CD4048BE [TI]

CMOS Multifunction Expandable 8-Input Gate; CMOS多功能EXPANDABLE 8输入门
CD4048BE
型号: CD4048BE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CMOS Multifunction Expandable 8-Input Gate
CMOS多功能EXPANDABLE 8输入门

逻辑集成电路 栅
文件: 总12页 (文件大小:544K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
In addition to the eight input lines, an EXPAND  
input is provided that permits the user to  
increase the number of inputs into a CD4048B  
(see Fig. 2). For example, two CD4048Bs can be  
cascaded to provide a 16-input multifunction  
gate. When the EXPAND input is not used, it  
should be connected to V  
.
SS  
The CD4048B-series types are supplied in  
16-lead hermetic dual-in-line ceramic packages  
(F3A suffix), 16-lead dual-in-line  
plastic  
packages (E suffix), 16-lead small-outline  
packages (M, M96, MT, and NSR suffixes), and  
16-lead thin shrink small-outline packages (PW  
and PWR suffixes).  
Copyright 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
CD4048BE  
ACTIVE  
PDIP  
N
16  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4048BF3A  
CD4048BM  
ACTIVE  
ACTIVE  
CDIP  
SOIC  
J
16  
16  
1
None  
Call TI Level-NC-NC-NC  
D
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
CD4048BM96  
CD4048BMT  
CD4048BNSR  
CD4048BPW  
CD4048BPWR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
16  
16  
16  
16  
16  
2500  
250  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
D
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SO  
NS  
PW  
PW  
2000  
90  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
TSSOP  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
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information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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