BQ20Z70-V150 [TI]
采用 Impedance Track™ 技术且符合 SBS 1.1 标准的电量监测计;
| 型号： | BQ20Z70-V150 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 Impedance Track™ 技术且符合 SBS 1.1 标准的电量监测计 |
| 文件： | 总20页 (文件大小：536K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
bq20z70
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™
TECHNOLOGY FOR USE WITH THE bq29330
FEATURES
APPLICATIONS
•
•
•
Notebook PCs
Medical and Test Equipment
Portable Instrumentation
•
Next Generation Patented Impedance Track™
Technology accurately Measures Available
Charge in Li-Ion and Li-Polymer Batteries
•
•
•
•
•
Better than 1% Error Over Lifetime of the
Battery
DESCRIPTION
Instant Accuracy – No Learning Cycle
Required
The bq20z70 SBS-compliant gas gauge IC,
incorporating
patented
Impedance
Track™
technology, is designed for battery-pack or in-system
installation. The bq20z70 measures and maintains
an accurate record of available charge in Li-ion or
Supports the Smart Battery Specification SBS
V1.1
Powerful 8-Bit RISC CPU With Ultra-Low
Power Modes
Li-polymer
batteries
using
its
integrated
high-performance analog peripherals. The bq20z70
monitors capacity change, battery impedance,
open-circuit voltage, and other critical parameters of
the battery pack, and reports the information to the
system host controller over a serial-communication
bus. It is designed to work with the bq29330 analog
front-end (AFE) protection IC to maximize
functionality and safety, and minimize component
count and cost in smart battery circuits.
Works With the TI bq29330 Analog Front-End
(AFE) Protection IC to Provide Complete Pack
Electronics Solution
•
Full Array of Programmable Protection
Features
–
Voltage, Current and Temperature
•
•
Fully Integrated High Accurate Clock
Flexible Configuration for 2 to 4 Series Li-Ion
and Li-Polymer Cells
The Impedance Track technology continuously
analyzes the battery impedance, resulting in superior
gas-gauging accuracy. This enables remaining
capacity to be calculated with discharge rate,
temperature, and cell aging all accounted for during
each stage of every cycle.
•
Integrated Field Programmable FLASH
Memory Eliminates the Need for External
Configuration Memory
•
•
Smart Battery Charger Control Feature
Two 16-Bit Delta-Sigma Converter
AVAILABLE OPTIONS
PACKAGE(1)
–
Accurate Voltage and Temperature
Measurements
TA
20-PIN TSSOP (PW)
Tube
20-PIN TSSOP (PW)
Tape and Reel
–
Integrating Coloumb Counter for Charge
Flow
–40°C to
85°C
bq20z70PW(2)
bq20z70PWR(3)
–
–
Better Than 0.65 nVh of Resolution
Self-Calibrating
(1) For the most current package and ordering information, see
the Package Option Addendum at the end of this document,
or see the TI website at www.ti.com.
(2) A single tube quantity is 50 units.
(3) A single reel quantity is 2000 units
•
•
Supports SHA-1 Authentication
20-Pin TSSOP (PW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IMPEDANCE TRACK is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
bq20z70
www.ti.com
SLUS686B–NOVEMBER 2005–REVISED JULY 2007
SYSTEM PARTITIONING DIAGRAM
Pack +
Fuse
Therm
Temperature
Measurement
& Protection
LDO
& Therm. Drive
Fail Safe
Protection
N-CH FET
Drive
&
Reset
Supply Voltage
Reset
Watchdog &
Protection
Timing
Charging
Algorithm
32kHz Clock
Generator
Charge Pumps
32KHz
bq29330
Validation &
Control
SMBus
Registers
SBS v1.1
Data
Alert
System
System
I2C
Interface
Interface
Overvoltage &
Cell & Pack
Voltage
Measurement
SHA-1
Voltage Level
Translator
Undervoltage
Authentication
Protection
Cell Balancing
Overrcurrent
Algorithm &
Protection
Impedance
Track™ Gas
Gauging
Overcurrent &
Short Circuit
Protection
Control
bq20z70
bq29330
bq294xy
Pack -
RSNS
5mΩ – 20mΩ typ.
TSSOP (PW)
(TOP VIEW)
XALERT
TS2
1
20
19
18
17
16
15
14
13
12
11
VCELL-
VCELL+
VCC
2
TS1
3
CLKOUT
PRES
PFIN
4
VSS
5
MRST
SRN
6
SAFE
SMBD
NC
7
SRP
8
VSS
9
SCLK
SDATA
SMBC
10
2
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
TERMINAL FUNCTIONS
TERMINAL
I/O(1)
DESCRIPTION
NO.
1
NAME
XALERT
TS2
I
Alert interrupt input from bq29330. Connect directly to bq29330 XALERT pin
2nd thermistor voltage input connection to monitor temperature
1st thermistor voltage input connection to monitor temperature
32.768kHz output for bq29330 watchdog. Connect directly to bq29330 WDI pin
Active low input to sense system insertion
2
I
I
3
TS1
4
CLKOUT
PRES
PFIN
O
5
I
6
I
Active low input to sense secondary protector output status
Active high output to enforce additional level of safety, e.g. fuse blow
SMBus data open drain bidirectional pin used for communication with bq20z70
Not used - leave floating
7
SAFE
SMBD
NC
O
8
I/OD
–
9
10
11
12
13
14
15
SMBC
SDATA
SCLK
VSS
I/OD
I/OD
I/OD
I/OD
IA
SMBus clock open drain bidirectional pin used for communication with bq20z70
Data transfer line from and to bq29330. Connect directly to SDATA pin of bq29330
Data clock line to bq29330. Connect directly to SCLK pin of bq29330
VSS
SRP
Connection for a small-value resistor to monitor the battery charge and discharge current flow
Connection for a small-value resistor to monitor the battery charge and discharge current flow
SRN
IA
Master reset input that forces the device into reset when held low. Connect directly to XRST pin of
bq29330
16
MRST
I
17
18
19
20
VSS
VCC
P
P
I
Negative supply. Both VSS needs to be connected together
Positive supply
VCELL+
VCELL-
Positive differential cell input. Connect directly to CELL+ pin of bq29330
Negative differential cell input. Connect directly to CELL- pin of bq29330
I
(1) I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
RANGE
(2)
VCC relative to VSS
V(IOD) relative to VSS
Supply voltage range on VCC pin
–0.3 V to 2.75 V
–0.3 V to 6.0 V
(2)
XALERT, PFIN, SAFE, SMBD, SMBC, SDATA, SCLK,
TS2, TS1, CLKOUT, PRES, SRP, SRN, MRST, VCELL+,VCELL-
Operating free-air temperature range
(2)
VI relative to VSS
–0.3 V to VCC + 0.3 V
–40°C to 85°C
TA
Tstg
Storage temperature range
–65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) VSS refers to Voltage at VSS pin.
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
ELECTRICAL CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = -40°C - 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VDDA and VDDD
No flash programming
bq20z70 + bq29330
Sleep mode
MIN
TYP
2.5
400(1)
MAX UNIT
VDD Supply voltage
2.4
2.6
V
IDD
Operating mode current
μA
475
8(1)
I(SLP) Low-power storage mode current
I(SLP) Shutdown Current
μA
μA
bq20z70 + bq29330
Shutdown Mode
bq20z70 + bq29330
IOL = 7 mA
48
0.1(1)
0.2
Output voltage low CLKOUT, SAFE, SMBD, SMBC, SDATA,
0.4
0.8
VOL
V
V
SCLK
VOH Output high voltage CLKOUT, SAFE, SMBD,SMBC, SDATA,
SCLK
IOH = –0.5 mA
VCC – 0.5
VIL
VIH
CIN
Input voltage low PRES, PFIN, SMBD, SMBC, SDATA, MRST
Input voltage high PRES, PFIN, SMBD, SMBC, SDATA, MRST
Input capacitance
V
V
2.0
5
pF
V(AI1) Input voltage range TS1, TS2, VCELL+, VCELL-
V(AI2) Input voltage range SRP, SRN
– 0.2
– 0.2
8
0.8 x VCC
0.2
V
Z(AI1) Input impedance TS1, TS2, VCELL+, VCELL -
Z(AI2) Input impedance SRP, SRN
0 V – 1 V
0 V – 1 V
MΩ
MΩ
2.5
(1) This value does not include the bq29330
POWER-ON RESET
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
1.8
MAX UNIT
VIT–
Negative-going voltage input
Power-on reset hysteresis
1.7
50
1.9
V
VHYS
125
200
mV
1.81
1.8
1.79
1.78
1.77
1.76
-40
-20
0
20
40
60
80
TA - Free-Air Temperature - °C
4
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(SR) = V(SRP) – V(SRN)
TA =25°C to 85°C
MIN
TYP
MAX UNIT
V(SR)
Input voltage range, V(SRN) and V(SRP)
–0.20
0.20
V
V(SROS) Input offset
10
μV
INL
Integral nonlinearity error
±0.007% ±0.037%
OSCILLATOR
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
HIGH FREQUENCY OSCILLATOR
f (OSC)
f (EIO)
f (sxo)
Operating frequency
4.194
0.25%
0.25%
2.5
MHz
3%
-3%
-2%
(1)(2)
Frequency error
T A = 20°C to 70°C
2%
(3)
Start-up time
5
ms
LOW FREQUENCY OSCILLATOR
f (LOSC) Operating frequency
32.768
0.25%
0.25%
kHz
-2.5%
-1.5%
2.5%
1.5%
500
(2)(4)
f (LEIO)
f (Lsxo)
Frequency error
T A = 20°C to 70°C
(5)
Start-up time
μs
(1) The frequency error is measured from 4.194 MHz.
(2) The frequency drift is included and measured f rom the trimmed frequency at V CC = 2.5 V, T A = 25°C.
(3) The start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency.
(4) The frequency error is measured from 32.768 kHz.
(5) The start-up time is defined as the time it takes for the oscillator output frequency to be ±3%.
DATA FLASH MEMORY CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Data retention
Flash programming write-cycles
t(WORDPROG) Word programming time
TEST CONDITIONS
MIN
10
TYP
MAX UNIT
Years
(1)
(1)
(1)
(1)
tDR
See
See
See
See
20,000
Cycles
2
ms
I(DDPROG)
Flash-write and erase supply current
5
10
mA
(1) Specified by design. Not production tested
5
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
SMBus TIMING SPECIFICATIONS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
fSMB
SMBus operating frequency
SMBus master clock frequency
Bus free time between start and stop
Hold time after (repeated) start
Repeated start setup time
Stop setup time
Slave mode, SMBC 50% duty cycle
10
100
kHz
fMAS
Master mode, no clock low slave extend
51.2
tBUF
4.7
4
tHD:STA
tSU:STA
tSU:STO
μs
4.7
4
Receive mode
Transmit mode
0
tHD:DAT
Data hold time
300
250
25
4.7
4
ns
tSU:DAT
tTIMEOUT
tLOW
Data setup time
Error signal/detect
Clock low period
Clock high period
(1)
See
35
ms
μs
(2)
tHIGH
See
50
25
(3)
tLOW:SEXT Cumulative clock low slave extend time
tLOW:MEXT Cumulative clock low master extend time
See
ms
ns
(4)
See
10
tF
Clock/data fall time
Clock/data rise time
(VILMAX – 0.15 V) to (VIHMIN + 0.15 V)
0.9 VCC to (VILMAX – 0.15 V)
300
1000
tR
(1) The bq20z70 times out when any clock low exceeds tTIMEOUT
.
(2) tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z70 that is in progress.
(3) tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
(4) tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
SMBus TIMING DIAGRAM
6
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
FEATURE SET
Primary (1st Level) Safety Features
The bq20z70 supports a wide range of battery and system protection features that can easily be configured. The
primary safety features include:
•
•
•
•
•
Cell over/under voltage protection
Charge and Discharge overcurrent
Short Circut
Charge and Discharge Overtemperature
AFE Watchdog
Secondary (2nd Level) Safety Features
The secondary safety features of the bq20z70 can be used to indicate more serious faults via the SAFE (pin 7).
This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or
discharging. The secondary safety protection features include:
•
•
•
•
•
•
Safety overvoltage
Safety overcurrent in Charge and Discharge
Safety overtemperature in Charge and Discharge
Charge FET and 0 Volt Charge FET fault
Discharge FET fault
AFE communication fault
Charge Control Features
The bq20z70 charge control features include:
•
Reports the appropriate charging current needed for constant current charging and the appropriate charging
voltage needed for constant voltage charging to a smart charger using SMBus broadcasts.
•
Determines the chemical state of charge of each battery cell using Impedance Track™ and can reduce the
charge difference of the battery cells in fully charged state of the battery pack gradually using cell balancing
algorithm during charging. This prevents fully charged cells from overcharging and causing excessive
degradation and also increases the usable pack energy by preventing premature charge termination
•
•
•
•
Supports pre-charging/zero-volt charging
Support fast charging
Supports charge inhibit and charge suspend if battery pack temperature is out of temperature range
Reports charging fault and also indicate charge status via charge and discharge alarms.
Gas Gauging
The bq20z70 uses the Impedance Track™ Technology to measure and calculate the available charge in battery
cells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no full charge
discharge learning cycle required.
See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note
(SLUA364) for further details.
Authentication
The bq20z70 supports authentication by the host using SHA-1.
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
FEATURE SET (continued)
Power Modes
The bq20z70 supports 3 different power modes to reduce power consumption:
•
In Normal Mode, the bq20z70 performs measurements, calculations, protection decisions and data updates
in 1 second intervals. Between these intervals, the bq20z70 is in a reduced power stage.
•
In Sleep Mode, the bq20z70 performs measurements, calculations, protection decisions and data update in
adjustable time intervals. Between these intervals, the bq20z70 is in a reduced power stage. The bq20z70
has a wake function that enables exit from Sleep mode, when current flow or failure is detected.
•
In Shutdown Mode the bq20z70 is completely disabled.
CONFIGURATION
Oscillator Function
The bq20z70 fully integrates the system oscillators. Therefore, the bq20z70 requires no external components for
this feature.
System Present Operation
The bq20z70 pulls the PU pin high periodically (1 s). Connect this pin to the PRES pin of the bq20z70 via a
resistor of approximately 5 kΩ. The bq20z70 measures the PRES input during the PU-active period to determine
its state. If PRES input is pulled to ground by external system, the bq20z70 detects this as system present.
BATTERY PARAMETER MEASUREMENTS
The bq20z70 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a
second delta-sigma ADC for individual cell and battery voltage, and temperature measurement.
Charge and Discharge Counting
The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage
drop across a small-value sense resistor between the SR1 and SR2 pins. The integrating ADC measures bipolar
signals from -0.25 V to 0.25 V. The bq20z70 detects charge activity when VSR = V(SR1)-V(SR2)is positive and
discharge activity when VSR = V(SR1)-V(SR2) is negative. The bq20z70 continuously integrates the signal over
time, using an internal counter. The fundamental rate of the counter is 0.65 nVh.
Voltage
The bq20z70 updates the individual series cell voltages through the bq29330 at one second intervals. The
bq20z70 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin of
the bq29330, which is required to be connected to VIN of the bq20z70. The internal ADC of the bq20z70
measures the voltage, scales and calibrates it appropriately. This data is also used to calculate the impedance
of the cell for the Impedance Track™ gas-gauging.
Current
The bq20z70 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current
using a 5 mΩ to 20 mΩ typ. sense resistor.
Auto Calibration
The bq20z70 provides an auto-calibration feature to cancel the voltage offset error across SRN and SRP for
maximum charge measurement accuracy. The bq20z70 performs auto-calibration when the SMBus lines stay
low continuously for a minimum of 5 s.
Temperature
The bq20z70 has an internal temperature sensor and 2 external temperature sensor inputs TS1 and TS2 used
in conjunction with two identical NTC thermistors (default are Semitec 103AT) to sense the battery enviromental
temperature. The bq20z70 can be configured to use internal or external temperature sensors.
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
FEATURE SET (continued)
COMMUNICATIONS
The bq20z70 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS
specification.
SMBus On and Off State
The bq20z70 detects an SMBus off state when SMBC and SMBD are logic-low for ≥ 2 seconds. Clearing this
state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available.
9
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
FEATURE SET (continued)
Table 1. SBS COMMANDS
SBS Commands
SBS
Cmd
Mode Name
Format
Size in Min
Max
Value
Default
Value
Unit
Bytes
Value
0x00
0x01
R/W
R/W
ManufacturerAccess
hex
2
2
0x0000
0
0xffff
—
—
RemainingCapacityAlarm
unsigned int
65535
mAh or
10mWh
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0a
0x0b
0x0c
0x0d
0x0e
0x0f
R/W
R/W
R/W
R
RemainingTimeAlarm
BatteryMode
unsigned int
hex
2
2
2
2
2
2
2
2
2
2
1
1
1
2
0
65535
0xffff
—
—
—
—
—
—
—
—
—
—
—
—
—
—
min
0x0000
AtRate
signed int
-32768
32767
65535
65535
65535
65535
20000
32767
32767
100
mA or 10mW
AtRateTimeToFull
AtRateTimeToEmpty
AtRateOK
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
signed int
0
min
min
R
0
R
0
R
Temperature
0
0.1°K
mV
mA
mA
%
R
Voltage
0
R
Current
-32768
R
AverageCurrent
MaxError
signed int
-32768
R
unsigned int
unsigned int
unsigned int
unsigned int
0
0
0
0
R
RelativeStateOfCharge
AbsoluteStateOfCharge
RemainingCapacity
100
%
R
100
%
R/W
65535
mAh or
10mWh
0x10
R
FullChargeCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
R
RunTimeToEmpty
AverageTimeToEmpty
AverageTimeToFull
ChargingCurrent
ChargingVoltage
BatteryStatus
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
unsigned int
2
2
2
2
2
2
2
2
0
65535
65535
65535
65535
65535
0xffff
—
—
—
—
—
—
—
—
min
min
min
mA
mV
R
0
R
0
R
0
R
0
R
0x0000
R/W
R/W
CycleCount
0
0
65535
65535
DesignCapacity
mAh or
10mWh
0x19
0x1a
0x1b
0x1c
0x20
R/W
R/W
R/W
R/W
R/W
DesignVoltage
unsigned int
unsigned int
unsigned int
hex
2
7000
0x0000
0
16000
0xffff
65535
0xffff
—
14400
0x0031
0
mV
SpecificationInfo
ManufactureDate
SerialNumber
2
2
2
0x0000
—
0x0001
ManufacturerName
String
11+1
Texas
ASCII
Instruments
0x21
0x22
0x23
0x2f
R/W
R/W
R
DeviceName
DeviceChemistry
ManufacturerData
Authenticate
String
7+1
4+1
14+1
20+1
2
—
—
—
—
0
—
bq20z70
LION
—
ASCII
ASCII
ASCII
ASCII
mV
String
—
String
—
R/W
R
String
—
—
0x3c
0x3d
0x3e
0x3f
CellVoltage4
CellVoltage3
CellVoltage2
CellVoltage1
unsigned int
unsigned int
unsigned int
unsigned int
65535
65535
65535
65535
—
R
2
0
—
mV
R
2
0
—
mV
R
2
0
—
mV
10
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SLUS686B–NOVEMBER 2005–REVISED JULY 2007
Table 2. EXTENDED SBS COMMANDS
SBS
Mode
Name
Format
Size in
Bytes
Min Value
Max Value
Default
Value
Unit
Cmd
0x45
0x46
0x4f
R
AFEData
String
hex
11+1
1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ASCII
R/W
R
FETControl
0x00
0xff
StateOfHealth
unsigned int
hex
1
0
100
%
0x51
0x53
0x54
0x55
0x57
0x5a
0x5d
0x60
0x61
0x62
0x63
0x64
0x65
0x66
0x70
0x71
0x77
0x78
0x79
0x7a
0x7b
0x7c
0x7d
0x7e
0x7f
R
SafetyStatus
2
0x0000
0xffff
0xffff
0xffff
0xffff
0xffff
65535
65535
0xffffffff
0xffffffff
0xffffffff
0xffffffff
0xffffffff
0xffffffff
0xffffffff
—
R
PFStatus
hex
2
0x0000
R
OperationStatus
ChargingStatus
ResetData
hex
2
0x0000
R
hex
2
0x0000
R
hex
2
0x0000
R
PackVoltage
unsigned int
unsigned int
hex
2
0
mV
mV
R
AverageVoltage
UnSealKey
2
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
4
0x00000000
FullAccessKey
hex
4
0x00000000
PFKey
hex
4
0x00000000
AuthenKey3
hex
4
0x00000000
AuthenKey2
hex
4
0x00000000
AuthenKey1
hex
4
0x00000000
AuthenKey0
hex
4
0x00000000
ManufacturerInfo
SenseResistor
String
unsigned int
hex
8+1
2
—
0
65535
0xffff
—
μΩ
DataFlashSubClassID
DataFlashSubClassPage1
DataFlashSubClassPage2
DataFlashSubClassPage3
DataFlashSubClassPage4
DataFlashSubClassPage5
DataFlashSubClassPage6
DataFlashSubClassPage7
DataFlashSubClassPage8
2
0x0000
—
hex
32
32
32
32
32
32
32
32
hex
—
—
hex
—
—
hex
—
—
hex
—
—
hex
—
—
hex
—
—
hex
—
—
Application Schematic
The application schematic is on the following page.
11
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ20Z70PW-V160
BQ20Z70PWR-V150
BQ20Z70PWR-V160
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
PW
PW
PW
20
20
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
20Z70
Samples
Samples
Samples
2000 RoHS & Green
2000 RoHS & Green
NIPDAU
NIPDAU
20Z70
20Z70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2022
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
PW TSSOP
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
BQ20Z70PW-V160
20
70
530
10.2
3600
3.5
Pack Materials-Page 1
PACKAGE OUTLINE
PW0020A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1
2X
5.85
6.6
6.4
NOTE 3
10
B
11
0.30
20X
4.5
4.3
NOTE 4
0.19
1.2 MAX
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220206/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.5)
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
11
10
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220206/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
20X (1.5)
SYMM
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
10
11
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220206/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
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TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
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