BQ3287EA [TI]
Real-Time Clock (RTC) Module;
| 型号： | BQ3287EA |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Real-Time Clock (RTC) Module |
| 文件： | 总7页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
bq3287E/bq3287EA
(
)
Real-Time Clock RTC Module
vided by an alarm interrupt, which is
➤ Calendar in day of the week, day
active in battery-backup mode. The
of the month, months, and years
bq3287EA version is identical to the
with automatic leap-year adjust-
bq3287E, with the addition of the
ment
Features
➤ Dir ect clock/ca len da r r epla ce-
m en t for IBM®AT-com pa t ible
computers and other applications
RAM clear input.
➤ Programmable square wave out-
The bq3287E is a fully compatible
put
➤ F u n ct ion a lly com pa t ible wit h
t h e D S 1 2 8 7 /D S 1 2 8 7 A a n d
MC146818A/ MC146818B
real-time clock for IBM AT-compatible
computers and other applications. The
➤ Three individually maskable in-
bq3287E write-protects the clock, cal-
endar, and storage registers during
power failure. The integral backup en-
ergy source then maintains data and
operates the clock and calendar.
terrupt event flags:
➤ 242 bytes of general nonvolatile
storage
- Periodic rates from 122µs to
500ms
➤ Provides a 32.768kHz output for
power management
- Time-of-day alarm once per
As shipped from Benchma rq, the
real time clock is turned off to maxi-
mize battery capacity for in-system
operation.
➤ System wake-up capability—
a la r m in t e r r u p t a ct ive in
battery-backup mode
second to once per day
- End-of-clock update cycle
➤ B e t t e r t h a n on e m in u t e p e r
➤ Integral lithium cell and crystal
The bq3287E is functionally equiva-
lent to the bq3285E, except the bat-
tery (16,20) and crystal pins (2,3)
are not accessible. These pins are
connected internally to a coin cell
and quartz crystal. The coin cell is
sized to provide 10 years of data re-
tention and clock operation in the
absence of power. For a complete de-
scription of features, operating con-
dit ion s, elect r ica l ch a r a ct er ist ics,
bus timing, and pin descriptions, see
the bq3285E data sheet.
month clock accuracy
➤ 160 ns cycle time allows fast bus
operation
General Description
➤ 14 bytes for clock/calendar and
control
The CMOS bq3287E/bq3287EA is a
low-power microprocessor periph-
eral providing a time-of-day clock
and 100-year calendar with alarm
fea t u r es a n d ba t t er y oper a t ion .
O t h e r fe a t u r e s in clu d e t h r e e
maskable interrupt sources, square-
wave output, and 242 bytes of gen-
➤ Time of day in seconds, minutes,
and hours
- 12- or 24-hour format
- Optional daylight saving
adjustment
e r a l n on vola t ile s t or a ge.
A
32.768kHz output is available for
sustaining power-management ac-
tivities. Wake-up capability is pro-
Pin Connections
Pin Names
AD0–AD7 Multiplex address/data
RST
Reset input
MOT
24
input/output
1
V
CC
NC
NC
23
22
2
3
SQW
EXTRAM
SQW
Square wave output
MOT
4
NC/RCL
NC
AD
0
AD
1
AD
2
AD
3
AD
4
AD
5
AD
6
21
20
19
18
17
16
15
14
13
EXTRAM Extended RAM enable
5
CS
Chip select input
6
INT
NC
No connect
7
RST
DS
NC
AS
Address strobe input
Data strobe input
8
9
RCL
RAM clear input
(bq3287EA only)
DS
10
11
12
R/W
AS
CS
AD
7
R/W
INT
Read/write input
V
SS
VCC
VSS
+5V supply
Ground
24-Pin DIP Module
Interrupt request output
PN3287E1.eps
Sept. 1996 C
1
bq3287E/bq3287EA
Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
Conditions
VCC
DC voltage applied on VCC relative to VSS
-0.3 to 7.0
V
DC voltage applied on any pin excluding VCC
relative to VSS
VT
V
VT ≤ VCC + 0.3
-0.3 to 7.0
TOPR
TSTG
TBIAS
Operating temperature
Storage temperature
Temperature under bias
0 to +70
-40 to +70
-10 to +70
260
°C
°C
°C
°C
Commercial
Commercial
Commercial
For 10 seconds
TSOLDER Soldering temperature
Note:
Permanent device damage may occur if Absolu te Maxim u m Ratin gs are exceeded. Functional operation
should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to
conditions beyond the operational limits for extended periods of time may affect device reliability.
Recommended DC Operating Conditions (T = T
)
OPR
A
Symbol
Parameter
Minimum
Typical
Maximum
Unit
V
VCC
Supply voltage
4.5
0
5.0
5.5
0
VSS
VIL
VIH
Supply voltage
0
-
V
Input low voltage
Input high voltage
-0.3
2.2
0.8
V
-
VCC + 0.3
V
Note:
Typical values indicate operation at TA = 25°C.
DC Electrical Characteristics (T = T
, V
= 5V ± 10%)
A
OPR CC
Symbol
ILI
Parameter
Minimum Typical Maximum
Unit
Conditions/Notes
Input leakage current
-
-
-
-
VIN = VSS to VCC
± 1
± 1
µA
AD0–AD7, INT and
SQW in high impedance
ILO
Output leakage current
µA
VOH
VOL
Output high voltage
Output low voltage
2.4
-
-
-
-
V
V
IOH = -1.0 mA
IOL = 4.0 mA
0.4
Min. cycle, duty = 100%,
IOH = 0mA, IOL = 0mA
ICC
Operating supply current
Supply switch-over voltage
Power-fail-detect voltage
-
-
7
15
-
mA
V
VSO
VPFD
3.0
4.0
4.17
4.35
V
Internal 30K pull-up
(bq3287EA only)
IRCL
Input current when RCL = VSS
-
-
-
-
185
µA
µA
IMOTH
Input current when MOT =
VCC
-185
Internal 30K pull-down
Input current when
EXTRAM = VCC
IXTRAM
-
-
-185
Internal 30K pull-down
µA
Note:
Typical values indicate operation at TA = 25°C, VCC = 5V.
Sept. 1996 C
2
bq3287E/bq3287EA
Power-Down/Power-Up Timing (T = T
A
OPR)
Symbol
Parameter
Minimum
300
Typical
Maximum
Unit
Conditions
tF
VCC slew from 4.5V to 0V
VCC slew from 0V to 4.5V
-
-
-
-
µs
µs
tR
100
Internal write-protection
period after VCC passes VPFD
on power-up.
tCSR
CS at VIH after power-up
20
10
-
-
200
-
ms
Data-retention and time-
keeping time
tDR
years TA = 25°C.
Note:
Clock accuracy is better than ± 1 minute per month at 25°C for the period of tDR.
Ca u tion : Nega tive u n d er sh oots below th e a bsolu te m a xim u m r a tin g of -0.3V in ba tter y-ba ck u p m od e
m a y a ffect d a ta in tegr ity.
Power-Down/Power-Up Timing
Sept. 1996 C
3
bq3287E/bq3287EA
24-Pin MT (T-type module)
(
)
24-Pin MT T-Type Module
Inches
Millimeters
Min.
0.360
0.015
0.015
0.008
1.320
0.710
0.590
0.090
0.110
0.100
Max.
0.390
-
Min.
Max.
9.91
-
Dimension
A
9.14
0.38
A1
B
C
D
E
0.022
0.013
1.335
0.740
0.620
0.110
0.130
0.120
0.38
0.56
0.33
33.91
18.80
15.75
2.79
3.30
3.05
0.20
33.53
18.03
14.99
2.29
e
G
L
2.79
S
2.54
Sept. 1996 C
4
bq3287E/bq3287EA
Data Sheet Revision History
Change No.
Page No.
Description
Nature of Change
1
2
2
8
2
2
Register C, bit 2
Was 0; is na (not affected)
IRCL max. was 275; is now 185. Pull-down = 30K. Value change
IXTRAM max. was -75; is now -185. Value change
Notes:
Change 1 = Apr. 1994 B “Final” changes from Dec. 1993 A “Preliminary.”
Change 2 = Sept. 1996 C changes from April 1994 B.
Ordering Information
bq3287E
MT -
Tem p er a tu r e:
blank = Commercial (0 to +70°C)
Pa ck a ge Op tion :
MT = T-type module
RAM Clea r Op tion :
A = RAM clear on pin 21
no mark = No connect on pin 21
Device:
bq3287E Real-Time Clock Module
Sept. 1996 C
5
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Type Drawing
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
BQ3287EAMT
BQ3287EMT
ACTIVE
ACTIVE
0
0
1
1
None
None
Call TI
Call TI
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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