further

if the fault is detected.

Boot time PBIST for L1P,

L1D, L2 and L3 Memories

Device architecture supports Parity diagnostic on DSP’s L1P memory. Parity error is

reported to the CPU as an interrupt.

Note:- L1D memory is not covered by parity or ECC and need to be covered by application

level diagnostics.

Parity on L1P

Device architecture supports both Parity Single error correction double error detection

(SECDED) ECC diagnostic on DSP’s L2 memory. L2 Memory is a unified 256KB of memory

used to store program and Data sections for the DSP. A 12-bit code word is used to store the

ECC data as calculated over the 256-bit data bus (logical instruction fetch size). The ECC

logic for the L2 access is located in the DSP and evaluation is done by the ECC control logic

inside the DSP. This scheme provides end-to-end diagnostics on the transmissions between

DSP and L2. Byte aligned Parity mechanism is also available on L2 to take care of data

section.

ECC on DSP’s L2 Memory

L3 memory is used as Radar data section in Device. Device architecture supports Single

error correction double error detection (SECDED) ECC diagnostic on L3 memory. An 8-bit

code word is used to store the ECC data as calculated over the 64-bit data bus.

Failure detection by ECC logic is reported to the MSS R4F CPU core as an interrupt via

ESM.

ECC on Radar Data Cube

(L3) Memory

Device architecture supports the use of an internal watchdog for BIST R4F that is

implemented in the real-time interrupt (RTI) module – replication of same module as used in

Main SS. This module supports same features as that of RTI/WD for Main/BIST R4F.

This watchdog is enabled by customer application code and Timeout condition is reported

via an interrupt to MSS R4F and rest is left to application code in MSS R4F to either go for

SW reset for DSP SS or warm reset for the device to come out of faulty condition.

RTI/WD for DSP Core

Device architecture supports dedicated hardware CRC on DSPSS implementing the below

polynomials.

•

CRC16 CCITT - 0x10

CRC32 Ethernet - 0x04C11DB7

CRC64

CRC for DSP Sub-System

The read of SRAM contents to the CRC can be done by DSP CPU or by DMA. The

comparison of results, indication of fault, and fault response are the responsibility of the

software managing the test.

Device architecture supports MPUs for DSP memory accesses (L1D, L1P, and L2). L2

memory supports 64 regions and 16 regions for L1P and L1D each. Failure detection by

MPU is reported to the DSP core as an abort.

MPU for DSP

Device architecture supports various temperature sensors all across the device (next to

power hungry modules such as PAs, DSP etc) which is monitored during the inter-frame

period.⁽¹⁾

Temperature Sensors

Tx Power Monitors

Device architecture supports power detectors at the Tx output.⁽²⁾

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Table 10-1. Monitoring and Diagnostic Mechanisms for Functional Safety-Compliant Targeted Devices

(continued)

FEATURE

DESCRIPTION

When a diagnostic detects a fault, the error must be indicated. The device architecture

provides aggregation of fault indication from internal monitoring/diagnostic mechanisms

using a peripheral logic known as the Error Signaling Module (ESM). The ESM provides

mechanisms to classify errors by severity and to provide programmable error response.

ESM module is configured by customer application code and specific error signals can be

enabled or masked to generate an interrupt (Low/High priority) for the MSS R4F CPU.

Device supports Nerror output signal (IO) which can be monitored externally to identify any

kind of high severity faults in the design which could not be handled by the R4F.

Error Signaling

Error Output

Monitors Synthesizer’s frequency ramp by counting (divided-down) clock cycles and

comparing to ideal frequency ramp. Excess frequency errors above a certain threshold, if

any, are detected and reported.

Synthesizer (Chirp) frequency

monitor

Device architecture supports a ball break detection mechanism based on Impedance

measurement at the TX output(s) to detect and report any large deviations that can indicate

a ball break.

Monitoring is done by TIs code running on BIST R4F and failure is reported to the MSS R4F

via Mailbox.

Ball break detection for TX

ports (TX Ball break monitor)

It is completely up to customer SW to decide on the appropriate action based on the

message from BIST R4F.

Built-in TX to RX loopback to enable detection of failures in the RX path(s), including Gain,

inter-RX balance, etc.

RX loopback test

Built-in IF (square wave) test tone input to monitor IF filter’s frequency response and detect

failure.

IF loopback test

Provision to detect ADC saturation due to excessive incoming signal level and/or

interference.

RX saturation detect

Boot time LBIST for DSP core

Device device supports boot time LBIST for the DSP Core. LBIST can be triggered by the

MSS R4F application code during boot time.

(1) Monitoring is done by the TI's code running on BIST R4F. There are two modes in which it could be configured to report the

temperature sensed via API by customer application.

a. Report the temperature sensed after every N frames

b. Report the condition once the temperature crosses programmed threshold.

It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4Fvia Mailbox.

(2) Monitoring is done by the TI's code running on BIST R4F.

There are two modes in which it could be configured to report the detected output power via API by customer application.

a. Report the power detected after every N frames

b. Report the condition once the output power degrades by more than configured threshold from the configured.

It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4F.

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10.1.1 Error Signaling Module

When a diagnostic detects a fault, the error must be indicated. AWR6843AOP architecture provides aggregation

of fault indication from internal diagnostic mechanisms using a peripheral logic known as the error signaling

module (ESM). The ESM provides mechanisms to classify faults by severity and allows programmable error

response. Below is the high level block diagram for ESM module.

Low Priority

Interrupt

Interrupy

Handing

Error Group 1

Interrupt Enable

High Priority

Interrupt

Handing

High Priority

Interrupy

Interrupt Priority

Error Group 2

Error Group 3

Nerror Enable

Error Signal

Handling

Device Output

Figure 10-1. ESM Module Diagram

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11 Applications, Implementation, and Layout

Note

Information in the following Applications section is not part of the TI component specification, and

TI does not warrant its accuracy or completeness. TI's customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

11.1 Application Information

Application information can be found on AWR Application web page.

11.2 Reference Schematic

The reference schematic and power supply information can be found in the AWR6843AOP EVM Documentation.

Listed for convenience are: Design Files, Schematics, Layouts, and Stack up for PCB.

•

Altium XWR6843 EVM Design Files

XWR6843 EVM Schematic Drawing, Assembly Drawing, and Bill of Materials

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SWRS246B – NOVEMBER 2020 – REVISED JUNE 2021

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12 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions follow.

12.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix)

(for example, AWR6843AOP). Texas Instruments recommends two of three possible prefix designators for its

support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from

engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

XA Experimental device that is not necessarily representative of the final device's electrical specifications and

may not use production assembly flow.

Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical

specifications.

null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.

TMDS Fully-qualified development-support product.

XA and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and

reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XA or P) have a greater failure rate than the standard production

devices. Texas Instruments recommends that these devices not be used in any production system because their

expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package

type (for example, ALP0180), the temperature range (for example, blank is the default automotive temperature

range). Figure 12-1 provides a legend for reading the complete device name for any AWR6843AOP device.

For orderable part numbers of AWR6843AOP devices in the ALP0180 package types, see the Package Option

Addendum of this document, the TI website ( www.ti.com ),or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the AWR6843AOP Device

Errata .

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SWRS246B – NOVEMBER 2020 – REVISED JUNE 2021

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ALP

AWR

Qualification

Blank= no special qual

Q1 = AEC-Q100

Prefix

XA = Pre-production Automotive

AWR = Production Automotive

Tray or Tape & Reel

R = Tape & Reel

Blank = Tray

Generation

1 = 77 GHz Band

6 = 60 GHz Band

Package

ALP = 180-Ball FCBGA, Rev2.0

Variant

2 = FE

Security

4 = FE + FFT + MCU

6 = FE + MCU + DSP

8 = FE + MCU + FFT + DSP

G = General

S = Secure

Num RX/TX Channels

RX = 1,2,3,4

TX = 1,2,3

Silicon PG Revision

A = Rev2.0

Features

Blank = baseline

R = Antenna on Package (AoP)

Safety Level

B = ASIL B

Figure 12-1. Device Nomenclature

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12.2 Tools and Software

Models

xWR6843AOP BSDL model

Boundary scan database of testable input and output pins for IEEE 1149.1 of

the specific device.

xWR6843AOP IBIS model

IO buffer information model for the IO buffers of the device. For simulation on a

circuit board, see IBIS Open Forum.

xWR6843AOP checklist for

schematic review, layout

review,bringup/wakeup

A set of steps in spreadsheet form to select system functions and pinmux

options. Specific EVM schematic and layout notes to apply to customer

engineering. A bring up checklist is suggested for customers.

12.3 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

The current documentation that describes the DSP, related peripherals, and other technical collateral follows.

Errata

AWR6843AOP Device Errata Describes known advisories, limitations, and cautions on silicon and provides

workarounds.

12.4 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.5 Trademarks

TI E2E^™is a trademark of Texas Instruments.

Arm^®and Cortex^®are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

All trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

12.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

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13 Mechanical, Packaging, and Orderable Information

13.1 Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Note

Variability in the color (or appearance) of Texas Instrument’s (TI’s) Antenna-on-Package (AoP) product

is normal and expected. This variation is not indicative of any degradation or variability to the

performance specifications of the AoP products.

13.2 Tray Information for ALP, 15 × 15 mm

Package

Type

Package

Name

Unit Array

Matrix

Max Temp.

(°C)

(mm)

Device

Pins

SPQ

(mm)

AWR6843ARBGALPQ1

AWR6843ARBSALPQ1

FCBGA

ALP

180

126

7x18

150

315

135.9

7.62

17.2

11.30

16.35

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PACKAGE OPTION ADDENDUM

www.ti.com

8-Jun-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

XA6843ARBGALP

ACTIVE

FCBGA

ALP

180

126

Non-RoHS &

Non-Green

Call TI

-40 to 125

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OUTLINE

ALP0180A

FCBGA - 0.965 mm max height

PLASTIC BALL GRID ARRAY

15.1

14.9

BALL A1

CORNER

15.1

14.9

0.965 MAX

SEATING PLANE

0.2 C

0.53

0.27

13.6 TYP

SYMM

(0.7)

(2.85)

(4.03)

SYMM

(9.29)

13.6

TYP

(6.94)

(0.15) TYP

ALL AROUND

10 11 12 13 14 15 16 17 18

0.8 TYP

0.612

0.512

180X

0.8 TYP

(7.1)

(3.58)

(2.85)

0.15

0.08

C A B

(9.29)

4225336/A 09/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

ALP0180A

FCBGA - 0.965 mm max height

PLASTIC BALL GRID ARRAY

(0.8) TYP

180X ( 0.4)

10 11 12 13 14 15 16 17 18

(0.8) TYP

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 6X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

METAL UNDER

SOLDER MASK

EXPOSED METAL

(

0.4)

(

0.4)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

EXPOSED METAL

METAL EDGE

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4225336/A 09/2019

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).

www.ti.com

EXAMPLE STENCIL DESIGN

ALP0180A

FCBGA - 0.965 mm max height

PLASTIC BALL GRID ARRAY

(0.8) TYP

180X ( 0.4)

10 11 12 13 14 15 16 17 18

(0.8) TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 6X

4225336/A 09/2019

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

1-Jul-2021

PACKAGING INFORMATION

Orderable Device

AWR6843ARBGALPQ1

AWR6843ARBGALPRQ1

AWR6843ARBSALPQ1

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

-40 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

ACTIVE

FCBGA

ALP

180

126

RoHS &

Non-Green

SNAGCU

Level---

AWR6843

AWR6843 BG

ACTIVE

ALP

1000

126

RoHS &

Non-Green

SNAGCU

-40 to 125

AWR6843

AWR6843 BG

RoHS &

-40 to 125

Non-Green

AWR6843

AWR6843 BS

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Jul-2021

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE OUTLINE

ALP0180A

FCBGA - 0.965 mm max height

PLASTIC BALL GRID ARRAY

15.1

14.9

BALL A1

CORNER

15.1

14.9

0.965 MAX

SEATING PLANE

0.2 C

0.53

0.27

13.6 TYP

SYMM

(0.7)

(2.85)

(4.03)

SYMM

(9.29)

13.6

TYP

(6.94)

(0.15) TYP

ALL AROUND

10 11 12 13 14 15 16 17 18

0.8 TYP

0.612

0.512

180X

0.8 TYP

(7.1)

(3.58)

(2.85)

0.15

0.08

C A B

(9.29)

4225336/A 09/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

ALP0180A

FCBGA - 0.965 mm max height

PLASTIC BALL GRID ARRAY

(0.8) TYP

180X ( 0.4)

10 11 12 13 14 15 16 17 18

(0.8) TYP

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 6X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

METAL UNDER

SOLDER MASK

EXPOSED METAL

(

0.4)

(

0.4)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

EXPOSED METAL

METAL EDGE

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4225336/A 09/2019

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).

www.ti.com

EXAMPLE STENCIL DESIGN

ALP0180A

FCBGA - 0.965 mm max height

PLASTIC BALL GRID ARRAY

(0.8) TYP

180X ( 0.4)

10 11 12 13 14 15 16 17 18

(0.8) TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 6X

4225336/A 09/2019

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party

intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,

costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either

on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s

applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

AWR6843ARBSALPQ1 [TI]

相关型号：

AWR6843ARBSALPRQ1

AWR6843_V02

AWR8001

AWR8001S5C

AWRCFREQ1MA

AWRCFREQ1MA-AMMO

AWRCFREQ1MD

AWRCFREQ1MD-AMMO

AWRCFREQ1MS

AWRCFREQ1MS-AMMO

AWRCFREQ2MA

AWRCFREQ2MA-AMMO