CD74AC240EE4 [TI]
具有三态输出的 8 通道、1.5V 至 5.5V 反相器 | N | 20 | -55 to 125;
| 型号： | CD74AC240EE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有三态输出的 8 通道、1.5V 至 5.5V 反相器 | N | 20 | -55 to 125 驱动 光电二极管 输出元件 逻辑集成电路 总线驱动器 总线收发器 |
| 文件： | 总13页 (文件大小：445K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the
CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal
buffer/line drivers use the RCA ADVANCED CMOS technology. The
CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output
enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE)
and one active-HIGH (2OE) output enable.
The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line
plastic packages (E suffix) and 20-lead small-outline packages (M and
M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic
packages (E suffix) and the CD74ACT241 is supplied in 20-lead
dual-in-line plastic packages (E suffix) and 20-lead small-outline
packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied
in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline
packages (M and M96 suffixes), and 20-lead shrink small-outline
packages (SM96 suffix). These package types are operable over the
following temperature ranges: Commerical (0 to 705C); Industrial (−40
to +855C); and Extended Industrial/Military (−55 to + 1255C).
The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241,
and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic
packages (F3A suffix) and are operable over the −55 to +1255C
temperature range.
Copyright 2004, Texas Instruments Incorporated
For T = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
A
For T = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW
A
For T = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly at 6 mW/°C to 310 mW
A
OPERATING-TEMPERATURE RANGE (T ): CD54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125°C
A
CD74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85°C
STORAGE TEMPERATURE (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150°C
stg
LEAD TEMPERATURE (DURING SOLDERING):
At distance 1/16 1/32 in. (1.59 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..+265°C
Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C
* For up to 4 outputs per device: add 25 mA for each additional output.
LIMITS
CHARACTERISTIC
UNITS
MAX.
MIN.
Supply-Voltage Range, V *:
CC
(For T = Full Package-Temperature Range)
A
1.5
4.5
5.5
5.5
AC Types
ACT Types
V
V
DC Input or Output Voltage, V , V
0
V
CC
V
I
o
CD54
CD74
-55
-40
+125
+85
Operating Temperature, T
A
°C
Input Rise and Fall Slew Rate, dt/dv
at 1.5 V to 3 V (AC Types)
0
0
0
50
20
10
ns/V
ns/V
ns/V
at 3.6 v to 5.5 V (AC Types)
at 4.5 V to 5.5 V (ACT Types)
* Unless otherwise specified, all voltages are referenced to ground.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
Drawing
CD54AC240F3A
CD54AC244F3A
CD54ACT240F3A
CD54ACT241F3A
CD54ACT244F3A
CD74AC240E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
20
20
20
20
20
20
1
1
None
None
None
None
None
Call TI
Call TI
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
J
1
J
1
J
1
N
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74AC240M
CD74AC240M96
CD74AC244E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
SOIC
SOIC
PDIP
SOIC
SOIC
SSOP
SSOP
PDIP
SOIC
SOIC
PDIP
SOIC
PDIP
SOIC
SOIC
SSOP
SSOP
DW
DW
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74AC244M
DW
DW
DB
DB
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74AC244M96
CD74AC244SM
CD74AC244SM96
CD74ACT240E
CD74ACT240M
CD74ACT240M96
CD74ACT241E
CD74ACT241M96
CD74ACT244E
CD74ACT244M
CD74ACT244M96
CD74ACT244SM
CD74ACT244SM96
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
DW
DW
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
DW
N
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
DW
DW
DB
DB
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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