BQ51013B-Q1 [TI]
符合 WPC 1.2 标准的汽车类完全集成式无线电源接收器 IC;
| 型号： | BQ51013B-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 符合 WPC 1.2 标准的汽车类完全集成式无线电源接收器 IC PC 无线 |
| 文件： | 总48页 (文件大小：4822K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BQ51013B-Q1
ZHCSM89 –JULY 2021
BQ51013B-Q1：符合Qi (WPC v1.2) 标准的汽车类高度集成式无线接收器电源
1 特性
2 应用
• 符合汽车应用要求
• 具有符合AEC-Q100 标准的下列特性：
• 符合WPC v1.2 标准的接收器
• 手机和智能电话
• 耳机
• 数码相机
• 便携式媒体播放器
• 手持设备
– 器件温度等级1：–40°C 至+125°C 的工作环
境温度范围
– 器件HBM ESD 分类等级2
– 器件CDM ESD 分类等级C4B
• 集成无线电源接收器解决方案
– 93% 的整体峰值交流/直流转换效率
– 完全同步整流器
– 符合WPC v1.2 标准的通信控制
– 输出电压调节
– 仅在Rx 线圈和输出之间需要IC
• 符合无线电源联盟(WPC) v1.2 标准（启用FOD）
的高精度电流检测
3 说明
BQ51013B-Q1 器件是一款灵活的高级单芯片次级侧器
件，适用于便携式应用中的无线电力传输，可提供高达
5W 功率。BQ51013B-Q1 器件在集成符合无线电源联
盟(WPC) Qi v1.2 通信协议所需的数字控制的同时，提
供接收器 (RX) 交流/ 直流电源转换和稳压。
BQ51013B-Q1 与 BQ50012A 初级侧控制器（或其他
Qi 发送器）相结合，可为无线电源解决方案实现一个
完整的非接触式电力传输系统。使用 Qi v1.2 协议，在
次级侧与初级侧之间建立全局反馈，从而控制电力传输
过程。
• 动态整流器控制，可改进负载瞬态响应
• 动态效率调节，可在各种输出功率下优化性能
• 自适应通信限制功能，可实现可靠的通信
• 支持20V 最大输入电压
• 低功率耗散整流器过压钳位(VOVP = 15V)
• 热关断保护
• 用于温度监控、充电完成和故障主机控制的多功能
NTC 和控制引脚
BQ51013B-Q1 集成了一个低电阻同步整流器、低压降
稳压器(LDO)、数字控制以及精确的电压和电流环路，
可确保高效率和低功率耗散。
器件信息(1)
封装尺寸（标称值）
器件型号
封装
VQFN (20)
BQ51013B-Q1
4.50mm × 3.50mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
AD-EN
System
Load
Power
BQ51013B-Q1
Voltage/
Current
AD
OUT
CCOMM1
C4
COMM1
System
Load
AC to DC
Drivers
Rectification
CBOOT1
D1
BOOT1
AC1
ROS
Conditioning
RECT
C1
R4
C3
Communication
HOST
BQ51013B-Q1
COIL
C2
TS/CTRL
AC2
NTC
LI-Ion
Battery
Battery
Charger
Controller
BOOT2
COMM2
V/I
Sense
Controller
CBOOT2
CHG
Tri-State
CCOMM2
CCLAMP2
CCLAMP1
CLAMP2
CLAMP1
ILIM
EN1
EN2
Bi-State
Bi-State
BQ500212A
Transmitter
Receiver
FOD
PGND
R1
RFOD
无线电源系统概述
简化原理图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSEE3
BQ51013B-Q1
ZHCSM89 –JULY 2021
www.ti.com.cn
Table of Contents
9.4 Device Functional Modes..........................................29
10 Application and Implementation................................30
10.1 Application Information........................................... 30
10.2 Typical Applications................................................ 30
11 Power Supply Recommendations..............................38
12 Layout...........................................................................38
12.1 Layout Guidelines................................................... 38
12.2 Layout Example...................................................... 39
13 Device and Documentation Support..........................40
13.1 Device Support....................................................... 40
13.2 接收文档更新通知................................................... 40
13.3 支持资源..................................................................40
13.4 Trademarks.............................................................40
13.5 静电放电警告.......................................................... 40
13.6 术语表..................................................................... 40
14 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 3
6 Device Comparison Table...............................................4
7 Pin Configuration and Functions...................................5
8 Specifications.................................................................. 6
8.1 Absolute Maximum Ratings........................................ 6
8.2 ESD Ratings............................................................... 6
8.3 Recommended Operating Conditions.........................6
8.4 Thermal Information....................................................7
8.5 Electrical Characteristics.............................................7
8.6 Typical Characteristics..............................................10
9 Detailed Description......................................................14
9.1 Overview...................................................................14
9.2 Functional Block Diagram.........................................15
9.3 Feature Description...................................................15
Information.................................................................... 40
4 Revision History
DATE
REVISION
NOTES
July 2021
*
Initial Release
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5 Description (continued)
The BQ51013B-Q1 also includes a digital controller that calculates the amount of power received by the mobile
device within the limits set by the WPC v1.2 standard. The controller then communicates this information to the
transmitter (TX) to allow the TX to determine if a foreign object is present within the magnetic interface and
introduces a higher level of safety within magnetic field. This Foreign Object Detection (FOD) method is part of
the requirements under the WPC v1.2 specification.
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6 Device Comparison Table
DEVICE
BQ51003
FUNCTION
VOUT (VBAT-REG
)
MAXIMUM POUT
2.5 W
I2C
No
No
Wireless Receiver
Wireless Receiver
5 V
5 V
BQ51013B
5 W
BQ51013B-Q1
Automotive Wireless Receiver
5 V
5 W
No
BQ51020
BQ51021
BQ51050B
BQ51051B
BQ51052B
Wireless Receiver
4.5 to 8 V
4.5 to 8 V
4.2 V
5 W
5 W
5 W
5 W
5 W
No
Yes
No
No
No
Wireless Receiver
Wireless Receiver and Direct Charger
Wireless Receiver and Direct Charger
Wireless Receiver and Direct Charger
4.35 V
4.4 V
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7 Pin Configuration and Functions
AC1
BOOT1
OUT
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
AC2
RECT
BOOT2
CLAMP2
COMM2
FOD
Thermal
Pad
CLAMP1
COMM1
CHG
AD-EN
AD
TS/CTRL
ILIM
Not to scale
The exposed thermal pad should be connected to ground.
图7-1. RHL Package 20-Pin VQFN Top View
表7-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
AC1
NO.
2
I
I
AC input from receiver coil.
AC2
19
If AD functionality is used, connect this pin to the wired adapter input. When VAD-Pres is applied to this pin
wireless charging is disabled and AD_EN is driven low. Connect a 1-µF capacitor from AD to PGND. If
unused, the capacitor is not required and AD should be connected directly to PGND.
AD
9
I
AD-EN
BOOT1
BOOT2
CHG
8
3
O
O
O
O
O
Push-pull driver for external PFET when wired charging is active. Float if not used.
Bootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a 10-nF ceramic
capacitor from BOOT1 to AC1 and from BOOT2 to AC2.
17
7
Open-drain output –active when OUT is enabled. Float or tie to PGND if unused.
CLAMP2
16
Open-drain FETs which are used for a non-power dissipative overvoltage AC clamp protection. When the
RECT voltage goes above 15 V, both switches will be turned on and the capacitors will act as a low
impedance to protect the device from damage. If used, capacitors are used to connect CLAMP1 to AC1 and
CLAMP2 to AC2. Recommended connections are 0.47-µF capacitors.
CLAMP1
COMM1
COMM2
EN1
5
6
O
O
O
I
Open-drain outputs used to communicate with primary by varying reflected impedance. Connect a capacitor
from COMM1 to AC1 and a capacitor from COMM2 to AC2 for capacitive load modulation. For resistive
modulation connect COMM1 and COMM2 to RECT through a single resistor. See 节9.3.10 for more
information.
15
10
Inputs that allow user to enable and disable wireless and wired charging <EN1 EN2>:
<00> Wireless charging is enabled unless AD voltage > VAD_Pres
<01> Dynamic communication current limit disabled.
<10> AD-EN pulled low, wireless charging disabled.
<11> Wired and wireless charging disabled.
.
EN2
FOD
11
14
I
I
Input for the rectified power measurement. See 节9.3.16 for details.
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表7-1. Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
Programming pin for the over current limit. The total resistance from ILIM to GND (RILIM) sets the current limit.
The schematic shown in 图10-1 illustrates the RILIM as R1 + RFOD. Details can be found in 节8.5 and 图10-1.
ILIM
12
I/O
O
OUT
4
Output pin, delivers power to the load.
Power ground
PGND
1, 20
Filter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND. Depending on the
power levels, the value may be 4.7 μF to 22 μF.
RECT
18
O
Dual function pin: Temperature Sense (TS) and Control (CTRL) pin functionality.
For the TS functionality connect TS/CTRL to ground through a Negative Temperature Coefficient (NTC)
resistor. If an NTC function is not desired, connect to PGND with a 10-kΩresistor. See 节9.3.13 for more
details.
TS/CTRL
13
I
For the CTRL functionality pull below VCTRL-Low or pull above VCTRL-High to send an End Power Transfer
Packet. See 表9-4 for more details.
PAD
The exposed thermal pad should be connected to ground (PGND)
—
—
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
MAX
UNIT
AC1, AC2
20
–0.8
RECT, COMM1, COMM2, OUT, CHG, CLAMP1,
CLAMP2
20
–0.3
Input voltage
V
AD, AD-EN
30
26
7
–0.3
–0.3
–0.3
BOOT1, BOOT2
EN1, EN2(3), FOD, TS/CTRL, ILIM
Input current
AC1, AC2
OUT
2
A(RMS)
Output current
1.5
15
1
A
mA
A
CHG
Output sink current
COMM1, COMM2
Junction temperature, TJ
Storage temperature, Tstg
°C
°C
150
150
–40
–65
(1) All voltages are with respect to the VSS terminal, unless otherwise noted.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) If EN1 or EN2 are subject to fast transient (>10V/10ns), current limiting resistors (1k to 10k ohms) should be added.
8.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX
UNIT
VRECT Voltage
RECT
4
7
V
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8.3 Recommended Operating Conditions (continued)
over operating free-air temperature range (unless otherwise noted)
MIN MAX
UNIT
Current through
IRECT
RECT
1.5
A
internal rectifier
Output current
Adapter voltage
Sink current
IOUT
OUT
AD
1.5
15
A
V
VAD
IAD-EN
AD-EN
1
mA
mA
°C
ICOMM COMMx sink current COMM1, COMM2
TJ Junction temperature
500
125
0
8.4 Thermal Information
BQ51013B-Q1
RHL (VQFN)
20 PINS
37.2
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
RθJC(top)
RθJB
30.0
14.0
0.4
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
°C/W
°C/W
°C/W
ψJB
13.9
3.3
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
8.5 Electrical Characteristics
over operating free-air temperature range, –40°C to 125°C (unless otherwise noted)
PARAMETER
Undervoltage lockout
Hysteresis on UVLO
TEST CONDITIONS
MIN
TYP
2.7
MAX
UNIT
V
VUVLO
2.5
2.8
VRECT: 0 V →3 V
VHYS-UVLO
VRECT-OVP
VHYS-OVP
VRECT-Th1
0.25
V
VRECT: 3 V →2 V
Input overvoltage threshold
Hysteresis on OVP
14.5
15
0.15
7.08
15.5
V
V
V
VRECT: 5 V →16 V
VRECT: 16 V →5 V
Dynamic VRECT Threshold 1
ILOAD < 0.1 x IIMAX (ILOAD rising)
0.1 x IIMAX < ILOAD < 0.2 x IIMAX
(ILOAD rising)
VRECT-Th2
Dynamic VRECT Threshold 2
6.28
V
0.2 x IIMAX < ILOAD < 0.4 x IIMAX
(ILOAD rising)
VRECT-Th3
VRECT-Th4
VRECT-DPM
Dynamic VRECT Threshold 3
Dynamic VRECT Threshold 4
5.53
5.11
3.1
V
V
V
ILOAD > 0.4 x IIMAX (ILOAD rising)
Rectifier undervoltage protection, restricts
IOUT at VRECT-DPM
3
7
3.2
9
Rectifier reverse voltage protection at the
output
VRECT-REV = VOUT - VRECT
VOUT = 10 V
,
VRECT-REV
8
V
QUIESCENT CURRENT
8
2
10
3
mA
mA
ILOAD = 0 mA, 0°C ≤TJ ≤85°C
Active chip quiescent current consumption
from RECT
IRECT
ILOAD = 300 mA,
0°C ≤TJ ≤85°C
Quiescent current at the output when
wireless power is disabled (Standby)
IOUT
20
35
µA
VOUT = 5 V, 0°C ≤TJ ≤85°C
ILIM SHORT CIRCUIT
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8.5 Electrical Characteristics (continued)
over operating free-air temperature range, –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Highest value of ILIM resistance to ground
(RILIM) considered a fault (short). Monitored
for IOUT > 100 mA
RILIM: 200 Ω→50 Ω. IOUT
latches off, cycle power to reset
RILIM-SHORT
120
Ω
Deglitch time transition from ILIM short to
IOUT disable
tDGL-Short
1
145
30
ms
mA
mA
mA
ILIM-SHORT,OK enables the ILIM short
IILIM_SHORT,OK comparator when IOUT is greater than this
value
116
165
ILOAD: 0 mA →200 mA
ILOAD: 0 mA →200 mA
IILIM_SHORT,OK
Hysteresis for ILIM-SHORT,OK comparator
HYST
Maximum ILOAD that will be
delivered for 1 ms when ILIM is
shorted
IOUT
Maximum output current limit, CL
2450
OUTPUT
ILOAD = 1000 mA
ILOAD = 10 mA
4.92
4.94
5.00
5.01
5.04
5.06
VOUT-REG
Regulated output voltage
V
RILIM = KILIM / IILIM, where IILIM is
the hardware current limit.
IOUT = 1 A
Current programming factor for hardware
protection
KILIM
285
314
262
321
AΩ
IIMAX = KIMAX / RILIM where IMAX
Current programming factor for the nominal is the maximum normal
KIMAX
AΩ
operating current
operating current.
IOUT = 1 A
IOUT
Current limit programming range
Current limit during WPC communication
1500
440
mA
mA
mA
IOUT > 300 mA
IOUT < 300 mA
Iout + 50
380
ICOMM
320
Hold off time for the communication current
limit during start-up
tHOLD
1
s
TS / CTRL FUNCTIONALITY
Internal TS Bias Voltage (VTS is the voltage
ITS-Bias < 100 µA (periodically
VTS-Bias
at the TS/CTRL pin, VTS-Bias is thet internal
bias voltage)
2
2.2
2.4
V
driven see tTS/CTRL
)
VCOLD
Rising threshold
56.5
58.7
2
60.8 %VTS-Bias
%VTS-Bias
VTS-Bias: 50% →60%
VTS-Bias: 60% →50%
VTS-Bias: 20% →15%
VTS-Bias: 15% →20%
VCOLD-Hyst
VHOT
Falling hysteresis
Falling threshold
18.5
19.6
3
20.7 %VTS-Bias
%VTS-Bias
VHOT-Hyst
VCTRL-High
VCTRL-Low
Rising hysteresis
Voltage on CTRL pin for a high
Voltage on CTRL pin for a low
0.2
0
5
V
0.05
mV
Time period of TS/CTRL measurements
(when VTS-Bias is being driven internally)
Synchronous to the
communication period
tTS/CTRL-Meas
tTS-Deglitch
RTS
24
10
20
ms
ms
kΩ
Deglitch time for all TS comparators
Pullup resistor for the NTC network. Pulled
up to VTB-Bias
18
22
THERMAL PROTECTION
TJ-SD
Thermal shutdown temperature
Thermal shutdown hysteresis
155
20
°C
°C
TJ-Hys
OUTPUT LOGIC LEVELS ON CHG
VOL
IOFF
Open-drain CHG pin
ISINK = 5 mA
V CHG = 20 V
500
1
mV
µA
CHG leakage current when disabled
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8.5 Electrical Characteristics (continued)
over operating free-air temperature range, –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
COMM PIN
RDS(ON)
COMM1 and COMM2
VRECT = 2.6 V
1.5
Ω
IOFF
COMMx pin leakage current
VCOMM1 = 20 V, VCOMM2 = 20 V
1
µA
CLAMP PIN
RDS(ON)
CLAMP1 and CLAMP2
0.8
Ω
ADAPTER ENABLE
VAD-Pres
VAD-PresH
IAD
VAD Rising threshold voltage
3.5
3.6
3.8
V
VAD 0 V →5 V
VAD hysteresis
400
mV
μA
VAD 5 V →0 V
Input leakage current
VRECT = 0 V, VAD = 5 V
60
Pullup resistance from AD-EN to OUT when
RAD
adapter mode is disabled and VOUT > VAD
EN-OUT
,
VAD = 0 V, VOUT = 5 V
200
4.5
350
Ω
Voltage difference between VAD and V AD-EN
when adapter mode is enabled
VAD-Diff
3
5
V
VAD = 5 V, 0°C ≤TJ ≤85°C
SYNCHRONOUS RECTIFIER
IOUT at which the synchronous rectifier
enters half-synchronous mode, SYNC_EN
IOUT-SR
80
100
30
135
mA
mA
V
ILOAD 200 mA →0 mA
ILOAD 0 mA →200 mA
Hysteresis for IOUT,SR (full-synchronous
mode enabled)
IOUT-SRH
VHS-DIODE
High-side diode drop when the rectifier is in IAC-VRECT = 250 mA and
half-synchronous mode
0.7
TJ = 25°C
EN1 AND EN2
VIL
Input low threshold for EN1 and EN2
Input high threshold for EN1 and EN2
EN1 and EN2 pulldown resistance
0.4
V
V
VIH
RPD
1.3
200
0%
kΩ
ADC (WPC RELATED MEASUREMENTS AND COEFFICIENTS)
Accuracy of the current sense over the load
range
IOUT SENSE
IOUT = 750 mA - 1000 mA
0.9%
–1.5%
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8.6 Typical Characteristics
100
80
70
90
80
70
60
50
40
60
50
40
30
20
10
0
0
1
2
3
4
5
0
1
2
3
4
5
Power (W)
Power (W)
Input: TX DC power
Output: RX RECT power
Input: RX AC power
Output: RX RECT power
Efficiency: Output Power / Input Power
Efficiency: Output Power / Input Power
图8-2. System Efficiency From DC Input to DC Output
图8-1. Rectifier Efficiency
80
70
7.5
VRECT_RISING
7.0
VRECT_FALLING
60
50
6.5
6.0
5.5
5.0
40
30
20
RILIM = 250 Ω
RILIM = 500 Ω
10
0
0
1
2
3
4
5
0
200
400
600
Iout (mA)
800
1000
1200
Power (W)
Input: TX DC power
Output: RX RECT power
RILIM = 250 Ω
图8-4. Impact of Load Current ( ILOAD) on Rectifier Voltage
Plot: Output Power / Input Power
(VRECT
)
图8-3. Light Load System Efficiency Improvement Due to
Dynamic Efficiency Scaling Feature (1)
7.5
4.99
4.985
4.98
RILIM = 250 Ω
7.0
RILIM = 750 Ω
4.975
4.97
6.5
6.0
5.5
5.0
4.965
4.96
4.955
4.95
4.945
0
200
400
600
IOUT (mA)
800
1000
1200
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Output Current (A)
RILIM = 250 Ωand 750 Ω
图8-5. Impact of Maximum Current setting (RILIM) on Rectifier
Maximum Current = 1 A
图8-6. Impact of Load Current on Output Voltage
Voltage (VRECT
)
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8.6 Typical Characteristics (continued)
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
5.004
5.002
5.000
4.998
0.0
0.2
0.4
0.6
0.8
1.0
0
20
40
60
80
100
120
Load Current (A)
Temperature (°C)
图8-8. VOUT vs Temperature
COUT = 1 µf
Without Communication
图8-7. Impact of Load Current on Output Ripple
图8-10. 1-A Load Step Full System Response
图8-9. 1-A Instantaneous Load Dump (2)
VRECT
VOUT
图8-11. 1-A Load Dump Full System Response
图8-12. Rectifier Overvoltage Clamp (fop = 110 kHz)
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8.6 Typical Characteristics (continued)
VTS/CTRL
VRECT
VRECT
VOUT
图8-13. TS Fault
图8-14. Adapter Insertion (VAD = 10 V)
VAD
VRECT
VRECT
VOUT
图8-16. On-the-Go Enabled (VOTG = 3.5 V) (3)
图8-15. Adapter Insertion (VAD = 10 V) Illustrating Break-Before-
Make Operation
IOUT
IOUT
VRECT
VRECT
VOUT
VOUT
图8-18. Adaptive Communication Limit Event Where the 400-
图8-17. BQ51013B-Q1 Typical Start-Up With a 1-A System Load
mA Current Limit is Enabled (IOUT-DC < 300 mA)
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8.6 Typical Characteristics (continued)
IOUT
VRECT
VOUT
图8-20. RX Communication Packet Structure
图8-19. Adaptive Communication Limit Event Where the
Current Limit is IOUT + 50 mA (IOUT-DC > 300 mA)
1. Efficiency measured from DC input to the transmitter to DC output of the receiver. The BQ500210EVM-689
TX was used for these measurements. Measurement subject to change if an alternate TX is used.
2. Total droop experienced at the output is dependent on receiver coil design. The output impedance must be
low enough at that particular operating frequency in order to not collapse the rectifier below 5 V.
3. On-the-go mode is enabled by driving EN1 high. In this test, the external PMOS is connected between the
output of the BQ51013B-Q1 device and the AD pin; therefore, any voltage source on the output is supplied
to the AD pin.
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9 Detailed Description
9.1 Overview
A wireless system consists of a charging pad (transmitter, TX or primary) and the secondary-side equipment
(receiver, RX or secondary). There is a coil in the charging pad and in the secondary equipment which are
magnetically coupled to each other when the secondary is placed on the primary. Power is then transferred from
the transmitter to the receiver through coupled inductors (effectively an air-core transformer). Controlling the
amount of power transferred is achieved by sending feedback (error signal) communication to the primary (to
increase or decrease power).
The receiver communicates with the transmitter by changing the load seen by the transmitter. This load variation
results in a change in the transmitter coil current, which is measured and interpreted by a processor in the
charging pad. The communication is digital; packets are transferred from the receiver to the transmitter.
Differential bi-phase encoding is used for the packets. The bit rate is 2-kbps.
Various types of communication packets have been defined. These include identification and authentication
packets, error packets, control packets, end power packets, and power usage packets.
The transmitter coil stays powered off most of the time. It occasionally wakes up to see if a receiver is present.
When a receiver authenticates itself to the transmitter, the transmitter will remain powered on. The receiver
maintains full control over the power transfer using communication packets.
Power
BQ51013B-Q1
Voltage/
Current
System
Load
AC to DC
Drivers
Rectification
Conditioning
Communication
LI-Ion
Battery
Battery
Charger
Controller
V/I
Sense
Controller
BQ500212A
Transmitter
Receiver
图9-1. WPC Wireless Power System Indicating the Functional Integration of the BQ51013B-Q1
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9.2 Functional Block Diagram
RECT
I
OUT
VOUT,FB
VREF,ILIM
VILIM
_
+
+
_
VOUT,REG
VREF,IABS
VIABS,FB
+
_
ILIM
VIN,FB
VIN,DPM
+
_
AD
+
_
VREFAD,OVP
BOOT2
BOOT1
_
+
VREFAD,UVLO
AD-EN
AC1
AC2
Sync
Rectifier
Control
VREF,TS-BIAS
VFOD
FOD
+
_
COMM1
COMM2
+
_
TS_COLD
TS_HOT
VBG,REF
VIN,FB
VOUT,FB
VILIM
+
_
DATA_
OUT
VIABS,FB
ADC
TS/CTRL
CLAMP1
CLAMP2
VIABS,REF
VIC,TEMP
VFOD
+
_
TS_DETECT
VREF_100MV
Digital Control
CHG
EN1
200kW
VRECT
VOVP,REF
+
_
OVP
EN2
200kW
PGND
9.3 Feature Description
9.3.1 Details of a Qi Wireless Power System and BQ51013B-Q1 Power Transfer Flow Diagrams
The BQ51013B-Q1 integrates a fully compliant WPC v1.2 communication algorithm in order to streamline
receiver designs (no extra software development required). Other unique algorithms such as Dynamic Rectifier
Control are also integrated to provide best-in-class system performance. This section provides a high level
overview of these features by illustrating the wireless power transfer flow diagram from start-up to active
operation.
During start-up operation, the wireless power receiver must comply with proper handshaking to be granted a
power contract from the TX. The TX will initiate the handshake by providing an extended digital ping. If an RX is
present on the TX surface, the RX will then provide the signal strength, configuration and identification packets
to the TX (see volume 1 of the WPC specification for details on each packet). These are the first three packets
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sent to the TX. The only exception is if there is a true shutdown condition on the EN1/EN2, AD, or TS/CTRL pins
where the RX will shut down the TX immediately. See 表 9-4 for details. Once the TX has successfully received
the signal strength, configuration and identification packets, the RX will be granted a power contract and is then
allowed to control the operating point of the power transfer. With the use of the BQ51013B-Q1 Dynamic Rectifier
Control algorithm, the RX will inform the TX to adjust the rectifier voltage above 7 V prior to enabling the output
supply. This method enhances the transient performance during system start-up. See 图 9-2 for the start-up flow
diagram details.
TX Powered
without RX
Active
TX Extended Digital Ping
EN1/EN2/AD/TS/CTRL
EPT Condition?
Send EPT packet with
reason value
YES
NO
Identification &
Configuration & SS, Received
by TX?
NO
YES
Power Contract Established.
All proceeding control is
dictated by the RX.
Send control error packet to
increase VRECT
VRECT < VRECT-TH1
?
YES
NO
Startup operating point
established. Enable the RX
output.
RX
Active Power
Transfer Stage
图9-2. Wireless Power Start-Up Flow Diagram
Once the start-up procedure has been established, the RX enters the active power transfer stage. This is
considered the “main loop” of operation. The Dynamic Rectifier Control algorithm determines the rectifier
voltage target based on a percentage of the maximum output current level setting (set by KIMAX and the ILIM
resistance to GND). The RX sends control error packets in order to converge on these targets. As the output
current changes, the rectifier voltage target will dynamically change. The feedback loop of the WPC system is
relatively slow where it can take up to 90 ms to converge on a new rectifier voltage target. It should be
understood that the instantaneous transient response of the system is open loop and dependent on the RX coil
output impedance at that operating point. More details on this is covered in the section Receiver Coil Load-Line
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Analysis. The “main loop” also determines if any conditions in 表 9-4 are true in order to discontinue power
transfer. See 图9-3 which illustrates the active power transfer loop.
RX
Active Power
Transfer Stage
RX Shutdown
conditions per
the EPT Table?
TX Powered
without RX
Active
Send EPT packet with
reason value
YES
YES
YES
YES
NO
IOUT < 10% of IIMAX
NO
VRECT target = VRECT-Th1
.
Send control error packets
to converge.
?
?
VRECT target = VRECT-Th2
.
Send control error packets
to converge.
IOUT < 20% of IIMAX
NO
VRECT target = VRECT-Th3
.
Send control error packets
to converge.
IOUT < 40% of IIMAX
?
NO
VRECT target = VRECT-Th4
.
Send control error packets
to converge.
Measure Rectified Power
and Send Value to TX
图9-3. Active Power Transfer Flow Diagram
Another requirement of the WPC v1.2 specification is to send the measured received power. This task is enabled
on the device by measuring the voltage on the FOD pin which is proportional to the output current and can be
scaled based on the choice of the resistor to ground on the FOD pin.
9.3.2 Dynamic Rectifier Control
The Dynamic Rectifier Control algorithm offers the end system designer optimal transient response for a given
maximum output current setting. This is achieved by providing enough voltage headroom across the internal
regulator at light loads in order to maintain regulation during a load transient. The WPC system has a relatively
slow global feedback loop where it can take more than 90 ms to converge on a new rectifier voltage target.
Therefore, the transient response is dependent on the loosely coupled transformers output impedance profile.
The Dynamic Rectifier Control allows for a 2 V change in rectified voltage before the transient response will be
observed at the output of the internal regulator (output of the BQ51013B-Q1). A 1-A application allows up to a
1.5-Ωoutput impedance. The Dynamic Rectifier Control behavior is illustrated in 图8-4 where RILIM is set to 220
Ω.
9.3.3 Dynamic Efficiency Scaling
The Dynamic Efficiency Scaling feature allows for the loss characteristics of the BQ51013B-Q1 to be scaled
based on the maximum expected output power in the end application. This effectively optimizes the efficiency for
each application. This feature is achieved by scaling the loss of the internal LDO based on a percentage of the
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maximum output current. Note that the maximum output current is set by the KIMAX term and the RILIM resistance
(where RILIM = KIMAX / IMAX). The flow diagram shown in 图 9-3 illustrates how the rectifier is dynamically
controlled (Dynamic Rectifier Control) based on a fixed percentage of the IMAX setting. 表 9-1 summarizes how
the rectifier behavior is dynamically adjusted based on two different RILIM settings.
表9-1. Dynamic Efficiency Scaling
OUTPUT CURRENT
PERCENTAGE
RILIM = 500 Ω
IMAX = 0.5 A
RILIM = 220 Ω
IMAX = 1.14 A
VRECT
0 to 10%
10 to 20%
20 to 40%
>40%
0 A to 0.05 A
0.05 A to 0.1 A
0.1 A to 0.2 A
> 0.2 A
0 A to 0.114 A
0.114 A to 0.227 A
0.227 A to 0.454 A
> 0.454 A
7.08 V
6.28 V
5.53 V
5.11 V
图 8-5 illustrates the shift in the Dynamic Rectifier Control behavior based on the two different RILIM settings.
With the rectifier voltage (VRECT) being the input to the internal LDO, this adjustment in the Dynamic Rectifier
Control thresholds will dynamically adjust the power dissipation across the LDO where:
P
= V
(
- V
× I
)
OUT OUT
DIS
RECT
(1)
图 8-3 illustrates how the system efficiency is improved due to the Dynamic Efficiency Scaling feature. Note that
this feature balances efficiency with optimal system transient response.
9.3.4 RILIM Calculations
The BQ51013B-Q1 includes a means of providing hardware overcurrent protection by means of an analog
current regulation loop. The hardware current limit provides an extra level of safety by clamping the maximum
allowable output current (current compliance). The RILIM resistor size also sets the thresholds for the dynamic
rectifier levels and thus providing efficiency tuning per each application’s maximum system current. The
calculation for the total RILIM resistance is as follows:
K
IM A X
R
=
IL IM
I
M A X
K
IL IM
IL IM
I
= 1 .2 ´ I
=
IL IM
M A X
R
R
= R + R
IL IM
1
F O D
(2)
where
• IMAX is the expected maximum output current during normal operation.
• IILIM is the hardware over current limit.
When referring to the application diagram shown in 图10-1, RILIM is the sum of RFOD and R1 (the total resistance
from the ILIM pin to GND).
9.3.5 Input Overvoltage
If the input voltage suddenly increases in potential (for example, due to a change in position of the equipment on
the charging pad), the voltage-control loop inside the BQ51013B-Q1 becomes active, and prevents the output
from going beyond VOUT-REG. The receiver then starts sending back error packets to the transmitter every 30 ms
until the input voltage comes back to the VRECT-REG target, and then maintains the error communication every
250 ms.
If the input voltage increases in potential beyond VRECT-OVP, the device switches off the LDO and communicates
to the primary to bring the voltage back to VRECT-REG. In addition, a proprietary voltage protection circuit is
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activated by means of CCLAMP1 and CCLAMP2 that protects the device from voltages beyond the maximum rating
of the device.
9.3.6 Adapter Enable Functionality and EN1/EN2 Control
图 10-6 is an example application that shows the BQ51013B-Q1 used as a wireless power receiver that can
power mutliplex between wired or wireless power for the down-system electronics. In the default operating
mode, pins EN1 and EN2 are low, which activates the adapter enable functionality. In this mode, if an adapter is
not present the AD pin will be low, and AD-EN pin will be pulled to the higher of the OUT and AD pins so that the
PMOS between OUT and AD will be turned off. If an adapter is plugged in and the voltage at the AD pin goes
above V AD-EN , then wireless charging is disabled and the AD-EN pin will be pulled approximately VAD below the
AD pin to connect AD to the secondary charger. The difference between AD and AD-EN is regulated to a
maximum of VAD-Diff to ensure the VGS of the external PMOS is protected.
The EN1 and EN2 pins include internal pulldown resistors (RPD), so that if these pins are not connected
BQ51013B-Q1 defaults to AD-EN control mode. However, these pins can be pulled high to enable other
operating modes. If the pins are pulled high or controlled by drivers and are subject to fast transient (>10V/10ns)
higher than ~ 8V it is recommended that current limit resistors (1k to 10k ohms) be added in series with the pins.
See 表9-2:
表9-2. Adapter Enable Functionality
EN1
EN2
RESULT
Adapter control enabled. If adapter is present then secondary charger is powered by adapter, otherwise wireless
charging is enabled when wireless power is available. Communication current limit is enabled.
0
0
0
1
1
1
0
1
Disables communication current limit.
AD-EN is pulled low, whether or not adapter voltage is present. This feature can be used for USB OTG applications.
Adapter and wireless charging are disabled, power will not be delivered by the OUT pin in this mode.
表9-3. EN1/EN2 Control
EN1
EN2
WIRELESS POWER
Enabled
WIRED POWER
Priority(1)
OTG MODE ADAPTIVE COMMUNICATION LIMIT
EPT
0
0
1
0
1
0
Disabled
Disabled
Enabled(2)
Enabled
Disabled
N/A
Not Sent to TX
Not Sent to TX
EPT 0x00, Unknown
Priority(1)
Enabled
Disabled
Enabled
EPT 0x01,
Charge Complete
1
1
Disabled
Disabled
Disabled
N/A
(1) If both wired and wireless power are present, wired or wireless is given priority based on EN2.
(2) Allows for a boost-back supply to be driven from the output terminal of the RX to the adapter port through the external back-to-back
PMOS FET.
As described in 表 9-3, when EN1 is low, both wired and wireless power are useable. If both are present, priority
is set between wired and wireless by EN2. When EN1 is high, wireless power is disabled and wired power
functionality is set by EN2. When EN1 is high but EN2 is low, wired power is enabled if present. Additionally,
USB OTG mode is active. In USB OTG mode, a charger connected to the OUT pin can power the AD pin. Note
that EN1 must be pulled high from an active source (microcontroller). Finally, pulling both EN1 and EN2 high
disables both wired and wireless charging.
备注
It is required to connect a back-to-back PMOS between AD and OUT so that voltage is blocked in
both directions. Also, when AD mode is enabled no load can be pulled from the RECT pin as this
could cause an internal device overvoltage in BQ51013B-Q1.
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9.3.7 End Power Transfer Packet (WPC Header 0x02)
The WPC allows for a special command for the receiver to terminate power transfer from the transmitter termed
End Power Transfer (EPT) packet. 表 9-4 specifies the v1.2 reasons column and their corresponding data field
value. The condition column corresponds to the methodology used by BQ51013B-Q1 to send equivalent
message.
表9-4. End Power Transfer Packet
MESSAGE
VALUE
CONDITION
Unknown
0x00
AD > VAD-Pres, or <EN1 EN2> = <10>, or TS/CTRL > VCTRL-
High, or TS > VCOLD
Charge Complete
Internal Fault
Overtemperature
Overvoltage
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
<EN1 EN2> = <11>
TJ > 150°C or RILIM < 100 Ω
TS < VHOT, or TS/CTRL < VCTRL-Low
VRECT target does not converge
Not sent
Overcurrent
Battery Failure
Reconfigure
Not sent
Not sent
No Response
Not sent
9.3.8 Status Outputs
The BQ51013B-Q1 has one status output, CHG. This output is an open-drain NMOS device that is rated to 20 V.
The open-drain FET connected to the CHG pin will be turned on whenever the output of the power supply is
enabled. The output of the power supply will not be enabled if the VRECT-REG does not converge at the no-load
target voltage.
9.3.9 WPC Communication Scheme
The WPC communication uses a modulation technique termed “back-scatter modulation” where the receiver
coil is dynamically loaded in order to provide amplitude modulation of the transmitter's coil voltage and current.
This scheme is possible due to the fundamental behavior between two loosely coupled inductors (here between
the TX and RX coils). This type of modulation can be accomplished by switching in and out a resistor at the
output of the rectifier, or by switching in and out a capacitor across the AC1/AC2 net. 图 9-4 shows how to
implement resistive modulation.
CRES1
AC1
VRECT
RMOD
COIL
CRES2
AC2
GND
图9-4. Resistive Modulation
图9-5 shows how to implement capacitive modulation.
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CRES1
AC1
VRECT
CMOD
COIL
CRES2
AC2
GND
图9-5. Capacitive Modulation
The amplitude change in the TX coil voltage or current can be detected by the transmitter's decoder. The
resulting signal observed by the TX is shown in 图9-6.
Power
BQ51013B-Q1
Voltage/
Current
System
Load
AC to DC
Drivers
Rectification
Conditioning
Communication
LI-Ion
Battery
Battery
Charger
Controller
V/I
Sense
Controller
BQ500212A
1
1
0
0
0
图9-6. TX Coil Voltage/Current
The WPC protocol uses a differential bi-phase encoding scheme to modulate the data bits onto the TX coil
voltage/current. Each data bit is aligned at a full period of 0.5 ms (tCLK) or 2 kHz. An encoded ONE results in two
transitions during the bit period and an encoded ZERO results in a single transition. See 图9-7 for an example of
the differential bi-phase encoding.
图9-7. Differential Bi-Phase Encoding Scheme (WPC Volume 1: Low Power, Part 1 Interface Definition)
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The bits are sent LSB first and use an 11-bit asynchronous serial format for each portion of the packet. This
includes one start bit, n-data bytes, a parity bit, and a single stop bit. The start bit is always ZERO and the parity
bit is odd. The stop bit is always ONE. 图9-8 shows the details of the asynchronous serial format.
图9-8. Asynchronous Serial Formatting (WPC Volume 1: Low Power, Part 1 Interface Definition)
Each packet format is organized as shown in 图9-9.
Preamble
Header
Message
Checksum
图9-9. Packet Format (WPC Volume 1: Low Power, Part 1 Interface Definition)
图8-20 shows an example waveform of the receiver sending a rectified power packet (header 0x04).
9.3.10 Communication Modulator
The BQ51013B-Q1 device provides two identical, integrated communication FETs which are connected to the
pins COMM1 and COMM2. These FETs are used for modulating the secondary load current which allows the
BQ51013B-Q1 to communicate error control and configuration information to the transmitter. 图 9-10 shows how
the COMMx pins can be used for resistive load modulation. Each COMMx pin can handle at most a 24-Ω
communication resistor. Therefore, if a COMMx resistor between 12 Ω and 24 Ω is required, COMM1 and
COMM2 pins must be connected in parallel. The BQ51013B-Q1 device does not support a COMMx resistor less
than 12 Ω.
RECTIFIER
24 W
24 W
COMM1
COMM2
COMM_DRIVE
图9-10. Resistive Load Modulation
In addition to resistive load modulation, the BQ51013B-Q1 is also capable of capacitive load modulation as
shown in 图 9-11. In this case, a capacitor is connected from COMM1 to AC1 and from COMM2 to AC2. When
the COMMx switches are closed there is effectively a 22 nF capacitor connected between AC1 and AC2.
Connecting a capacitor in between AC1 and AC2 modulates the impedance seen by the coil, which will be
reflected in the primary as a change in current.
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AC1
AC2
47 nF
47 nF
COMM1
COMM2
COMM_DRIVE
图9-11. Capacitive Load Modulation
9.3.11 Adaptive Communication Limit
The Qi communication channel is established through backscatter modulation as described in the previous
sections. This type of modulation takes advantage of the loosely coupled inductor relationship between the RX
and TX coils. Essentially, the switching in-and-out of the communication capacitor or resistor adds a transient
load to the RX coil in order to modulate the TX coil voltage and current waveform (amplitude modulation). The
consequence of this technique is that a load transient (load current noise) from the mobile device has the same
signature. To provide noise immunity to the communication channel, the output load transients must be isolated
from the RX coil. The proprietary feature Adaptive Communication Limit achieves this by dynamically adjusting
the current limit of the regulator. When the regulator is put in current limit, any load transients will be offloaded to
the battery in the system.
Note that this requires the battery charger device to have input voltage regulation (weak adapter mode). The
output of the RX appears as a weak supply if a transient occurs above the current limit of the regulator.
The Adaptive Communication Limit feature has two current limit modes and is detailed in 表9-5.
表9-5. Adaptive Communication Limit
IOUT
COMMUNICATION CURRENT LIMIT
Fixed 400 mA
< 300 mA
> 300 mA
IOUT + 50 mA
The first mode is illustrated in 图8-18. In this plot, an output load pulse of 300 mA is periodically introduced on a
DC current level of 200 mA. Therefore, the 400 mA current limit is enabled. The pulses on VRECT indicate that a
communication packet event is occurring. When the output load pulse occurs, the regulator limits the pulse to a
constant 400 mA and, therefore, preserves communication. Note that VOUT drops to 4.5 V instead of GND. A
charger device with an input voltage regulation set to 4.5 V allows this to occur by offloading the load transient
support to the mobile device’s battery.
The second mode is illustrated in 图 8-19. In this plot, an output pulse of 200 mA is periodically introduced on a
DC current level of 400 mA. Therefore, the tracking current mode (IOUT + 50 mA) is enabled. In this mode, the
BQ51013B-Q1 measures the active output current and sets the regulator's current limit 50 mA above this
measurement. When the load pulse occurs during a communication packet event, the output current is regulated
to 450 mA. As the communication packet event has finished the output load is allowed to increase. Note that
during the time the regulator is in current limit VOUT is reduced to 4.5 V and 5 V when not in current limit.
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9.3.12 Synchronous Rectification
The BQ51013B-Q1 provides an integrated, self-driven synchronous rectifier that enables high-efficiency AC to
DC power conversion. The rectifier consists of an all NMOS H-Bridge driver where the backgates of the diodes
are configured to be the rectifier when the synchronous rectifier is disabled. During the initial start-up of the WPC
system the synchronous rectifier is not enabled. At this operating point, the DC rectifier voltage is provided by
the diode rectifier. Once VRECT is greater than VUVLO, half synchronous mode will be enabled until the load
current surpasses IBAT-SR. Above IBAT-SR the full synchronous rectifier stays enabled until the load current drops
back below the hysteresis level (IBAT-SRH) where half-synchronous mode is enabled re-enabled.
9.3.13 Temperature Sense Resistor Network (TS)
The BQ51013B-Q1 includes a ratiometric external temperature sense function. The temperature sense function
has two ratiometric thresholds which represent a hot and cold condition. An external temperature sensor is
recommended in order to provide safe operating conditions for the receiver product. This pin is best used for
monitoring the surface that can be exposed to the end user (place the NTC resistor closest to where the user
would physically contact the end product).
图9-12 allows for any NTC resistor to be used with the given VHOT and VCOLD thresholds.
VTSB
VTSB
20 lQ
R2
20 lQ
R2
TS/CTRL
TS/CTRL
R1
R1
R3
C3
C3
NTC
NTC
图9-12. NTC Circuit Options For Safe Operation of the Wireless Receiver Power Supply
The resistors R1 and R3 can be solved by resolving the system of equations at the desired temperature
thresholds. The two equations are:
æ
ç
ç
ö
÷
÷
÷
R
R
+ R
1
TCOLD
(
)
3
NTC
R + R
+ R
1
ç
(
NTC
)
3
NTC
TCOLD
è
ø
%V
=
=
´100
COLD
æ
ç
ç
ö
R
R
+ R
1
(
)
÷
÷
÷
3
TCOLD
+ R2
R + R
+ R
1
ç
(
)
3
NTC
TCOLD
è
ø
æ
ö
÷
÷
÷
R
R
+ R
1
THOT
(
)
ç
ç
3
NTC
R + R
+ R
ç
(
NTC
)
3
NTC
1
THOT
è
ø
%V
´100
HOT
æ
ç
ç
ö
R
R
+ R
1
(
)
÷
÷
÷
3
THOT
+ R2
R + R
+ R
1
ç
(
)
3
NTC
THOT
è
ø
(3)
Where:
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ö
÷
÷
çæ 1
è
1
b
-
ç
TCOLD Toø
R
= R e
o
NTC
TCOLD
ö
çæ 1
1
-
÷
÷
b
ç
Toø
THOT
è
R
= R e
o
NTC
THOT
(4)
where
• TCOLD and THOT are the desired temperature thresholds in degrees Kelvin.
• RO is the nominal resistance.
• βis the temperature coefficient of the NTC resistor.
R2 is fixed at 20 kΩ. An example solution is provided:
• R1 = 4.23 kΩ
• R3 = 66.8 kΩ
where the chosen parameters are:
• %VHOT = 19.6%
• %VCOLD = 58.7%
• TCOLD = –10°C
• THOT = 100°C
• β= 3380
• RO = 10 kΩ
The plot of the percent VTSB vs. temperature is shown in 图9-13:
图9-13. Example Solution for an NTC Resistor with RO = 10 kΩand β= 3380
图 9-14 illustrates the periodic biasing scheme used for measuring the TS state. An internal TS_READ signal
enables the TS bias voltage (VTS-Bias) for 24 ms. During this period, the TS comparators are read (with tTS
deglitch) and appropriate action is taken based on the temperature measurement. After this 24-ms period has
elapsed, the TS_READ signal goes low, which causes the TS/CTRL pin to become high impedance. During the
next 35 ms (priority packet period) or 235 ms (standard packet period), the TS voltage is monitored and
compared to VCTRL-HI. If the TS voltage is greater than VCTRL-HI then a secondary device is driving the TS/CTRL
pin and a CTRL = ‘1’is detected.
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24 ms
240 ms
TS_READ
Tracks comm packet
rate, typically 240 ms
when standard error
packets are sent.
TS pin is Hi-Z - it‘s
monitored to see
whether some other
device is driving the TS
pin.
10 ms deglitch on all TS
comps
图9-14. Timing Diagram For TS Detection Circuit
9.3.14 3-State Driver Recommendations for the TS/CTRL Pin
The TS/CTRL pin offers three functions with one 3-state driver interface:
• NTC temperature monitoring
• Over-Temperature Fault
• End Power Transfer 0x00 (EPT Unknown)
A 3-state driver can be implemented with the circuit in 图9-15 and the use of two GPIO connections. M3 and M4
and both resistors are external components.
BAT
TERM
BQ51013B-Q1
TS/CTRL
GPIO
System
Controller
FAULT
GPIO
图9-15. 3-State Driver For TS/CTRL
Note that the signals TERM and FAULT are given by two GPIOs. The truth table for this circuit is found in 表9-6:
表9-6. Truth Table
TERM
FAULT
F (Result)
1
0
1
0
0
1
High Impedance (Normal Mode)
End Power Transfer 0x00
End Power Transfer 0x03
The default setting is TERM / FAULT = 1 / 0. In this condition, the TS-CTRL net is high impedance (high-z) and
the NTC function is allowed to operate, normal operation. When TERM / FAULT = 1 /1 the TS-CTRL pin is pulled
to GND and the RX is shutdown with End Power Transfer Over Temperature sent to TX. When TERM / FAULT =
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0 / 0, the TS-CTRL pin is pulled to the battery and the RX is shutdown with End Power Transfer Unknown sent to
the TX.
9.3.15 Thermal Protection
The BQ51013B-Q1 includes a thermal shutdown protection. If the die temperature reaches TJ-SD, the LDO is
shut off to prevent any further power dissipation. In this case BQ51013B-Q1 will send an EPT message of
internal fault (0x02). Once the temperature falls TJ-Hys below TJ-SD, operation can continue.
9.3.16 WPC v1.2 Compliance –Foreign Object Detection
The BQ51013B-Q1 is a WPC v1.2 compatible device. In order to enable a Power Transmitter to monitor the
power loss across the interface as one of the possible methods to limit the temperature rise of Foreign Objects,
the BQ51013B-Q1 reports its Received Power to the Power Transmitter. The Received Power equals the power
that is available from the output of the Power Receiver plus any power that is lost in producing that output power
(the power loss in the Secondary Coil and series resonant capacitor, the power loss in the Shielding of the
Power Receiver, the power loss in the rectifier). In the WPC1.2 specification, foreign object detection (FOD) is
enforced. This means the BQ51013B-Q1 will send received power information with known accuracy to the
transmitter.
WPC v1.2 defines Received Power as “the average amount of power that the Power Receiver receives through
its Interface Surface, in the time window indicated in the Configuration Packet”.
To receive certification as a WPC v1.2 receiver, the Device Under Test (DUT) is tested on a Reference
Transmitter whose transmitted power is calibrated, the receiver must send a received power such that:
0 > (TX PWR)REF –(RX PWR out)DUT > –375 mW
(5)
This 375-mW bias ensures that system will remain interoperable.
WPC v1.2 Transmitter is tested to see if it can detect reference Foreign Objects with a Reference receiver.
WPC v1.2 Specification will allow much more accurate sensing of Foreign Objects.
9.3.17 Receiver Coil Load-Line Analysis
When choosing a receiver coil, TI recommends analyzing the transformer characteristics between the primary
coil and receiver coil through load-line analysis. This will capture two important conditions in the WPC system:
• Operating point characteristics in the closed loop of the WPC system.
• Instantaneous transient response prior to the convergence of the new operating point.
An example test configuration for conducting this analysis is shown in 图9-16:
CP
CS
A
VIN
LP
LS
CD
CB
RL
V
图9-16. Load-Line Analysis Test Bench
Where:
• VIN is a square-wave power source that should have a peak-to-peak operation of 19 V.
• CP is the primary series resonant capacitor (for example, 100 nF for Type A1 coil).
• LP is the primary coil of interest (such as, Type A1).
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• LS is the secondary coil of interest.
• CS is the series resonant capacitor chosen for the receiver coil under test.
• CD is the parallel resonant capacitor chosen for the receiver coil under test.
• CB is the bulk capacitor of the diode bridge (voltage rating should be at least 25 V and capacitance value of at
least 10 µF)
• V is a Kelvin connected voltage meter
• A is a series ammeter
• RL is the load of interest
TI recommends that the diode bridge be constructed of Schottky diodes.
The test procedure is as follows
• Supply a 19-V AC signal to LP starting at a frequency of 210 kHz
• Measure the resulting rectified voltage from no load to the expected full load
• Repeat the above steps for lower frequencies (stopping at 110 kHz)
An example load-line analysis is shown in 图9-17:
20
18
115 kHz
125 kHz
16
130 kHz
14
135 kHz
140 kHz
12
150 kHz
160 kHz
175 kHz
10
8
6
4
2
1 A load operating point
0.8 0.9 1
Ping voltage
0.1 0.2
1 A load step droop
0
0
0.3
0.4
0.5
0.6
0.7
LOAD (A)
图9-17. Example Load-Line Results
What 图 9-17 conveys about the operating point is that a specific load and rectifier target condition consequently
results in a specific operating frequency (for the type A1 TX). For example, at 1 A the dynamic rectifier target is
5.15 V. Therefore, the operating frequency will be from 150 kHz to 160 kHz in the above example. This is an
acceptable operating point. If the operating point ever falls outside the WPC frequency range (110 kHz – 205
kHz), the system will never converge and will become unstable.
In regards to transient analysis, there are two major points of interest:
• Rectifier voltage at the ping frequency (175 kHz).
• Rectifier voltage droop from no load to full load at the constant operating point.
In this example, the ping voltage will be approximately 5 V. This is above the UVLO of the BQ51013B-Q1 and,
therefore, start-up in the WPC system can be ensured. If the voltage is near or below the UVLO at this
frequency, then start-up in the WPC system may not occur.
If the maximum load step is 1 A, the droop in this example will be approximately 1 V (using the 140 kHz load-
line). To analyze the droop, locate the load-line that starts at 7 V at no-load. Follow this load-line to the maximum
load expected and take the difference between the 7-V no-load voltage and the full-load voltage at that constant
frequency. Ensure that the full-load voltage at this constant frequency is above 5 V. If it descends below 5 V, the
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output of the power supply will also droop to this level. This type of transient response analysis is necessary due
to the slow feedback response of the WPC system. This simulates the step response prior to the WPC system
adjusting the operating point.
备注
Coupling between the primary and secondary coils will worsen with misalignment of the secondary
coil. Therefore, it is recommended to re-analyze the load-lines at multiple misalignments to determine
where, in planar space, the receiver will discontinue operation.
See 表10-1 for recommended RX coils.
9.4 Device Functional Modes
The operational modes of the BQ51013B-Q1 are described in the 节 9.3. The BQ51013B-Q1 has several
functional modes. Start-up refers to the initial power transfer and communication between the receiver
(BQ51013B-Q1 circuit) and the transmitter. Power transfer refers to any time that the TX and RX are
communicating and power is being delivered from the TX to the RX. Power transfer termination occurs when the
RX is removed from the TX, power is removed from the TX, or the RX requests power transfer termination.
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10 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
10.1 Application Information
The BQ51013B-Q1 is a fully integrated wireless power receiver in a single device. The device complies with the
WPC v1.2 specifications for a wireless power receiver. When paired with a WPC v1.2 compliant transmitter, it
can provide up to 5 W of power. There are several tools available for the design of the system. These tools may
be obtained by checking the product page at www.ti.com/product/BQ51013B.
10.2 Typical Applications
10.2.1 BQ51013B-Q1 Wireless Power Receiver Used as a Power Supply
The following application discussion covers the requirements for setting up the BQ51013B-Q1 in a Qi-compliant
system for use as a power supply.
AD-EN
System
Load
AD
OUT
CCOMM1
C4
COMM1
BOOT1
AC1
CBOOT1
D1
ROS
RECT
C1
R4
C3
HOST
BQ51013B-Q1
TS/CTRL
COIL
C2
AC2
NTC
BOOT2
COMM2
CBOOT2
CHG
Tri-State
CCOMM2
CCLAMP2
CCLAMP1
Bi-State
Bi-State
CLAMP2
CLAMP1
ILIM
EN1
EN2
PGND
FOD
R1
RFOD
图10-1. BQ51013B-Q1 Used as a Wireless Power Receiver and Power Supply for System Loads
10.2.1.1 Design Requirements
This application is for a system that has varying loads from less than 100 mA up to 1 A. It must work with any Qi-
certified transmitter. There is no requirement for any external thermal measurements. An LED indication is
required to indicate an active power supply. Each of the components from the application drawing will be
examined.
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10.2.1.2 Detailed Design Procedure
10.2.1.2.1 Using The BQ51013B-Q1 as a Wireless Power Supply: (See 图10-1)
图 10-6 is the schematic of a system which uses the BQ51013B-Q1 as a power supply while power multiplexing
the wired (adapter) port.
When the system shown in 图 10-1 is placed on the charging pad, the receiver coil is inductively coupled to the
magnetic flux generated by the coil in the charging pad which consequently induces a voltage in the receiver
coil. The internal synchronous rectifier feeds this voltage to the RECT pin which has the filter capacitor C3.
The BQ51013B-Q1 identifies and authenticates itself to the primary using the COMM pins by switching on and
off the COMM FETs and hence switching in and out CCOMM. If the authentication is successful, the transmitter
will remain powered on. The BQ51013B-Q1 measures the voltage at the RECT pin, calculates the difference
between the actual voltage and the desired voltage VRECT-REG, (threshold 1 at no load) and sends back error
packets to the primary. (Dynamic VRECT Thresholds are shown in the 节 8.5 table.) This process goes on until
the input voltage settles at VRECT-REG. During a load transient, the dynamic rectifier algorithm will set the targets
specified by VRECT-REG thresholds 1, 2, 3, and 4. This algorithm is termed Dynamic Rectifier Control and is used
to enhance the transient response of the power supply.
During power up, the LDO is held off until the VRECT-REG threshold 1 converges. The voltage control loop
ensures that the output voltage is maintained at VOUT-REG to power the system. The BQ51013B-Q1 meanwhile
continues to monitor the input voltage, and maintains sending error packets to the primary every 250 ms. If a
large overshoot occurs, the feedback to the primary speeds up to every 32 ms in order to converge on an
operating point in less time.
10.2.1.2.2 Series and Parallel Resonant Capacitor Selection
Shown in 图10-1, the capacitors C1 (series) and C2 (parallel) make up the dual resonant circuit with the receiver
coil. These two capacitors must be sized correctly per the WPC v1.2 specification. 图 10-2 illustrates the
equivalent circuit of the dual resonant circuit:
C1 (Cs)
[•[
C2 (Cd)
图10-2. Dual Resonant Circuit With the Receiver Coil
The Power Receiver Design Requirements in Volume 1 of the WPC v1.2 specification highlights in detail the
sizing requirements. To summarize, the receiver designer will be required to take inductance measurements with
a standard test fixture as shown in 图10-3:
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Magnetic
Attractor
(example)
Interface
Surface
Secondary Coil
Shielding (optional)
Mobile
Device
Spacer
d
z
Primary Shielding
图10-3. WPC V1.2 Receiver Coil Test Fixture For the Inductance Measurement Ls’(Copied From
System Description Wireless Power Transfer, Volume 1: Low Power, Part 1 Interface Definition, Version
1.1)
The primary shield is to be 50 mm × 50 mm × 1 mm of Ferrite material PC44 from TDK Corp. The gap dZ is to be
3.4 mm. The receiver coil, as it will be placed in the final system (for example, the back cover and battery must
be included if the system calls for this), is to be placed on top of this surface and the inductance is to be
measured at 1-V RMS and a frequency of 100 kHz. This measurement is termed Ls’. The same measurement
is to be repeated without the test fixture shown in 图 10-3. This measurement is termed Ls or the free-space
inductance. Each capacitor can then be calculated using 方程式6:
-1
2
é
ù
'
S
C = f ´ 2p ´ L
(
)
ê
ú
1
S
ë
û
-1
é
ù
ú
1û
2
1
C = f ´ 2p ´ L -
ê
(
)
2
D
S
C
ê
ë
ú
(6)
where
• fS is 100 kHz +5/-10%.
• fD is 1 MHz ±10%.
C1 must be chosen first prior to calculating C2.
The quality factor must be greater than 77 and can be determined by 方程式7:
2p× f ×LS
D
Q =
R
(7)
where
• R is the DC resistance of the receiver coil.
All other constants are defined above.
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For this application, the selected coil inductance, Ls, is 11 µH and the Ls' is 16 µH with a DC resistance of 191
mΩ. Using 方程式6, the C1 resolves to 158.3 nF (with a range of 144 nF to 175 nF). For an optimum solution of
3 capacitors in parallel, the chosen capacitors are 68 nF, 47 nF, and 39 nF for a total of 154 nF, well within the
desired range. Using the same equation (and the chosen value for C1), C2 resolves to 2.3 nF. This is easily met
with capacitors of 2.2 nF and 100 pF. The C1 and C2 capacitors must have a minimum voltage rating of 25 V.
Solving for the quality factor (Q in 方程式7), gives a value of over 500.
表10-1 lists the recommended RX coils.
10.2.1.2.3 Recommended RX Coils
表10-1. Recommended RX Coils
OUTPUT CURRENT
MANUFACTURER
Mingstar
PART NUMBER
DIMENSIONS
28 mm × 14 mm
25 mm (round)
Ls
APPLICATION
Ls’
RANGE
312-00015
36.3 µH
10.9 µH
43.7 µH(1)
14.1 µH(1)
50 mA - 1000 mA
General 5-V Power Supply
General 5-V Power Supply
NC-01-
R37L02O-25250R53
NuCurrent
50 mA - 1000 mA
TDK
WR483265-15F5-G
IWAS-4832FF-50
48 mm × 32 mm
48mm × 32 mm
13.2 µH
10.9 µH
18.8 µH(1)
15.8 µH(2)
50 mA - 1000 mA
50 mA - 1000 mA
General 5-V Power Supply
General 5-V Power Supply
Vishay
(1) Ls’measurements conducted with a standard battery behind the RX coil assembly. This measurement is subject to change based on
different battery sizes, placements, and casing material.
(2) Battery not present behind the RX coil assembly. Subject to drop in inductance depending on the placement of the battery.
TI recommends that all inductance measurements are repeated in the designers specific system as there are
many influence on the final measurements.
10.2.1.2.4 COMM, CLAMP, and BOOT Capacitors
For most applications, the COMM, CLAMP, and BOOT capacitance values will be chosen to match the
BQ51013BEVM-764.
The BOOT capacitors are used to allow the internal rectifier FETs to turn on and off properly. These capacitors
are from AC1 to BOOT1 and from AC2 to BOOT2 and must have a minimum 25-V rating. A 10-nF capacitor with
a 25-V rating is chosen.
The CLAMP capacitors are used to aid in the clamping process to protect against overvoltage. These capacitors
are from AC1 to CLAMP1 and from AC2 to CLAMP2 and must have a minimum 25-V rating. A 0.47-µF capacitor
with a 25-V rating is chosen.
The COMM capacitors are used to facilitate the communication from the RX to the TX. This selection can vary a
bit more than the BOOT and CLAMP capacitors. In general, a 22-nF capacitor is recommended. Based on the
results of testing of the communication robustness in the final solution, a change to a 47-nF capacitor may be in
order. The larger the capacitor the larger the deviation will be on the coil which sends a stronger signal to the TX.
This also decreases the efficiency somewhat. In this case, a 22-nF capacitor with a 25-V rating is chosen.
10.2.1.2.5 Control Pins and CHG
This section discusses the pins that control the functions of the BQ51013B-Q1 (AD, AD_EN, EN1, EN2, and TS/
CTRL).
This solution uses wireless power exclusively. The AD pin is tied low to disable wired power interaction. The
output pin AD_EN is left floating.
EN1 and EN2 are tied to the system controller GPIO pins. This allows the system to control the wireless power
transfer. Normal operation leaves EN1 and EN2 low or floating (GPIO low or high impedance). EN1 and EN2
have internal pulldown resistors. With both EN1 and EN2 low, wireless power is enabled and power can be
transferred whenever the RX is on a suitable TX. The RX system controller can terminate power transfer and
send an EPT 0x01 (Charge Complete) by setting EN1=EN2=1. The TX will terminate power when the EPT 0x01
is received. The TX will continue to test for power transfer, but will not engage until the RX requests power. For
example, if the TX is the BQ500212A, the TX will send digital pings approximately once per 5 seconds. During
each ping, the BQ51013B-Q1 will resend the EPT 0x01. Between the pings, the BQ500212A goes into low
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power "Sleep" mode reducing power consumption. When the RX system controller determines it is time to
resume power transfer (for example, the battery voltage is below its recharge threshold) the controller simply
returns EN1 and EN2 to low (or float) states. The next ping of the BQ500212A will power the BQ51013B-Q1
which will now communicate that it is time to transfer power. The TX and RX communication resumes and power
transfer is reinitiated.
The TS/CTRL pin will be used as a temperature sensor (with the NTC) and maintain the ability to terminate
power transfer through the system controller. In this case, the GPIO will be in high impedance for normal NTC
(Temperature Sense) control.
The CHG pin is used to indicate power transfer. A 2.1-V forward bias LED is used for D1 with a current limiting
1.5-kΩseries resistor. The LED and resistor are tied from OUT to PGND and D1 will light during power transfer.
10.2.1.2.6 Current Limit and FOD
The current limit and foreign object detection functions are related. The current limit is set by R1 + RFOD. RFOD
and Ros are determined by FOD calibration. Default values of 20 kΩfor Ros and 196 Ωfor RFOD are used. The
final values need to be determined based on the FOD calibration. The tool for FOD calibration can be found on
the BQ51013B-Q1 web folder under "Tools & software". Good practice is to set the layout with 2 resistors for Ros
and 2 for RFOD to allow for precise values once the calibration is complete.
After setting RFOD, R1 can be calculated based on the desired current limit. The maximum current for this
solution under normal operating conditions (IMAX) is 1 A. Using 方程式 2 to calculate the maximum current yields
a value of 262 Ω for RILIM. With RFOD set to 196 Ω the remaining resistance for R1 is 66 Ω. This also sets the
hardware current limit to 1.2 A to allow for temporary current surges without system performance concerns.
10.2.1.2.7 RECT and OUT Capacitance
RECT capacitance is used to smooth the AC to DC conversion and to prevent minor current transients from
passing to OUT. For this 1-A IMAX, select two 10-µF capacitors and one 0.1-µF capacitor. These should be rated
to 16 V.
OUT capacitance is used to reduce any ripple from minor load transients. For this solution, a single 10-µF
capacitor and a single 0.1-µF capacitor are used.
10.2.1.3 Application Curves
图10-4 shows wireless power start-up when the RX is placed on the TX. In this case, the BQ500212A is used as
the transmitter. When the rectifier voltage stabilizes, the output is enabled and current is passed. In this case, the
load is resistive generating 900 mA. The pulses on the RECT pin indicate communication packets being
transferred from the RX to the TX.
图 10-5 shows a current transition. The plot shows a 1-A load removed then added again. Note the stability of
VOUT
.
IOUT
VOUT
IOUT
VOUT
VRECT
VRECT
图10-4. Start-Up With 900-mA Load
图10-5. Load Transitions (1 A to 0 A to 1 A)
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10.2.2 Dual Power Path: Wireless Power and DC Input
System
Load
Q1
USB or
AC Adapter
Input
AD-EN
AD
OUT
CCOMM1
C4
COMM1
C5
CBOOT1
D1
BOOT1
ROS
RECT
C1
AC1
R4
C3
BQ51013B-Q1
COIL
C2
TS/CTRL
AC2
NTC
BOOT2
COMM2
CBOOT2
HOST
CHG
Tri-State
CCOMM2
CCLAMP2
CCLAMP1
CLAMP2
CLAMP1
ILIM
EN1
EN2
Bi-State
Bi-State
PGND
FOD
R1
RFOD
图10-6. BQ51013B-Q1 Used as a Wireless Power Receiver and Power Supply for System Loads With
Adapter Power-Path Multiplexing
10.2.2.1 Design Requirements
This solution adds the ability to disable wireless charging with the AD and AD_EN pins. A DC supply (USB or AC
Adapter with DC output) can also be used to power the subsystem. This can occur during wireless power
transfer or without wireless power transfer. The system must allow power transfer without any back-flow or
damage to the circuitry.
10.2.2.2 Detailed Design Procedure
The components chosen for the 节 10.2.1 system are identical. Adding a blocking FET while using the
BQ51013B-Q1 for control is the only addition to the circuitry.The AD pin will be tied to the DC input as a
threshold detector. The AD_EN pin will be used to enable or disable the blocking FET. The blocking FET must be
chosen to handle the appropriate current level and the DC voltage level supplied from the input. In this example,
the expectation is that the DC input will be 5 V with a maximum current of 1 A (same configuration as the
wireless power supply). The CSD75207W15 is a good fit because it is a P-Channel, –20-V, 3.9-A FET pair in a
1.5-mm2 WCSP.
The following scope plots show behavior under different conditions.
图 10-7 shows the transition from wireless power to wired power when power is added to the AD pin. VRECT
drops and there is a short time (IOUT drops to zero) when neither source is providing power. When Q1 is enabled
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(through AD_EN) the output current turns back on. Note the RECT voltage after about 500 ms. This is the TX
sending a ping to check to see if power is required. RECT returns to low after the BQ51013B-Q1 informs the TX
it does not need power (without enabling the OUT pin). This timing is based on the TX (BQ500212A used here).
图 10-8 shows the transition to wireless power when the AD voltage is removed. Note that after wired power is
removed, the next ping from the (BQ500212A) will energize the BQ51013B. Once the rectifier voltage is stable
the output will turn on.
图 10-9 shows a system placed onto the transmitter with AD already powered. The TX sends a ping which the
RX responds to and informs the TX that no power is needed. The ping will continue with the timing based on the
TX used.
图10-10 shows the AD added when the RX is not on a TX. This indicates normal start-up without requirement of
the TX.
10.2.2.3 Application Curves
VOUT
IOUT
VAD
VOUT
IOUT
VRECT
VRECT
VAD
图10-7. Transition Between Wireless Power and
图10-8. Transition Between Wired Power and
Wired Power (EN1 = EN2 = LOW)
Wireless Power (EN1 = EN2 = LOW)
VAD
VAD
VOUT
IOUT
VOUT
IOUT
VRECT
VRECT
图10-9. Wireless Power Start-Up With VAD = 5 V
图10-10. AD Power Start-Up With No Transmitter
(EN1 = EN2 = LOW)
(EN1 = EN2 = LOW)
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10.2.3 Wireless and Direct Charging of a Li-Ion Battery at 800 mA
1.5 KΩ
Q1
USB or
AC Adapter
Input
BQ51013B-Q1
Output
SYSTEM
Load
1
2
3
4
5
10
9
OUT
TS
AD-EN
IN
1ÛF
1.5 KΩ
1ÛF
AD
OUT
CCOMM1
ISET
VSS
C4
COMM1
BOOT1
AC1
PACK+
C5
TEMP
D1
ROS
/CHG
8
BQ24040
RECT
C1
CBOOT1
R4
C3
675 Ω
7
6
PRETERM
/PG
ISET2
NC
BQ51013B-Q1
COIL
C2
PACK-
TS/CTRL
HOST
AC2
NTC
CBOOT2
BOOT2
COMM2
2 KΩ
CCOMM2
CCLAMP2
CHG
Tri-State
Bi-State
CLAMP2
CLAMP1
ILIM
EN1
EN2
Bi-State
CCLAMP1
FOD
PGND
ISET/100/500mA
R1
RFOD
图10-11. BQ51013B-Q1 Used as a Wireless Power Supply With Adapter Multiplexing for a Linear Charger
10.2.3.1 Design Requirements
The goal of this design is to charge a 3.7-V Li-Ion battery at 800 mA either wirelessly or with a direct USB wired
input. This design will use the BQ51013B-Q1 wireless power supply and the BQ24040 single-cell Li-Ion battery
charger. A low resistance path has to be created between the output of BQ51013B-Q1 and the input of
BQ24040.
10.2.3.2 Detailed Design Procedure
The basic BQ51013B-Q1 design is identical to the 节 10.2.2. The BQ51013B-Q1 OUT pin is tied to the output of
Q1 and directly to the IN pin of the BQ24040. No other changes to the BQ51013B-Q1 circuitry are required.
The BQ24040 has a few parameters that need to be programmed for this charger to work properly. Ceramic
decoupling capacitors are needed on the IN and OUT pins using the values shown in 图 10-11. After evaluation
during actual system operational conditions, the final values may be adjusted up or down. In high amplitude
pulsed load applications, the IN and OUT capacitors will generally require larger values. The next step is setting
up the fast charge current and pre-charge and termination current.
Program the Fast Charge Current, ISET: RISET = [KISET/IOUT] = [540 AΩ/ 0.8 A] = 675 Ω.
Program the Termination Current, ITERM: RPRE-TERM = [KTERM/%OUT-FC] = 200 Ω/% x 10% = 2 kΩ.
TS Function: To enable the temperature sense function, a 10-kΩ NTC thermistor (103AT) from TS to VSS
should be placed in the battery pack. To disable the temperature sense function, use a fixed 10-kΩ resistor
between TS and VSS.
图10-12 shows start-up of the wireless system with the BQ24040 charger when TX power is applied after the full
RX system has been placed on the charging pad. Channel 1 (yellow) shows the initial power to the TX system.
The RECT pin of the BQ51013B-Q1 is shown on Channel 3 (purple). The output of the BQ24040 is shown on
Channel 2 (blue). Battery current can be seen on Channel 4 (green).
图 10-13 shows a similar condition but in this case, the battery is not connected initially, so the battery detection
routine can be observed. After the battery is connected to the charger, the charge current jumps to 800 mA and
the output voltage becomes stable. Both the current out of the BQ51013B-Q1 (Channel 1, yellow) and the
current out of the BQ24040 (Channel 4, green) can be seen.
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10.2.3.3 Application Curves
The following plots show the performance of the BQ51013B-Q1 + charger solution.
图10-12. System Start-Up (200 ms / division)
图10-13. System Start-Up With Battery Inserted
After Wireless Power is Enabled (1 s / division)
11 Power Supply Recommendations
The BQ51013B-Q1 requires a Qi-compatible transmitter as its power source.
12 Layout
12.1 Layout Guidelines
• Keep the trace resistance as low as possible on AC1, AC2, and BAT.
• Detection and resonant capacitors must be as close to the device as possible.
• COMM, CLAMP, and BOOT capacitors must be placed as close to the device as possible.
• Via interconnect on PGND net is critical for appropriate signal integrity and proper thermal performance.
• High frequency bypass capacitors must be placed close to RECT and OUT pins.
• ILIM and FOD resistors are important signal paths and the loops in those paths to PGND must be minimized.
Signal and sensing traces are the most sensitive to noise; the sensing signal amplitudes are usually
measured in mV, which is comparable to the noise amplitude. Make sure that these traces are not being
interfered by the noisy and power traces. AC1, AC2, BOOT1, BOOT2, COMM1, and COMM2 are the main
source of noise in the board. These traces should be shielded from other components in the board. It is
usually preferred to have a ground copper area placed underneath these traces to provide additional
shielding. Also, make sure they do not interfere with the signal and sensing traces. The PCB should have a
ground plane (return) connected directly to the return of all components through vias (two vias per capacitor
for power-stage capacitors, one via per capacitor for small-signal components).
For a 1-A fast charge current application, the current rating for each net is as follows:
– AC1 = AC2 = 1.2 A
– OUT = 1 A
– RECT = 100 mA (RMS)
– COMMx = 300 mA
– CLAMPx = 500 mA
– All others can be rated for 10 mA or less
For the RHL package, the thermal pad should be connected to ground to help dissipate heat.
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12.2 Layout Example
For the RHL package, the thermal pad should be connected to ground to help dissipate heat.
图12-1. BQ51013B-Q1 Layout Schematic
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13 Device and Documentation Support
13.1 Device Support
13.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
13.1.2 Development Support
The tool for Foreign Object Detection (FOD) Calibration can be found on the BQ51013B-Q1 web folder under
Tools and software.
13.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
13.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
13.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
13.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
13.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
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重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021，德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jul-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ51013BQWRHLRQ1
ACTIVE
VQFN
RHL
20
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
51013BQW
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF BQ51013B-Q1 :
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jul-2021
Catalog : BQ51013B
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE OUTLINE
VQFN - 1 mm max height
RHL0020B
PLASTIC QUAD FLATPACK- NO LEAD
3.6
3.4
A
B
4.6
4.4
0.1 MIN
PIN 1 INDEX AREA
(0.13)
SECTION A-A
TYPICAL
C
1 MAX
SEATING PLANE
0.08 C
2.15
1.95
2X 1.5
0.05
0.00
SYMM
2X (0.32) TYP
(0.2) TYP
10
11
14X 0.5
9
12
(0.16)
SYMM
21
3.15
2.95
2X 3.5
0.35
0.15
0.1
19
20X
2
C
A B
PIN 1 ID
(OPTIONAL)
0.05
C
20
1
(0.25) TYP
2X 0.5
0.5
0.3
20X
4226154/B 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
RHL0020B
PLASTIC QUAD FLATPACK- NO LEAD
(3.3)
(2.05)
2X (0.5)
1
4X
(0.25)
TYP
20
20X (0.6)
2
20X (0.25)
19
14X (0.5)
SYMM
21
(3.85)
TYP
(3.05)
(4.3)
(1.275)
9
12
(R0.05) TYP
(Ø 0.2) VIA
TYP
10
11
(0.775)
4X (0.75)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 18X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4226154/B 06/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN - 1 mm max height
RHL0020B
PLASTIC QUAD FLATPACK- NO LEAD
(3.3)
2X (0.5)
1
2X
(0.82)
4X (0.25)
TYP
20
20X (0.6)
20X (0.25)
2
19
21
2X
(0.295)
14X (0.5)
4X (0.765)
SYMM
(4.3)
METAL
TYP
4X (1.33)
(0.2) TYP
9
12
(R0.05) TYP
10
11
4X (0.92)
4X (0.56)
4X (0.75)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
79% PRINTED COVERAGE BY AREA
SCALE: 18X
4226154/B 06/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023，德州仪器 (TI) 公司
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
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SI9135LG-T1
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-
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SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137DB
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