CD4041UB-MIL [TI]
CMOS 四原码/补码缓冲器;
| 型号： | CD4041UB-MIL |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS 四原码/补码缓冲器 栅 栅极 |
| 文件： | 总14页 (文件大小：855K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4041UB types are supplied in 14-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic packages
(E suffix), 14-lead small-outline packages (M,
MT, M96, and NSR suffixes), and 14-lead thin
shrink small-outline packages (PW and PWR
suffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
CD4041UBE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4041UBEE4
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4041UBF
CD4041UBF3A
CD4041UBM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4041UBM96
CD4041UBM96E4
CD4041UBM96G4
CD4041UBME4
CD4041UBMG4
CD4041UBMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4041UBMTE4
CD4041UBMTG4
CD4041UBPW
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4041UBPWE4
CD4041UBPWG4
CD4041UBPWR
CD4041UBPWRE4
CD4041UBPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4041UBM96
CD4041UBMT
CD4041UBPWR
SOIC
SOIC
D
D
14
14
14
2500
250
330.0
330.0
330.0
16.4
16.4
12.4
6.5
6.5
6.9
9.0
9.0
5.6
2.1
2.1
1.6
8.0
8.0
8.0
16.0
16.0
12.0
Q1
Q1
Q1
TSSOP
PW
2000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4041UBM96
CD4041UBMT
CD4041UBPWR
SOIC
SOIC
D
D
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
35.0
TSSOP
PW
2000
Pack Materials-Page 2
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