CD4009UBEE4 [TI]
CMOs Hex Buffers/Converters; CMOS六缓冲器/转换器
| 型号： | CD4009UBEE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOs Hex Buffers/Converters |
| 文件： | 总18页 (文件大小：1050K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4009UB and CD4010B types are
supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead
dual-in-line plastic packages (E suffix), 16-lead
small-outline packages (M, M96, MT, and NSR
suffixes), and 16-lead thin shink small-outline
packages (PW and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Oct-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
89264UKB3T
CD4009UBE
CD4009UBEE4
CD4009UBF
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CFP
PDIP
PDIP
CDIP
CDIP
SOIC
WR
N
16
16
16
16
16
16
TBD
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
Call TI
Call TI
25
25
1
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
N
J
A42
A42
N / A for Pkg Type
N / A for Pkg Type
CD4009UBF3A
CD4009UBM
J
1
TBD
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4009UBME4
CD4009UBMG4
CD4009UBMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
40
40
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SOIC
D
250
250
250
2000
2000
2000
Green (RoHS
& no Sb/Br)
CD4009UBMTE4
CD4009UBMTG4
CD4009UBPWR
CD4009UBPWRE4
CD4009UBPWRG4
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
PW
PW
PW
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CD4010BE
CD4010BEE4
CD4010BF
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
PDIP
CDIP
CDIP
SOIC
N
N
J
16
16
16
16
16
25
25
1
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
A42
A42
N / A for Pkg Type
N / A for Pkg Type
CD4010BF3A
CD4010BM
J
1
TBD
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4010BM96
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4010BM96E4
TBD
Call TI
Call TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Oct-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4010BM96G4
CD4010BME4
OBSOLETE
ACTIVE
SOIC
SOIC
D
D
16
16
TBD
Call TI
Call TI
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4010BMG4
CD4010BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SO
D
16
16
16
16
16
16
16
16
16
16
16
16
16
Green (RoHS
& no Sb/Br)
D
250
250
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4010BMTE4
CD4010BMTG4
CD4010BNSR
CD4010BNSRE4
CD4010BNSRG4
CD4010BPW
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
CD4010BPWE4
CD4010BPWG4
CD4010BPWR
CD4010BPWRE4
CD4010BPWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
23-Oct-2012
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4009UB, CD4009UB-MIL, CD4010B, CD4010B-MIL :
Catalog: CD4009UB, CD4010B
•
Automotive: CD4010B-Q1, CD4010B-Q1
•
Military: CD4009UB-MIL, CD4010B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4009UBPWR
CD4010BM96
CD4010BNSR
CD4010BPWR
TSSOP
SOIC
SO
PW
D
16
16
16
16
2000
2500
2000
2000
330.0
330.0
330.0
330.0
12.4
16.4
16.4
12.4
6.9
6.5
8.2
6.9
5.6
10.3
10.5
5.6
1.6
2.1
2.5
1.6
8.0
8.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
NS
PW
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4009UBPWR
CD4010BM96
CD4010BNSR
CD4010BPWR
TSSOP
SOIC
SO
PW
D
16
16
16
16
2000
2500
2000
2000
367.0
333.2
367.0
367.0
367.0
345.9
367.0
367.0
35.0
28.6
38.0
35.0
NS
PW
TSSOP
Pack Materials-Page 2
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Mouser Electronics
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Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
CD4009UBE CD4010BE CD4009UBPWR CD4010BPWR CD4009UBM96G4 CD4009UBMG4 CD4009UBMTG4
CD4009UBPWG4 CD4009UBPWRG4 CD4010BM96G4 CD4010BMG4 CD4010BMTG4 CD4010BPWG4
CD4010BPWRG4 CD4009UBNSRG4 CD4010BNSRG4 CD4009UBEE4 CD4009UBM CD4009UBM96
CD4009UBM96E4 CD4009UBME4 CD4009UBMT CD4009UBMTE4 CD4009UBNSR CD4009UBNSRE4
CD4009UBPW CD4009UBPWE4 CD4009UBPWRE4 CD4010BEE4 CD4010BM CD4010BM96 CD4010BM96E4
CD4010BME4 CD4010BMT CD4010BMTE4 CD4010BNSR CD4010BNSRE4 CD4010BPW CD4010BPWE4
CD4010BPWRE4
相关型号：
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