BQ29415PWG4 [TI]

VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES (2nd-LEVEL PROTECTION); 电压保护2-, 3-,或4节锂离子电池(第2级保护)
BQ29415PWG4
型号: BQ29415PWG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES (2nd-LEVEL PROTECTION)
电压保护2-, 3-,或4节锂离子电池(第2级保护)

电源电路 电池 电源管理电路 光电二极管
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bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES  
nd  
(2 -LEVEL PROTECTION)  
FEATURES  
FUNCTION  
2-, 3-, or 4-Cell Secondary Protection  
Each cell in a multiple-cell pack is compared to an  
internal reference voltage. If one cell reaches an  
overvoltage condition, the protection sequence  
begins. The bq2941x device starts charging an  
external capacitor through the CD pin. When the CD  
pin voltage reaches 1.2 V, the OUT pin changes  
from a low level to a high level.  
Low Power Consumption ICC < 2 µA  
[VCELL(ALL) < V(PROTECT)  
]
Fixed High Accuracy Overvoltage Protection  
Threshold  
bq29410 = 4.35 V  
bq29411 = 4.40 V  
bq29412 = 4.45 V  
bq29413 = 4.50 V  
bq29414 = 4.55 V  
bq29415 = 4.60 V  
bq29419 = 4.30 V  
DCT PACKAGE  
(TOP VIEW)  
1
2
3
4
8
OUT  
VDD  
CD  
VC1  
VC2  
VC3  
7
6
5
VC4  
GND  
Programmable Delay Time of Detection  
High Power Supply Ripple Rejection  
Stable During Pulse Charge Operation  
PW PACKAGE  
(TOP VIEW)  
1
2
3
4
8
7
6
5
VC1  
OUT  
APPLICATIONS  
2nd-Level Overvoltage Protection in Li-Ion  
Battery Packs in:  
VC2  
VC3  
GND  
VDD  
CD  
VC4  
Notebook Computers  
Portable Instrumentation  
Portable Equipment  
DESCRIPTION  
The bq2941x is a secondary overvoltage protection  
IC for 2-, 3-, or 4-cell lithium-ion battery packs that  
incorporates a high-accuracy precision overvoltage  
detection circuit. It includes a programmable delay  
circuit for overvoltage detection time.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
UNLESS OTHERWISE NOTED this document contains  
Copyright © 2005–2007, Texas Instruments Incorporated  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION(1)  
PACKAGE(3)  
(2)  
TA  
V(PROTECT)  
MSOP (DCT)  
Not Applicable  
bq29410DCT3R  
bq29410DCTR  
bq29410DCTT  
bq29411DCT3R  
bq29411DCTR  
bq29411DCTT  
bq29412DCT3R  
bq29412DCTR  
bq29412DCTT  
bq29413DCTR  
bq29413DCTT  
bq29414DCTR(4)  
bq29414DCTT(4)  
bq29415DCTR(4)  
bq29415DCTT(4)  
SYMBOL  
SSOP (PW)  
4.30 V  
Not Applicable  
bq29419PW  
bq29410PW  
bq29419PWR  
bq29410PWR  
4.35 V  
4.40 V  
4.45 V  
CJG  
CJH  
CJJ  
bq29410PWG4  
bq29410PWRG4  
bq29411PW  
bq29411PWR  
bq29411PWG4  
bq29411PWRG4  
–40°C to 110°C  
bq29412PW  
bq29412PWR  
bq29412PWG4  
bq29412PWRG4  
4.50 V  
4.55 V  
4.60 V  
CJk  
CJL  
CJM  
bq29413PW  
bq29414PW(4)  
bq29415PW(4)  
bq29413PWR  
bq29414PWR(4)  
bq29415PWR(4)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Contact your local Texas Instruments representative or sales office for alternative overvoltage threshold options.  
(3) The "R" suffix indicates tape-and-reel packaging.  
(4) Product Preview  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range unless otherwise noted(1)(2)  
UNIT  
Supply voltage range  
Input voltage range  
VDD  
–0.3 V to 28 V  
–0.3 V to 28 V  
VC1, VC2, VC3, VC4  
VC1 TO VC2, VC2 TO VC3, VC3 TO VC4, VC4 TO GND  
–0.3 V to 8 V  
OUT  
CD  
–0.3 V to 28 V  
Output voltage range  
–0.3 V to 28 V  
Continuous total power dissipation  
Storage temperature range, Tstg  
Lead temperature (soldering, 10 s)  
See Dissipation Rating Table  
–65°C to 150°C  
300°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to ground of this device except the differential voltage of VC1-VC2, VC2-VC3, VC3-VC4, and VC4-GND.  
PACKAGE DISSIPATION RATINGS  
TA = 25°C  
POWER RATING  
DERATING FACTOR  
ABOVE TA = 25°C  
TA = 70°C  
POWER RATING  
TA = 85°C  
POWER RATING  
PACKAGE  
DCT  
PW  
412 mW  
525 mW  
3.3 mW/°C  
4.2 mW/°C  
264 mW  
336 mW  
214 mW  
273 mW  
2
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bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
RECOMMENDED OPERATING CONDITIONS  
MIN NOM  
MAX UNIT  
VDD  
VI  
Supply voltage  
4
25  
VDD  
5
V
VC1, VC2, VC3, VC4  
0
Input voltage range  
V
VCn – VC (n=1), (n=1, 2, 3), VC4 – GND  
0
td(CD) Delay time capacitance  
0.22  
µF  
RIN  
CIN  
RVD  
CVD  
TA  
Voltage-monitor filter resistance  
Voltage-monitor filter capacitance  
100  
0.01  
0
1k  
0.1  
µF  
kΩ  
µF  
°C  
Supply-voltage filter resistance  
Supply-voltage filter capacitance  
Operating ambient temperature range  
1
0.1  
–40  
110  
ELECTRICAL CHARACTERISTICS  
over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITION  
MIN NOM MAX UNIT  
TA = 25°C  
25  
25  
35  
50  
80  
Overvoltage detection  
accuracy  
V(OA)  
TA = –20°C to 85°C  
TA = –40°C to 110°C  
bq29410  
mV  
4.35  
4.40  
4.45  
4.50  
4.55  
4.60  
4.30  
bq29411  
bq29412  
Overvoltage  
V(PROTECT)  
bq29413  
V
detection voltage(1)  
bq29414  
bq29415  
bq29419  
Overvoltage detection  
hysteresis(1)  
Vhys  
IIN  
300  
mV  
µA  
V2, V3 , VC4 input ,VDD = VC1  
VC1 = VC2 = VC3 = VC4 = 3.5 V (see Figure 1)  
Input current  
0.3  
2
Overvoltage detection delay  
time  
tD1  
VDD = VC1, CD = 0.22 µF  
1
5
1.5  
12  
S
I(CD_dis)  
CD GND clamp current  
VDD = VC1, CD = 1 V  
µA  
VDD = VC1,  
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V  
(see Figure 1)  
2
3
ICC  
Supply current  
µA  
V
VDD = VC1,  
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 2.3 V  
(see Figure 1)  
1.5  
2.5  
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND =  
V(PROTECT)Max, VDD = VC1, IOH = 0 mA  
7
2
V(OUT)  
OUT pin drive voltage  
VC1 = VC2 = VC3 = VC4 = V(PROTECT)Max,  
VDD = 4.3 V, TA = 0°C to 70°C, IOH = 40 µA  
1.5  
–1  
5
2.5  
OUT = 3 V,  
VC1 = VC2 = VC3 = VC4 = 4.7 V  
IOH  
IOL  
High-level output current  
Low-level output current  
mA  
µA  
OUT = 0.1 V, VDD = VC1,  
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V  
(1) Levels of the overvoltage detection and the hysteresis can be adjusted. For assistance, contact a Texas Instruments sales  
representative.  
3
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bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
OUT  
7
VC1
VC2
VDD  
CD  
VC3
GND
3
4
VC4  
Figure 1. ICC, IIN Measurement (DCT Package)  
Terminal Functions  
TERMINAL  
DESCRIPTION  
MSOP  
(DCT)  
TSSOP  
(PW)  
NAME  
8
7
6
5
4
3
2
1
1
2
3
4
5
6
7
8
VC1  
VC2  
VC3  
GND  
VC4  
CD  
Sense voltage input for most positive cell  
Sense voltage input for second most positive cell  
Sense voltage input for third most positive cell  
Ground pin  
Sense voltage input for least positive cell  
An external capacitor is connected to determine the programmable delay time  
Power supply  
VDD  
OUT  
Output  
4
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bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
FUNCTIONAL BLOCK DIAGRAM  
R
VD  
C
VD  
VDD  
VC1  
VC2  
R
R
IN  
I
= 0.2 A (TYP)  
CD  
C
IN  
IN  
C
IN  
VC3  
OUT  
R
R
IN  
C
IN  
VC4  
1.2 V (TYP)  
IN  
C
IN  
GND  
CD  
C(DELAY)  
OVERVOLTAGE PROTECTION  
When one of the cell voltages exceeds V(PROTECT), an internal current source begins to charge the capacitor,  
C(DELAY), connected to the CD pin. If the voltage at the CD pin, VCD, reaches 1.2 V, the OUT pin is activated and  
transitions high. An externally connected NCH FET is activiated and blows the external fuse in the positive  
battery rail; see the functional block diagram.  
If all cell voltages fall below V(PROTECT) before the voltage at pin CD reaches 1.2 V, the delay time does not run  
out. An internal switch clamps the CD pin to GND and discharges the capacitor, C(DELAY), and secures the full  
delay time for the next occurring overvoltage event.  
Once the pin OUT is activated, it transitions back from high to low after all battery cells reach V(PROTECT)– Vhys.  
DELAY TIME CALCULATION  
The delay time is calculated as follows:  
ƪ1.2 V   C(DELAY)ƫ  
t
+
d
I
CD  
ƪtd   ICDƫ  
C
+
(DELAY)  
1.2 V  
Where I(CD) = CD current source = 0.18 µA  
5
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bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
V
(PROTECT)  
V
- V  
hys  
(PROTECT)  
Cell Voltage  
(VCn - VC(n-1),  
VC4 - GND)  
1.2 V  
CD  
t
DELAY  
OUT  
t
d
= (1.2 V x C  
)/I  
DELAY CD  
Figure 2. Timing for Overvoltage Sensing  
APPLICATION INFORMATION  
BATTERY CONNECTIONS  
The following diagrams show the DCT package device in different cell configurations.  
OUT  
7
OUT  
7
VC1  
VC2  
VC1  
VC2  
VDD  
CD  
VDD  
CD  
VC3
3
4
VC3
3
4
VC4  
GND  
VC4  
GND  
Figure 3. 4-Series Cell Configuration  
Figure 4. 3-Series Cell Configuration  
(Connect together VC1 and VC2)  
6
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bq29410, bq29411, bq29412, bq29413  
bq29414, bq29415, bq29419  
www.ti.com  
SLUS669EAUGUST 2005REVISED MAY 2007  
APPLICATION INFORMATION (continued)  
8
7
1
2
OUT  
VC1  
VC2  
VC3  
GND  
VDD  
CD  
3
6
5
4
VC4  
Figure 5. 2-Series Cell Configuration  
CELL CONNECTIONS  
To prevent incorrect output activation, the following connection sequences must be used.  
4-Series Cell Configuration  
VC1(=VDD) VC2 VC3 VC4 GND or  
GND VC4 VC3 VC2 VC1(=VDD)  
3-Series Cell Configuration  
VC1(=VC2=VDD) VC3 VC4 GND or  
GND VC4 VC3 VC1(=VC2=VDD)  
2-Series Cell Configuration  
VC1(=VC2=VC3=VDD) VC4 GND or  
GND VC4 VC1(=VC2=VC3=VDD)  
7
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PACKAGE OPTION ADDENDUM  
www.ti.com  
4-May-2007  
PACKAGING INFORMATION  
Orderable Device  
BQ29410DCT3R  
BQ29410DCT3RE6  
BQ29410DCTR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SM8  
DCT  
8
8
8
8
8
8
3000  
Pb-Free  
(RoHS)  
CU SNBI  
Level-1-260C-UNLIM  
SM8  
SM8  
SM8  
SM8  
SM8  
DCT  
DCT  
DCT  
DCT  
DCT  
3000  
Pb-Free  
(RoHS)  
CU SNBI  
Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29410DCTRG4  
BQ29410DCTT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29410DCTTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29410PW  
BQ29410PWR  
BQ29410PWRG4  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
8
8
8
150  
TBD  
TBD  
CU NIPDAU Level-1-220C-UNLIM  
CU NIPDAU Level-1-220C-UNLIM  
2000  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29411DCT3R  
BQ29411DCT3RE6  
BQ29411DCTR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
DCT  
DCT  
DCT  
DCT  
DCT  
DCT  
8
8
8
8
8
8
3000  
Pb-Free  
(RoHS)  
CU SNBI  
Level-1-260C-UNLIM  
3000  
Pb-Free  
(RoHS)  
CU SNBI  
Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29411DCTRG4  
BQ29411DCTT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29411DCTTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29411PW  
BQ29411PWR  
BQ29411PWRG4  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
8
8
8
150  
TBD  
TBD  
CU NIPDAU Level-1-220C-UNLIM  
CU NIPDAU Level-1-220C-UNLIM  
2000  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29412DCT3R  
ACTIVE  
ACTIVE  
SM8  
SM8  
DCT  
DCT  
8
8
3000  
Pb-Free  
(RoHS)  
CU SNBI  
CU SNBI  
Call TI  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Call TI  
BQ29412DCT3RE6  
3000  
Pb-Free  
(RoHS)  
BQ29412DCT3T  
BQ29412DCTR  
PREVIEW  
ACTIVE  
8
8
TBD  
SM8  
SM8  
SM8  
SM8  
DCT  
DCT  
DCT  
DCT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29412DCTRG4  
BQ29412DCTT  
ACTIVE  
ACTIVE  
ACTIVE  
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29412DCTTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BQ29412PW  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
8
8
150  
TBD  
CU NIPDAU Level-1-220C-UNLIM  
BQ29412PWG4  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-May-2007  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
BQ29412PWR  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
PW  
8
8
2000  
TBD  
CU NIPDAU Level-1-220C-UNLIM  
BQ29412PWRG4  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29413DCTR  
BQ29413DCTRG4  
BQ29413DCTT  
BQ29413DCTTG4  
BQ29413PW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SM8  
SM8  
DCT  
DCT  
DCT  
DCT  
PW  
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SM8  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29413PWG4  
BQ29413PWR  
PW  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29413PWRG4  
BQ29414DCTR  
BQ29414DCTRG4  
BQ29414DCTT  
BQ29414DCTTG4  
BQ29414PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
DCT  
DCT  
DCT  
DCT  
PW  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SM8  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29414PWG4  
BQ29414PWR  
PW  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29414PWRG4  
BQ29415DCTR  
BQ29415DCTRG4  
BQ29415DCTT  
BQ29415DCTTG4  
BQ29415PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
DCT  
DCT  
DCT  
DCT  
PW  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29415PWG4  
BQ29415PWR  
PW  
150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BQ29415PWRG4  
PW  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-May-2007  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
MECHANICAL DATA  
MPDS049B – MAY 1999 – REVISED OCTOBER 2002  
DCT (R-PDSO-G8)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,13  
0,65  
8
5
0,15 NOM  
2,90  
2,70  
4,25  
3,75  
Gage Plane  
PIN 1  
INDEX AREA  
0,25  
1
4
0° – 8°  
0,60  
0,20  
3,15  
2,75  
1,30 MAX  
Seating Plane  
0,10  
0,10  
0,00  
4188781/C 09/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion  
D. Falls within JEDEC MO-187 variation DA.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
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the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
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Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
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dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
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Broadband  
Digital Control  
Military  
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www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
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logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
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Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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