CD4069UBMTE4 [TI]
CMOS Hex Inverter; CMOS六反相器
| 型号： | CD4069UBMTE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS Hex Inverter |
| 文件： | 总16页 (文件大小：940K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4069UB-Series types are supplied in
14-leadhermetic dual-in-line ceramicpackages
(F3A suffix), 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline
packages (M, MT, M96, and NSR suffixes), and
14-lead thin shrink small-outline packages (PW
and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
PACKAGING INFORMATION
Orderable Device
CD4069UBE
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
ACTIVE
PDIP
PDIP
N
14
14
25
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
-55 to 125 CD4069UBE
CD4069UBEE4
ACTIVE
N
Pb-Free
(RoHS)
N / A for Pkg Type
-55 to 125 CD4069UBE
CD4069UBF
CD4069UBF3A
CD4069UBM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125 CD4069UBF
-55 to 125 CD4069UBF3A
-55 to 125 CD4069UBM
TBD
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CD4069UBM96
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Call TI
-55 to 125 CD4069UBM
-55 to 125
CD4069UBM96E4
TBD
CD4069UBM96G4
CD4069UBME4
OBSOLETE
ACTIVE
SOIC
SOIC
D
D
14
14
TBD
Call TI
Call TI
-55 to 125 CD4069UBM
-55 to 125 CD4069UBM
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4069UBMG4
CD4069UBMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125 CD4069UBM
-55 to 125 CD4069UBM
-55 to 125 CD4069UBM
-55 to 125 CD4069UBM
-55 to 125 CD4069UB
-55 to 125 CD4069UB
-55 to 125 CD4069UB
-55 to 125 CM069UB
-55 to 125 CM069UB
250
250
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4069UBMTE4
CD4069UBMTG4
CD4069UBNSR
CD4069UBNSRE4
CD4069UBNSRG4
CD4069UBPW
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
NS
PW
PW
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
CD4069UBPWE4
90
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
CD4069UBPWG4
CD4069UBPWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
CDIP
PW
PW
PW
PW
J
14
14
14
14
14
14
90
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
A42
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-55 to 125 CM069UB
-55 to 125 CM069UB
-55 to 125 CM069UB
-55 to 125 CM069UB
Green (RoHS
& no Sb/Br)
CD4069UBPWRE4
CD4069UBPWRG4
JM38510/17401BCA
M38510/17401BCA
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
-55 to 125 JM38510/
17401BCA
CDIP
J
1
TBD
A42
N / A for Pkg Type
-55 to 125 JM38510/
17401BCA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4069UB, CD4069UB-MIL :
Catalog: CD4069UB
•
Military: CD4069UB-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4069UBM96
CD4069UBMT
CD4069UBNSR
CD4069UBPWR
SOIC
SOIC
SO
D
D
14
14
14
14
2500
250
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
6.5
6.5
8.2
6.9
9.0
9.0
2.1
2.1
2.5
1.6
8.0
8.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
NS
PW
2000
2000
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4069UBM96
CD4069UBMT
CD4069UBNSR
CD4069UBPWR
SOIC
SOIC
SO
D
D
14
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
35.0
NS
PW
2000
2000
TSSOP
Pack Materials-Page 2
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