CD74ACT109M [TI]
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET; 双JK正沿触发触发器具有清零和预设
| 型号： | CD74ACT109M |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET |
| 文件： | 总10页 (文件大小：338K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
CD54ACT109 . . . F PACKAGE
CD74ACT109 . . . E OR M PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
1CLR
1J
V
CC
2CLR
2J
1
2
3
4
5
6
7
8
16
15
14
13
12
Balanced Propagation Delays
±24-mA Output Drive Current
– Fanout to 15 F Devices
1K
1CLK
1PRE
1Q
2K
SCR-Latchup-Resistant CMOS Process and
Circuit Design
2CLK
11 2PRE
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
10
9
1Q
2Q
2Q
GND
description/ordering information
The ’ACT109 devices contain two independent J-K positive-edge-triggered flip-flops. A low level at the preset
(PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE
and CLR are inactive (high), data at the J and K inputs meeting the setup-time requirements are transferred to
the outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a voltage level and
isnotdirectlyrelatedtotherisetimeoftheclockpulse. Followingthehold-timeinterval, dataattheJandKinputs
can be changed without affecting the levels at the outputs. These versatile flip-flops can perform as toggle
flip-flops by grounding K and tying J high. They also can perform as D-type flip-flops if J and K are tied together.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – E
SOIC – M
CDIP – F
Tube
Tube
CD74ACT109E
CD74ACT109M
CD74ACT109E
–55°C to 125°C
ACT109M
Tape and reel CD74ACT109M96
Tube CD54ACT109F3A
CD54ACT109F3A
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUTS
PRE
L
CLR
H
CLK
X
J
X
X
X
L
K
X
X
X
L
Q
H
L
Q
L
H
L
X
H
†
†
H
L
L
X
H
H
H
↑
L
H
H
H
↑
H
L
L
Toggle
H
H
↑
H
H
X
Q0
H
Q0
L
H
H
↑
H
X
H
H
L
Q0
Q0
‡
Unpredictableand unstable condition if both PRE and CLR
go high simultaneously after both being low at the same
time
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
logic diagram, each flip-flop (positive logic)
PRE
C
J
C
TG
C
Q
TG
K
C
C
C
TG
C
CLK
CLR
C
C
TG
C
Q
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
CC
I
Input clamp current, I (V < 0 V or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
CC
Output clamp current, I
(V < 0 V or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
OK
O O CC
Continuous output current, I (V > 0 V or V < V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V
Package thermal impedance, θ (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
O
O
CC
O
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
JA
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
–55°C to
125°C
–40°C to
85°C
T
A
= 25°C
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
MIN
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
4.5
2
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
0.8
0.8
V
0
0
V
V
0
0
V
V
0
0
V
V
V
I
CC
CC
CC
Output voltage
V
O
CC
CC
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
–24
24
–24
24
–24
24
mA
mA
ns/V
OH
OL
∆t/∆v
10
10
10
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
–55°C to
125°C
–40°C to
85°C
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
CC
UNIT
MIN
4.4
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
I
I
I
I
= –50 µA
= –24 mA
= –50 mA
= –75 mA
= 50 µA
4.5 V
4.5 V
5.5 V
5.5 V
4.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
OH
OH
OH
OH
OL
OL
OL
OL
3.94
3.7
3.8
V
V
V = V or V
IH
V
OH
I
IL
†
†
3.85
3.85
0.1
0.1
0.5
0.1
= 24 mA
0.36
0.44
V = V or V
V
OL
I
IH
IL
†
= 50 mA
= 75 mA
1.65
†
1.65
±1
I
I
V = V
or GND
or GND,
±0.1
±1
µA
µA
I
I
CC
CC
V = V
I
I
O
= 0
4
80
40
CC
4.5 V to
5.5 V
‡
V = V
I
–2.1 V
2.4
3
2.8
mA
I
CC
CC
C
10
10
10
pF
i
†
‡
Testoneoutputatatime, notexceeding1-secondduration. Measurementismadebyforcingindicatedcurrentandmeasuringvoltagetominimize
power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
Additional quiescent supply current per input pin, TTL inputs high, 1 unit load
ACT INPUT LOAD TABLE
INPUT
J or CLK
K
UNIT LOAD
1
0.53
0.58
CLR or PRE
Unit Load is ∆I
electrical characteristics table
limit specified in
CC
(e.g., 2.4 mA at 25°C).
timing requirements over recommended operating conditions (unless otherwise noted)
–55°C to
125°C
–40°C to
85°C
UNIT
MIN
MAX
100
MIN
MAX
114
f
t
Clock frequency
Pulse duration
MHz
ns
clock
CLK high or low
CLR or PRE low
J or K
5
5.5
5.5
0
4.4
4.8
4.8
0
w
t
t
t
Setup time, before CLK↑
Hold time, after CLK↑
ns
ns
ns
su
J or K
h
Recovery time, before CLK↑
CLR↑ or PRE↑
2.5
2.2
rec
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V, C = 50 pF (unless otherwise noted) (see Figure 1)
CC
L
–55°C to
125°C
–40°C to
85°C
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
100
2.6
3.1
2.6
3.1
MAX
MIN
114
2.7
3.2
2.7
3.2
MAX
f
t
MHz
ns
max
CLK
10.3
12.2
10.3
12.2
9.4
11.1
9.4
Q or Q
Q or Q
PLH
CLR or PRE
CLK
t
ns
PHL
CLR or PRE
11.1
operating characteristics, V
= 5 V, T = 25°C
CC
A
PARAMETER
TYP
UNIT
C
Power dissipation capacitance
56
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
GND
TEST
S1
S1
t
t
/t
Open
R1 = 500 Ω
R2 = 500 Ω
PLH PHL
From Output
Under Test
t
/t
2 × V
CC
GND
PLZ PZL
/t
PHZ PZH
C
= 50 pF
L
(see Note A)
t
w
3 V
0 V
1.5 V
1.5 V
Input
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATION
3 V
Reference
Input
3 V
0 V
1.5 V
CLR
Input
1.5 V
0 V
t
t
h
su
t
rec
3 V
0 V
Data
Input
90%
t
90%
3 V
0 V
1.5 V
10%
1.5 V
10%
1.5 V
CLK
t
r
f
VOLTAGE WAVEFORMS
RECOVERY TIME
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
3 V
0 V
3 V
Input
1.5 V
1.5 V
Output
Control
1.5 V
1.5 V
0 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
V
OH
Output
Waveform 1
In-Phase
Output
90%
t
≈V
CC
50%
10%
50% V
10%
CC
V
20% V
20% V
CC
S1 at 2 × V
(see Note B)
CC
OL
CC
t
f
r
V
OL
t
t
PLH
PHL
90%
t
t
PHZ
PZH
V
V
OH
90%
Output
Waveform 2
S1 at GND
Out-of-Phase
Output
50% V
10%
50%
10%
CC
V
OH
80% V
80% V
CC
CC
OL
t
t
r
f
≈0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
Phase relationships between waveforms are arbitrary.
D. For clock inputs, f is measured with the input duty cycle at 50%.
max
E. The outputs are measured one at a time with one input transition per measurement.
F.
G.
H.
t
t
t
and t
and t
and t
are the same as t
.
pd
PLH
PZL
PLZ
PHL
PZH
PHZ
are the same as t
are the same as t
.
en
dis
.
I. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
PDIP
Drawing
CD54ACT109F3A
CD74ACT109E
ACTIVE
ACTIVE
J
16
16
1
TBD
Call TI
N / A for Pkg Type
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74ACT109EE4
CD74ACT109M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
N
D
D
D
D
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74ACT109M96
CD74ACT109M96E4
CD74ACT109ME4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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