CD4070BPWG4 [TI]
CMOS Quad Exclusive-OR and Exclusive-NOR Gate; CMOS四路异或及异或非门
| 型号： | CD4070BPWG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS Quad Exclusive-OR and Exclusive-NOR Gate |
| 文件： | 总30页 (文件大小：1223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD4070B,
CD4077B
Data sheet acquired from Harris Semiconductor
SCHS055E
CMOS Quad Exclusive-OR
and Exclusive-NOR Gate
January 1998 - Revised September 2003
Features
Ordering Information
• High-Voltage Types (20V Rating)
• CD4070B - Quad Exclusive-OR Gate
• CD4077B - Quad Exclusive-NOR Gate
• Medium Speed Operation
TEMP. RANGE
o
PART NUMBER
CD4070BE
( C)
PACKAGE
14 Ld PDIP
[ /Title
(CD40
70B,
CD407
7B)
/Sub-
ject
(CMO
SQuad
Exclu-
sive-
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4070BF3A
CD4070BM
14 Ld CERDIP
14 Ld SOIC
14 Ld SOIC
14 Ld SOIC
14 Ld SOP
- t
, t
PHL PLH
= 65ns (Typ) at V = 10V, C = 50pF
DD L
• 100% Tested for Quiescent Current at 20V
• Standardized Symmetrical Output Characteristics
• 5V, 10V and 15V Parametric Ratings
CD4070BMT
CD4070BM96
CD4070BNSR
CD4070BPW
CD4070BPWR
CD4077BE
• Maximum Input Current of 1µA at 18V Over Full
Package Temperature Range
o
- 100nA at 18V and 25 C
14 Ld TSSOP
14 Ld TSSOP
14 Ld PDIP
14 Ld CERDIP
14 Ld SOIC
14 Ld SOIC
14 Ld SOIC
14 Ld SOP
• Noise Margin (Over Full Package Temperature Range)
OR
and
- 1V at V
DD
= 5V, 2V at V
DD
= 10V, 2.5V at V
= 15V
DD
• Meets All Requirements of JEDEC Standard No. 13B,
“Standard Specifications for Description of ‘B’ Series
CMOS Devices
Exclu-
sive-
NOR
Gate)
/Autho
r ()
/Key-
words
(Har-
ris
Semi-
con-
CD4077BF3A
CD4077BM
Applications
CD4077BMT
CD4077BM96
CD4077BNSR
CD4077BPW
CD4077BPWR
• Logical Comparators
• Adders/Subtractors
• Parity Generators and Checkers
14 Ld TSSOP
14 Ld TSSOP
Description
The Harris CD4070B contains four independent Exclusive-
OR gates. The Harris CD4077B contains four independent
Exclusive-NOR gates.
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
ductor,
CD400
0,
The CD4070B and CD4077B provide the system designer
with a means for direct implementation of the Exclusive-OR
and Exclusive-NOR functions, respectively.
metal
gate,
CMOS
, pdip,
cerdip,
mil,
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
CD4070B, CD4077B
Pinouts
CD4070B
(PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW
CD4077B
(PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW
A
B
B
D
C
D
1
2
3
4
5
6
7
14
13
12
V
A
B
B
D
C
D
1
2
3
4
5
6
7
14
13
12
V
DD
DD
H
G
H
G
J = A
K = C
J = A
11 M = G
10 L = E
H
K = C
11 M = G
10 L = E
H
F
F
9
8
F
E
9
8
F
E
V
V
SS
SS
Functional Diagrams
CD4070B
CD4077B
1
1
2
A
3
4
A
B
3
J
2
J
B
J = A
B
D
J = A
K = C
B
5
6
C
5
6
K =
C
D
C
D
4
D
K
L
K
L
M = G
L = E
H
F
8
9
8
9
E
F
M = G
L = E
H
F
10
11
E
F
10
11
V
V
= 7
= 14
SS
DD
12
13
12
13
G
H
G
H
M
M
2
CD4070B, CD4077B
V
DD
V
DD
V
DD
p
n
V
DD
p
B †
p
B †
n
2(5,9,12)
p
n
V
n
2(5,9,12)
n
V
p
SS
DD
p
p
SS
DD
J
V
p
p
J
V
p
p
n
3(4,10,11)
n
A †
3(4,10,11)
n
A †
1(6,8,13)
n
n
1(6,8,13)
n
V
SS
V
SS
V
V
DD
DD
V
V
SS
SS
† INPUTS PROTECTED
BY CMOS PROTECTION
NETWORK
† INPUTS PROTECTED
BY CMOS PROTECTION
NETWORK
V
V
SS
SS
FIGURE 1. SCHEMATIC DIAGRAM FOR CD4070B
(1 OF 4 IDENTICAL GATES)
FIGURE 2. SCHEMATIC DIAGRAM FOR CD4077B
(1 OF 4 IDENTICAL GATES)
CD4070B TRUTH TABLE (1 OF 4 GATES)
CD4077B TRUTH TABLE (1 OF 4 GATES)
A
0
1
0
1
B
0
0
1
1
J
0
1
1
0
A
B
0
0
1
1
J
1
0
0
1
0
1
0
1
NOTE:
NOTE:
1 = High Level
0 = Low Level
1 = High Level
0 = Low Level
J = A
B
J = A
B
3
CD4070B, CD4077B
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage Range (V ) . . . . . . . . . . . . . . . . . -0.5V to 20V
DD
Package Thermal Impedance, θ (see Note 1):
JA
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80 C/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86 C/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 C/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 113 C/W
Maximum Junction Temperature (Hermetic Package or Die) . 175 C
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
o
Input Voltage Range, All Inputs . . . . . . . . . . . . . . -0.5V to V
0.5V
DD
o
DC Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 10mA
o
o
Operating Conditions
o
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
o
Supply Voltage Range (Typical) . . . . . . . . . . . . . . . . . . . . 3V to 18V
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
o
LIMITS AT INDICATED TEMPERATURES ( C)
CONDITIONS
25
V
V
V
DD
O
IN
PARAMETER
(V)
(V)
0, 5
0, 10
0, 15
0, 20
0, 5
0, 10
0, 15
0, 5
0, 5
0, 10
0, 15
0, 5
0, 10
0, 15
0, 5
0, 10
0, 15
-
(V)
-55
0.25
0.5
1
-40
0.25
0.5
1
85
7.5
15
125
7.5
MIN
TYP
0.01
0.01
0.01
0.02
1
MAX
UNITS
µA
µA
µA
µA
mA
mA
mA
mA
mA
mA
mA
V
Quiescent Device Current
-
5
-
0.25
I
Max
DD
-
10
15
20
5
15
-
0.5
-
30
30
-
-
1
-
5
5
150
0.42
1.1
2.8
-0.42
-1.3
-1.1
-2.8
0.05
0.05
0.05
4.95
9.95
14.95
1.5
3
150
0.36
0.9
5
Output Low (Sink) Current
Min
0.4
0.64
1.6
4.2
-0.64
-2
0.61
1.5
4
0.51
1.3
3.4
-0.51
-1.6
-1.3
-3.4
-
-
I
OL
0.5
10
15
5
2.6
6.8
-1
-
1.5
2.4
-
Output High (Source) Current
Min
4.6
-0.61
-1.8
-1.5
-4
-0.36
-1.15
-0.9
-2.4
0.05
0.05
0.05
4.95
9.95
14.95
1.5
-
I
OH
2.5
5
-3.2
-2.6
-6.8
0
-
9.5
10
15
5
-1.6
-4.2
0.05
0.05
0.05
4.95
9.95
14.95
1.5
3
-
13.5
-
Output Voltage: Low Level,
Max
-
0.05
0.05
0.05
4.95
9.95
14.95
1.5
3
0.05
V
OL
-
10
15
5
-
0
0.05
V
-
-
0
0.05
V
Output Voltage: High Level,
Min
-
4.95
9.95
14.95
-
5
-
V
V
OH
-
-
10
15
5
10
15
-
-
V
-
V
Input Low Voltage,
Max
0.5, 4.5
1, 9
1.5
V
V
IL
-
10
15
5
3
-
-
3
V
1.5, 13.5
0.5, 4.5
1, 9
-
4
4
4
4
-
-
4
V
Input High Voltage,
Min
-
3.5
7
3.5
7
3.5
7
3.5
3.5
7
-
-
V
V
IH
-
10
15
18
7
-
-
-
V
1.5, 13.5
-
-
11
11
11
11
11
-
-
V
-5
±10
Input Current, I Max
IN
0, 18
±0.1
±0.1
±1
±1
±0.1
µA
4
CD4070B, CD4077B
o
AC Electrical Specifications
T = 25 C, Input t , t = 20ns, C = 50pF, R = 200kΩ
A
r
f
L
L
TEST CONDITIONS
LIMITS ON ALL TYPES
PARAMETER
SYMBOL
V
(V)
TYP
140
65
MAX
280
130
100
200
100
80
UNITS
ns
DD
Propagation Delay Time
t
, t
PHL PLH
5
10
15
5
ns
50
ns
Transition Time
t
, t
THL TLH
100
50
ns
10
15
ns
40
ns
Input Capacitance
C
Any Input
5
7.5
pF
IN
Typical Performance Curves
o
o
T
= 25 C
T = 25 C
A
A
30
25
20
15
10
5
GATE TO SOURCE VOLTAGE (V ) = 15V
GS
15
12.5
10
GATE TO SOURCE VOLTAGE (V ) = 15V
GS
10V
10V
7.5
5
5V
5V
2.5
0
0
0
0
5
10
15
5
10
15
V
, DRAIN TO SOURCE VOLTAGE (V)
V , DRAIN TO SOURCE VOLTAGE (V)
DS
DS
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
-15
-10
-5
0
-15
-10
-5
0
0
0
o
o
T
= 25 C
A
T
= 25 C
A
-5
GATE TO SOURCE VOLTAGE (V ) = -5V
GS
GATE TO SOURCE VOLTAGE (V ) = -5V
GS
-10
-15
-20
-25
-30
-5
-10V
-10V
-10
-15
-15V
-15V
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
5
Typical Performance Curves (Continued)
o
T
= 25 C
A
o
T
= 25 C
A
300
200
100
0
200
150
100
50
SUPPLY VOLTAGE (V ) = 5V
DD
SUPPLY VOLTAGE (V ) = 5V
DD
10V
10V
15V
15V
0
0
20
40
60
80
100
0
20
40
60
80
100
110
C , LOAD CAPACITANCE (pF)
C , LOAD CAPACITANCE (pF)
L
L
FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
5
10
o
o
T
= 25 C
T
= 25 C
A
A
LOAD CAPACITANCE C = 50pF
L
4
3
2
10
10
10
300
200
100
0
10V
C
= 50pF
L
10V
= 15pF
C
L
10
1
5V
-1
10
-1
2
3
4
0
5
10
15
20
10
1
10
10
10
10
V
, SUPPLY VOLTAGE (V)
f , INPUT FREQUENCY (kHz)
DD
I
FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF SUPPLY VOLTAGE
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT FREQUENCY
6
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
CD4070BE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4070BEE4
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4070BF
CD4070BF3A
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
SOIC
J
J
14
14
14
14
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4070BF3AS2534
CD4070BM
OBSOLETE
ACTIVE
J
Call TI
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4070BM96
CD4070BM96E4
CD4070BM96G4
CD4070BME4
CD4070BMG4
CD4070BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4070BMTE4
CD4070BMTG4
CD4070BNSR
CD4070BNSRE4
CD4070BNSRG4
CD4070BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4070BPWE4
CD4070BPWG4
CD4070BPWR
CD4070BPWRE4
CD4070BPWRG4
CD4077BE
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4077BEE4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4077BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
CD4077BF3A
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
CD4077BM
CD4077BM96
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4077BM96E4
CD4077BM96G4
CD4077BME4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4077BMG4
CD4077BMT
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4077BMTE4
CD4077BMTG4
CD4077BNSR
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
J
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4077BNSRE4
CD4077BNSRG4
CD4077BPW
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
CDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4077BPWE4
CD4077BPWG4
CD4077BPWR
CD4077BPWRE4
CD4077BPWRG4
JM38510/17203BCA
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CD4070BM96
CD4070BNSR
CD4070BPWR
CD4077BM96
CD4077BNSR
CD4077BPWR
SOIC
SO
D
14
14
14
14
14
14
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
16.4
16.4
12.4
6.5
8.2
7.0
6.5
8.2
7.0
9.0
10.5
5.6
2.1
2.5
1.6
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
TSSOP
SOIC
SO
9.0
8.0
NS
PW
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4070BM96
CD4070BNSR
CD4070BPWR
CD4077BM96
CD4077BNSR
CD4077BPWR
SOIC
SO
D
14
14
14
14
14
14
2500
2000
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
29.0
33.0
33.0
29.0
NS
PW
D
TSSOP
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4070BE
CD4070BEE4
CD4070BF
ACTIVE
ACTIVE
PDIP
PDIP
CDIP
CDIP
CDIP
SOIC
N
N
J
14
14
14
14
14
14
25
25
1
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
ACTIVE
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4070BF3A
CD4070BF3AS2534
CD4070BM
ACTIVE
J
1
TBD
OBSOLETE
ACTIVE
J
TBD
Call TI
D
50
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4070BM96
CD4070BM96E4
CD4070BM96G4
CD4070BME4
CD4070BMG4
CD4070BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
250
250
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4070BMTE4
CD4070BMTG4
CD4070BNSR
CD4070BNSRE4
CD4070BNSRG4
CD4070BPW
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
NS
PW
PW
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
CD4070BPWE4
90
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4070BPWG4
CD4070BPWR
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
14
14
14
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRE4
CD4070BPWRG4
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CD4077BE
CD4077BEE4
CD4077BF
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
PDIP
CDIP
CDIP
SOIC
N
N
J
14
14
14
14
14
25
25
1
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
A42
A42
N / A for Pkg Type
N / A for Pkg Type
CD4077BF3A
CD4077BM
J
1
TBD
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4077BM96
CD4077BM96E4
CD4077BM96G4
CD4077BME4
CD4077BMG4
CD4077BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
250
250
250
2000
2000
Green (RoHS
& no Sb/Br)
CD4077BMTE4
CD4077BMTG4
CD4077BNSR
CD4077BNSRE4
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CD4077BNSRG4
CD4077BPW
SO
NS
PW
PW
PW
14
14
14
14
2000
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CD4077BPWE4
CD4077BPWG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
JM38510/17203BCA
M38510/17203BCA
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4070B, CD4070B-MIL, CD4077B, CD4077B-MIL :
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Catalog: CD4070B, CD4077B
•
Military: CD4070B-MIL, CD4077B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4070BM96
CD4070BMT
CD4070BNSR
CD4070BPWR
CD4077BM96
CD4077BMT
CD4077BNSR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
6.5
6.5
8.2
6.9
6.5
6.5
8.2
9.0
9.0
2.1
2.1
2.5
1.6
2.1
2.1
2.5
8.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
2000
2000
2500
250
10.5
5.6
12.0
8.0
TSSOP
SOIC
SOIC
SO
9.0
8.0
D
9.0
8.0
NS
2000
10.5
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4070BM96
CD4070BMT
CD4070BNSR
CD4070BPWR
CD4077BM96
CD4077BMT
CD4077BNSR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
2000
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明