CD74ACT241EE4 [TI]
Octal Vuffer Line Drivers 3-State; 八Vuffer线路驱动器三态
| 型号： | CD74ACT241EE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Octal Vuffer Line Drivers 3-State |
| 文件： | 总17页 (文件大小：782K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the
CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal
buffer/line drivers use the RCA ADVANCED CMOS technology. The
CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output
enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE)
and one active-HIGH (2OE) output enable.
The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line
plastic packages (E suffix) and 20-lead small-outline packages (M and
M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic
packages (E suffix) and the CD74ACT241 is supplied in 20-lead
dual-in-line plastic packages (E suffix) and 20-lead small-outline
packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied
in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline
packages (M and M96 suffixes), and 20-lead shrink small-outline
packages (SM96 suffix). These package types are operable over the
following temperature ranges: Commerical (0 to 705C); Industrial (−40
to +855C); and Extended Industrial/Military (−55 to + 1255C).
The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241,
and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic
packages (F3A suffix) and are operable over the −55 to +1255C
temperature range.
Copyright 2004, Texas Instruments Incorporated
For T = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
A
For T = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW
A
For T = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly at 6 mW/°C to 310 mW
A
OPERATING-TEMPERATURE RANGE (T ): CD54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125°C
A
CD74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85°C
STORAGE TEMPERATURE (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150°C
stg
LEAD TEMPERATURE (DURING SOLDERING):
At distance 1/16 1/32 in. (1.59 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..+265°C
Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C
* For up to 4 outputs per device: add 25 mA for each additional output.
LIMITS
CHARACTERISTIC
UNITS
MAX.
MIN.
Supply-Voltage Range, V *:
CC
(For T = Full Package-Temperature Range)
A
1.5
4.5
5.5
5.5
AC Types
ACT Types
V
V
DC Input or Output Voltage, V , V
0
V
CC
V
I
o
CD54
CD74
-55
-40
+125
+85
Operating Temperature, T
A
°C
Input Rise and Fall Slew Rate, dt/dv
at 1.5 V to 3 V (AC Types)
0
0
0
50
20
10
ns/V
ns/V
ns/V
at 3.6 v to 5.5 V (AC Types)
at 4.5 V to 5.5 V (ACT Types)
* Unless otherwise specified, all voltages are referenced to ground.
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
Drawing
CD54AC240F3A
CD54AC244F3A
CD54ACT240F3A
CD54ACT241F3A
CD54ACT244F3A
CD74AC240E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
20
20
20
20
20
20
1
1
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
1
J
1
J
1
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74AC240EE4
CD74AC240M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
PDIP
PDIP
SOIC
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
DW
DW
DW
DW
DW
DW
N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74AC240M96
CD74AC240M96E4
CD74AC240M96G4
CD74AC240ME4
CD74AC240MG4
CD74AC244E
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74AC244EE4
CD74AC244M
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
DW
DW
DW
DW
DW
DW
DB
DB
DB
N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74AC244M96
CD74AC244M96E4
CD74AC244M96G4
CD74AC244ME4
CD74AC244MG4
CD74AC244SM96
CD74AC244SM96E4
CD74AC244SM96G4
CD74ACT240E
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74ACT240EE4
CD74ACT240M
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
CD74ACT240M96
CD74ACT240M96E4
CD74ACT240M96G4
CD74ACT240ME4
CD74ACT240MG4
CD74ACT241E
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
DW
DW
DW
DW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74ACT241EE4
CD74ACT241M96
CD74ACT241M96E4
CD74ACT241M96G4
CD74ACT244E
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
DW
DW
DW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74ACT244EE4
CD74ACT244M
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
DW
DW
DW
DW
DW
DW
DB
DB
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74ACT244M96
CD74ACT244M96E4
CD74ACT244M96G4
CD74ACT244ME4
CD74ACT244MG4
CD74ACT244SM96
CD74ACT244SM96E4
CD74ACT244SM96G4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD74AC240M96
CD74AC244M96
CD74AC244SM96
CD74ACT240M96
CD74ACT241M96
CD74ACT244M96
CD74ACT244SM96
SOIC
SOIC
SSOP
SOIC
SOIC
SOIC
SSOP
DW
DW
DB
20
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
24.4
24.4
16.4
24.4
24.4
24.4
16.4
10.8
10.8
8.2
13.0
13.0
7.5
2.7
2.7
2.5
2.7
2.7
2.7
2.5
12.0
12.0
12.0
12.0
12.0
12.0
12.0
24.0
24.0
16.0
24.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
DW
DW
DW
DB
10.8
10.8
10.8
8.2
13.0
13.0
13.0
7.5
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD74AC240M96
CD74AC244M96
CD74AC244SM96
CD74ACT240M96
CD74ACT241M96
CD74ACT244M96
CD74ACT244SM96
SOIC
SOIC
SSOP
SOIC
SOIC
SOIC
SSOP
DW
DW
DB
20
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
38.0
45.0
45.0
45.0
38.0
DW
DW
DW
DB
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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