CD40193BEE4 [TI]

CMOS Pressettable Up/Down Counters; CMOS Pressettable加/减计数器
CD40193BEE4
型号: CD40193BEE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CMOS Pressettable Up/Down Counters
CMOS Pressettable加/减计数器

计数器
文件: 总16页 (文件大小:1112K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
The CD40192B and CD40193B types are  
supplied in 16-lead hermetic dual-in-line  
ceramic packages (F3A suffix), 16-lead  
dual-in-line plastic packages (E suffix),  
16-leadsmall-outlinepackages(NSRsuffix),  
and 16-lead thin shrink small-outline  
packages (PW and PWR suffixes).  
Copyright 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
PACKAGING INFORMATION  
Orderable Device  
CD40192BE  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
PDIP  
PDIP  
N
16  
16  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
-55 to 125 CD40192BE  
CD40192BEE4  
ACTIVE  
N
Pb-Free  
(RoHS)  
N / A for Pkg Type  
-55 to 125 CD40192BE  
CD40192BF  
CD40192BF3A  
CD40192BNSR  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SO  
J
J
16  
16  
16  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
-55 to 125 CD40192BF  
-55 to 125 CD40192BF3A  
-55 to 125 CD40192B  
TBD  
NS  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CD40192BNSRE4  
CD40192BNSRG4  
CD40193BE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
N
16  
16  
16  
16  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125 CD40192B  
-55 to 125 CD40192B  
-55 to 125 CD40193BE  
-55 to 125 CD40193BE  
Green (RoHS  
& no Sb/Br)  
PDIP  
PDIP  
Pb-Free  
(RoHS)  
CD40193BEE4  
N
25  
Pb-Free  
(RoHS)  
CD40193BF3A  
CD40193BNSR  
ACTIVE  
ACTIVE  
CDIP  
SO  
J
16  
16  
1
TBD  
A42  
N / A for Pkg Type  
-55 to 125 CD40193BF3A  
-55 to 125 CD40193B  
NS  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
CD40193BNSRE4  
CD40193BNSRG4  
CD40193BPW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
NS  
16  
16  
16  
16  
16  
16  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-55 to 125 CD40193B  
-55 to 125 CD40193B  
-55 to 125 CM0193B  
-55 to 125 CM0193B  
-55 to 125 CM0193B  
-55 to 125 CM0193B  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
Green (RoHS  
& no Sb/Br)  
CD40193BPWE4  
CD40193BPWG4  
CD40193BPWR  
90  
Green (RoHS  
& no Sb/Br)  
90  
Green (RoHS  
& no Sb/Br)  
2000  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
CD40193BPWRE4  
CD40193BPWRG4  
ACTIVE  
TSSOP  
TSSOP  
PW  
16  
16  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
-55 to 125 CM0193B  
-55 to 125 CM0193B  
ACTIVE  
PW  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF CD40192B, CD40192B-MIL, CD40193B, CD40193B-MIL :  
Catalog: CD40192B, CD40193B  
Military: CD40192B-MIL, CD40193B-MIL  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Apr-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD40193BNSR  
CD40193BPWR  
SO  
NS  
16  
16  
2000  
2000  
330.0  
330.0  
16.4  
12.4  
8.2  
6.9  
10.5  
5.6  
2.5  
1.6  
12.0  
8.0  
16.0  
12.0  
Q1  
Q1  
TSSOP  
PW  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Apr-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD40193BNSR  
CD40193BPWR  
SO  
NS  
16  
16  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
38.0  
35.0  
TSSOP  
PW  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
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