CD4014BPWG4 [TI]
CMOS 8-Stage Statice Shift Registers; CMOS 8级Statice移位寄存器
| 型号： | CD4014BPWG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS 8-Stage Statice Shift Registers |
| 文件： | 总29页 (文件大小：1450K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4014B and CD4021b series types are
supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead
dual-in-line plastic packages (E suffix), 16-lead
small-outline packages (M, M96, MT, and NSR
suffixes), and 16-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2010
PACKAGING INFORMATION
Orderable Device
CD4014BE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
N
16
25
25
1
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4014BEE4
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4014BF3A
CD4014BM
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
TBD
A42
N / A for Pkg Type
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4014BM96
CD4014BM96E4
CD4014BM96G4
CD4014BME4
CD4014BMG4
CD4014BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4014BMTE4
CD4014BMTG4
CD4014BPW
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
PW
PW
PW
PW
PW
PW
N
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4014BPWE4
CD4014BPWG4
CD4014BPWR
CD4014BPWRE4
CD4014BPWRG4
CD4021BE
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4021BEE4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4021BF
CD4021BF3A
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
SOIC
J
J
16
16
16
16
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4021BF3AS2283
CD4021BM
OBSOLETE
ACTIVE
J
Call TI
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4021BM96
CD4021BM96E4
CD4021BM96G4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
16
16
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2010
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
CD4021BME4
CD4021BMG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4021BMT
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4021BMTE4
CD4021BMTG4
CD4021BNSR
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
J
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4021BNSRE4
CD4021BNSRG4
CD4021BPW
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
CDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4021BPWE4
CD4021BPWG4
CD4021BPWR
CD4021BPWRE4
CD4021BPWRG4
JM38510/05754BEA
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2010
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4014BM96
CD4014BPWR
CD4021BM96
CD4021BNSR
CD4021BPWR
SOIC
TSSOP
SOIC
D
16
16
16
16
16
2500
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
16.4
12.4
16.4
16.4
12.4
6.5
7.0
6.5
8.2
7.0
10.3
5.6
2.1
1.6
2.1
2.5
1.6
8.0
8.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
PW
D
10.3
10.5
5.6
8.0
SO
NS
PW
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4014BM96
CD4014BPWR
CD4021BM96
CD4021BNSR
CD4021BPWR
SOIC
TSSOP
SOIC
D
16
16
16
16
16
2500
2000
2500
2000
2000
333.2
346.0
333.2
346.0
346.0
345.9
346.0
345.9
346.0
346.0
28.6
29.0
28.6
33.0
29.0
PW
D
SO
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4014BE
CD4014BEE4
CD4014BF3A
CD4014BM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
PDIP
CDIP
SOIC
N
N
J
16
16
16
16
25
25
1
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
A42
N / A for Pkg Type
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4014BM96
CD4014BM96E4
CD4014BM96G4
CD4014BME4
CD4014BMG4
CD4014BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500
2500
2500
40
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
250
250
250
90
Green (RoHS
& no Sb/Br)
CD4014BMTE4
CD4014BMTG4
CD4014BPW
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
CD4014BPWE4
CD4014BPWG4
CD4014BPWR
CD4014BPWRE4
CD4014BPWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4021BE
CD4021BEE4
CD4021BF
ACTIVE
ACTIVE
PDIP
PDIP
CDIP
CDIP
CDIP
SOIC
N
N
J
16
16
16
16
16
16
25
25
1
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
ACTIVE
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4021BF3A
CD4021BF3AS2283
CD4021BM
ACTIVE
J
1
TBD
OBSOLETE
ACTIVE
J
TBD
Call TI
D
40
2500
2500
2500
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4021BM96
CD4021BM96E4
CD4021BM96G4
CD4021BME4
CD4021BMG4
CD4021BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
250
250
250
90
Green (RoHS
& no Sb/Br)
CD4021BMTE4
CD4021BMTG4
CD4021BPW
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
CD4021BPWE4
CD4021BPWG4
CD4021BPWR
CD4021BPWRE4
CD4021BPWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
JM38510/05754BEA
M38510/05754BEA
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4014B, CD4014B-MIL, CD4021B, CD4021B-MIL :
Catalog: CD4014B, CD4021B
•
Automotive: CD4021B-Q1, CD4021B-Q1
•
Military: CD4014B-MIL, CD4021B-MIL
•
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
•
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4014BM96
CD4014BPWR
CD4021BM96
CD4021BPWR
SOIC
TSSOP
SOIC
D
PW
D
16
16
16
16
2500
2000
2500
2000
330.0
330.0
330.0
330.0
16.4
12.4
16.4
12.4
6.5
6.9
6.5
6.9
10.3
5.6
2.1
1.6
2.1
1.6
8.0
8.0
8.0
8.0
16.0
12.0
16.0
12.0
Q1
Q1
Q1
Q1
10.3
5.6
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4014BM96
CD4014BPWR
CD4021BM96
CD4021BPWR
SOIC
TSSOP
SOIC
D
PW
D
16
16
16
16
2500
2000
2500
2000
333.2
367.0
333.2
367.0
345.9
367.0
345.9
367.0
28.6
35.0
28.6
35.0
TSSOP
PW
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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