CC8531 [TI]
2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING; 2.4 GHz射频片上系统的无线数字音频流
| 型号： | CC8531 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING |
| 文件： | 总18页 (文件大小：653K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CC8520, CC8521, CC8530 & CC8531
www.ti.com
SWRS091D – JULY 2011
2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING
CC8520, CC8521, CC8530 & CC8531 - PurePath™ Wireless
APPLICATIONS
-
Suited for systems targeting compliance
with worldwide radio frequency
regulations: ETSI EN 300 328 and EN
300 440 class 2 (Europe), FCC CFR47 Part
15 (US) and ARIB STD-T66 (Japan)
-
-
-
-
-
-
-
-
Wireless high-quality digital audio
Wireless point-to-point audio link
Wireless (USB) headphones / headsets
Wireless (USB) loudspeakers
Wireless 2.1 speaker systems
CC852x supports up to 2 channels
CC853x supports up to 4 channels
CC85x1 supports USB
Digital audio support
-
Digital I2S audio interface supports 1 or 2
audio channels for the CC8520 and 1 to 4
audio channels for the CC8530 at sample
rates of 32, 40.275, 44.1 and 48 kHz, and
supports 16 bit word-widths
USB audio support for 32, 44.1 and 48 kHz,
and supports 16 bit word-widths.
Audio latency down to 16 ms
FEATURES
Built-in audio protocol
-
-
-
CD-quality uncompressed audio
Excellent robustness and co-existence
through multiple techniques
-
-
Data side-channel allows data to be sent
alongside the audio between external host
controllers
-
-
-
-
-
Adaptive Frequency Hopping
Forward Error Correction
Buffering and Retransmission
Error Concealment
Optional
compression
USB
-
-
Full-speed USB Audio device
high
quality
audio
USB Basic Audio Device Class: HT1, HS1
and MT topologies (headphone, headset
and microphone)
USB Audio Device Class. Maximum 2 input
channels. Maximum 2 output channels
Basic USB HID device class support for
remote control functionality
-
No software development needed when
used in autonomous mode
-
-
-
External system
-
-
-
-
Can be used autonomously, or can be
controlled by an external host MCU for
greatest flexibility
Seamless connection and control of
selected TI audio codecs, DACs/ADCs and
digital audio amplifiers using I2S and I2C
HID functions like power control, binding,
volume control, audio channel selection
can be mapped to I/Os
Autonomous operation only.
Development tools
-
PC-based PurePath™ Wireless
Configurator for CC85xx configuration
CC85xx Family User Guide
CC85XXDK audio development kit
CC85XXDK-HEADSET development kit
-
-
-
RoHS compliant 6mm x 6mm QFN-40
package
QFN-40 PIN CONFIGURATION (TOP VIEW)
RF section
-
-
-
5 Mbps over-the-air data rate
Bandwidth-efficient modulation format
Excellent link budget with programmable
output power up to +3.5 dBm and -83 dBm
sensitivity
Seamless support for CC2590 range
extender (+11dBm output power, -87dBm
sensitivity)
xANTN
/USBP
xANTP
/USBN
CSN
RBIAS
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
1
2
3
4
5
6
7
8
9
30
29
28
27
26
25
24
23
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
-
CC85xx
X0
X1
22
21
10 IOVDD
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PurePath™ is a trademark for Texas Instruments
All other trademarks are the property of their respective owners.
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
DESCRIPTION
The PurePath™ Wireless platform is a cost-effective and low-power solution optimized for wireless
transmission of high-quality digital audio.
The CC85xx includes a robust built-in wireless audio transmission protocol and can control
selected external audio devices. Utilizing numerous coexistence mechanisms allows the CC85xx to
avoid interfering with, or being interfered by other 2.4 GHz radio systems.
The CC85xx operates autonomously, and can be used with or without an external MCU. An external
host processor can be connected through SPI and control some aspects of its operation. The
CC85xx interfaces easily with other TI audio ICs and DSPs (using I2S and DSP/TDM interfaces).
More details can be found in the CC85xx Family User Guide [2].
ABBREVIATIONS
ADC
ARIB
BER
Analog to Digital Converter
Association of Radio Industries and Businesses
Bit Error Rate
LED
LNA
MISO
MOSI
MCU
PA
Light Emitting Diode
Low Noise Amplifier
Master In Slave Out
Master Out Slave In
Microcontroller
CODEC Coder/Decoder
DAC
DSP
EHIF
ESD
ETSI
FCC
FEC
FSK
FW
Digital to Analog Converter
Digital Signal Processor
Power Amplifier
External Host Interface
PCM
PER
PLL
Pulse Code Modulation
Packet Error Rate
Electro Static Discharge
European Telecommunications Standard Institute
Federal Communications Commission
Forward Error Correction
Phase Lock Loop
PM
Protocol Master
PPW
PS
PurePath™ Wireless
Protocol Slave
Frequency Shift Keying
Firmware
RoHS
RF
Restriction of Hazardous Substances
Radio Frequency
HID
Human Interface Device
I2C
Inter-Integrated Circuit (serial communications bus)
Inter-IC Sound (serial bus for digital audio signals)
Institute of Electrical and Electronics Engineers
Industrial, Scientific, Medical
SLAC
SPI
Slightly Lossy Compression Algorithm
Serial Peripheral Interface
System-on-Chip
I2S
IEEE
ISM
SoC
STD
TDM
Standard
JEDEC
LDO
Joint Electron Device Engineering Council
Low-Dropout Regulator
Time-Division Multiplexing
2
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS(1)
PARAMETER
TEST CONDITIONS
Min
–0.3
–0.3
Max
Unit
V
Supply voltage (2)
All supply pins must have the same voltage
3.9
Voltage on any digital pin
min(VDD +
0.3, 3.9)
V
Input RF level
10
125
260
2000
dBm
°C
Storage temperature range
Reflow soldering temperature
ESD (3)
-40
According to IPC/JEDEC J-STD-020
°C
All pads, according to human-body model
(HBM), JEDEC STD 22, method A114
V
According to charged-device model (CDM),
JEDEC STD 22, method C101E
400
V
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings.
(3)
CAUTION: ESD sensitive device. Precaution should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS, CC8520/CC8530
PARAMETER
TEST CONDITIONS
Min
-40
2.0
Max
+85
3.6
Unit
°C
Operating ambient temperature range, TA
Operating supply voltage
V
RECOMMENDED OPERATING CONDITIONS, CC8521/CC8531
PARAMETER
TEST CONDITIONS
Min
-40
3.0
Max
+85
3.6
Unit
°C
Operating ambient temperature range, TA
Operating supply voltage (1)
V
(1)
For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings.
3
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
RF frequency range
Data rate
TEST CONDITION
MIN
TYP
MAX
UNIT
MHz
2400
2483.5
Shaped 8FSK
5
Mbps
Latency between I2S interface on audio source
and I2S interface on audio sink. Uncompressed
16 bit. Audio latency is programmable using the
PurePath Wireless Configurator [1].
Audio latency
768
2048
Samples
kHz
48
44.1
Audio sample rate is programmable using the
PurePath Wireless Configurator [1] (1)
Audio sample rate
40.275(2)
32
(1)
(2)
±2000ppm tolerance
Not supported in USB mode. For USB Headset, dynamic sample rate change is not allowed.
ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531
Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Current consumption,
power down state
Voltage regulator / crystal oscillator off – status
lost (POWERED_DOWN state)
1
A
Current consumption, headphone
master(1)
Average current for a PurePath Wireless master
with I2S interface active, sourcing two PCM16
channels with maximum output power.
Average current for a PurePath Wireless slave
with I2S interface active, sinking two PCM16
channels with maximum output power
29
25
mA
mA
Current consumption, headphone
slave(1)
(1)
Measured on Texas Instruments CC85xx EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled.
RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531
Measured on Texas Instruments CC85xx EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
3.5
-83
-2
MAX
UNIT
dBm
dBm
dBm
Output power
Maximum output power setting
5 Mbps, 0.1 % BER
Receiver sensitivity(1)
Saturation (maximum input level) (1)
5 Mbps, 0.1 % BER
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity
8
dB
dB
Selectivity
Alternate channel, ±8MHz, wanted 3dB above
sensitivity
35
Occupied bandwidth
99% energy bandwidth
3.8
MHz
Optimum load impedance
Differential impedance seen from the RF port
(RF_P and RF_N) towards the antenna
70 + j30
Ω
Spurious emission
Suitable for systems targeting compliance with EN 300 328, EN 300 440(2), FCC CFR47 Part 15
and ARIB STD-T-66
(1)
(2)
Measured using data packets with 40 byte payload.
Systems with external antenna connector: Margins for passing conducted requirements at sub 1GHz frequencies can be improved by
using a simple band-pass filter connected between matching network and RF connector (1.6 pF in parallel with 1.6 nH); this filter must be
connected to a good RF ground.
4
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 +CC2590
Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Current consumption,
power down state(1)
Voltage regulator / crystal oscillator off – status
lost (POWERED_DOWN state)
1
A
Average current for a PurePath Wireless master
with I2S interface active, sourcing two PCM16
channels.
Average current for a PurePath Wireless slave
with I2S interface active, sinking two PCM16
channels
Current consumption, headphone
master(2)
38
28
mA
mA
Current consumption, headphone
slave(2)
(1)
(2)
CC2590 power down current is 100 nA[4]
Measured on Texas Instruments CC85xx+CC2590 EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled.
RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 +CC2590
Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
11
MAX
UNIT
dBm
dBm
dBm
Output power
Maximum output power setting
5 Mbps, 0.1 % BER
Receiver sensitivity(1)
-87
-12
Saturation (maximum input level)
5 Mbps, 0.1 % BER
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity
9
Selectivity
dB
Alternate channel, ±8MHz, wanted 3dB above
sensitivity
34
Suitable for systems targeting compliance with EN 300 328, EN 300 440(2), FCC CFR47 Part 15
and ARIB STD-T-66
Spurious emission
(1)
Measured using data packets with 40 byte payload.
48-MHz CRYSTAL REQUIREMENTS
General parameters with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
MHz
ppm
ohm
pF
Crystal frequency
48
Crystal frequency accuracy requirement(1)
ESR Equivalent series resistance
C0 Crystal shunt capacitance
CL Crystal load capacitance
-50
-
50
60
3
-
15
16
17
pF
(1)
Including aging and temperature dependency
AUDIO CLOCK CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Programmable using the PurePath Wireless
Configurator [1]
32·FWCLK
512·FWCLK
MCLK Frequency range
Programmable using the PurePath Wireless
Configurator [1]
32·FWCLK
31.936
256·FWCLK
48.096
200
BCLK Frequency range
WCLK Frequency range
RMS jitter (Output clocks)
kHz
ps
80
RMS period jitter for 1000 periods
5
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
SPI INTERFACE CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
SCLK frequency
SCLKlow
TEST CONDITION
MIN
TYP
MAX
20
UNIT
MHz
0
25
25
50
ns
ns
ns
SCLKhigh
CSNhigh
Minimum time CSNmust be high, if brought high,
between commands (it is not necessary to bring
CSNhigh between commands).
25
ns
ns
ns
CSNfalling edge to
SCLKrising edge
Distance from CSNasserted until first rising edge
on SCLK.
100
50
SCLKfalling edge to
CSNrising edge
Distance from last negative edge of SCLKin last
word until CSNcan be de-asserted.
Inter-word spacing
Minimum distance in time from rising edge of
SCLKfor last bit in word n and the rising edge of
SCLKfor the first bit in word n+1.
Properly handles abutting words.
Hysteresis around trigger point of input buffer
using a Schmitt trigger
100
mV
Hysteresis on SCLK
Slew rate on SCLK
Slew rate from 0.1·IOVDD to 0.9·IOVDD
10
V/ s
1
PIN DESCRIPTION
xANTN
/USBN
RBIAS
1
30
xANTP
/USBP
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
2
3
4
5
6
7
8
9
29
28
27
26
25
24
23
CSN
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
CC85xx
X0
X1
22
21
10 IOVDD
Figure 1 - CC85xx QFN-40 PIN CONFIGURATION
6
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
PIN
PIN NAME
PIN TYPE
DESCRIPTION
-
GND
Ground
The exposed die attach pad must be connected to a solid ground plane underneath the
chip
1
2
3
xANTN
USBN
Digital I/O1
Digital I/O1
CC85x0: DO NOT CONNECT (Future FW: Controlling external antenna switch)
CC85x1: USB D- data line
xANTP
USBP
CC85x0: DO NOT CONNECT (Future FW: Controlling external antenna switch)
CC85x1: USB D+ data line
CS_N
Digital Input
(pull-up)
Serial SPI configuration interface, active low chip select
4
5
6
SCLK
MOSI
MISO
Digital I/O1
Digital I/O1
Digital I/O1
Serial SPI configuration interface, clock input/output
Serial SPI configuration interface, master data output, slave data input
Serial SPI configuration interface, master data input, slave data output.
7
GIO1
Digital I/O1
General-purpose digital I/O pin 1
Configurable with PurePath™ Wireless Configurator
General-purpose digital I/O pin 2
8
9
GIO2
GIO3
Digital I/O1
Digital I/O2
General-purpose digital I/O pin 3
Configurable with PurePath™ Wireless Configurator
Digital power supply for the digital I/Os in the SPI interface and GIO1-GIO3.
10
11
12
13
IOVDD
RSTN
Power
(I/O pads)
Digital Input
(pull-up)
Active-low device reset
IOVDD
Power
(I/O pins)
Digital power supply for the RSTN and MCLK digital I/O pins.
MCLK
GIO4
BCLK
GIO5
WCLK
GIO6
AD0
Digital I/O1
Digital I/O1
Digital I/O1
Digital I/O1
Digital I/O1
Master clock output for external audio devices
General-purpose digital I/O pin 4
14
15
16
17
I2S/DSP audio interface bit clock (in/out)
General-purpose digital I/O pin 5
I2S/DSP audio interface word clock (in/out)
General-purpose digital I/O pin 6
I2S/DSP audio interface data line 0 (in/out)
General-purpose digital I/O pin 7
GIO7
AD1
I2S/DSP audio interface data line 1 (in/out)
General-purpose digital I/O pin 8
GIO8
IOVDD
18
19
Power
(I/O pins)
Digital power supply for the digital I/Os in audio interface (BCLK-AD2).
AD2
GIO9
AVDD
X1
Digital I/O2
I2S/DSP audio interface data line 2 (in/out)
Configurable with PurePath™ Wireless Configurator
2.0-3.6V analog power supply connection
20
21
22
23
24
Power (Analog)
Analog I/O
Crystal oscillator pin input, or external clock input (48 MHz)
Crystal oscillator pin output (48 MHz)
X0
Analog I/O
AVDD
RF_P
Power (Analog)
RF I/O
Analog power supply connection
Positive differential RF input signal to LNA in receive mode
Positive differential RF output signal from PA in transmit mode
Negative differential RF input signal to LNA in receive mode
Negative differential RF output signal from PA in transmit mode
25
RF_N
RF I/O
7
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
PIN
26
PIN NAME
PIN TYPE
DESCRIPTION
AVDD
AVDD
AVDD
VBAT
Power (Analog)
Power (Analog)
Power (Analog)
Analog input
Analog power supply connection
Analog power supply connection
Analog power supply connection
27
28
29
Battery voltage supervisor (threshold level programmable by external resistor to positive
battery terminal)
30
31
32
RBIAS
AVDD
SCL
Analog output
Power (Analog)
Digital I/O1
External precision bias resistor for reference current. 56 k , 1%
Analog power supply connection (Guard ring AVDD connection for digital noise isolation)
I2C master clock line. Must be connected to external pull-up
General-purpose digital I/O pin 10
GIO10
SDA
33
Digital I/O1
I2C master data line. Must be connected to external pull-up
General-purpose digital I/O pin 11
GIO11
GIO12
GIO13
xPAEN
IOVDD
xLNAEN
DCPL
34
35
36
37
38
39
Digital I/O1
Digital I/O1
Digital I/O2
General-purpose digital I/O pin 12
General-purpose digital I/O pin 13
Control external PA
Power (I/O pads) Digital power supply for SCL-GIO15 pins.
Digital I/O2
Control external LNA
Power (Digital)
1.7V-1.85 V linear voltage regulator output to which a 1 uF decoupling capacitor should be
attached. For test-purposes an external digital supply voltage (1.62-1.98 V) can be applied
here, bypassing the voltage regulator.
NOTE: The voltage regulator is intended for use with the CC85xx chip only. It cannot be
used to provide supply voltage to other devices.
40
DVDD
Power (Digital)
Digital power supply for the linear voltage regulator.
1
2
Digital I/O pad with 4 mA source/sink capability.
Digital I/O pad with 20 mA source/sink capability.
8
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
2
APPLICATION CIRCUIT
2.0V-3.6V
Power Supply
C391
Antenna
(50 Ohm)
CC2590 +
Matching/
Filtering
Alternative:
CC2590 External LNA/PA
xANTM
RBIAS
1
2
3
4
5
6
7
8
9
30
29
28
27
26
25
24
23
xANTP
CSN
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
Antenna
(50 Ohm)
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
C301
L302
CC8520/30
Audio Device
C306
L303
C303
L304
C305
L301
C302
X0
X1
22
21
10 IOVDD
Figure 2 - CC8520/CC8530 Application Circuit
2.0V-3.6V
Power Supply
C391
Antenna
(50 Ohm)
CC2590 +
Matching/
Filtering
47 pF
Alternative:
CC2590 External LNA/PA
33 ohm
USB D-
USBN
USBP
CSN
RBIAS
VBAT
AVDD
AVDD
AVDD
RF_N
RF_P
AVDD
1
2
3
4
5
6
7
8
9
30
29
28
27
26
25
24
23
USB D+
33 ohm
47 pF
Antenna
(50 Ohm)
SCLK
MOSI
MISO
GIO1
GIO2
GIO3
C301
L302
CC8521/31
C306
L303
C303
L304
C305
L301
C302
X0
X1
22
21
10 IOVDD
Figure 3 - CC8521/CC8531 Application Circuit
9
Copyright ©2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
WWW.TI.COM
SWRS091D – JULY 2011
3
SYSTEM DESCRIPTION
By employing proprietary technology, referred to as PurePath Wireless, the CC85xx device family provides
robust, high-quality, short-range 2.4 GHz wireless digital audio streaming in low-cost single chip solutions.
Two or more devices form a PurePath Wireless audio network. Great care has been taken to ensure that this
audio network provides gap-less and robust audio streaming in varied environments and that it can coexist
amicably with existing wireless technologies in the crowded 2.4 GHz ISM band.
Most applications can be implemented without any software development and only require the CC85xx to be
connected to an external audio source or sink (such as an audio codec, S/PDIF interface or class-D amplifier)
and a few push buttons, switches or LED for human interaction. Advanced applications can interface a host
processor or DSP directly to the CC85xx and directly stream audio and control most aspects of device and
audio network operation. The complete list of supported audio devices can be found in the PurePath Wireless
Configurator [1].
The PurePath Wireless Configurator [1], a PC-based configuration tool, is used to set up the desired
functionality and parameters of the target system and then produces firmware images that subsequently must
be programmed into the embedded flash memory of each CC85xx.
All devices in the CC85xx family interface seamlessly with the CC2590 RF range extender device to allow for
even wider RF coverage and improved robustness in difficult environments.
4
DOCUMENT HISTORY
Revision
SWRC09D
Date
Description/Changes
July 2011
Added info on CC8521 and CC8531
March 2011
Added info on CC8530. Updated current consumption numbers
and how they are measured. Storage temperature updated. Info on
supported codecs now in PurePath Wireless Configurator.
Add RF Characteristics for CC8520+CC2590EM. Moved the
sections; Network topology, Coexistence, Audio Interface, Human
Interaction drivers and external host interface to the CC85xx
Family User’s Guide [2]. Updated pin-out table and fig 1.
First release
SWRS09C
Sept 2010
SWRS09B
SWRS09A
March 2010
5
REFERENCES
[1] PurePath™ Wireless Configurator
[2] CC85xx Family User Guide
[3] CC-Debugger
[4] CC2590 Product folder
10
Copyright ©2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jul-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CC8520RHAR
CC8520RHAT
CC8521RHAR
CC8521RHAT
CC8530RHAR
CC8530RHAT
CC8531RHAR
CC8531RHAT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
RHA
RHA
RHA
RHA
RHA
RHA
RHA
RHA
40
40
40
40
40
40
40
40
2500
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
2500
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
2500
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
2500
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jul-2011
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CC8520RHAR
CC8520RHAT
CC8521RHAR
CC8521RHAT
CC8530RHAR
CC8530RHAT
CC8531RHAR
CC8531RHAT
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
RHA
RHA
RHA
RHA
RHA
RHA
RHA
RHA
40
40
40
40
40
40
40
40
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
2500
250
2500
250
2500
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CC8520RHAR
CC8520RHAT
CC8521RHAR
CC8521RHAT
CC8530RHAR
CC8530RHAT
CC8531RHAR
CC8531RHAT
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
RHA
RHA
RHA
RHA
RHA
RHA
RHA
RHA
40
40
40
40
40
40
40
40
2500
250
333.2
333.2
333.2
333.2
333.2
333.2
333.2
333.2
345.9
345.9
345.9
345.9
345.9
345.9
345.9
345.9
28.6
28.6
28.6
28.6
28.6
28.6
28.6
28.6
2500
250
2500
250
2500
250
Pack Materials-Page 2
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