CD4054BM96E4 [TI]
CMOS Lquid-Crystal Display Drivers; CMOS Lquid液晶显示驱动器
| 型号： | CD4054BM96E4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS Lquid-Crystal Display Drivers |
| 文件： | 总18页 (文件大小：1002K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4054B-, CD4055B-, and CD4056B-series
types are supplied in 16-lead dual-in-line plastic
packages (E suffix), 16-lead small-outline
packages (M, M96, MT, and NSR suffixes), and
16-lead thin shrink small-outline packages (PW
and PWR suffixes). The CD4054B- and
CD4056B-series types also are supplied in 16-lead
hermetic dual-in-line ceramic packages (F3A
suffix).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4054BE
ACTIVE
ACTIVE
PDIP
PDIP
N
N
16
16
25
25
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD4054BEE4
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD4054BF3A
CD4054BM
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
Purchase Samples
Purchase Samples
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CD4054BM96
CD4054BM96E4
CD4054BM96G4
CD4054BME4
CD4054BMG4
CD4054BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
TSSOP
TSSOP
TSSOP
PDIP
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
2500
2500
2500
40
Green (RoHS
& no Sb/Br)
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
40
Green (RoHS
& no Sb/Br)
D
250
250
250
90
Green (RoHS
& no Sb/Br)
CD4054BMTE4
CD4054BMTG4
CD4054BPW
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
PW
PW
PW
N
Green (RoHS
& no Sb/Br)
CD4054BPWE4
CD4054BPWG4
CD4055BE
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
25
Pb-Free (RoHS)
Contact TI Distributor
or Sales Office
CD4055BEE4
PDIP
N
25
Pb-Free (RoHS)
Contact TI Distributor
or Sales Office
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4055BM
CD4055BME4
CD4055BMG4
CD4055BMT
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
250
250
250
90
Green (RoHS
& no Sb/Br)
CD4055BMTE4
CD4055BMTG4
CD4055BPW
CD4055BPWE4
CD4055BPWG4
CD4056BE
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
PDIP
PW
PW
PW
N
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
25
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
Contact TI Distributor
or Sales Office
CD4056BEE4
PDIP
N
25
Contact TI Distributor
or Sales Office
CD4056BF3A
CD4056BM
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
Purchase Samples
Purchase Samples
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4056BM96
CD4056BM96E4
CD4056BM96G4
CD4056BME4
CD4056BMG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
16
16
16
16
16
2500
2500
2500
40
Green (RoHS
& no Sb/Br)
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4056BMT
CD4056BMTE4
CD4056BMTG4
CD4056BPW
SOIC
SOIC
D
16
16
16
16
16
16
16
16
16
250
250
250
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
D
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
CD4056BPWE4
CD4056BPWG4
CD4056BPWR
CD4056BPWRE4
CD4056BPWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4054B, CD4054B-MIL, CD4056B, CD4056B-MIL :
Catalog: CD4054B, CD4056B
•
Military: CD4054B-MIL, CD4056B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4054BM96
CD4056BM96
CD4056BPWR
SOIC
SOIC
D
D
16
16
16
2500
2500
2000
330.0
330.0
330.0
16.4
16.4
12.4
6.5
6.5
6.9
10.3
10.3
5.6
2.1
2.1
1.6
8.0
8.0
8.0
16.0
16.0
12.0
Q1
Q1
Q1
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4054BM96
CD4056BM96
CD4056BPWR
SOIC
SOIC
D
D
16
16
16
2500
2500
2000
333.2
333.2
367.0
345.9
345.9
367.0
28.6
28.6
35.0
TSSOP
PW
Pack Materials-Page 2
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