BQ24800 [TI]
支持混合动力升压和电池升压模式的 SMBus 1 至 4 节降压电池充电控制器;
| 型号： | BQ24800 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 支持混合动力升压和电池升压模式的 SMBus 1 至 4 节降压电池充电控制器 电池 控制器 |
| 文件： | 总11页 (文件大小：410K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
BQ24800
SLUSE37 –MARCH 2020
BQ24800 SMBus 1- to 4-Cell Buck Battery Charge Controller
With Peak Power, Hybrid Power Boost and Battery Only Boost Modes
1 Features
2 Applications
1
•
Hybrid Power Boost Mode to power up system
from adapter and battery together
•
•
•
•
Notebook, ultrabook, detachable, and tablet PC
Industrial and medical equipment
System with battery backup
–
Ultra-fast transient response of 150 µs to enter
Hybrid Power Boost Mode
Portable equipment
•
•
Battery Only Boost Mode to extend battery run
time
3 Description
The BQ24800 device is
synchronous buck battery charger, offering low
component count for space-constrained, multi-
chemistry battery charging applications.
Peak power two-level input current limit to
maximize the power from adapter and minimize
battery discharge
a
high-efficiency,
•
•
Charge 1- to 4-cell battery pack from 4.5- to 24-V
adapter
The BQ24800 device supports hybrid power boost
mode. Hybrid power boost mode boosts the battery
up to the system voltage in order to supplement the
adapter when system power demand is temporarily
higher than the adapter is able to provide. The ultra-
fast transition from battery charging to battery
discharging prevents adapter crash from overloading
condition.
High accuracy power and current monitoring for
CPU throttling
–
–
–
Comprehensive PROCHOT profile
± 2% Current monitor accuracy
± 5% System Power Monitor Accuracy
(PMON)
The BQ24800 device also supports battery only boost
mode when no adapter is present. When the battery
voltage is above the minimum system operation
voltage, the battery is directly connected to the
system supply rail through BATFET. Once the battery
voltage goes below the minimum system operation
voltage, BQ24800 will turn on the boost mode to
regulate the system supply rail, extending the system
run time.
•
•
Automatic NMOS power source selection from
adapter or battery
–
ACFET Fast turn on in 100 µs when exiting
learn mode from battery removal
Programmable input current, charge voltage,
charge and discharge current limit
–
–
–
–
±0.4% Charge voltage (16-mV/step)
±2% Input current (64-mA/step)
Device Information(1)
±2% Charge current (64-mA/step)
±2% Discharge current (512-mA/step)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
BQ24800
WQFN (28)
4.00 mm × 4.00 mm
•
High integration
–
–
–
–
–
Battery LEARN function
Battery present monitor
Boost Mode indicator
Loop compensation
BTST Diode
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Adapter
4.5 œ 24 V
Enhanced Safety:
OCP, OVP, FET Short
System
RAC
NFET
Driver
NFET Driver
•
Enhanced safety features for over-voltage
protection, over-current protection, battery,
inductor, and MOSFET short-circuit protection
Adapter Detection
Battery
Pack
1S-4S
BQ24800
RSR
•
•
•
Switching frequency: 300 kHz, 400 kHz, 600 kHz,
and 800 kHz
Hybrid Power Boost Charge
Controller with Peak Power
Mode and Battery Only
Boost Mode
SMBUS
Host
Realtime system control on ILIM pin to limit
charge and discharge current
IADPT, PROCHOT,
IDCHG, PMON
Integration:
Loop Compensation, Soft Start,
Comparator, BTST Diode
0.65-mA Adapter standby quiescent current for
Energy Star
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
BQ24800
SLUSE37 –MARCH 2020
www.ti.com
4 Description (continued)
The BQ24800 device uses two charge pumps to separately drive N-channel MOSFETs (ACFET, RBFET, and
BATFET) for automatic system power source selection.
Through SMBus, a system power management microcontroller programs input current, charge current, discharge
current, and charge voltage DACs with high regulation accuracies.
The BQ24800 device monitors adapter current (IADP), battery discharge current (IDCHG), and system power
(PMON) for host to throttle back CPU speed or reduce system power when needed.
The BQ24800 device charges 1-, 2-, 3-, or 4-series Li+ cells.
2
Submit Documentation Feedback
Copyright © 2020, Texas Instruments Incorporated
Product Folder Links: BQ24800
BQ24800
www.ti.com
SLUSE37 –MARCH 2020
5 Device and Documentation Support
5.1 Device Support
5.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation see the following: BQ24800 EVM User's Guide
5.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2020, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: BQ24800
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ24800RUYR
BQ24800RUYT
ACTIVE
WQFN
WQFN
RUY
28
28
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
BQ
24800
ACTIVE
RUY
NIPDAU
BQ
24800
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ24800RUYR
BQ24800RUYT
WQFN
WQFN
RUY
RUY
28
28
3000
250
330.0
180.0
12.4
12.4
4.25
4.25
4.25
4.25
1.15
1.15
8.0
8.0
12.0
12.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ24800RUYR
BQ24800RUYT
WQFN
WQFN
RUY
RUY
28
28
3000
250
367.0
210.0
367.0
185.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK-NO LEAD
RUY0028A
A
4.1
3.9
B
PIN 1 INDEX AREA
4.1
3.9
0.8
0.7
C
SEATING PLANE
0.08 C
0.05
0.00
SQ 2.6±0.1
2X 2.4
8
14
24X 0.4
7
15
SYMM
29
2X
2.4
0.25
28X
0.15
21
0.1
C A B
C
1
0.05
28
22
0.5
0.3
28X
SYMM
4219146/C 03/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK-NO LEAD
RUY0028A
2X (3.8)
SQ (2.6)
2X (2.4)
22
28
28X (0.6)
28X (0.2)
1
21
24X (0.4)
SYMM
29
2X
2X
(2.4) (3.8)
2X (1.05)
7
15
(R0.05) TYP
(Ø0.2) VIA
TYP
14
8
2X (1.05)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED METAL
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219146/C 03/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
WQFN - 0.8 mm max height
RUY0028A
PLASTIC QUAD FLATPACK-NO LEAD
2X (3.8)
4X
SQ (1.15)
28
22
28X (0.6)
28X (0.2)
29
1
21
24X (0.4)
SYMM
2X
(3.8)
2X (0.675)
7
15
(R0.05) TYP
METAL TYP
14
8
2X (0.675)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
78% PRINTED COVERAGE BY AREA
SCALE: 15X
4219146/C 03/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
相关型号：
BQ25010
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR BLUETOOTH HEADSETS AND OTHER PORTABLE APPLICATIONS (bqHYBRID⑩)
TI
BQ25010RHLR
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR BLUETOOTH HEADSETS AND OTHER PORTABLE APPLICATIONS (bqHYBRID⑩)
TI
BQ25010RHLRG4
1.5A SWITCHING REGULATOR, 1500kHz SWITCHING FREQ-MAX, PQCC20, 3.50 X 4.50 MM, GREEN, PLASTIC, QFN-20
TI
BQ25011
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR BLUETOOTH HEADSETS AND OTHER PORTABLE APPLICATIONS (bqHYBRID⑩)
TI
BQ25011RHLR
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR BLUETOOTH HEADSETS AND OTHER PORTABLE APPLICATIONS (bqHYBRID⑩)
TI
BQ25012
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR BLUETOOTH HEADSETS AND OTHER PORTABLE APPLICATIONS (bqHYBRID⑩)
TI
©2020 ICPDF网 联系我们和版权申明