CD4072BMG4 [TI]
4000/14000/40000 SERIES, DUAL 4-INPUT OR GATE, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14;
| 型号： | CD4072BMG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4000/14000/40000 SERIES, DUAL 4-INPUT OR GATE, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14 栅 输入元件 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总30页 (文件大小：1422K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD4071B Quad 2-Input OR Gate
CD4072B Dual 4-Input OR Gate
CD4075B Triple 3-Input OR Gate
CD4071B, CD4072B, and CD4075B
OR gates provide the system designer with
direct implementation of the positive-logic OR
function and supplement the existing family of
CMOS gates.
The CD4071B, CD4072B, and CD4075B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
PDIP
Drawing
7706002CA
CD4071BE
ACTIVE
ACTIVE
J
14
14
1
TBD
A42
N / A for Pkg Type
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4071BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4071BF
CD4071BF3A
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
SOIC
J
J
14
14
14
14
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4071BF3AS2534
CD4071BM
OBSOLETE
ACTIVE
J
Call TI
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4071BM96
CD4071BM96E4
CD4071BM96G4
CD4071BME4
CD4071BMG4
CD4071BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4071BMTE4
CD4071BMTG4
CD4071BNSR
CD4071BNSRE4
CD4071BNSRG4
CD4071BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4071BPWE4
CD4071BPWG4
CD4071BPWR
CD4071BPWRE4
CD4071BPWRG4
CD4072BE
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
25
1
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4072BEE4
CD4072BF
PDIP
N
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CDIP
J
TBD
A42
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
SOIC
Drawing
CD4072BF3A
CD4072BM
ACTIVE
ACTIVE
J
14
14
1
TBD
A42
N / A for Pkg Type
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BM96
CD4072BM96E4
CD4072BM96G4
CD4072BME4
CD4072BMG4
CD4072BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BMTE4
CD4072BMTG4
CD4072BNSR
CD4072BNSRE4
CD4072BNSRG4
CD4072BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
PDIP
PDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPWE4
CD4072BPWG4
CD4075BE
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4075BEE4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4075BF
CD4075BF3A
CD4075BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BM96
CD4075BM96E4
CD4075BM96G4
CD4075BME4
CD4075BMG4
CD4075BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
CD4075BMTE4
CD4075BMTG4
CD4075BNSR
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SO
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BNSRE4
CD4075BNSRG4
CD4075BPW
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPWE4
CD4075BPWG4
CD4075BPWR
CD4075BPWRE4
CD4075BPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
JM38510/17101BCA
JM38510/17103BCA
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4071BM96
CD4071BNSR
CD4071BPWR
CD4072BM96
CD4072BNSR
CD4075BM96
CD4075BNSR
CD4075BPWR
SOIC
SO
D
NS
PW
D
14
14
14
14
14
14
14
14
2500
2000
2000
2500
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
16.4
16.4
16.4
16.4
12.4
6.5
8.2
7.0
6.5
8.2
6.5
8.2
7.0
9.0
10.5
5.6
2.1
2.5
1.6
2.1
2.5
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
16.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
SOIC
SO
9.0
8.0
NS
D
10.5
9.0
12.0
8.0
SOIC
SO
NS
PW
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4071BM96
CD4071BNSR
CD4071BPWR
CD4072BM96
CD4072BNSR
CD4075BM96
CD4075BNSR
CD4075BPWR
SOIC
SO
D
NS
PW
D
14
14
14
14
14
14
14
14
2500
2000
2000
2500
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
29.0
33.0
33.0
33.0
33.0
29.0
TSSOP
SOIC
SO
NS
D
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
7706002CA
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
CDIP
PDIP
PDIP
J
14
14
14
1
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
7706002CA
CD4072BF3A
CD4071BE
ACTIVE
ACTIVE
N
N
25
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
-55 to 125
CD4071BE
CD4071BEE4
Pb-Free
(RoHS)
-55 to 125
CD4071BE
CD4071BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4071BF
CD4071BF3A
CD4071BF3A
CD4071BF3AS2534
CD4071BM
OBSOLETE
ACTIVE
CDIP
SOIC
J
14
14
Call TI
Call TI
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4071BM
CD4071BM
CD4071BM
CD4071BM
CD4071BM
CD4071BM
CD4071BM
CD4071BM
CD4071BM
CD4071B
CD4071BM96
CD4071BM96E4
CD4071BM96G4
CD4071BME4
CD4071BMG4
CD4071BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
250
Green (RoHS
& no Sb/Br)
CD4071BMTE4
CD4071BMTG4
CD4071BNSR
CD4071BNSRE4
CD4071BNSRG4
D
250
Green (RoHS
& no Sb/Br)
D
250
Green (RoHS
& no Sb/Br)
NS
NS
NS
2000
2000
2000
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
CD4071B
SO
Green (RoHS
& no Sb/Br)
CD4071B
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4071BPW
CD4071BPWE4
CD4071BPWG4
CD4071BPWR
CD4071BPWRE4
CD4071BPWRG4
CD4072BE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
PW
14
14
14
14
14
14
14
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
CM071B
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
PW
N
90
90
Green (RoHS
& no Sb/Br)
CM071B
Green (RoHS
& no Sb/Br)
CM071B
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CM071B
Green (RoHS
& no Sb/Br)
CM071B
Green (RoHS
& no Sb/Br)
CM071B
Pb-Free
(RoHS)
CD4072BE
CD4072BE
CD4072BF
CD4072BEE4
PDIP
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
CD4072BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4072BF3A
TBD
7706002CA
CD4072BF3A
CD4072BM
CD4072BM96
CD4072BM96E4
CD4072BM96G4
CD4072BME4
CD4072BMG4
CD4072BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
14
14
14
14
14
14
14
14
50
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4072BM
CD4072BM
CD4072BM
CD4072BM
CD4072BM
CD4072BM
CD4072BM
CD4072BM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
250
250
Green (RoHS
& no Sb/Br)
CD4072BMTE4
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4072BMTG4
CD4072BNSR
CD4072BNSRE4
CD4072BNSRG4
CD4072BPW
ACTIVE
SOIC
SO
D
14
14
14
14
14
14
14
14
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
CD4072BM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NS
NS
NS
PW
PW
PW
N
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4072B
CD4072B
CD4072B
CM072B
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
PDIP
PDIP
Green (RoHS
& no Sb/Br)
CD4072BPWE4
CD4072BPWG4
CD4075BE
90
Green (RoHS
& no Sb/Br)
CM072B
90
Green (RoHS
& no Sb/Br)
CM072B
25
Pb-Free
(RoHS)
CD4075BE
CD4075BE
CD4075BEE4
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
CD4075BF
CD4075BF3A
CD4075BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
CD4075BF
CD4075BF3A
CD4075BM
TBD
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CD4075BM96
CD4075BM96E4
CD4075BM96G4
CD4075BME4
CD4075BMG4
CD4075BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
14
14
14
14
14
14
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4075BM
CD4075BM
CD4075BM
CD4075BM
CD4075BM
CD4075BM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4075BMTE4
CD4075BMTG4
CD4075BNSR
ACTIVE
SOIC
SOIC
SO
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
A42
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
CD4075BM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
NS
NS
NS
PW
PW
PW
PW
PW
PW
J
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4075BM
CD4075B
CD4075B
CD4075B
CM075B
CM075B
CM075B
CM075B
CM075B
CM075B
Green (RoHS
& no Sb/Br)
CD4075BNSRE4
CD4075BNSRG4
CD4075BPW
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
CDIP
Green (RoHS
& no Sb/Br)
CD4075BPWE4
CD4075BPWG4
CD4075BPWR
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CD4075BPWRE4
CD4075BPWRG4
JM38510/17101BCA
JM38510/17103BCA
M38510/17101BCA
M38510/17103BCA
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
TBD
JM38510/
17101BCA
CDIP
J
1
A42
N / A for Pkg Type
JM38510/
17103BCA
CDIP
J
1
A42
N / A for Pkg Type
JM38510/
17101BCA
CDIP
J
1
A42
N / A for Pkg Type
JM38510/
17103BCA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4071B, CD4071B-MIL, CD4072B, CD4072B-MIL, CD4075B, CD4075B-MIL :
Catalog: CD4071B, CD4072B, CD4075B
•
Military: CD4071B-MIL, CD4072B-MIL, CD4075B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4071BM96
CD4071BMT
CD4071BNSR
CD4071BPWR
CD4072BM96
CD4072BMT
CD4072BNSR
CD4075BM96
CD4075BMT
CD4075BNSR
CD4075BPWR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
16.4
16.4
16.4
12.4
6.5
6.5
8.2
6.9
6.5
6.5
8.2
6.5
6.5
8.2
6.9
9.0
9.0
2.1
2.1
2.5
1.6
2.1
2.1
2.5
2.1
2.1
2.5
1.6
8.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
2000
2000
2500
250
10.5
5.6
12.0
8.0
TSSOP
SOIC
SOIC
SO
9.0
8.0
D
9.0
8.0
NS
D
2000
2500
250
10.5
9.0
12.0
8.0
SOIC
SOIC
SO
D
9.0
8.0
NS
PW
2000
2000
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4071BM96
CD4071BMT
CD4071BNSR
CD4071BPWR
CD4072BM96
CD4072BMT
CD4072BNSR
CD4075BM96
CD4075BMT
CD4075BNSR
CD4075BPWR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
38.0
38.0
38.0
35.0
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
D
2000
2500
250
SOIC
SOIC
SO
D
NS
PW
2000
2000
TSSOP
Pack Materials-Page 2
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相关型号：
CD4072BMTE4
4000/14000/40000 SERIES, DUAL 4-INPUT OR GATE, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14
TI
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