CD4067BPWRG4 [TI]
16-CHANNEL, SGL ENDED MULTIPLEXER, PDSO24, GREEN, PLASTIC, TSSOP-24;
| 型号： | CD4067BPWRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-CHANNEL, SGL ENDED MULTIPLEXER, PDSO24, GREEN, PLASTIC, TSSOP-24 光电二极管 |
| 文件： | 总17页 (文件大小：1065K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4067B and CD4097B types are supplied
in 24-lead hermetic dual-in-line ceramic
packages (F3A suffix), 24-lead dual-in-line
plastic
packages
(E
suffix),
24-lead
small-outline packages (M, M96, and NSR
suffixes), and 24-lead thin shrink small-outline
packages (P and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
CD4067BE
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
PDIP
PDIP
N
24
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4067BE
CD4067BEE4
ACTIVE
N
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4067BE
CD4067BF
CD4067BF3A
CD4067BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
24
24
24
1
1
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
CD4067BF
CD4067BF3A
CD4067BM
TBD
DW
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CD4067BM96
CD4067BM96E4
CD4067BM96G4
CD4067BME4
CD4067BPW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
DW
DW
PW
PW
N
24
24
24
24
24
24
24
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4067BM
CD4067BM
CD4067BM
CD4067BM
CM067B
Green (RoHS
& no Sb/Br)
SOIC
Green (RoHS
& no Sb/Br)
SOIC
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
PDIP
60
Green (RoHS
& no Sb/Br)
CD4067BPWG4
CD4097BE
60
Green (RoHS
& no Sb/Br)
CM067B
15
Pb-Free
(RoHS)
CD4097BE
CD4097BF
CD4097BM
ACTIVE
ACTIVE
CDIP
SOIC
J
24
24
1
TBD
Call TI
N / A for Pkg Type
-55 to 125
-55 to 125
CD4097BF
CD4097BM
DW
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4097BME4
CD4097BMG4
CD4097BPW
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
PW
24
24
24
25
25
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
CD4097BM
CD4097BM
CM097B
Green (RoHS
& no Sb/Br)
TSSOP
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
CD4097BPWR
ACTIVE
TSSOP
TSSOP
PW
24
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CM097B
CM097B
CD4097BPWRE4
ACTIVE
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
OTHER QUALIFIED VERSIONS OF CD4067B, CD4067B-MIL, CD4097B, CD4097B-MIL :
Catalog: CD4067B, CD4097B
•
Military: CD4067B-MIL, CD4097B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4067BM96
CD4067BM96G4
CD4097BPWR
SOIC
SOIC
DW
DW
PW
24
24
24
2000
2000
2000
330.0
330.0
330.0
24.4
24.4
16.4
10.75 15.7
10.75 15.7
2.7
2.7
1.6
12.0
12.0
8.0
24.0
24.0
16.0
Q1
Q1
Q1
TSSOP
6.95
8.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4067BM96
CD4067BM96G4
CD4097BPWR
SOIC
SOIC
DW
DW
PW
24
24
24
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
38.0
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
12
1
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.090 (2,29)
0.060 (1,53)
0.175 (4,45)
0.140 (3,56)
A
Seating Plane
0.018 (0,46) MIN
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
24
28
32
40
PINS **
DIM
”A”
NARR
WIDE
NARR
WIDE
NARR
WIDE
NARR
WIDE
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
MAX
MIN
MAX
MIN
”B”
”C”
MAX
MIN
4040084/C 10/97
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.020 (0,51) MIN
0.610 (15,49)
0.590 (14,99)
Seating Plane
0.100 (2,54)
0.125 (3,18) MIN
0.010 (0,25) NOM
0°–15°
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
PINS **
M
24
28
32
40
48
52
DIM
1.270
1.450
1.650
2.090
2.450
2.650
A MAX
(32,26) (36,83) (41,91) (53,09) (62,23) (67,31)
1.230
1.410
1.610
2.040
2.390
2.590
A MIN
(31,24) (35,81) (40,89) (51,82) (60,71) (65,79)
4040053/B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-011
D. Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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