CC2642R1FRGZT_技术文档

CC2642R

ZHCSHI2I –JANUARY 2018 –REVISED JUNE 2023

CC2642R SimpleLink™ 低功耗Bluetooth ® 5.2 无线MCU

• 低功耗

– 有源模式RX：6.9 mA

1 特性

• 微控制器

– 有源模式TX (0dBm)：7.3mA

– 有源模式TX (5dBm)：9.6 mA

– 有源模式MCU 48MHz (CoreMark)：

3.4mA (71μA/MHz)

– 功能强大的48MHz Arm^®Cortex^®-M4F 处理器

– EEMBC CoreMark^®评分：148

– 352KB 系统内可编程闪存

– 256KB ROM，用于协议和库函数

– 8KB 缓存SRAM（也可作为通用RAM 提供）

– 80KB 超低泄漏SRAM。SRAM 通过奇偶校验得

到保护，从而确保高度可靠运行。

– 2 引脚cJTAG 和JTAG 调试

– 支持无线(OTA) 升级

– 传感器控制器（低功耗模式、2MHz、运行无限

环路）：30.1μA

– 传感器控制器，有源模式，24MHz，运行无限循

环：808μA

– 待机电流：0.94μA（RTC 运行，80KB RAM 和

CPU 保持）

• 具有4KB SRAM 的超低功耗传感器控制器

– 关断电流：150nA（发生外部事件时唤醒）

• 无线电部分

– 采样、存储和处理传感器数据

– 独立于系统CPU 运行

– 快速唤醒进入低功耗运行

– 2.4GHz 射频收发器，兼容低功耗蓝牙5.2 与早

期LE 规范

• TI-RTOS、驱动程序、引导加载程序、低功耗

Bluetooth^®5.2 控制器嵌入在ROM 中，优化了应用

尺寸

– 3 线、2 线、1 线PTA 共存机制

– 出色的接收器灵敏度：

蓝牙125kbps 时（LE 编码PHY）为-105 dBm

1Mbps (PHY) 时为-97dBm

• 符合RoHS 标准的封装

– 7mm × 7mm RGZ VQFN48（31 个GPIO）

• 外设

– 高达+5dBm 的输出功率，具有温度补偿

– 适用于符合各项全球射频规范的系统

• EN 300 328、（欧洲）

– 数字外设可连接至任何GPIO

– 4 个32 位或8 个16 位通用计时器

– 12 位ADC、200ksps、8 通道

– 2 个具有内部基准DAC 的比较器

（1 个连续时间比较器、1 个超低功耗比较器）

– 可编程电流源

• EN 300 440 类别2

• FCC CFR47 第15 部分

• ARIB STD-T66（日本）

• 开发工具和软件

– CC26x2R LaunchPad™ 开发套件

– SimpleLink™ CC13x2 和CC26x2 软件开发套

件(SDK)

– 用于简单无线电配置的SmartRF^™Studio

– 用于构建低功耗检测应用的Sensor Controller

Studio

– 2 个异步收发器(UART)

– 2 个同步串行接口(SSI)（SPI、MICROWIRE

和TI）

– I²C 和I²S

– 实时时钟(RTC)

– AES 128 位和256 位加密加速计

– ECC 和RSA 公钥硬件加速器

– SHA2 加速器（包括至SHA-512 的全套装）

– 真随机数发生器(TRNG)

– 电容式检测，最多8 通道

– 集成温度和电池监控器

• 外部系统

– 片上降压直流/直流转换器

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SWRS194

CC2642R

www.ti.com.cn

ZHCSHI2I –JANUARY 2018 –REVISED JUNE 2023

– 智能仪表–水表、燃气表、电表和热量分配表

– 电网通信–无线通信–远距离传感器应用

– 其他替代能源–能量收集

2 应用

• 手机- 手机电池包

• 医疗

• 楼宇自动化

• 通信设备

– 有线网络–无线LAN 或Wi-Fi 接入点、边缘路

由器

• 个人电子产品

– 楼宇安防系统–运动检测器、电子智能锁、门

窗传感器、车库门系统、网关

– HVAC –恒温器、无线环境传感器、HVAC 系

统控制器、网关

– 防火安全系统–烟雾和热量探测器、火警控制

面板(FACP)

– 便携式电子产品–射频智能遥控器

– 家庭影院和娱乐–智能扬声器、智能显示器、

机顶盒

– 联网外设–消费类无线模块、指点设备、键盘

– 游戏–电子玩具和机器人玩具

– 可穿戴设备（非医用）- 智能追踪器、智能服装

– 视频监控–IP 网络摄像头

• 工厂自动化和控制

• 电子销售终端(EPOS) - RFID 读取器

• 电网基础设施

3 说明

SimpleLink^™CC2642R 器件是一款 2.4GHz 无线微控制器 (MCU)，支持低功耗Bluetooth^®5.2 和专有2.4GHz 应

用。该器件经过优化，可用于楼宇安防系统、HVAC、资产跟踪、医疗、有线网络、便携式电子产品、家庭影院和

娱乐和联网外设市场以及需要工业性能的应用中的低功耗无线通信和高级检测。该器件的突出特性包括：

• 支持Bluetooth ^®5.2 特性：LE 编码PHY（远距离）、LE 2Mbit PHY（高速）、广播扩展、多个广播集、

CSA#2、方向查找以及对Bluetooth ^®4.2 和早期低功耗规范的向后兼容性和支持。

• 完全合格的Bluetooth ^®5.2 软件协议栈（SimpleLink™ CC13x2 和CC26x2 软件开发套件(SDK) 随附）。

• 延长无线应用的电池寿命，完全RAM 保持时低待机电流为0.94µA。

• 支持工业温度，在105°C 下最低待机电流为11µA。

• 通过具有快速唤醒功能的可编程、自主式超低功耗传感器控制器CPU 实现高级检测。例如，传感器控制器能

够在1µA 系统电流下进行1Hz ADC 采样。

• 低SER（软错误率）FIT（时基故障），可延长运行寿命，不会对工业市场造成干扰，SRAM 奇偶校验功能始

终开启，可防止潜在辐射事件导致的损坏。

• 软件控制的专用无线电控制器(Arm^®Cortex^®-M0) 提供灵活的低功耗射频收发器功能，支持多个物理层和射频

标准（如实时定位(RTLS) 技术）。

• 出色的无线电敏感度和稳健性（选择性与阻断）性能，适用于低功耗Bluetooth ^®（对于125kbps LE 编码

PHY 为-105dBm）。

CC2642R 器件是 SimpleLink™ MCU 平台的一部分，该平台包括 Wi-Fi^®、低功耗蓝牙、Thread、Zigbee、

Sub-1GHz MCU 和主机 MCU，它们共用一个通用、易于使用的开发环境，其中包含单核软件开发套件 (SDK) 和

丰富的工具集。借助一次性集成的 SimpleLink™ 平台，可以将产品组合中的任何器件组合添加至您的设计中，从

而在设计要求变更时实现100% 的代码重用。如需更多信息，请访问SimpleLink™ MCU 平台。

器件信息

器件型号⁽¹⁾

CC2642R1FRGZ

封装尺寸（标称值）

封装

VQFN (48)

7.00mm × 7.00mm

(1) 如需所有可用器件的最新器件、封装和订购信息，请参阅节12 中的“封装选项附录”或访问TI 网站。

English Data Sheet: SWRS194

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4 Functional Block Diagram

2.4 GHz

CC26x2R

RF Core

cJTAG

Main CPU

256KB

ROM

ADC

Arm^®

Cortex^®-M4F

Processor

Up to

352KB

Flash

Digital PLL

with 8KB

Cache

DSP Modem

48 MHz

71 µA/MHz (3.0 V)

16KB

SRAM

Arm^®

Cortex^®-M0

Processor

Up to

80KB

SRAM

ROM

with Parity

General Hardware Peripherals and Modules

Sensor Interface

I²C and I²S

4× 32-bit Timers

2× SSI (SPI)

Watchdog Timer

TRNG

ULP Sensor Controller

8-bit DAC

2× UART

12-bit ADC, 200 ks/s

32 ch. µDMA

31 GPIOs

2x Low-Power Comparator

SPI-I²C Digital Sensor IF

Capacitive Touch IF

Time-to-Digital Converter

4KB SRAM

Temperature and

Battery Monitor

AES-256, SHA2-512

ECC, RSA

RTC

LDO, Clocks, and References

Optional DC/DC Converter

图4-1. CC2642R Block Diagram

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English Data Sheet: SWRS194

CC2642R

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Table of Contents

9.2 System CPU............................................................. 40

9.3 Radio (RF Core)........................................................41

9.4 Memory.....................................................................41

9.5 Sensor Controller......................................................42

9.6 Cryptography............................................................ 43

9.7 Timers....................................................................... 44

9.8 Serial Peripherals and I/O.........................................45

9.9 Battery and Temperature Monitor............................. 45

9.10 µDMA......................................................................45

9.11 Debug......................................................................45

9.12 Power Management................................................46

9.13 Clock Systems........................................................ 47

9.14 Network Processor..................................................47

10 Application, Implementation, and Layout................. 48

10.1 Reference Designs................................................. 48

10.2 Junction Temperature Calculation...........................49

11 Device and Documentation Support..........................50

11.1 Tools and Software..................................................50

11.2 Documentation Support.......................................... 52

11.3 支持资源..................................................................53

11.4 Trademarks............................................................. 53

11.5 静电放电警告...........................................................53

11.6 术语表..................................................................... 53

12 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 2

3 说明................................................................................... 2

4 Functional Block Diagram.............................................. 3

5 Revision History.............................................................. 4

6 Device Comparison.........................................................5

7 Terminal Configuration and Functions..........................6

7.1 Pin Diagram –RGZ Package (Top View)..................6

7.2 Signal Descriptions –RGZ Package.........................7

7.3 Connections for Unused Pins and Modules................8

8 Specifications.................................................................. 9

8.1 Absolute Maximum Ratings........................................ 9

8.2 ESD Ratings............................................................... 9

8.3 Recommended Operating Conditions.........................9

8.4 Power Supply and Modules........................................ 9

8.5 Power Consumption - Power Modes........................ 10

8.6 Power Consumption - Radio Modes......................... 11

8.7 Nonvolatile (Flash) Memory Characteristics............. 11

8.8 Thermal Resistance Characteristics......................... 11

8.9 RF Frequency Bands................................................ 11

8.10 Bluetooth Low Energy - Receive (RX).................... 12

8.11 Bluetooth Low Energy - Transmit (TX)....................15

8.12 Timing and Switching Characteristics..................... 15

8.13 Peripheral Characteristics.......................................20

8.14 Typical Characteristics............................................28

9 Detailed Description......................................................40

9.1 Overview...................................................................40

Information.................................................................... 54

12.1 Packaging Information............................................ 54

5 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from March 30, 2021 to June 12, 2023 (from Revision H (March 2021) to Revision I

(June 2023))

Page

• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1

• Corrected radio support for CC2642R in 表6-1 ................................................................................................ 5

• Changed Reset to Active and Shutdown to Active timing specification in 节8.12.2 ......................................... 9

• Added injection current footnote to Absolute Maximum Ratings table............................................................... 9

English Data Sheet: SWRS194

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6 Device Comparison

表6-1. Device Family Overview

FLASH

(KB)

RAM

(KB)

DEVICE

RADIO SUPPORT

GPIO

PACKAGE SIZE

CC1312R

Sub-1 GHz

352

80

30

RGZ (7-mm × 7-mm VQFN48)

Multiprotocol

Sub-1 GHz

Bluetooth 5.2 Low Energy

Zigbee, Thread

2.4 GHz proprietary FSK-based formats

+20-dBm high-power amplifier

CC1352P

CC1352R

352

80

26

28

RGZ (7-mm × 7-mm VQFN48)

Multiprotocol

Sub-1 GHz

Bluetooth 5.2 Low Energy

Zigbee, Thread

352

80

2.4 GHz proprietary FSK-based formats

CC2642R

Bluetooth 5.2 Low Energy

352

80

31

RGZ (7-mm × 7-mm VQFN48)

RTC (7-mm × 7-mm VQFN48)

CC2642R-Q1

Multiprotocol

Bluetooth 5.2 Low Energy

Zigbee, Thread

CC2652R

352

80

31

RGZ (7-mm × 7-mm VQFN48)

2.4 GHz proprietary FSK-based formats

Multiprotocol

Bluetooth 5.2 Low Energy

Zigbee, Thread

CC2652RB

2.4 GHz proprietary FSK-based formats

Multiprotocol

Bluetooth 5.2 Low Energy

Zigbee, Thread

CC2652P

352

80

26

RGZ (7-mm × 7-mm VQFN48)

2.4 GHz proprietary FSK-based formats

+19.5-dBm high-power amplifier

RGZ (7-mm × 7-mm VQFN48)

RHB (5-mm × 5-mm VQFN32)

RSM (4-mm × 4-mm VQFN32)

CC1310

CC1350

Sub-1 GHz

32–128

16–20

10–31

RGZ (7-mm × 7-mm VQFN48)

RHB (5-mm × 5-mm VQFN32)

RSM (4-mm × 4-mm VQFN32)

Sub-1 GHz

Bluetooth 4.2 Low Energy

128

20

RGZ (7-mm × 7-mm VQFN48)

RHB (5-mm × 5-mm VQFN32)

RSM (4-mm × 4-mm VQFN32)

YFV (2.7-mm × 2.7-mm DSBGA34)

Bluetooth 5.1 Low Energy

2.4 GHz proprietary FSK-based formats

CC2640R2F

128

20

10–31

Bluetooth 5.1 Low Energy

2.4 GHz proprietary FSK-based formats

CC2640R2F-Q1

31

RGZ (7-mm × 7-mm VQFN48)

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English Data Sheet: SWRS194

CC2642R

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ZHCSHI2I –JANUARY 2018 –REVISED JUNE 2023

7 Terminal Configuration and Functions

7.1 Pin Diagram –RGZ Package (Top View)

RF_P

RF_N

1

2

3

4

5

6

7

8

9

36 DIO_23

35 RESET_N

34 VDDS_DCDC

33 DCDC_SW

32 DIO_22

X32K_Q1

X32K_Q2

DIO_0

DIO_1

31 DIO_21

DIO_2

30 DIO_20

DIO_3

29 DIO_19

DIO_4

28 DIO_18

DIO_5 10

DIO_6 11

DIO_7 12

27 DIO_17

26 DIO_16

25 JTAG_TCKC

图7-1. RGZ (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View)

The following I/O pins marked in 图7-1 in bold have high-drive capabilities:

• Pin 10, DIO_5

• Pin 11, DIO_6

• Pin 12, DIO_7

• Pin 24, JTAG_TMSC

• Pin 26, DIO_16

• Pin 27, DIO_17

The following I/O pins marked in 图7-1 in italics have analog capabilities:

• Pin 36, DIO_23

• Pin 37, DIO_24

• Pin 38, DIO_25

• Pin 39, DIO_26

• Pin 40, DIO_27

• Pin 41, DIO_28

• Pin 42, DIO_29

• Pin 43, DIO_30

English Data Sheet: SWRS194

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7.2 Signal Descriptions –RGZ Package

表7-1. Signal Descriptions –RGZ Package

I/O

TYPE

DESCRIPTION

NAME

NO.

33

23

5

DCDC_SW

DCOUPL

DIO_0

Power

Output from internal DC/DC converter⁽¹⁾

—

For decoupling of internal 1.27 V regulated digital-supply ⁽²⁾

—

I/O

Digital

GPIO

DIO_1

6

Digital

GPIO

DIO_2

7

Digital

GPIO

DIO_3

8

Digital

GPIO

DIO_4

9

Digital

GPIO

DIO_5

10

11

12

14

15

16

17

18

19

20

21

26

27

28

29

30

31

32

36

37

38

39

40

41

42

43

Digital

GPIO, high-drive capability

DIO_6

Digital

GPIO, high-drive capability

DIO_7

Digital

GPIO, high-drive capability

DIO_8

Digital

GPIO

DIO_9

Digital

GPIO

DIO_10

DIO_11

DIO_12

DIO_13

DIO_14

DIO_15

DIO_16

DIO_17

DIO_18

DIO_19

DIO_20

DIO_21

DIO_22

DIO_23

DIO_24

DIO_25

DIO_26

DIO_27

DIO_28

DIO_29

DIO_30

EGP

Digital

GPIO

Digital

GPIO

Digital

GPIO

Digital

GPIO

Digital

GPIO

Digital

GPIO

Digital

GPIO, JTAG_TDO, high-drive capability

GPIO, JTAG_TDI, high-drive capability

GPIO

Digital

GPIO

Digital

GPIO

Digital

GPIO

Digital

GPIO

Digital or Analog

GND

GPIO, analog capability

Ground –exposed ground pad⁽³⁾

JTAG TMSC, high-drive capability

JTAG TCKC

—

24

25

35

—

I/O

I

JTAG_TMSC

JTAG_TCKC

RESET_N

Digital

I

Digital

Reset, active low. No internal pullup resistor

Positive RF input signal to LNA during RX

Positive RF output signal from PA during TX

RF_P

RF_N

VDDR

1

2

RF

—

Negative RF input signal to LNA during RX

Negative RF output signal from PA during TX

Internal supply, must be powered from the internal DC/DC

converter or the internal LDO^{(2) (4) (6)}

45

Power

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English Data Sheet: SWRS194

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表7-1. Signal Descriptions –RGZ Package (continued)

I/O

TYPE

DESCRIPTION

NAME

NO.

Internal supply, must be powered from the internal DC/DC

converter or the internal LDO^{(2) (5) (6)}

VDDR_RF

48

Power

—

VDDS

44

13

22

34

46

47

3

Power

Analog

1.8-V to 3.8-V main chip supply⁽¹⁾

1.8-V to 3.8-V DIO supply⁽¹⁾

—

VDDS2

VDDS3

1.8-V to 3.8-V DIO supply⁽¹⁾

VDDS_DCDC

X48M_N

X48M_P

X32K_Q1

X32K_Q2

1.8-V to 3.8-V DC/DC converter supply

48-MHz crystal oscillator pin 1

48-MHz crystal oscillator pin 2

32-kHz crystal oscillator pin 1

32-kHz crystal oscillator pin 2

4

(1) For more details, see technical reference manual listed in 节11.2.

(2) Do not supply external circuitry from this pin.

(3) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is

imperative for proper device operation.

(4) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.

(5) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.

(6) Output from internal DC/DC and LDO is trimmed to 1.68 V.

7.3 Connections for Unused Pins and Modules

表7-2. Connections for Unused Pins

PREFERRED

FUNCTION

SIGNAL NAME

PIN NUMBER

ACCEPTABLE PRACTICE⁽¹⁾

PRACTICE⁽¹⁾

5–12

14–21

26–32

36–43

GPIO

DIO_n

NC or GND

NC

X32K_Q1

3

4

32.768-kHz crystal

NC or GND

NC

X32K_Q2

DCDC_SW

VDDS_DCDC

33

34

NC

DC/DC converter⁽²⁾

VDDS

(1) NC = No connect

(2) When the DC/DC converter is not used, the inductor between DCDC_SW and VDDR can be removed. VDDR and VDDR_RF must still

be connected and the 22 uF DCDC capacitor must be kept on the VDDR net.

English Data Sheet: SWRS194

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)^{(1) (2)}

MIN

–0.3

MAX UNIT

VDDS⁽³⁾

Supply voltage

4.1

V

Voltage on any digital pin^{(4) (5)}

VDDS + 0.3, max 4.1

Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P

Voltage scaling enabled

VDDR + 0.3, max 2.25

VDDS

1.49

V_in

Voltage on ADC input

Voltage scaling disabled, internal reference

Voltage scaling disabled, VDDS as reference

V

VDDS / 2.9

5

Input level, RF pins

Storage temperature

dBm

°C

T_stg

150

–40

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime

(2) All voltage values are with respect to ground, unless otherwise noted.

(3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.

(4) Including analog capable DIOs.

(5) Injection current is not supported on any GPIO pin

8.2 ESD Ratings

VALUE

±2000

±500

UNIT

V

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002⁽²⁾

All pins

V_ESD

Electrostatic discharge

V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

105

3.8

UNIT

°C

Operating junction temperature⁽²⁾

–40

Operating supply voltage (VDDS)

Rising supply voltage slew rate

Falling supply voltage slew rate⁽¹⁾

1.8

0

V

100

20

mV/µs

0

(1) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor must be used

to ensure compliance with this slew rate.

(2) For thermal resistance characteristics refer to Thermal Resistance Characteristics. For application considerations, refer to Junction

Temperature.

8.4 Power Supply and Modules

over operating free-air temperature range (unless otherwise noted)

PARAMETER

VDDS Power-on-Reset (POR) threshold

VDDS Brown-out Detector (BOD) ⁽¹⁾

MIN

TYP

1.1 - 1.55

1.77

MAX

UNIT

V

Rising threshold

Falling threshold

VDDS Brown-out Detector (BOD), before initial boot ⁽²⁾

VDDS Brown-out Detector (BOD) ⁽¹⁾

1.70

1.75

(1) For boost mode (VDDR =1.95 V), TI drivers software initialization will trim VDDS BOD limits to maximum (approximately 2.0 V)

(2) Brown-out Detector is trimmed at initial boot, value is kept until device is reset by a POR reset or the RESET_N pin

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8.5 Power Consumption - Power Modes

When measured on the CC26x2REM-7ID reference design with T_c= 25 °C, V_DDS= 3.0 V with DC/DC enabled unless

otherwise noted.

PARAMETER

TEST CONDITIONS

TYP

UNIT

Core Current Consumption

Reset. RESET_N pin asserted or VDDS below power-on-reset threshold

Shutdown. No clocks running, no retention

150

Reset and Shutdown

nA

RTC running, CPU, 80KB RAM and (partial) register retention.

RCOSC_LF

0.94

1.09

3.2

µA

mA

Standby without cache

retention

RTC running, CPU, 80KB RAM and (partial) register retention

XOSC_LF

RTC running, CPU, 80KB RAM and (partial) register retention.

RCOSC_LF

I_core

Standby with cache

retention

RTC running, CPU, 80KB RAM and (partial) register retention.

XOSC_LF

3.3

Supply Systems and RAM powered

RCOSC_HF

Idle

675

3.39

MCU running CoreMark at 48 MHz

RCOSC_HF

Active

Peripheral Current Consumption, ^{(1) (2)}

Peripheral power

domain

Delta current with domain enabled

97.7

Serial power domain

RF Core

Delta current with domain enabled

7.2

210.9

63.9

81.0

10.1

26.3

82.9

167.5

25.6

84.7

35.6

Delta current with power domain enabled, clock enabled, RF core idle

Delta current with clock enabled, module is idle

Delta current with clock enabled, module is idle⁽⁵⁾

Delta current with clock enabled, module is idle

Delta current with clock enabled, module is idle ⁽³⁾

Delta current with clock enabled, module is idle ⁽⁴⁾

Delta current with clock enabled, module is idle

µDMA

Timers

I2C

I_peri

µA

I2S

SSI

UART

CRYPTO (AES)

PKA

TRNG

Sensor Controller Engine Consumption

Active mode

I_SCE

24 MHz, infinite loop

2 MHz, infinite loop

808.5

30.1

µA

Low-power mode

(1) Adds to core current I_corefor each peripheral unit activated.

(2) I_periis not supported in Standby or Shutdown modes.

(3) Only one UART running

(4) Only one SSI running

(5) Only one GPTimer running

English Data Sheet: SWRS194

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8.6 Power Consumption - Radio Modes

When measured on the reference design with T_c= 25 °C, V_DDS= 3.0 V with DC/DC enabled unless otherwise noted.

PARAMETER

TEST CONDITIONS

TYP UNIT

Radio receive current

2440 MHz

6.9

7.3

mA

0 dBm output power setting

2440 MHz

Radio transmit current

2.4 GHz PA (BLE)

+5 dBm output power setting

2440 MHz

9.6

mA

8.7 Nonvolatile (Flash) Memory Characteristics

Over operating free-air temperature range and V_DDS= 3.0 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Flash sector size

8

KB

Supported flash erase cycles before failure, full bank^{(1) (5)}

Supported flash erase cycles before failure, single sector⁽²⁾

30

60

k Cycles

Write

Maximum number of write operations per row before sector

erase⁽³⁾

83

Operations

Years at 105

°C

Flash retention

105 °C

11.4

Flash sector erase current

Flash sector erase time⁽⁴⁾

Flash write current

Average delta current

Zero cycles

10.7

10

mA

ms

mA

µs

Average delta current, 4 bytes at a time

4 bytes at a time

6.2

Flash write time⁽⁴⁾

21.6

(1) A full bank erase is counted as a single erase cycle on each sector

(2) Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k

cycles

(3) Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum per

write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum

number of write operations per row is reached.

(4) This number is dependent on Flash aging and increases over time and erase cycles

(5) Aborting flash during erase or program modes is not a safe operation.

8.8 Thermal Resistance Characteristics

PACKAGE

RGZ

THERMAL METRIC⁽¹⁾

UNIT

(VQFN)

48 PINS

23.4

13.3

8.0

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W⁽²⁾

R_θJC(top)

R_θJB

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.1

ψ_JT

7.9

ψ_JB

R_θJC(bot)

1.7

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2) °C/W = degrees Celsius per watt.

8.9 RF Frequency Bands

Over operating free-air temperature range (unless otherwise noted).

PARAMETER

MIN

TYP

MAX

UNIT

Frequency bands

2360

2500

MHz

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8.10 Bluetooth Low Energy - Receive (RX)

When measured on the CC26x2REM-7ID reference design with T_c= 25 °C, V_DDS= 3.0 V, f_RF= 2440 MHz with

DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX

path. All measurements are performed conducted.

PARAMETER

125 kbps (LE Coded)

Receiver sensitivity

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Differential mode. BER = 10^–3

dBm

–105

Receiver saturation

Differential mode. BER = 10^–3

>5

Difference between the incoming carrier frequency and

the internally generated carrier frequency

Frequency error tolerance

Data rate error tolerance

Co-channel rejection⁽¹⁾

Selectivity, ±1 MHz⁽¹⁾

Selectivity, ±2 MHz⁽¹⁾

Selectivity, ±3 MHz⁽¹⁾

Selectivity, ±4 MHz⁽¹⁾

Selectivity, ±6 MHz⁽¹⁾

Selectivity, ±7 MHz

kHz

ppm

dB

> (–300 / 300)

> (–320 / 240)

> (–125 / 100)

–1.5

Difference between incoming data rate and the internally

generated data rate (37-byte packets)

Difference between incoming data rate and the internally

generated data rate (255-byte packets)

Wanted signal at –79 dBm, modulated interferer in

channel, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at ±1

8 / 4.5⁽²⁾

dB

MHz, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at ±2

44 / 37 ⁽²⁾

46 / 44⁽²⁾

44 / 46⁽²⁾

48 / 44⁽²⁾

51 / 45⁽²⁾

37

dB

MHz, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at ±3

dB

MHz, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at ±4

dB

MHz, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at ≥±6

dB

MHz, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at ≥±7

dB

MHz, BER = 10^–3

Wanted signal at –79 dBm, modulated interferer at

Selectivity, Image frequency⁽¹⁾

dB

image frequency, BER = 10^–3

Note that Image frequency + 1 MHz is the Co- channel –

1 MHz. Wanted signal at –79 dBm, modulated interferer

at ±1 MHz from image frequency, BER = 10^–3

Selectivity, Image frequency ±1

MHz⁽¹⁾

4.5 / 44 ⁽²⁾

dB

500 kbps (LE Coded)

Receiver sensitivity

Receiver saturation

Differential mode. BER = 10^–3

dBm

–100

> 5

Difference between the incoming carrier frequency and

the internally generated carrier frequency

Frequency error tolerance

Data rate error tolerance

Co-channel rejection⁽¹⁾

Selectivity, ±1 MHz⁽¹⁾

Selectivity, ±2 MHz⁽¹⁾

Selectivity, ±3 MHz⁽¹⁾

Selectivity, ±4 MHz⁽¹⁾

Selectivity, ±6 MHz⁽¹⁾

Selectivity, ±7 MHz

kHz

ppm

dB

> (–300 / 300)

> (–450 / 450)

> (–150/ 175)

–3.5

Difference between incoming data rate and the internally

generated data rate (37-byte packets)

Difference between incoming data rate and the internally

generated data rate (255-byte packets)

Wanted signal at –72 dBm, modulated interferer in

channel, BER = 10^–3

Wanted signal at –72 dBm, modulated interferer at ±1

8 / 4⁽²⁾

dB

MHz, BER = 10^–3

Wanted signal at –72 dBm, modulated interferer at ±2

43 / 35 ⁽²⁾

46 / 46⁽²⁾

dB

MHz, BER = 10^–3

Wanted signal at –72 dBm, modulated interferer at ±3

dB

MHz, BER = 10^–3

Wanted signal at –72 dBm, modulated interferer at ±4

45 / 47⁽²⁾

dB

MHz, BER = 10^–3

Wanted signal at –72 dBm, modulated interferer at ≥±6

46 / 45⁽²⁾

dB

MHz, BER = 10^–3

Wanted signal at –72 dBm, modulated interferer at ≥±7

49 / 45⁽²⁾

dB

MHz, BER = 10^–3

English Data Sheet: SWRS194

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8.10 Bluetooth Low Energy - Receive (RX) (continued)

When measured on the CC26x2REM-7ID reference design with T_c= 25 °C, V_DDS= 3.0 V, f_RF= 2440 MHz with

DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX

path. All measurements are performed conducted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Wanted signal at –72 dBm, modulated interferer at

Selectivity, Image frequency⁽¹⁾

35

dB

image frequency, BER = 10^–3

Note that Image frequency + 1 MHz is the Co- channel –

1 MHz. Wanted signal at –72 dBm, modulated interferer

at ±1 MHz from image frequency, BER = 10^–3

Selectivity, Image frequency ±1

MHz⁽¹⁾

4 / 46⁽²⁾

dB

1 Mbps (LE 1M)

Receiver sensitivity

Receiver saturation

Differential mode. BER = 10^–3

dBm

–97

> 5

Difference between the incoming carrier frequency and

the internally generated carrier frequency

Frequency error tolerance

Data rate error tolerance

Co-channel rejection⁽¹⁾

Selectivity, ±1 MHz⁽¹⁾

kHz

ppm

dB

> (–350 / 350)

> (–650 / 750)

–6

Difference between incoming data rate and the internally

generated data rate (37-byte packets)

Wanted signal at –67 dBm, modulated interferer in

channel, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ±1

7 / 4⁽²⁾

dB

MHz, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ±2

Selectivity, ±2 MHz⁽¹⁾

39 / 33⁽²⁾

36 / 40 ⁽²⁾

36 / 45⁽²⁾

40

dB

MHz,BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ±3

Selectivity, ±3 MHz⁽¹⁾

dB

MHz, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ±4

Selectivity, ±4 MHz⁽¹⁾

dB

MHz, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ≥±5

Selectivity, ±5 MHz or more⁽¹⁾

Selectivity, image frequency⁽¹⁾

dB

MHz, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at

33

dB

image frequency, BER = 10^–3

Note that Image frequency + 1 MHz is the Co- channel –

1 MHz. Wanted signal at –67 dBm, modulated interferer

at ±1 MHz from image frequency, BER = 10^–3

Selectivity, image frequency

±1 MHz⁽¹⁾

4 / 41⁽²⁾

dB

Out-of-band blocking⁽³⁾

Out-of-band blocking

30 MHz to 2000 MHz

2003 MHz to 2399 MHz

2484 MHz to 2997 MHz

3000 MHz to 12.75 GHz

dBm

–10

–18

–12

–2

Wanted signal at 2402 MHz, –64 dBm. Two interferers

at 2405 and 2408 MHz respectively, at the given power

level

Intermodulation

dBm

–42

Spurious emissions,

30 to 1000 MHz⁽⁴⁾

dBm

Measurement in a 50-Ωsingle-ended load.

< –59

< –47

Spurious emissions,

1 to 12.75 GHz⁽⁴⁾

RSSI dynamic range

RSSI accuracy

70

±4

dB

2 Mbps (LE 2M)

Differential mode. Measured at SMA connector, BER =

10^–3

Receiver sensitivity

dBm

kHz

–91

> 5

Differential mode. Measured at SMA connector, BER =

10^–3

Receiver saturation

Difference between the incoming carrier frequency and

the internally generated carrier frequency

Frequency error tolerance

Data rate error tolerance

> (–500 / 500)

> (–700 / 750)

Difference between incoming data rate and the internally

generated data rate (37-byte packets)

ppm

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8.10 Bluetooth Low Energy - Receive (RX) (continued)

When measured on the CC26x2REM-7ID reference design with T_c= 25 °C, V_DDS= 3.0 V, f_RF= 2440 MHz with

DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX

path. All measurements are performed conducted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Wanted signal at –67 dBm, modulated interferer in

Co-channel rejection⁽¹⁾

dB

–7

channel,BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ±2

MHz, Image frequency is at –2 MHz, BER = 10^–3

Selectivity, ±2 MHz⁽¹⁾

8 / 4⁽²⁾

36 / 34 ⁽²⁾

37 / 36⁽²⁾

4

dB

Wanted signal at –67 dBm, modulated interferer at ±4

Selectivity, ±4 MHz⁽¹⁾

MHz, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at ±6

Selectivity, ±6 MHz⁽¹⁾

MHz, BER = 10^–3

Wanted signal at –67 dBm, modulated interferer at

Selectivity, image frequency⁽¹⁾

image frequency, BER = 10^–3

Note that Image frequency + 2 MHz is the Co-channel.

Wanted signal at –67 dBm, modulated interferer at ±2

MHz from image frequency, BER = 10^–3

Selectivity, image frequency

±2 MHz⁽¹⁾

–7 / 36⁽²⁾

dB

Out-of-band blocking⁽³⁾

Out-of-band blocking

30 MHz to 2000 MHz

2003 MHz to 2399 MHz

2484 MHz to 2997 MHz

3000 MHz to 12.75 GHz

dBm

–16

–21

–15

–12

Wanted signal at 2402 MHz, –64 dBm. Two interferers

at 2408 and 2414 MHz respectively, at the given power

level

Intermodulation

dBm

–38

(1) Numbers given as I/C dB

(2) X / Y, where X is +N MHz and Y is –N MHz

(3) Excluding one exception at F_wanted/ 2, per Bluetooth Specification

(4) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

English Data Sheet: SWRS194

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8.11 Bluetooth Low Energy - Transmit (TX)

When measured on the CC26x2REM-7ID reference design with T_c= 25 °C, V_DDS= 3.0 V, f_RF= 2440 MHz with

DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX

path. All measurements are performed conducted.

PARAMETER

General Parameters

Max output power

TEST CONDITIONS

MIN

TYP

MAX UNIT

5

dBm

dB

Differential mode, delivered to a single-ended 50 Ωload through a balun

Output power

programmable range

26

Spurious emissions and harmonics

f < 1 GHz, outside restricted bands

dBm

< –36

< –54

< –55

< –42

f < 1 GHz, restricted bands ETSI

f < 1 GHz, restricted bands FCC

f > 1 GHz, including harmonics

Second harmonic

Spurious emissions ⁽¹⁾

+5 dBm setting

Harmonics ⁽¹⁾

Third harmonic

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

8.12 Timing and Switching Characteristics

8.12.1 Reset Timing

PARAMETER

MIN

TYP

MAX

UNIT

RESET_N low duration

1

µs

8.12.2 Wakeup Timing

Measured over operating free-air temperature with V_DDS= 3.0 V (unless otherwise noted). The times listed here do not

include software overhead.

PARAMETER

TEST CONDITIONS

MIN

TYP

850 - 4000

160

MAX

UNIT

MCU, Reset to Active⁽¹⁾

µs

MCU, Shutdown to Active⁽¹⁾

MCU, Standby to Active

MCU, Active to Standby

MCU, Idle to Active

36

14

(1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has

been in Reset or Shutdown before starting up again. The wake up time increases with a higher capacitor value.

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8.12.3 Clock Specifications

8.12.3.1 48 MHz Crystal Oscillator (XOSC_HF)

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.⁽¹⁾

PARAMETER

MIN

TYP

MAX

UNIT

Crystal frequency

48

MHz

Equivalent series resistance

6 pF < C_L≤9 pF

ESR

20

60

80

Ω

Equivalent series resistance

5 pF < C_L≤ 6 pF

Ω

Motional inductance, relates to the load capacitance that is used for the crystal (C_L

in Farads)⁽⁵⁾

2

L_M

C_L

< 3 × 10^–25/ C_L

H

Crystal load capacitance⁽⁴⁾

Start-up time⁽²⁾

5

7⁽³⁾

9

pF

µs

200

(1) Probing or otherwise stopping the crystal while the DC/DC converter is enabled may cause permanent damage to the device.

(2) Start-up time using the TI-provided power driver. Start-up time may increase if driver is not used.

(3) On-chip default connected capacitance including reference design parasitic capacitance. Connected internal capacitance is changed

through software in the Customer Configuration section (CCFG).

(4) Adjustable load capacitance is integrated into the device.

(5) The crystal manufacturer's specification must satisfy this requirement for proper operation.

8.12.3.2 48 MHz RC Oscillator (RCOSC_HF)

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

MIN

TYP

MAX

UNIT

MHz

%

Frequency

48

Uncalibrated frequency accuracy

Calibrated frequency accuracy⁽¹⁾

Start-up time

±1

±0.25

5

%

µs

(1) Accuracy relative to the calibration source (XOSC_HF)

8.12.3.3 2 MHz RC Oscillator (RCOSC_MF)

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

MIN

TYP

MAX

UNIT

MHz

µs

Calibrated frequency

Start-up time

2

5

8.12.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

MIN

TYP

32.768

30

MAX

UNIT

kHz

kΩ

Crystal frequency

ESR

C_L

Equivalent series resistance

Crystal load capacitance

100

12

6

7⁽¹⁾

pF

(1) Default load capacitance using TI reference designs including parasitic capacitance. Crystals with different load capacitance may be

used.

8.12.3.5 32 kHz RC Oscillator (RCOSC_LF)

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

MIN

TYP

MAX

UNIT

Calibrated frequency

32.8 ⁽¹⁾

kHz

English Data Sheet: SWRS194

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8.12.3.5 32 kHz RC Oscillator (RCOSC_LF) (continued)

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

MIN

TYP

MAX

UNIT

Temperature coefficient.

50

ppm/°C

(1) When using RCOSC_LF as source for the low frequency system clock (SCLK_LF), the accuracy of the SCLK_LF-derived Real Time

Clock (RTC) can be improved by measuring RCOSC_LF relative to XOSC_HF and compensating for the RTC tick speed. This

functionality is available through the TI-provided Power driver.

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8.12.4 Synchronous Serial Interface (SSI) Characteristics

8.12.4.1 Synchronous Serial Interface (SSI) Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

NO.

MIN

TYP

MAX

UNIT

S1

t_{clk_per}

t_{clk_high}

t_{clk_low}

SSIClk cycle time

SSIClk high time

SSIClk low time

12

65024

System Clocks ⁽²⁾

t_{clk_per}

S2⁽¹⁾

S3⁽¹⁾

0.5

t_{clk_per}

(1) Refer to SSI timing diagrams Diagram 1, Diagram 2, Diagram 3

(2) When using the TI-provided Power driver, the SSI system clock is always 48 MHz.

S1

S2

SSIClk

S3

SSIFss

SSITx

MSB

LSB

SSIRx

4 to 16 bits

图8-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement

S2

S1

SSIClk

SSIFss

SSITx

SSIRx

S3

MSB

LSB

8-bit control

0

MSB

LSB

4 to 16 bits output data

图8-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer

English Data Sheet: SWRS194

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S1

S2

SSIClk

(SPO = 0)

S3

SSIClk

(SPO = 1)

SSITx

(Master)

MSB

LSB

SSIRx

(Slave)

MSB

LSB

SSIFss

图8-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1

8.12.5 UART

8.12.5.1 UART Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

UART rate

3

MBaud

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8.13 Peripheral Characteristics

8.13.1 ADC

8.13.1.1 Analog-to-Digital Converter (ADC) Characteristics

T_c= 25 °C, V_DDS= 3.0 V and voltage scaling enabled, unless otherwise noted.⁽¹⁾

Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers.

PARAMETER

Input voltage range

Resolution

TEST CONDITIONS

MIN

TYP

MAX

UNIT

V

0

VDDS

12

Bits

ksps

LSB

Sample Rate

200

Offset

Internal 4.3 V equivalent reference⁽²⁾

–0.24

7.14

>–1

±4

Gain error

Internal 4.3 V equivalent reference⁽²⁾

DNL⁽⁴⁾

INL

Differential nonlinearity

Integral nonlinearity

Internal 4.3 V equivalent reference⁽²⁾, 200 kSamples/s,

9.6 kHz input tone

9.8

Internal 4.3 V equivalent reference⁽²⁾, 200 kSamples/s,

9.6 kHz input tone, DC/DC enabled

9.8

10.1

11.1

VDDS as reference, 200 kSamples/s, 9.6 kHz input tone

ENOB

Effective number of bits

Bits

Internal reference, voltage scaling disabled,

32 samples average, 200 kSamples/s, 300 Hz input tone

Internal reference, voltage scaling disabled,

11.3

11.6

14-bit mode, 200 kSamples/s, 600 Hz input tone ⁽⁵⁾

Internal reference, voltage scaling disabled,

15-bit mode, 200 kSamples/s, 150 Hz input tone ⁽⁵⁾

Internal 4.3 V equivalent reference⁽²⁾, 200 kSamples/s,

9.6 kHz input tone

–65

–70

–72

THD

Total harmonic distortion

VDDS as reference, 200 kSamples/s, 9.6 kHz input tone

dB

Internal reference, voltage scaling disabled,

32 samples average, 200 kSamples/s, 300 Hz input tone

Internal 4.3 V equivalent reference⁽²⁾, 200 kSamples/s,

9.6 kHz input tone

60

63

68

Signal-to-noise

and

distortion ratio

SINAD,

SNDR

VDDS as reference, 200 kSamples/s, 9.6 kHz input tone

Internal reference, voltage scaling disabled,

32 samples average, 200 kSamples/s, 300 Hz input tone

Internal 4.3 V equivalent reference⁽²⁾, 200 kSamples/s,

9.6 kHz input tone

70

73

75

SFDR

Spurious-free dynamic range VDDS as reference, 200 kSamples/s, 9.6 kHz input tone

Internal reference, voltage scaling disabled,

32 samples average, 200 kSamples/s, 300 Hz input tone

Conversion time

Serial conversion, time-to-output, 24 MHz clock

Internal 4.3 V equivalent reference⁽²⁾

VDDS as reference

50

0.42

0.6

Clock Cycles

Current consumption

mA

Equivalent fixed internal reference (input voltage scaling

enabled). For best accuracy, the ADC conversion should be

initiated through the TI-RTOS API in order to include the gain/

offset compensation factors stored in FCFG1

Reference voltage

4.3^{(2) (3)}

V

Fixed internal reference (input voltage scaling disabled). For

best accuracy, the ADC conversion should be initiated through

the TI-RTOS API in order to include the gain/offset

compensation factors stored in FCFG1. This value is derived

from the scaled value (4.3 V) as follows:

Reference voltage

1.48

V

V_ref= 4.3 V × 1408 / 4095

Reference voltage

VDDS as reference, input voltage scaling enabled

VDDS as reference, input voltage scaling disabled

VDDS

V

VDDS /

2.82⁽³⁾

English Data Sheet: SWRS194

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8.13.1.1 Analog-to-Digital Converter (ADC) Characteristics (continued)

T_c= 25 °C, V_DDS= 3.0 V and voltage scaling enabled, unless otherwise noted.⁽¹⁾

Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

200 kSamples/s, voltage scaling enabled. Capacitive input,

Input impedance depends on sampling frequency and sampling

time

Input impedance

>1

MΩ

(1) Using IEEE Std 1241-2010 for terminology and test methods

(2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V

(3) Applied voltage must be within Absolute Maximum Ratings (see 节8.1) at all times

(4) No missing codes

(5) ADC_output = Σ(4ⁿsamples ) >> n, n = desired extra bits

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8.13.2 DAC

8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics

T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

General Parameters

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Resolution

8

Bits

Any load, any V_REF, pre-charge OFF, DAC charge-pump ON

1.8

2.0

3.8

External Load⁽⁴⁾, any V_REF, pre-charge OFF, DAC charge-pump

OFF

V_DDS

Supply voltage

V

Any load, V_REF= DCOUPL, pre-charge ON

Buffer ON (recommended for external load)

Buffer OFF (internal load)

2.6

16

3.8

250

F_DAC

Clock frequency

kHz

1000

V_REF= VDDS, buffer OFF, internal load

V_REF= VDDS, buffer ON, external capacitive load = 20 pF⁽³⁾

13

13.8

20

Voltage output settling time

1 / F_DAC

External capacitive load

External resistive load

Short circuit current

200

400

pF

MΩ

µA

10

VDDS = 3.8 V, DAC charge-pump OFF

VDDS = 3.0 V, DAC charge-pump ON

VDDS = 3.0 V, DAC charge-pump OFF

VDDS = 2.0 V, DAC charge-pump ON

VDDS = 2.0 V, DAC charge-pump OFF

VDDS = 1.8 V, DAC charge-pump ON

VDDS = 1.8 V, DAC charge-pump OFF

50.8

51.7

53.2

48.7

70.2

46.3

88.9

Max output impedance Vref =

VDDS, buffer ON, CLK 250

kHz

Z_MAX

kΩ

Internal Load - Continuous Time Comparator / Low Power Clocked Comparator

V_REF= VDDS,

load = Continuous Time Comparator or Low Power Clocked

Comparator

F_DAC= 250 kHz

Differential nonlinearity

±1

DNL

LSB⁽¹⁾

V_REF= VDDS,

load = Continuous Time Comparator or Low Power Clocked

Comparator

±1.2

F_DAC= 16 kHz

V_REF= VDDS = 3.8 V

±0.64

±0.81

±1.27

±3.43

±2.88

±2.37

±0.78

±0.77

±3.46

±3.44

±4.70

±4.11

±1.53

±1.71

±2.10

±6.00

±3.85

±5.84

V_REF= VDDS= 3.0 V

Offset error⁽²⁾

Load = Continuous Time

Comparator

V_REF= VDDS = 1.8 V

V_REF= DCOUPL, pre-charge ON

V_REF= DCOUPL, pre-charge OFF

V_REF= ADCREF

V_REF= VDDS= 3.8 V

V_REF= VDDS = 3.0 V

Offset error⁽²⁾

Load = Low Power Clocked

Comparator

V_REF= VDDS= 1.8 V

V_REF= DCOUPL, pre-charge ON

V_REF= DCOUPL, pre-charge OFF

V_REF= ADCREF

V_REF= VDDS = 3.8 V

V_REF= VDDS = 3.0 V

Max code output voltage

variation⁽²⁾

Load = Continuous Time

Comparator

V_REF= VDDS= 1.8 V

V_REF= DCOUPL, pre-charge ON

V_REF= DCOUPL, pre-charge OFF

V_REF= ADCREF

English Data Sheet: SWRS194

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8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics (continued)

T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

±2.92

±3.06

±3.91

±7.84

±4.06

±6.94

0.03

3.62

0.02

2.86

0.01

1.71

0.01

1.21

1.27

2.46

0.01

1.41

0.03

3.61

0.02

2.85

0.01

1.71

0.01

1.21

1.27

2.46

0.01

1.41

MAX

UNIT

V_REF= VDDS= 3.8 V

V_REF=VDDS= 3.0 V

V_REF= VDDS= 1.8 V

Max code output voltage

variation⁽²⁾

Load = Low Power Clocked

Comparator

LSB⁽¹⁾

V_REF= DCOUPL, pre-charge ON

V_REF= DCOUPL, pre-charge OFF

V_REF= ADCREF

V_REF= VDDS = 3.8 V, code 1

V_REF= VDDS = 3.8 V, code 255

V_REF= VDDS= 3.0 V, code 1

V_REF= VDDS= 3.0 V, code 255

V_REF= VDDS= 1.8 V, code 1

Output voltage range⁽²⁾

Load = Continuous Time

Comparator

V_REF= VDDS = 1.8 V, code 255

V_REF= DCOUPL, pre-charge OFF, code 1

V_REF= DCOUPL, pre-charge OFF, code 255

V_REF= DCOUPL, pre-charge ON, code 1

V_REF= DCOUPL, pre-charge ON, code 255

V_REF= ADCREF, code 1

V

V_REF= ADCREF, code 255

V_REF= VDDS = 3.8 V, code 1

V_REF= VDDS= 3.8 V, code 255

V_REF= VDDS= 3.0 V, code 1

V_REF= VDDS= 3.0 V, code 255

V_REF= VDDS = 1.8 V, code 1

Output voltage range⁽²⁾

Load = Low Power Clocked

Comparator

V_REF= VDDS = 1.8 V, code 255

V_REF= DCOUPL, pre-charge OFF, code 1

V_REF= DCOUPL, pre-charge OFF, code 255

V_REF= DCOUPL, pre-charge ON, code 1

V_REF= DCOUPL, pre-charge ON, code 255

V_REF= ADCREF, code 1

V

V_REF= ADCREF, code 255

External Load (Keysight 34401A Multimeter)

V_REF= VDDS, F_DAC= 250 kHz

±1

INL

Integral nonlinearity

V_REF= DCOUPL, F_DAC= 250 kHz

V_REF= ADCREF, F_DAC= 250 kHz

V_REF= VDDS, F_DAC= 250 kHz

V_REF= VDDS= 3.8 V

LSB⁽¹⁾

±1

DNL

Differential nonlinearity

±1

±0.40

±0.50

±0.75

±1.55

±1.30

±1.10

±1.00

±3.45

±2.10

±1.90

V_REF= VDDS= 3.0 V

V_REF= VDDS = 1.8 V

Offset error

LSB⁽¹⁾

V_REF= DCOUPL, pre-charge ON

V_REF= DCOUPL, pre-charge OFF

V_REF= ADCREF

V_REF= VDDS= 3.8 V

V_REF= VDDS= 3.0 V

V_REF= VDDS= 1.8 V

Max code output voltage

variation

LSB⁽¹⁾

V_REF= DCOUPL, pre-charge ON

V_REF= DCOUPL, pre-charge OFF

V_REF= ADCREF

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MAX UNIT

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8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics (continued)

T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

0.03

3.61

0.02

2.85

0.02

1.71

0.02

1.20

1.27

2.46

0.02

1.42

V_REF= VDDS = 3.8 V, code 1

V_REF= VDDS = 3.8 V, code 255

V_REF= VDDS = 3.0 V, code 1

V_REF= VDDS= 3.0 V, code 255

V_REF= VDDS= 1.8 V, code 1

Output voltage range

Load = Low Power Clocked

Comparator

V_REF= VDDS = 1.8 V, code 255

V_REF= DCOUPL, pre-charge OFF, code 1

V_REF= DCOUPL, pre-charge OFF, code 255

V_REF= DCOUPL, pre-charge ON, code 1

V_REF= DCOUPL, pre-charge ON, code 255

V_REF= ADCREF, code 1

V

V_REF= ADCREF, code 255

(1) 1 LSB (V_REF3.8 V/3.0 V/1.8 V/DCOUPL/ADCREF) = 14.10 mV/11.13 mV/6.68 mV/4.67 mV/5.48 mV

(2) Includes comparator offset

(3) A load > 20 pF will increases the settling time

(4) Keysight 34401A Multimeter

English Data Sheet: SWRS194

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8.13.3 Temperature and Battery Monitor

8.13.3.1 Temperature Sensor

Measured on a Texas Instruments reference design with T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

°C

Resolution

Accuracy

2

-40 °C to 0 °C

0 °C to 105 °C

±4.0

±2.5

3.6

°C

Supply voltage coefficient⁽¹⁾

°C/V

(1) The temperature sensor is automatically compensated for VDDS variation when using the TI-provided driver.

8.13.3.2 Battery Monitor

Measured on a Texas Instruments reference design with T_c= 25 °C, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

mV

V

Resolution

Range

25

1.8

3.8

Integral nonlinearity (max)

Accuracy

23

22.5

-32

-1

mV

%

VDDS = 3.0 V

Offset error

Gain error

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8.13.4 Comparators

8.13.4.1 Low-Power Clocked Comparator

T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Input voltage range

Clock frequency

0

V_DDS

V

SCLK_LF

Using internal DAC with VDDS as reference voltage,

DAC code = 0 - 255

Internal reference voltage⁽¹⁾

Offset

0.024 - 2.865

V

Measured at V_DDS/ 2, includes error from internal DAC

±5

1

mV

Clock

Cycle

Decision time

Step from –50 mV to 50 mV

(1) The comparator can use an internal 8 bits DAC as its reference. The DAC output voltage range depends on the reference voltage

selected. See 节8.13.2.1

8.13.4.2 Continuous Time Comparator

T_c= 25°C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

V

Input voltage range⁽¹⁾

Offset

0

V_DDS

Measured at V_DDS/ 2

±5

0.78

8.6

mV

µs

Decision time

Step from –10 mV to 10 mV

Current consumption

Internal reference

µA

(1) The input voltages can be generated externally and connected throughout I/Os or an internal reference voltage can be generated using

the DAC

8.13.5 Current Source

8.13.5.1 Programmable Current Source

T_c= 25 °C, V_DDS= 3.0 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

0.25 - 20

0.25

MAX UNIT

Current source programmable output range (logarithmic

range)

µA

Resolution

English Data Sheet: SWRS194

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8.13.6 GPIO

8.13.6.1 GPIO DC Characteristics

PARAMETER

T_A= 25 °C, V_DDS= 1.8 V

TEST CONDITIONS

MIN

TYP

MAX UNIT

GPIO VOH at 8 mA load

IOCURR = 2, high-drive GPIOs only

IOCURR = 1

1.56

0.24

1.59

0.21

73

V

GPIO VOL at 8 mA load

GPIO VOH at 4 mA load

V

GPIO VOL at 4 mA load

IOCURR = 1

V

GPIO pullup current

Input mode, pullup enabled, Vpad = 0 V

Input mode, pulldown enabled, Vpad = VDDS

IH = 1, transition voltage for input read as 0 →1

IH = 1, transition voltage for input read as 1 →0

µA

V

GPIO pulldown current

19

GPIO low-to-high input transition, with hysteresis

GPIO high-to-low input transition, with hysteresis

1.08

0.73

V

IH = 1, difference between 0 →1

and 1 →0 points

GPIO input hysteresis

0.35

V

T_A= 25 °C, V_DDS= 3.0 V

GPIO VOH at 8 mA load

IOCURR = 2, high-drive GPIOs only

IOCURR = 1

2.59

0.42

2.63

0.40

V

GPIO VOL at 8 mA load

GPIO VOH at 4 mA load

GPIO VOL at 4 mA load

IOCURR = 1

T_A= 25 °C, V_DDS= 3.8 V

GPIO pullup current

Input mode, pullup enabled, Vpad = 0 V

282

110

µA

V

GPIO pulldown current

Input mode, pulldown enabled, Vpad = VDDS

IH = 1, transition voltage for input read as 0 →1

IH = 1, transition voltage for input read as 1 →0

GPIO low-to-high input transition, with hysteresis

GPIO high-to-low input transition, with hysteresis

1.97

1.55

V

IH = 1, difference between 0 →1

and 1 →0 points

GPIO input hysteresis

T_A= 25 °C

0.42

V

Lowest GPIO input voltage reliably interpreted as a

High

VIH

0.8*V_DDS

V

Highest GPIO input voltage reliably interpreted as a

Low

VIL

0.2*V_DDS

V

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8.14 Typical Characteristics

All measurements in this section are done with T_c= 25 °C and V_DDS= 3.0 V, unless otherwise noted. See

Recommended Operating Conditions for device limits. Values exceeding these limits are for reference only.

8.14.1 MCU Current

Active Current vs. VDDS

Running CoreMark, SCLK_HF = 48 MHz RCOSC

6

5.5

5

4.5

4

3.5

3

2.5

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D001

图8-4. Active Mode (MCU) Current vs.

Supply Voltage (VDDS)

Standby Current vs. Temperature

80 kB RAM Retention, no Cache Retention, RTC On

SCLK_LF = 32 kHz XOSC

12

10

8

6

4

2

0

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D006

图8-5. Standby Mode (MCU) Current vs.

Temperature

English Data Sheet: SWRS194

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8.14.2 RX Current

RX Current vs. Temperature

BLE 1 Mbps, 2.44 GHz

8.5

8.4

8.3

8.2

8.1

8

7.9

7.8

7.7

7.6

7.5

7.4

7.3

7.2

7.1

7

6.9

6.8

6.7

6.6

6.5

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D010

图8-6. RX Current vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

RX Current vs. VDDS

BLE 1 Mbps, 2.44 GHz

11.5

11

10.5

10

9.5

9

8.5

8

7.5

7

6.5

6

5.5

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D013

图8-7. RX Current vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

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8.14.3 TX Current

TX Current vs. Temperature

BLE 1 Mbps, 2.44 GHz, 0 dBm

9

8.85

8.7

8.55

8.4

8.25

8.1

7.95

7.8

7.65

7.5

7.35

7.2

7.05

6.9

6.75

6.6

6.45

6.3

6.15

6

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D018

图8-8. TX Current vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

TX Current vs. VDDS

BLE 1 Mbps, 2.44 GHz, 0 dBm

12

11.5

11

10.5

10

9.5

9

8.5

8

7.5

7

6.5

6

5.5

5

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D024

图8-9. TX Current vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

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表8-1 shows typical TX current and output power for different output power settings.

表8-1. Typical TX Current and Output Power

CC2642R at 2.4 GHz, VDDS = 3.0 V (Measured on CC2652REM-7ID)

txPower

0x7217

0x4E63

0x385D

0x3259

0x2856

0x2853

0x12D6

0x0ACF

0x06CA

0x04C6

TX Power Setting (SmartRF Studio)

Typical Output Power [dBm]

Typical Current Consumption [mA]

5

4

4.9

3.9

9.5

9.0

8.6

8.0

7.6

7.3

6.2

5.6

5.2

4.8

3

2.8

2

1.8

1

0.9

0

-0.3

-4.9

-9.4

-14.5

-20.3

-5

-10

-15

-20

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8.14.4 RX Performance

Sensitivity vs. Frequency

BLE 1 Mbps, 2.44 GHz

-92

-93

-94

-95

-96

-97

-98

-99

-100

-101

-102

2.4

2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48

Frequency [GHz]

D028

图8-10. Sensitivity vs. Frequency (BLE 1 Mbps, 2.44 GHz)

Sensitivity vs. Temperature

BLE 1 Mbps, 2.44 GHz

-92

-93

-94

-95

-96

-97

-98

-99

-100

-101

-102

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D031

图8-11. Sensitivity vs. Temperature (BLE 1 Mbps, 2.44 GHz)

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Sensitivity vs. VDDS

BLE 1 Mbps, 2.44 GHz

-92

-93

-94

-95

-96

-97

-98

-99

-100

-101

-102

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D034

图8-12. Sensitivity vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

Sensitivity vs. VDDS

BLE 1 Mbps, 2.44 GHz, DCDC Off

-92

-93

-94

-95

-96

-97

-98

-99

-100

-101

-102

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D035

图8-13. Sensitivity vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, DCDC Off)

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8.14.5 TX Performance

Output Power vs. Temperature

BLE 1 Mbps, 2.44 GHz, 0 dBm

2

1.8

1.6

1.4

1.2

1

0.8

0.6

0.4

0.2

0

-0.2

-0.4

-0.6

-0.8

-1

-1.2

-1.4

-1.6

-1.8

-2

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D041

图8-14. Output Power vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

Output Power vs. Temperature

BLE 1 Mbps, 2.44 GHz, +5 dBm

7

6.8

6.6

6.4

6.2

6

5.8

5.6

5.4

5.2

5

4.8

4.6

4.4

4.2

4

3.8

3.6

3.4

3.2

3

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D042

图8-15. Output Power vs.

Temperature (BLE 1 Mbps, 2.44 GHz, +5 dBm)

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Output Power vs. VDDS

BLE 1 Mbps, 2.44 GHz, 0 dBm

2

1.8

1.6

1.4

1.2

1

0.8

0.6

0.4

0.2

0

-0.2

-0.4

-0.6

-0.8

-1

-1.2

-1.4

-1.6

-1.8

-2

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D046

图8-16. Output Power vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

Output power vs. VDDS

BLE 1 Mbps, 2.44 GHz, +5 dBm

7

6.8

6.6

6.4

6.2

6

5.8

5.6

5.4

5.2

5

4.8

4.6

4.4

4.2

4

3.8

3.6

3.4

3.2

3

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D048

图8-17. Output Power vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +5 dBm)

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Output Power vs. Frequency

BLE 1 Mbps, 2.44 GHz, 0 dBm

2

1.8

1.6

1.4

1.2

1

0.8

0.6

0.4

0.2

0

-0.2

-0.4

-0.6

-0.8

-1

-1.2

-1.4

-1.6

-1.8

-2

2.4

2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48

Frequency [GHz]

D058

图8-18. Output Power vs.

Frequency (BLE 1 Mbps, 2.44 GHz)

Output Power vs. Frequency

BLE 1 Mbps, 2.44 GHz, +5 dBm

7

6.8

6.6

6.4

6.2

6

5.8

5.6

5.4

5.2

5

4.8

4.6

4.4

4.2

4

3.8

3.6

3.4

3.2

3

2.4

2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48

Frequency [GHz]

D059

图8-19. Output Power vs.

Frequency (BLE 1 Mbps, 2.44 GHz, +5 dBm)

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8.14.6 ADC Performance

ENOB vs. Input Frequency

11.4

Internal Reference, No Averaging

Internal Unscaled Reference, 14-bit Mode

11.1

10.8

10.5

10.2

9.9

9.6

0.2 0.3

0.5 0.7

1

2

3

4

5

6 7 8 10

20

30 40 50 70 100

Frequency [kHz]

D061

图8-20. ENOB vs.

Input Frequency

ENOB vs. Sampling Frequency

Vin = 3.0 V Sine wave, Internal reference,

Fin = Fs / 10

10.2

10.15

10.1

10.05

10

9.95

9.9

9.85

9.8

1

2

3

4

5

6 7 8 10

20

30 40 50 70 100

200

Frequency [kHz]

D062

图8-21. ENOB vs.

Sampling Frequency

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INL vs. ADC Code

Vin = 3.0 V Sine wave, Internal reference,

200 kSamples/s

1.5

1

0.5

0

-0.5

-1

-1.5

0

400

800

1200 1600 2000 2400 2800 3200 3600 4000

ADC Code

D064

图8-22. INL vs.

ADC Code

DNL vs. ADC Code

Vin = 3.0 V Sine wave, Internal reference,

200 kSamples/s

2.5

2

1.5

1

0.5

0

-0.5

0

400

800

1200 1600 2000 2400 2800 3200 3600 4000

ADC Code

D065

图8-23. DNL vs.

ADC Code

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ADC Accuracy vs. Temperature

Vin = 1 V, Internal reference,

200 kSamples/s

1.01

1.009

1.008

1.007

1.006

1.005

1.004

1.003

1.002

1.001

1

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80 90 100

Temperature [°C]

D066

图8-24. ADC Accuracy vs.

Temperature

ADC Accuracy vs. VDDS

Vin = 1 V, Internal reference,

200 kSamples/s

1.01

1.009

1.008

1.007

1.006

1.005

1.004

1.003

1.002

1.001

1

1.8

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

Voltage [V]

D067

图8-25. ADC Accuracy vs.

Supply Voltage (VDDS)

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9 Detailed Description

9.1 Overview

节4 shows the core modules of the CC2642R device.

9.2 System CPU

The CC2642R SimpleLink^™Wireless MCU contains an Arm^®Cortex^®-M4F system CPU, which runs the

application and the higher layers of radio protocol stacks.

The system CPU is the foundation of a high-performance, low-cost platform that meets the system requirements

of minimal memory implementation, and low-power consumption, while delivering outstanding computational

performance and exceptional system response to interrupts.

Its features include the following:

• ARMv7-M architecture optimized for small-footprint embedded applications

• Arm Thumb^®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit Arm

core in a compact memory size

• Fast code execution permits increased sleep mode time

• Deterministic, high-performance interrupt handling for time-critical applications

• Single-cycle multiply instruction and hardware divide

• Hardware division and fast digital-signal-processing oriented multiply accumulate

• Saturating arithmetic for signal processing

• IEEE 754-compliant single-precision Floating Point Unit (FPU)

• Memory Protection Unit (MPU) for safety-critical applications

• Full debug with data matching for watchpoint generation

– Data Watchpoint and Trace Unit (DWT)

– JTAG Debug Access Port (DAP)

– Flash Patch and Breakpoint Unit (FPB)

• Trace support reduces the number of pins required for debugging and tracing

– Instrumentation Trace Macrocell Unit (ITM)

– Trace Port Interface Unit (TPIU) with asynchronous serial wire output (SWO)

• Optimized for single-cycle flash memory access

• Tightly connected to 8-KB 4-way random replacement cache for minimal active power consumption and wait

states

• Ultra-low-power consumption with integrated sleep modes

• 48 MHz operation

• 1.25 DMIPS per MHz

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9.3 Radio (RF Core)

The RF Core is a highly flexible and future proof radio module which contains an Arm Cortex-M0 processor that

interfaces the analog RF and base-band circuitry, handles data to and from the system CPU side, and

assembles the information bits in a given packet structure. The RF core offers a high level, command-based API

to the main CPU that configurations and data are passed through. The Arm Cortex-M0 processor is not

programmable by customers and is interfaced through the TI-provided RF driver that is included with the

SimpleLink Software Development Kit (SDK).

The RF core can autonomously handle the time-critical aspects of the radio protocols, thus offloading the main

CPU, which reduces power and leaves more resources for the user application. Several signals are also

available to control external circuitry such as RF switches or range extenders autonomously.

A Packet Traffic Arbitrator (PTA) scheme is available for the managed coexistence of BLE and a co-located 2.4-

GHz radio. This is based on 802.15.2 recommendations and common industry standards. The 3-wire

coexistence interface has multiple modes of operation, encompassing different use cases and number of lines

used for signaling. The radio acting as a slave is able to request access to the 2.4-GHz ISM band, and the

master to grant it. Information about the request priority and TX or RX operation can also be conveyed.

The various physical layer radio formats are partly built as a software defined radio where the radio behavior is

either defined by radio ROM contents or by non-ROM radio formats delivered in form of firmware patches with

the SimpleLink SDKs. This allows the radio platform to be updated for support of future versions of standards

even with over-the-air (OTA) updates while still using the same silicon.

9.3.1 Bluetooth 5.2 Low Energy

The RF Core offers full support for Bluetooth 5.2 Low Energy, including the high-sped 2-Mbps physical layer and

the 500-kbps and 125-kbps long range PHYs (Coded PHY) through the TI provided Bluetooth 5.2 stack or

through a high-level Bluetooth API. The Bluetooth 5.2 PHY and part of the controller are in radio and system

ROM, providing significant savings in memory usage and more space available for applications.

The new high-speed mode allows data transfers up to 2 Mbps, twice the speed of Bluetooth 4.2 and five times

the speed of Bluetooth 4.0, without increasing power consumption. In addition to faster speeds, this mode offers

significant improvements for energy efficiency and wireless coexistence with reduced radio communication time.

Bluetooth 5.2 also enables unparalleled flexibility for adjustment of speed and range based on application needs,

which capitalizes on the high-speed or long-range modes respectively. Data transfers are now possible at 2

Mbps, enabling development of applications using voice, audio, imaging, and data logging that were not

previously an option using Bluetooth low energy. With high-speed mode, existing applications deliver faster

responses, richer engagement, and longer battery life. Bluetooth 5.2 enables fast, reliable firmware updates.

9.4 Memory

The up to 352-KB nonvolatile (Flash) memory provides storage for code and data. The flash memory is in-

system programmable and erasable. The last flash memory sector must contain a Customer Configuration

section (CCFG) that is used by boot ROM and TI provided drivers to configure the device. This configuration is

done through the ccfg.c source file that is included in all TI provided examples.

The ultra-low leakage system static RAM (SRAM) is split into up to five 16-KB blocks and can be used for both

storage of data and execution of code. Retention of SRAM contents in Standby power mode is enabled by

default and included in Standby mode power consumption numbers. Parity checking for detection of bit errors in

memory is built-in, which reduces chip-level soft errors and thereby increases reliability. System SRAM is always

initialized to zeroes upon code execution from boot.

To improve code execution speed and lower power when executing code from nonvolatile memory, a 4-way

nonassociative 8-KB cache is enabled by default to cache and prefetch instructions read by the system CPU.

The cache can be used as a general-purpose RAM by enabling this feature in the Customer Configuration Area

(CCFG).

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There is a 4-KB ultra-low leakage SRAM available for use with the Sensor Controller Engine which is typically

used for storing Sensor Controller programs, data and configuration parameters. This RAM is also accessible by

the system CPU. The Sensor Controller RAM is not cleared to zeroes between system resets.

The ROM includes a TI-RTOS kernel and low-level drivers, as well as significant parts of selected radio stacks,

which frees up flash memory for the application. The ROM also contains a serial (SPI and UART) bootloader that

can be used for initial programming of the device.

9.5 Sensor Controller

The Sensor Controller contains circuitry that can be selectively enabled in both Standby and Active power

modes. The peripherals in this domain can be controlled by the Sensor Controller Engine, which is a proprietary

power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously; thereby

significantly reducing power consumption and offloading the system CPU.

The Sensor Controller Engine is user programmable with a simple programming language that has syntax

similar to C. This programmability allows for sensor polling and other tasks to be specified as sequential

algorithms rather than static configuration of complex peripheral modules, timers, DMA, register programmable

state machines, or event routing.

The main advantages are:

• Flexibility - data can be read and processed in unlimited manners while still ensuring ultra-low power

• 2 MHz low-power mode enables lowest possible handling of digital sensors

• Dynamic reuse of hardware resources

• 40-bit accumulator supporting multiplication, addition and shift

• Observability and debugging options

Sensor Controller Studio is used to write, test, and debug code for the Sensor Controller. The tool produces C

driver source code, which the System CPU application uses to control and exchange data with the Sensor

Controller. Typical use cases may be (but are not limited to) the following:

• Read analog sensors using integrated ADC or comparators

• Interface digital sensors using GPIOs, SPI, UART, or I²C (UART and I²C are bit-banged)

• Capacitive sensing

• Waveform generation

• Very low-power pulse counting (flow metering)

• Key scan

The peripherals in the Sensor Controller include the following:

• The low-power clocked comparator can be used to wake the system CPU from any state in which the

comparator is active. A configurable internal reference DAC can be used in conjunction with the comparator.

The output of the comparator can also be used to trigger an interrupt or the ADC.

• Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital

converter, and a comparator. The continuous time comparator in this block can also be used as a higher-

accuracy alternative to the low-power clocked comparator. The Sensor Controller takes care of baseline

tracking, hysteresis, filtering, and other related functions when these modules are used for capacitive

sensing.

• The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be

triggered by many different sources including timers, I/O pins, software, and comparators.

• The analog modules can connect to up to eight different GPIOs

• Dedicated SPI master with up to 6 MHz clock speed

The peripherals in the Sensor Controller can also be controlled from the main application processor.

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9.6 Cryptography

The CC2642R device comes with a wide set of modern cryptography-related hardware accelerators, drastically

reducing code footprint and execution time for cryptographic operations. It also has the benefit of being lower

power and improves availability and responsiveness of the system because the cryptography operations runs in

a background hardware thread.

Together with a large selection of open-source cryptography libraries provided with the Software Development

Kit (SDK), this allows for secure and future proof IoT applications to be easily built on top of the platform. The

hardware accelerator modules are:

• True Random Number Generator (TRNG) module provides a true, nondeterministic noise source for the

purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is

built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear-combinatorial circuit.

• Secure Hash Algorithm 2 (SHA-2) with support for SHA224, SHA256, SHA384, and SHA512

• Advanced Encryption Standard (AES) with 128 and 256 bit key lengths

• Public Key Accelerator - Hardware accelerator supporting mathematical operations needed for elliptic

curves up to 512 bits and RSA key pair generation up to 1024 bits.

Through use of these modules and the TI provided cryptography drivers, the following capabilities are available

for an application or stack:

• Key Agreement Schemes

– Elliptic curve Diffie–Hellman with static or ephemeral keys (ECDH and ECDHE)

– Elliptic curve Password Authenticated Key Exchange by Juggling (ECJ-PAKE)

• Signature Generation

– Elliptic curve Diffie-Hellman Digital Signature Algorithm (ECDSA)

• Curve Support

– Short Weierstrass form (full hardware support), such as:

• NIST-P224, NIST-P256, NIST-P384, NIST-P521

• Brainpool-256R1, Brainpool-384R1, Brainpool-512R1

• secp256r1

– Montgomery form (hardware support for multiplication), such as:

• Curve25519

• SHA2 based MACs

– HMAC with SHA224, SHA256, SHA384, or SHA512

• Block cipher mode of operation

– AESCCM

– AESGCM

– AESECB

– AESCBC

– AESCBC-MAC

• True random number generation

Other capabilities, such as RSA encryption and signatures as well as Edwards type of elliptic curves such as

Curve1174 or Ed25519, can also be implemented using the provided hardware accelerators but are not part of

the TI SimpleLink SDK for the CC2642R device.

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9.7 Timers

A large selection of timers are available as part of the CC2642R device. These timers are:

• Real-Time Clock (RTC)

A 70-bit 3-channel timer running on the 32 kHz low frequency system clock (SCLK_LF)

This timer is available in all power modes except Shutdown. The timer can be calibrated to compensate for

frequency drift when using the LF RCOSC as the low frequency system clock. If an external LF clock with

frequency different from 32.768 kHz is used, the RTC tick speed can be adjusted to compensate for this.

When using TI-RTOS, the RTC is used as the base timer in the operating system and should thus only be

accessed through the kernel APIs such as the Clock module. The real time clock can also be read by the

Sensor Controller Engine to timestamp sensor data and also has dedicated capture channels. By default, the

RTC halts when a debugger halts the device.

• General Purpose Timers (GPTIMER)

The four flexible GPTIMERs can be used as either 4× 32 bit timers or 8× 16 bit timers, all running on up to 48

MHz. Each of the 16- or 32-bit timers support a wide range of features such as one-shot or periodic counting,

pulse width modulation (PWM), time counting between edges and edge counting. The inputs and outputs of

the timer are connected to the device event fabric, which allows the timers to interact with signals such as

GPIO inputs, other timers, DMA and ADC. The GPTIMERs are available in Active and Idle power modes.

• Sensor Controller Timers

The Sensor Controller contains 3 timers:

AUX Timer 0 and 1 are 16-bit timers with a 2^Nprescaler. Timers can either increment on a clock or on each

edge of a selected tick source. Both one-shot and periodical timer modes are available.

AUX Timer 2 is a 16-bit timer that can operate at 24 MHz, 2 MHz or 32 kHz independent of the Sensor

Controller functionality. There are 4 capture or compare channels, which can be operated in one-shot or

periodical modes. The timer can be used to generate events for the Sensor Controller Engine or the ADC, as

well as for PWM output or waveform generation.

• Radio Timer

A multichannel 32-bit timer running at 4 MHz is available as part of the device radio. The radio timer is

typically used as the timing base in wireless network communication using the 32-bit timing word as the

network time. The radio timer is synchronized with the RTC by using a dedicated radio API when the device

radio is turned on or off. This ensures that for a network stack, the radio timer seems to always be running

when the radio is enabled. The radio timer is in most cases used indirectly through the trigger time fields in

the radio APIs and should only be used when running the accurate 48 MHz high frequency crystal is the

source of SCLK_HF.

• Watchdog timer

The watchdog timer is used to regain control if the system operates incorrectly due to software errors. It is

typically used to generate an interrupt to and reset of the device for the case where periodic monitoring of the

system components and tasks fails to verify proper functionality. The watchdog timer runs on a 1.5 MHz clock

rate and cannot be stopped once enabled. The watchdog timer pauses to run in Standby power mode and

when a debugger halts the device.

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9.8 Serial Peripherals and I/O

The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's synchronous

serial interfaces. The SSIs support both SPI master and slave up to 4 MHz. The SSI modules support

configurable phase and polarity.

The UARTs implement universal asynchronous receiver and transmitter functions. They support flexible baud-

rate generation up to a maximum of 3 Mbps.

The I²S interface is used to handle digital audio and can also be used to interface pulse-density modulation

microphones (PDM).

The I²C interface is also used to communicate with devices compatible with the I²C standard. The I²C interface

can handle 100 kHz and 400 kHz operation, and can serve as both master and slave.

The I/O controller (IOC) controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals

to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a

programmable pullup and pulldown function, and can generate an interrupt on a negative or positive edge

(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs

have high-drive capabilities, which are marked in bold in 节 7. All digital peripherals can be connected to any

digital pin on the device.

For more information, see the CC13x2, CC26x2 SimpleLink™ Wireless MCU Technical Reference Manual.

9.9 Battery and Temperature Monitor

A combined temperature and battery voltage monitor is available in the CC2642R device. The battery and

temperature monitor allows an application to continuously monitor on-chip temperature and supply voltage and

respond to changes in environmental conditions as needed. The module contains window comparators to

interrupt the system CPU when temperature or supply voltage go outside defined windows. These events can

also be used to wake up the device from Standby mode through the Always-On (AON) event fabric.

9.10 µDMA

The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload

data-transfer tasks from the system CPU, thus allowing for more efficient use of the processor and the available

bus bandwidth. The µDMA controller can perform a transfer between memory and peripherals. The µDMA

controller has dedicated channels for each supported on-chip module and can be programmed to automatically

perform transfers between peripherals and memory when the peripheral is ready to transfer more data.

Some features of the µDMA controller include the following (this is not an exhaustive list):

• Highly flexible and configurable channel operation of up to 32 channels

• Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and

peripheral-to-peripheral

• Data sizes of 8, 16, and 32 bits

• Ping-pong mode for continuous streaming of data

9.11 Debug

The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface.

The device boots by default into cJTAG mode and must be reconfigured to use 4-pin JTAG.

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9.12 Power Management

To minimize power consumption, the CC2642R supports a number of power modes and power management

features (see 表9-1).

表9-1. Power Modes

SOFTWARE CONFIGURABLE POWER MODES

RESET PIN

HELD

MODE

ACTIVE

Active

On

IDLE

Off

STANDBY

Off

SHUTDOWN

CPU

Off

No

Off

No

Flash

Available

On

Off

SRAM

On

Retention

Off

Radio

Available

On

Available

On

Supply System

Register and CPU retention

SRAM retention

Duty Cycled

Partial

Full

48 MHz high-speed clock

(SCLK_HF)

XOSC_HF or

RCOSC_HF

XOSC_HF or

RCOSC_HF

Off

2 MHz medium-speed clock

(SCLK_MF)

RCOSC_MF

Available

32 kHz low-speed clock

(SCLK_LF)

XOSC_LF or

RCOSC_LF

XOSC_LF or

RCOSC_LF

XOSC_LF or

RCOSC_LF

Peripherals

Available

On

Available

On

Off

Available

On

Off

On

Off

Sensor Controller

Wake-up on RTC

Off

Wake-up on pin edge

Wake-up on reset pin

Brownout detector (BOD)

Power-on reset (POR)

Watchdog timer (WDT)

Available

On

Duty Cycled

On

Off

On

Off

Available

Paused

Off

In Active mode, the application system CPU is actively executing code. Active mode provides normal operation

of the processor and all of the peripherals that are currently enabled. The system clock can be any available

clock source (see 表9-1).

In Idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked

and no code is executed. Any interrupt event brings the processor back into active mode.

In Standby mode, only the always-on (AON) domain is active. An external wake-up event, RTC event, or Sensor

Controller event is required to bring the device back to active mode. MCU peripherals with retention do not need

to be reconfigured when waking up again, and the CPU continues execution from where it went into standby

mode. All GPIOs are latched in standby mode.

In Shutdown mode, the device is entirely turned off (including the AON domain and Sensor Controller), and the

I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin

defined as a wake from shutdown pin wakes up the device and functions as a reset trigger. The CPU can

differentiate between reset in this way and reset-by-reset pin or power-on reset by reading the reset status

register. The only state retained in this mode is the latched I/O state and the flash memory contents.

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The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller

independently of the system CPU. This means that the system CPU does not have to wake up, for example to

perform an ADC sampling or poll a digital sensor over SPI, thus saving both current and wake-up time that would

otherwise be wasted. The Sensor Controller Studio tool enables the user to program the Sensor Controller,

control its peripherals, and wake up the system CPU as needed. All Sensor Controller peripherals can also be

controlled by the system CPU.

备注

The power, RF and clock management for the CC2642R device require specific configuration and

handling by software for optimized performance. This configuration and handling is implemented in the

TI-provided drivers that are part of the CC2642R software development kit (SDK). Therefore, TI highly

recommends using this software framework for all application development on the device. The

complete SDK with TI-RTOS (optional), device drivers, and examples are offered free of charge in

source code.

9.13 Clock Systems

The CC2642R device has several internal system clocks.

The 48 MHz SCLK_HF is used as the main system (MCU and peripherals) clock. This can be driven by the

internal 48 MHz RC Oscillator (RCOSC_HF) or an external 48 MHz crystal (XOSC_HF). Radio operation

requires an external 48 MHz crystal.

SCLK_MF is an internal 2 MHz clock that is used by the Sensor Controller in low-power mode and also for

internal power management circuitry. The SCLK_MF clock is always driven by the internal 2 MHz RC Oscillator

(RCOSC_MF).

SCLK_LF is the 32.768 kHz internal low-frequency system clock. It can be used by the Sensor Controller for

ultra-low-power operation and is also used for the RTC and to synchronize the radio timer before or after

Standby power mode. SCLK_LF can be driven by the internal 32.8 kHz RC Oscillator (RCOSC_LF), a 32.768

kHz watch-type crystal, or a clock input on any digital IO.

When using a crystal or the internal RC oscillator, the device can output the 32 kHz SCLK_LF signal to other

devices, thereby reducing the overall system cost.

9.14 Network Processor

Depending on the product configuration, the CC2642R device can function as a wireless network processor

(WNP - a device running the wireless protocol stack with the application running on a separate host MCU), or as

a system-on-chip (SoC) with the application and protocol stack running on the system CPU inside the device.

In the first case, the external host MCU communicates with the device using SPI or UART. In the second case,

the application must be written according to the application framework supplied with the wireless protocol stack.

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10 Application, Implementation, and Layout

备注

以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客户应负责确定

器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。

For general design guidelines and hardware configuration guidelines, refer to the CC13xx/CC26xx Hardware

Configuration and PCB Design Considerations Application Report.

10.1 Reference Designs

The following reference designs should be followed closely when implementing designs using the CC2642R

device.

Special attention must be paid to RF component placement, decoupling capacitors and DCDC regulator

components, as well as ground connections for all of these.

Integrated matched filter-balun devices can be used both at sub-1 GHz frequencies and at 2.4 GHz for the low-

power RF outputs. Refer to the "Integrated Passive Component" section in CC13xx/CC26xx Hardware

Configuration and PCB Design Considerations for further information.

CC26x2REM-7ID Design

Files

The CC26x2REM-7ID reference design provides schematic, layout and

production files for the characterization board used for deriving the performance

number found in this document.

LAUNCHXL-CC26X2R1

Design Files

The CC26X2R LaunchPad Design Files contain detailed schematics and layouts

to build application specific boards using the CC2642R device. This design

applies to both the CC2642R and CC2652R devices.

Sub-1 GHz and 2.4 GHz

The antenna kit allows real-life testing to identify the optimal antenna for your

Antenna Kit for LaunchPad application. The antenna kit includes 16 antennas for frequencies from 169 MHz

™ Development Kit and

SensorTag

to 2.4 GHz, including:

• PCB antennas

• Helical antennas

• Chip antennas

• Dual-band antennas for 868 MHz and 915 MHz combined with 2.4 GHz

The antenna kit includes a JSC cable to connect to the Wireless MCU LaunchPad

development kits and SensorTags.

48

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10.2 Junction Temperature Calculation

This section shows the different techniques for calculating the junction temperature under various operating

conditions. For more details, see Semiconductor and IC Package Thermal Metrics.

There are three recommended ways to derive the junction temperature from other measured temperatures:

1. From package temperature:

T = ψ × P + T

case

(1)

(2)

(3)

J

JT

2. From board temperature:

T = ψ × P + T

board

J

JB

3. From ambient temperature:

T = R

× P + T

A

J

θJA

P is the power dissipated from the device and can be calculated by multiplying current consumption with supply

voltage. Thermal resistance coefficients are found in Thermal Resistance Characteristics.

Example:

Using 方程式 3, the temperature difference between ambient temperature and junction temperature is

calculated. In this example, we assume a simple use case where the radio is transmitting continuously at 0 dBm

output power. Let us assume the ambient temperature is 85 °C and the supply voltage is 3 V. To calculate P, we

need to look up the current consumption for Tx at 85 °C in 节 8.14 . From the plot, we see that the current

consumption is 7.8 mA. This means that P is 7.8 mA × 3 V = 23.4 mW.

The junction temperature is then calculated as:

°C

T = 23.4

× 23.4mW + T = 0.6°C + T

A

(4)

W

J

A

As can be seen from the example, the junction temperature is 0.6 °C higher than the ambient temperature when

running continuous Tx at 85 °C and, thus, well within the recommended operating conditions.

For various application use cases current consumption for other modules may have to be added to calculate the

appropriate power dissipation. For example, the MCU may be running simultaneously as the radio, peripheral

modules may be enabled, etc. Typically, the easiest way to find the peak current consumption, and thus the peak

power dissipation in the device, is to measure as described in Measuring CC13xx and CC26xx current

consumption.

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11 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed as follows.

11.1 Tools and Software

The CC2642R device is supported by a variety of software and hardware development tools.

Development Kit

CC26x2

LaunchPad™

Development Kit

The CC26x2R LaunchPad^™Development Kit enables development of high-performance

wireless applications that benefit from low-power operation. The kit features the CC2652R

SimpleLink Wireless MCU, which allows you to quickly evaluate and prototype 2.4-GHz

wireless applications such as Bluetooth 5 Low Energy, Zigbee and Thread, plus

combinations of these. The kit works with the LaunchPad ecosystem, easily enabling

additional functionality like sensors, display and more. The built-in EnergyTrace^™software is

an energy-based code analysis tool that measures and displays the application’s energy

profile and helps to optimize it for ultra-low-power consumption. See 表 6-1 for guidance in

selecting the correct device for single-protocol products.

Software

SimpleLink™

CC13x2-

CC26x2 SDK

The SimpleLink CC13x2-CC26x2 Software Development Kit (SDK) provides a complete

package for the development of wireless applications on the CC13x2 / CC26x2 family of

devices. The SDK includes a comprehensive software package for the CC2642R device,

including the following protocol stacks:

• Bluetooth Low Energy 4 and 5.2

• Thread (based on OpenThread)

• Zigbee 3.0

• TI 15.4-Stack - an IEEE 802.15.4-based star networking solution for Sub-1 GHz and

2.4 GHz

• EasyLink - a large set of building blocks for building proprietary RF software stacks

• Multiprotocol support - concurrent operation between stacks using the Dynamic

Multiprotocol Manager (DMM)

The SimpleLink CC13x2-CC26x2 SDK is part of TI’s SimpleLink MCU platform, offering a

single development environment that delivers flexible hardware, software and tool options for

customers developing wired and wireless applications. For more information about the

SimpleLink MCU Platform, visit https://www.ti.com/simplelink.

English Data Sheet: SWRS194

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Code Composer

Studio^™

Integrated

Development

Environment (IDE)

Code Composer Studio is an integrated development environment (IDE) that supports TI's

Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a

suite of tools used to develop and debug embedded applications. It includes an optimizing

C/C++ compiler, source code editor, project build environment, debugger, profiler, and many

other features. The intuitive IDE provides a single user interface taking you through each

step of the application development flow. Familiar tools and interfaces allow users to get

started faster than ever before. Code Composer Studio combines the advantages of the

Eclipse^®software framework with advanced embedded debug capabilities from TI resulting

in a compelling feature-rich development environment for embedded developers.

CCS has support for all SimpleLink Wireless MCUs and includes support for EnergyTrace^™

software (application energy usage profiling). A real-time object viewer plugin is available for

TI-RTOS, part of the SimpleLink SDK.

Code Composer Studio is provided free of charge when used in conjunction with the XDS

debuggers included on a LaunchPad Development Kit.

Code Composer

Studio™ Cloud

IDE

Code Composer Studio (CCS) Cloud is a web-based IDE that allows you to create, edit and

build CCS and Energia™ projects. After you have successfully built your project, you can

download and run on your connected LaunchPad. Basic debugging, including features like

setting breakpoints and viewing variable values is now supported with CCS Cloud.

IAR Embedded

Workbench^®for

Arm^®

IAR Embedded Workbench^®is a set of development tools for building and debugging

embedded system applications using assembler, C and C++. It provides a completely

integrated development environment that includes a project manager, editor, and build tools.

IAR has support for all SimpleLink Wireless MCUs. It offers broad debugger support,

including XDS110, IAR I-jet^™and Segger J-Link^™. A real-time object viewer plugin is

available for TI-RTOS, part of the SimpleLink SDK. IAR is also supported out-of-the-box on

most software examples provided as part of the SimpleLink SDK.

A 30-day evaluation or a 32 KB size-limited version is available through iar.com.

SmartRF™ Studio

SmartRF™ Studio is a Windows^®application that can be used to evaluate and configure

SimpleLink Wireless MCUs from Texas Instruments. The application will help designers of

RF systems to easily evaluate the radio at an early stage in the design process. It is

especially useful for generation of configuration register values and for practical testing and

debugging of the RF system. SmartRF Studio can be used either as a standalone

application or together with applicable evaluation boards or debug probes for the RF device.

Features of the SmartRF Studio include:

• Link tests - send and receive packets between nodes

• Antenna and radiation tests - set the radio in continuous wave TX and RX states

• Export radio configuration code for use with the TI SimpleLink SDK RF driver

• Custom GPIO configuration for signaling and control of external switches

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Sensor Controller

Studio

Sensor Controller Studio is used to write, test and debug code for the Sensor Controller

peripheral. The tool generates a Sensor Controller Interface driver, which is a set of C

source files that are compiled into the System CPU application. These source files also

contain the Sensor Controller binary image and allow the System CPU application to control

and exchange data with the Sensor Controller. Features of the Sensor Controller Studio

include:

• Ready-to-use examples for several common use cases

• Full toolchain with built-in compiler and assembler for programming in a C-like

programming language

• Provides rapid development by using the integrated sensor controller task testing and

debugging functionality, including visualization of sensor data and verification of

algorithms

CCS UniFlash

CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs.

UniFlash has a GUI, command line, and scripting interface. CCS UniFlash is available free

of charge.

11.1.1 SimpleLink™ Microcontroller Platform

The SimpleLink microcontroller platform sets a new standard for developers with the broadest portfolio of wired

and wireless Arm^®MCUs (System-on-Chip) in a single software development environment. Delivering flexible

hardware, software and tool options for your IoT applications. Invest once in the SimpleLink software

development kit and use throughout your entire portfolio. Learn more on ti.com/simplelink.

11.2 Documentation Support

To receive notification of documentation updates on data sheets, errata, application notes and similar, navigate

to the device product folder on ti.com/product/CC2642R. In the upper right corner, click on Alert me to register

and receive a weekly digest of any product information that has changed. For change details, review the revision

history included in any revised document.

The current documentation that describes the MCU, related peripherals, and other technical collateral is listed as

follows.

TI Resource Explorer

Software examples, libraries, executables, and documentation are available for your

device and development board.

Errata

CC2642R Silicon

Errata

The silicon errata describes the known exceptions to the functional specifications for

each silicon revision of the device and description on how to recognize a device

revision.

Application Reports

All application reports for the CC2642R device are found on the device product folder at: ti.com/product/

CC2642R/technicaldocuments.

Technical Reference Manual (TRM)

CC13x2, CC26x2 SimpleLink™ Wireless

MCU TRM

The TRM provides a detailed description of all modules and

peripherals available in the device family.

English Data Sheet: SWRS194

52

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11.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

11.4 Trademarks

SmartRF^™, SimpleLink^™, LaunchPad^™, EnergyTrace^™, Code Composer Studio^™, and TI E2E^™are trademarks

of Texas Instruments.

I-jet^™is a trademark of IAR Systems AB.

J-Link^™is a trademark of SEGGER Microcontroller Systeme GmbH.

Arm^®, Cortex^®, and Arm Thumb^®are registered trademarks of Arm Limited (or its subsidiaries).

CoreMark^®is a registered trademark of Embedded Microprocessor Benchmark Consortium.

Bluetooth^®is a registered trademark of Bluetooth SIG Inc.

Wi-Fi^®is a registered trademark of Wi-Fi Alliance.

Eclipse^®is a registered trademark of Eclipse Foundation.

IAR Embedded Workbench^®is a registered trademark of IAR Systems AB.

Windows^®is a registered trademark of Microsoft Corporation.

所有商标均为其各自所有者的财产。

11.5 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

11.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

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12 Mechanical, Packaging, and Orderable Information

12.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

English Data Sheet: SWRS194

54

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GENERIC PACKAGE VIEW

RGZ 48

7 x 7, 0.5 mm pitch

VQFN - 1 mm max height

PLASTIC QUADFLAT PACK- NO LEAD

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224671/A

www.ti.com

PACKAGE OUTLINE

VQFN - 1 mm max height

RGZ0048A

PLASTIC QUADFLAT PACK- NO LEAD

A

7.1

6.9

B

(0.1) TYP

7.1

6.9

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

PIN 1 INDEX AREA

(0.45) TYP

CHAMFERED LEAD

CORNER LEAD OPTION

1 MAX

C

SEATING PLANE

0.08 C

0.05

0.00

2X 5.5

5.15±0.1

(0.2) TYP

13

24

44X 0.5

12

25

SEE SIDE WALL

DETAIL

SYMM

2X

5.5

1

36

0.30

0.18

PIN1 ID

(OPTIONAL)

48X

48

37

SYMM

0.1

C A B

C

0.5

0.3

48X

0.05

SEE LEAD OPTION

4219044/D 02/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

VQFN - 1 mm max height

RGZ0048A

PLASTIC QUADFLAT PACK- NO LEAD

2X (6.8)

5.15)

SYMM

(

48X (0.6)

37

48

48X (0.24)

44X (0.5)

1

36

SYMM

2X

(5.5)

(6.8)

2X

(1.26)

2X

(1.065)

(R0.05)

TYP

25

12

21X (Ø0.2) VIA

TYP

24

13

2X (1.065)

2X (1.26)

2X (5.5)

LAND PATTERN EXAMPLE

SCALE: 15X

SOLDER MASK

OPENING

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

EXPOSED METAL

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4219044/D 02/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

VQFN - 1 mm max height

RGZ0048A

PLASTIC QUADFLAT PACK- NO LEAD

2X (6.8)

SYMM

(

1.06)

37

48X (0.6)

48

48X (0.24)

44X (0.5)

1

36

SYMM

2X

(5.5)

(6.8)

2X

(0.63)

2X

(1.26)

(R0.05)

TYP

25

12

24

13

2X

(1.26)

2X (0.63)

2X (5.5)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

67% PRINTED COVERAGE BY AREA

SCALE: 15X

4219044/D 02/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

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保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	CC2642R1FRGZT
厂家：	TEXAS INSTRUMENTS
描述：	具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU \| RGZ \| 48 \| -40 to 105 无线电信电信集成电路闪存
文件：	总63页 (文件大小：2678K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CC2642R1FRGZT [TI]

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